EP1080486A1 - Device for fixing substrates - Google Patents

Device for fixing substrates

Info

Publication number
EP1080486A1
EP1080486A1 EP99917978A EP99917978A EP1080486A1 EP 1080486 A1 EP1080486 A1 EP 1080486A1 EP 99917978 A EP99917978 A EP 99917978A EP 99917978 A EP99917978 A EP 99917978A EP 1080486 A1 EP1080486 A1 EP 1080486A1
Authority
EP
European Patent Office
Prior art keywords
spring
outer member
inner hole
end part
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99917978A
Other languages
German (de)
French (fr)
Inventor
Ludwig Denzler
Ulrich Speer
Klaus Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Steag Hamatech AG
Original Assignee
Steag Hamatech AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Hamatech AG filed Critical Steag Hamatech AG
Publication of EP1080486A1 publication Critical patent/EP1080486A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B19/00—Bolts without screw-thread; Pins, including deformable elements; Rivets
    • F16B19/04—Rivets; Spigots or the like fastened by riveting
    • F16B19/08—Hollow rivets; Multi-part rivets
    • F16B19/10—Hollow rivets; Multi-part rivets fastened by expanding mechanically
    • F16B19/1027—Multi-part rivets
    • F16B19/1036—Blind rivets
    • F16B19/109—Temporary rivets, e.g. with a spring-loaded pin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B17/00—Guiding record carriers not specifically of filamentary or web form, or of supports therefor
    • G11B17/02—Details
    • G11B17/022—Positioning or locking of single discs
    • G11B17/028—Positioning or locking of single discs of discs rotating during transducing operation
    • G11B17/0284—Positioning or locking of single discs of discs rotating during transducing operation by clampers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
    • G11B23/0014—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture record carriers not specifically of filamentary or web form
    • G11B23/0021—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture record carriers not specifically of filamentary or web form discs
    • G11B23/0028—Details
    • G11B23/0035—Details means incorporated in the disc, e.g. hub, to enable its guiding, loading or driving
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers

Definitions

  • IPC International Patent Classification
  • the invention relates to a device for fixing substrates each having an inner hole with a housing and an element arranged in the housing and insertable into the inner hole.
  • Such a device can be used, for example, at different stations in a device for bonding substrates, as is described, for example, in DE-A-197 18 471, which did not prepublish, and which is based on the same applicant.
  • the device according to the invention is suitable for use in a device for drying substrates, as is described in DE 197 21 689, which did not prepublish and is based on the same applicant.
  • the content of the above-mentioned applications is made the content of this application.
  • substrates for specific treatment steps are each deposited on a support in order, for example, to bond two substrates or to dry substrates.
  • the support surfaces do not provide any fixation of the substrates to be treated, so that the substrates can slip, in particular two substrates to be bonded can slip. This in turn affects the treatment process, which can lead to a loss of quality in the treated substrates.
  • a device for gripping objects with a through opening has a gripper 12 consisting of a base body 4, a plunger 9 axially movable in the base body 4 and balls 6 arranged in the base body 4, which can be pushed outwards by an axial movement of the plunger within the base body over the outer circumference of the base body 4.
  • a clamping device for pulling in and clamping a tool holder with a hollow taper shank in the tool holder of a work spindle is known.
  • clamping claws for attaching the tool holder are spread on via a clamping mechanism which can be displaced relative to the clamping claws.
  • DE-A-195 29 537 shows a device according to the preamble of claim 1.
  • the invention is therefore based on the object of creating a device for fixing substrates having an inner hole each of the type mentioned at the outset, which, with simple technical means and simple handling of the device, enables the substrates to be fixed well in order to reduce reject rates and to enable better quality of the manufactured substrates.
  • the insertable element in the inner hole has an axially movable relative to the housing outer member and an axially movable relative to the housing inner member, the outer member is expandable by a relative movement of the links.
  • the widening of the outer member in the inner hole of a substrate firstly fixes the substrate and centers it with respect to the outer member.
  • the two substrates are also well centered with respect to one another.
  • the outer and / or inner member is advantageously cylindrical in order to achieve a simple configuration and to securely engage the inner hole of the substrate or the substrates.
