EP1101842A3 - Substrat pour l'épitaxie de composés III-V et sa méthode de fabrication - Google Patents
Substrat pour l'épitaxie de composés III-V et sa méthode de fabrication Download PDFInfo
- Publication number
- EP1101842A3 EP1101842A3 EP00124939A EP00124939A EP1101842A3 EP 1101842 A3 EP1101842 A3 EP 1101842A3 EP 00124939 A EP00124939 A EP 00124939A EP 00124939 A EP00124939 A EP 00124939A EP 1101842 A3 EP1101842 A3 EP 1101842A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- epitaxy
- iii
- compounds
- producing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 150000001875 compounds Chemical class 0.000 title 1
- 238000000407 epitaxy Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 230000003746 surface roughness Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Led Devices (AREA)
- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32656199A JP2001144014A (ja) | 1999-11-17 | 1999-11-17 | エピタキシャル成長用基板およびその製造方法 |
JP32656199 | 1999-11-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1101842A2 EP1101842A2 (fr) | 2001-05-23 |
EP1101842A3 true EP1101842A3 (fr) | 2005-08-17 |
Family
ID=18189210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00124939A Withdrawn EP1101842A3 (fr) | 1999-11-17 | 2000-11-15 | Substrat pour l'épitaxie de composés III-V et sa méthode de fabrication |
Country Status (3)
Country | Link |
---|---|
US (1) | US6554896B1 (fr) |
EP (1) | EP1101842A3 (fr) |
JP (1) | JP2001144014A (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6596079B1 (en) | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same |
US6488767B1 (en) | 2001-06-08 | 2002-12-03 | Advanced Technology Materials, Inc. | High surface quality GaN wafer and method of fabricating same |
JP4784012B2 (ja) * | 2001-07-27 | 2011-09-28 | 日亜化学工業株式会社 | 窒化物半導体基板、及びその製造方法 |
JP4514727B2 (ja) * | 2001-12-25 | 2010-07-28 | 日本碍子株式会社 | Iii族窒化物膜の製造方法、iii族窒化物膜、iii族窒化物素子用エピタキシャル基板、及びiii族窒化物素子 |
JP2003327497A (ja) * | 2002-05-13 | 2003-11-19 | Sumitomo Electric Ind Ltd | GaN単結晶基板、窒化物系半導体エピタキシャル基板、窒化物系半導体素子及びその製造方法 |
TW561637B (en) * | 2002-10-16 | 2003-11-11 | Epistar Corp | LED having contact layer with dual dopant state |
JP4052150B2 (ja) * | 2003-03-05 | 2008-02-27 | 住友電気工業株式会社 | 窒化物系半導体装置の製造方法 |
JP2006206343A (ja) * | 2005-01-25 | 2006-08-10 | Ngk Insulators Ltd | AlN単結晶の表面平坦化方法およびAlN単結晶基板の作製方法 |
KR100766858B1 (ko) * | 2006-03-16 | 2007-10-12 | 서울옵토디바이스주식회사 | 질화물 반도체 발광소자용 버퍼층 형성 방법 및 그 질화물반도체 발광소자 |
JP4789973B2 (ja) * | 2008-05-22 | 2011-10-12 | シャープ株式会社 | Mos電界効果トランジスタおよびその製造方法 |
JP2011222969A (ja) * | 2010-03-26 | 2011-11-04 | Ngk Insulators Ltd | 半導体素子用エピタキシャル基板の製造方法、半導体素子用エピタキシャル基板、および半導体素子 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10144962A (ja) * | 1996-09-10 | 1998-05-29 | Toshiba Corp | 半導体発光素子およびその製造方法 |
WO1998045511A1 (fr) * | 1997-04-04 | 1998-10-15 | Centrum Badan Wysokocisnieniowych Polskiej Akademii Nauk | POLISSAGE MECANOCHIMIQUE DE CRISTAUX ET DE COUCHES EPITAXIALES DE GaN ET DE Ga1-x-yAlxInyN |
US6020602A (en) * | 1996-09-10 | 2000-02-01 | Kabushiki Kaisha Toshba | GaN based optoelectronic device and method for manufacturing the same |
EP0993048A2 (fr) * | 1998-09-14 | 2000-04-12 | Matsushita Electronics Corporation | Dispositif à semi-conducteur de nitrure et son procédé de fabrication |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0754806B2 (ja) * | 1987-01-20 | 1995-06-07 | 日本電信電話株式会社 | 化合物半導体単結晶膜の成長方法 |
JP3395631B2 (ja) * | 1997-04-17 | 2003-04-14 | 日亜化学工業株式会社 | 窒化物半導体素子及び窒化物半導体素子の製造方法 |
JPH11261106A (ja) * | 1998-03-12 | 1999-09-24 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
-
1999
- 1999-11-17 JP JP32656199A patent/JP2001144014A/ja active Pending
-
2000
- 2000-11-15 US US09/713,636 patent/US6554896B1/en not_active Expired - Lifetime
- 2000-11-15 EP EP00124939A patent/EP1101842A3/fr not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10144962A (ja) * | 1996-09-10 | 1998-05-29 | Toshiba Corp | 半導体発光素子およびその製造方法 |
US6020602A (en) * | 1996-09-10 | 2000-02-01 | Kabushiki Kaisha Toshba | GaN based optoelectronic device and method for manufacturing the same |
WO1998045511A1 (fr) * | 1997-04-04 | 1998-10-15 | Centrum Badan Wysokocisnieniowych Polskiej Akademii Nauk | POLISSAGE MECANOCHIMIQUE DE CRISTAUX ET DE COUCHES EPITAXIALES DE GaN ET DE Ga1-x-yAlxInyN |
EP0993048A2 (fr) * | 1998-09-14 | 2000-04-12 | Matsushita Electronics Corporation | Dispositif à semi-conducteur de nitrure et son procédé de fabrication |
Non-Patent Citations (1)
Title |
---|
MATSUOKA T ET AL: "GROWTH AND PROPERTIES OF A WIDE-GAP SEMICONDUCTOR INGAN", OPTOELECTRONICS DEVICES AND TECHNOLOGIES, MITA PRESS, TOKYO, JP, vol. 5, no. 1, June 1990 (1990-06-01), pages 53 - 64, XP000160110, ISSN: 0912-5434 * |
Also Published As
Publication number | Publication date |
---|---|
EP1101842A2 (fr) | 2001-05-23 |
US6554896B1 (en) | 2003-04-29 |
JP2001144014A (ja) | 2001-05-25 |
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Legal Events
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: 7C 30B 29/40 B Ipc: 7C 30B 25/18 B Ipc: 7H 01L 21/20 B Ipc: 7H 01L 33/00 B Ipc: 7H 01L 21/306 A |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20050601 |