  • the outer member is elastically expandable, i. H. that it elastically returns to the unexpanded state after expansion and thus releases the engagement with the substrate or substrates.
  • the outer member has a tapering inner diameter in the region of the slots, via which the expandability is achieved when the members move relative.
  • the outer member can be axially pretensioned by a pretensioning device, so that it is pretensioned into a specific axial position in which the outer member is located in an inner hole of a substrate.
  • a spring is provided as a particularly suitable pretensioning device.
  • the inner member has a bevel on the outer circumference, which is advantageously complementary to the tapering inner diameter of the outer member, in order to widen the outer member with as little resistance as possible during a relative movement of the members.
  • the inner member can advantageously be axially pretensioned into a position widening the outer member by means of a pretensioning device, in order to bring the inner member in a simple manner into a position in which the inner member expands the outer member.
  • the biasing device is advantageously a spring.
  • the pretensioning device for the inner member has a smaller spring constant than the pretensioning device for the outer member.
  • the outer link preferably has a support surface for the pretensioning device of the outer and inner links.
  • the outer and inner links can be axially pretensioned by a common pretensioning device, which is advantageously a spring.
  • the number of parts forming the device can be reduced by using a common pretensioning device.
  • the outer link In order to limit the relative movement of the links to one another and to avoid the links coming apart, the outer link has a shoulder in the inner circumference in an end region which cannot be expanded.
  • the inner member has a protrusion that can be extended out of the outer member in order to allow relative movement between the members in a simple manner by pressure on the protrusion.
  • this is the movable outer and inner members receiving housing stationary to form a fixed receiving device.
  • the housing advantageously has a substrate contact surface.
  • the housing advantageously has a bottom wall at one end in order to form a counter surface for the prestressing device that prestresses the outer and / or inner member.
  • FIG. 1 shows a schematic illustration of a fixing device according to the invention in an expanded state, as is used in a drying device;
  • FIG. 1 shows a schematic illustration of a fixing device 1 according to the invention, as is used in a drying device for semiconductor substrates 2, which is at least partially shown.
  • the drying device 2 shown in FIG. 1 can be of the type described in DE 197 721 689, which is not prepublished and goes back to the same applicant. To avoid repetition, the content of this application is made the subject of the present application.
  • the drying device has a lower part 4 and an upper part, not shown.
  • the lower part 4 has a support plate 5 with a support glass plate 6 on which a substrate disk 8 is located.
  • the support plate 5 is rotatable by rollers 9 and 10 and at the same time guided in its position. Although only two rollers 9, 10 are shown in FIG. 1, the drying device generally has three rollers, each offset by 120 ° to one another.
  • the lower part 4 also has a central guide element 12 for receiving the fixing device 1 according to the invention.
  • the fixing device 1 has a stationary housing 15 accommodated in the guide element 12.
  • the housing 15 has a hollow cylindrical shape with an annular flange 16 at an upper end of the housing.
  • the annular flange 16 projects beyond the outer circumference of the cylindrical housing 15 and forms a substrate contact surface 17 on the upper side.
  • outer member 20 Within the cylindrical housing 15 there is concentrically a movably received outer member 20 with an upper, expandable end part 21 and one not expandable part 22.
  • the outer member 20 is in turn hollow cylindrical with an inner circumference 24 which tapers upward in the region of the expandable part 21.
  • three slots 23 are provided, as can best be seen in FIG. 4.
  • the non-expandable part 22 of the outer member is closed at its lower end by means of a screwable plug 25.
  • the outer member 20 is biased upwards by means of a spring 27, which is supported on the one hand on the plug 25 and on the other hand on the guide element 12.
  • the guide element 12 has a centered guide projection 28 which extends into the spring 27, which as
  • Compression spring is formed. This prevents the spring 27 from slipping and tilting to the side.
  • the inner member 30 has a hollow cylindrical end part 32, a conically tapering middle part 30 and an end part 34 forming a projection.
  • the hollow cylindrical end part 32 has a receiving cavity 36 in which a spring 37 is received.
  • the spring 37 which is designed as a compression spring, is supported at one end on the plug 25 and at the other end on a wall of the inner member in order to bias it upward.
  • the conically tapering central part 33 has an inclined outer peripheral surface 39 which is complementary to the conically tapering inner peripheral surface of the expandable end part 21 of the outer member 20.
  • the cylindrical end part 34 forms a projection which can extend through the expandable end part 21, as shown in FIG.
  • a so-called inner hole gripper 40 is shown in FIGS. 1 to 3 above the fixing device 1 according to the invention.
  • This inner hole gripper 40 is axially movable by a mechanism, not shown. Furthermore, the inner hole gripper 40 has a spherical head-shaped end part 41 which can be inserted into an inner hole of a substrate 8 and which can be expanded within the inner hole in order to grip the substrate 8 and, if necessary, to transport it. Inner hole grippers of this type are known in the art, and the inner hole gripper is therefore not described further here.
  • the outer member is biased upward by means of the spring 27 within the stationary housing 15.
  • the outer member 20 extends through an inner hole of a substrate 8.
  • the inner member 30 is biased upward by the spring 37 within the outer member 20.
  • the bevel 39 comes into contact with the tapering inner circumference 24 of the expandable end part 21 and expands the expandable end part 21.
  • the expandable end part 21 comes with its outer circumference firmly with the inner hole of the wafer 8 in
  • the wafer is centered and fixed with respect to the fixing device 1.
  • the cylindrical end part 34 extends axially out of the expandable end part 21 of the outer member 20.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Solid Materials (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)

Abstract

The invention relates to a device for fixing substrates, each of which have an inner cavity, with an element which can be introduced into said inner cavity. Said device also has an axially moveable inner member (30) and an outer member (20) which can be expanded by means of a relative movement of the members.

Description

INTERNATIONAL SEARCH REPORT Inte. lonal Application No INTERNATIONAL SEARCH REPORT Inte. Lonal application no
PCT/EP 99/02500PCT / EP 99/02500
A CLASSIFICATION OF SUBJECT MATTERA CLASSIFICATION OF SUBJECT MATTER
IPC 6 H01L21/00 G11B7/26 C23C14/50IPC 6 H01L21 / 00 G11B7 / 26 C23C14 / 50
According to International Patent Classification (IPC) or to both national classification and IPCAccording to International Patent Classification (IPC) or to both national classification and IPC
B. FIELDS SEARCHEDB. FIELDS SEARCHED
Minimum documentation searched (classification system followed by classification Symbols)Minimum documentation searched (classification system followed by classification symbols)
IPC 6 H01L G11B C23CIPC 6 H01L G11B C23C
Documentation searched other than minimum documentation to the extent that such documsnts are included in the fields searchedDocumentation searched other than minimum documentation to the extent that such documsnts are included in the fields searched
Electronic data base consulted during the international search (name of data base and where practical, search terms used)Electronic data base consulted during the international search (name of data base and where practical, search terms used)
C. DOCUMENTS CONSIDERED TO BE RELEVANTC. DOCUMENTS CONSIDERED TO BE RELEVANT
Category ' Citation of document, with indication, where appropπate of the relevant passages Relevant to Claim NoCategory 'Citation of document, with indication, where appropπate of the relevant passages Relevant to Claim No
PATENT ABSTRACTS OF JAPAN 1,2,4,8, vol. 010, no. 110 (P-450), 9,17,18 24 April 1986 (1986-04-24) -& JP 60 239961 A (HITACHI SEISAKUSHO KK:0THERS: 01), 28 November 1985 (1985-11-28) abstract; figures 2-9PATENT ABSTRACTS OF JAPAN 1,2,4,8, vol. 010, no. 110 (P-450), 9,17,18 April 24, 1986 (1986-04-24) - & JP 60 239961 A (HITACHI SEISAKUSHO KK: 0THERS: 01), November 28, 1985 (1985-11- 28) abstract; figures 2-9
US 5 698 030 A (RUBENCHIK YURI) 1-20 16 December 1997 (1997-12-16) column 4, 1 ine 60 - column 6, 1 ine 38; figures 3,5A-D,6A-DUS 5,698,030 A (RUBENCHIK YURI) 1-20 December 16, 1997 (1997-12-16) column 4, 1 in 60 - column 6, 1 in 38; figures 3.5A-D, 6A-D
EP 0 790 331 A (SINGULUS TECHNOLOGIES 1-20 GMBH) 20 August 1997 (1997-08-20) column 6, 1 ine 26 - column 8, 1 ine 33; figure 3EP 0 790 331 A (SINGULUS TECHNOLOGIES 1-20 GMBH) August 20, 1997 (1997-08-20) column 6, 1 in 26 - column 8, 1 in 33; figure 3
-/--- / -
Further documents are Iisted in the contmuation of box C Patent family members are Iisted in annexFurther documents are Iisted in the contmuation of box C Patent family members are Iisted in annex
' Special categoπes of cited documents'Special categories of cited documents
T' later document published after the international filing dateT 'later document published after the international filing date
A ' document defining the general State of the art which is not or pπority date and not in conflict with the application but considered to be of particular relevance cited to understand the pπnciple or theory underlying the mventionA 'document defining the general State of the art which is not or pπority date and not in conflict with the application but considered to be of particular relevance cited to understand the pπnciple or theory underlying the mvention
Ε" earlier document but published on orafter the international filing date X" document of particular relevance the claimed mvention cannot be considered novel or cannot be considered toEarlier "earlier document but published on orafter the international filing date X" document of particular relevance the claimed mvention cannot be considered novel or cannot be considered to
'L" document which may throw doubts on pπority claιm(s) or involve an inventive Step when the document is taken alone which is cited to establish the publication date of another citation or other Special reason (as specified) Y ' document of particular relevance the claimed mvention cannot be considered to involve an inventive Step when the'L "document which may throw doubts on pπority claιm (s) or involve an inventive Step when the document is taken alone which is cited to establish the publication date of another citation or other Special reason (as specified) Y' document of particular relevance the claimed mvention cannot be considered to involve an inventive step when the
O" document referπng to an oral disclosure, use, exhibition or document is combmed with one or more other such docuother means ments such combination being obvious to a person skilledO "document referπng to an oral disclosure, use, exhibition or document is combmed with one or more other such docuother meansments such combination being obvious to a person skilled
"P" document published pπor to the international filing date but in the art later than the pπority date claimed &" document member of the same patent family"P" document published pπor to the international filing date but in the art later than the pπority date claimed & "document member of the same patent family
Date of the actual completion of the international search Date of mailing of the international search reportDate of the actual completion of the international search Date of mailing of the international search report
6 August 1999 13/08/19996 August 1999 13/08/1999
Name and mailing address of the ISA Authoπzed officerName and mailing address of the ISA Authoπzed officer
European Patent Office, P θ 5818 Patentlaan 2 NL - 2280 HV Ri|swi|k Tel (+31-70) 3 0-2040, Tx 31651 epo nl, Fax (+31-70)340-3016 Micke, KEuropean Patent Office, P θ 5818 Patentlaan 2 NL - 2280 HV Ri | swi | k Tel (+ 31-70) 3 0-2040, Tx 31651 epo nl, Fax (+ 31-70) 340-3016 Micke, K
Form PCT/ISA/210 (second sheβt) (July 1992) page 1 of 2 INTERNATIONAL SEARCH REPORT Intt lonal Application NoForm PCT / ISA / 210 (second sheβt) (July 1992) page 1 of 2 INTERNATIONAL SEARCH REPORT International Application No
PCT/EP 99/02500PCT / EP 99/02500
C.(Contιnuatιon) DOCUMENTS CONSIDERED TO BE RELEVANTC. (Contιnuatιon) DOCUMENTS CONSIDERED TO BE RELEVANT
Category ° Citation of document with indication where appropnate, of the relevant passagss Relevant to Claim NoCategory ° Citation of document with indication where appropnate, of the relevant passagss Relevant to Claim No
US 5 000 651 A (AKAGAWA MIN0RU ET AL) 1-20 19 Maren 1991 (1991-03-19) column 3, line 31 - column 4, line 9; figures 2,4US 5,000 651 A (AKAGAWA MIN0RU ET AL) 1-20 19 Maren 1991 (1991-03-19) column 3, line 31 - column 4, line 9; figures 2.4
US 5 080 736 A (MATSUI TAKAO) 1-20 14 January 1992 (1992-01-14) column 8, line 13 - column 9, line 9 column 14, line 8 - column 15, line 50; figures 8,22,27US 5,080,736 A (MATSUI TAKAO) 1-20 January 14, 1992 (1992-01-14) column 8, line 13 - column 9, line 9 column 14, line 8 - column 15, line 50; figures 8,22,27
Form PCT/ISA/210 (con-nuation of second sheet) (July 1992) page 2 of 2 INTERNATIONAL SEARCH REPORTForm PCT / ISA / 210 (con-nuation of second sheet) (July 1992) page 2 of 2 INTERNATIONAL SEARCH REPORT
Int .tional Application NoInt .tional Application No
Information on patent family membersInformation on patent family members
PCT/EP 99/02500PCT / EP 99/02500
Patent document Publication Patent family Publication cited in search report date member(s) datePatent document Publication Patent family Publication cited in search report date member (s) date
JP 60239961 A 28-11-1985 NONEJP 60239961 A 28-11-1985 NONE
US 5698030 A 16-12-1997 O 9623594 A 08-08-1996 US 5629044 A 13-05-1997US 5698030 A 16-12-1997 O 9623594 A 08-08-1996 US 5629044 A 13-05-1997
EP 0790331 A 20-08-1997 DE 19605598 C 31-10-1996 JP 9287073 A 04-11-1997 US 5876082 A 02-03-1999EP 0790331 A 20-08-1997 DE 19605598 C 31-10-1996 JP 9287073 A 04-11-1997 US 5876082 A 02-03-1999
US 5000651 A 19-03-1991 NONEUS 5000651 A 19-03-1991 NONE
US 5080736 A 14-01-1992 JP 2312078 A 27-12-1990 US 5080736 A 14-01-1992 JP 2312078 A 27-12-1990
Form PCT/ISA210 (patent family annex) (July 1992) Vorrichtung zum Fixieren von SubstratenForm PCT / ISA210 (patent family annex) (July 1992) Device for fixing substrates
Die Erfindung betrifft eine Vorrichtung zum Fixieren von jeweils ein Innenloch aufweisenden Substraten mit einem Gehäuse und einem in dem Gehäuse angeordneten in das Innenloch einfügbaren Element.The invention relates to a device for fixing substrates each having an inner hole with a housing and an element arranged in the housing and insertable into the inner hole.
Eine solche Vorrichtung ist beispielsweise an unterschiedlichen Stationen bei einer Vorrichtung zum Verkle- ben von Substraten einsetzbar, wie sie zum Beispiel in der auf dieselbe Anmelderin zurückgehenden, nicht vorveröffentlichten DE-A-197 18 471 beschrieben ist. Insbesondere ist die erfindungsgemäße Vorrichtung zu einem Einsatz bei einer Vorrichtung zum Trocknen von Substraten, wie sie in der auf dieselbe Anmelderin zurückgehenden, nicht vorveröffentlichten DE 197 21 689 beschrieben ist, geeignet. Zur Vermeidung von Wiederholungen, wird der Inhalt der oben genannten Anmeldungen zum Inhalt dieser Anmeldung gemacht. Bei den obigen Vorrichtungen werden Sub- strate zu bestimmten Behandlungsschritten jeweils auf einer Auflage abgelegt, um beispielsweise ein Verkleben von zwei Substraten oder eine Trocknung von Substraten durchzuführen. Dabei sehen die Auflageflächen keine Fixierung der zu behandelnden Substrate vor, so daß ein Verrutschen der Substrate, insbesondere ein Verrutschen von zwei miteinander zu verklebenden Substraten auftreten kann. Dies beeinflußt wiederum den Behandlungsvorgang, was zu Qualitätsverlusten bei den behandelten Substraten führen kann.Such a device can be used, for example, at different stations in a device for bonding substrates, as is described, for example, in DE-A-197 18 471, which did not prepublish, and which is based on the same applicant. In particular, the device according to the invention is suitable for use in a device for drying substrates, as is described in DE 197 21 689, which did not prepublish and is based on the same applicant. To avoid repetition, the content of the above-mentioned applications is made the content of this application. In the above devices, substrates for specific treatment steps are each deposited on a support in order, for example, to bond two substrates or to dry substrates. The support surfaces do not provide any fixation of the substrates to be treated, so that the substrates can slip, in particular two substrates to be bonded can slip. This in turn affects the treatment process, which can lead to a loss of quality in the treated substrates.
Aus der DE-A-196 44 158 ist eine Vorrichtung zum Greifen von Gegenständen mit einer Durchgangsöffnung bekannt. Die Vorrichtung weist einen Greifer 12 bestehend aus einem Grundkörper 4, einem axial im Grundkörper 4 bewegbaren Stößel 9 und im Grundkörper 4 angeordneten Kugeln 6 auf, welche durch eine Axialbewegung des Stößels innerhalb des Grundkörpers über den Außenumfang des Grundkörpers 4 nach außen geschoben werden können. Aus der DE-A-196 18 278 ist eine Spannvorrichtung zum Einziehen und Spannen eines Werkzeughalters mit Hohlkegelschaft in der Werkzeugaufnahme einer Arbeitsspindel bekannt. Bei der Vorrichtung werden Spannklauen zum Befestigen des Werkzeughalters über einen relativ zu den Spannklauen verschiebbaren Spannmechanismus aufge- εpreitzt.From DE-A-196 44 158 a device for gripping objects with a through opening is known. The device has a gripper 12 consisting of a base body 4, a plunger 9 axially movable in the base body 4 and balls 6 arranged in the base body 4, which can be pushed outwards by an axial movement of the plunger within the base body over the outer circumference of the base body 4. From DE-A-196 18 278 a clamping device for pulling in and clamping a tool holder with a hollow taper shank in the tool holder of a work spindle is known. In the device, clamping claws for attaching the tool holder are spread on via a clamping mechanism which can be displaced relative to the clamping claws.
Aus der Zeitschrift "o+p - ölhydraulik und pneumatik - 22 (1978) Nr. 1, Seite 10 ist ein Innenlochgreifer bekannt, der ein Substrat über pneumatische Aufweitung eines in ein Innenloch des Substrats eingeführtes Element fixiert.From the magazine "o + p - Oil Hydraulics and Pneumatics - 22 (1978) No. 1, page 10 an inner hole gripper is known which fixes a substrate by pneumatic expansion of an element inserted into an inner hole of the substrate.
Ferner zeigt die DE-A-195 29 537 eine Vorrichtung gemäß dem Oberbegriff des Anspruchs 1.Furthermore, DE-A-195 29 537 shows a device according to the preamble of claim 1.
Der Erfindung liegt daher die Aufgabe zugrunde, eine Vorrichtung zum Fixieren von jeweils ein Innenloch aufwei- senden Substraten der eingangs genannten Art zu schaffen, die mit einfachen technischen Mitteln und bei einfacher Handhabung der Vorrichtung eine gute Fixierung der Substrate ermöglicht, um geringere Ausschußraten und eine bessere Qualität der gefertigten Substrate zu ermögli- chen.The invention is therefore based on the object of creating a device for fixing substrates having an inner hole each of the type mentioned at the outset, which, with simple technical means and simple handling of the device, enables the substrates to be fixed well in order to reduce reject rates and to enable better quality of the manufactured substrates.
Die gestellte Aufgabe wird erfindungsgemäß dadurch gelöst, daß das in das Innenloch einführbare Element ein axial relativ zum Gehäuse bewegbares Außenglied und ein axial relativ zum Gehäuse bewegbares Innenglied aufweist, wobei das Außenglied durch eine Relativbewegung der Glieder aufweitbar ist. Durch die AufWeitung des Außengliedes in dem Innenloch eines Substrates wird das Substrat zum einen fixiert und bezüglich des Außengliedes zentriert. Insbesondere bei miteinander verklebten, noch zu trocknenden Substraten ergibt sich dabei auch eine gute Zentrierung der beiden Substrate zueinander. Dadurch, daß nicht nur das Innenglied, sondern auch das Außenglied axial relativ zum Gehäuse bewegbar ist, ergibt sich eine einfache Möglichkeit, diese in ein Innenloch eines Substrats einzuführen und herauszubewegen.The object is achieved in that the insertable element in the inner hole has an axially movable relative to the housing outer member and an axially movable relative to the housing inner member, the outer member is expandable by a relative movement of the links. The widening of the outer member in the inner hole of a substrate firstly fixes the substrate and centers it with respect to the outer member. In particular in the case of substrates which are still bonded and still to be dried, the two substrates are also well centered with respect to one another. As a result of that not only the inner member, but also the outer member can be moved axially relative to the housing, there is a simple possibility of inserting it into an inner hole of a substrate and moving it out.
Vorteilhafterweise ist das Außen- und/oder Innenglied zylindrisch, um eine einfache Ausgestaltung zu erreichen und sicher mit dem Innenloch des Substrats bzw. der Substrate in Eingriff zu kommen.The outer and / or inner member is advantageously cylindrical in order to achieve a simple configuration and to securely engage the inner hole of the substrate or the substrates.
Um auf einfache Weise die Aufweitbarkeit des Außenglieds vorzusehen, sind Schlitze in einem Endbereich des Außenglieds vorgesehen. Vorteilhafterweise ist das Außenglied elastisch aufweitbar, d. h. , daß es nach der Aufweitung elastisch in den nicht aufgeweiteten Zustand zurückkehrt und somit den Eingriff mit dem oder den Substraten löst.In order to provide for the expandability of the outer member in a simple manner, slots are provided in an end region of the outer member. Advantageously, the outer member is elastically expandable, i. H. that it elastically returns to the unexpanded state after expansion and thus releases the engagement with the substrate or substrates.
Gemäß einer Ausführungsform der Erfindung weist das Au- ßenglied im Bereich der Schlitze einen sich verjüngenden Innendurchmesser auf, über den bei einer Relativbewegung der Glieder die Aufweitbarkeit erreicht wird.According to one embodiment of the invention, the outer member has a tapering inner diameter in the region of the slots, via which the expandability is achieved when the members move relative.
Vorteilhafterweise ist das Außenglied durch eine Vorspan- neinrichtung axial vorspannbar, damit es in eine bestimmte Axialposition vorgespannt ist, in der sich das Außenglied in einem Innenloch eines Substrates befindet. Als besonders geeignete Vorspanneinrichtung ist eine Feder vorgesehen.Advantageously, the outer member can be axially pretensioned by a pretensioning device, so that it is pretensioned into a specific axial position in which the outer member is located in an inner hole of a substrate. A spring is provided as a particularly suitable pretensioning device.
Gemäß einer bevorzugten Ausführungsform weist das Innenglied eine Schräge am Außenumfang auf, die vorteilhafterweise komplementär zu dem sich verjüngenden Innendurchmesser des Außengliedes ist, um möglichst wider- standsfrei bei einer Relativbewegung der Glieder das Außenglied aufzuweiten. Das Innenglied ist vorteilhafterweise durch eine Vorspanneinrichtung in eine das Außenglied aufweitende Position axial vorspannbar, um das Innenglied auf einfache Weise in eine Position zu bringen, in der das Innenglied das Außenglied aufweitet. Hierbei ist die Vorspanneinrichtung vorteilhafterweise eine Feder.According to a preferred embodiment, the inner member has a bevel on the outer circumference, which is advantageously complementary to the tapering inner diameter of the outer member, in order to widen the outer member with as little resistance as possible during a relative movement of the members. The inner member can advantageously be axially pretensioned into a position widening the outer member by means of a pretensioning device, in order to bring the inner member in a simple manner into a position in which the inner member expands the outer member. Here, the biasing device is advantageously a spring.
Um zu gewährleisten, daß bei einem auf die Vorrichtung von außen ausgeübten Druck vor einer Bewegung des Au- ßenglieds zunächst dessen Aufweitung beendet wird, weist die Vorspanneinrichtung für das Innenglied eine kleinere Federkonstante auf, als die Vorspanneinrichtung für das Außenglied.In order to ensure that, when pressure is exerted on the device from the outside, the expansion of the outer member is stopped before the outer member moves, the pretensioning device for the inner member has a smaller spring constant than the pretensioning device for the outer member.
Vorzugsweise weist das Außenglied eine Abstützflache für die Vorspanneinrichtung der Außen- und Innenglieder auf.The outer link preferably has a support surface for the pretensioning device of the outer and inner links.
Gemäß einer weiteren Ausführungsform der Erfindung sind die Außen- und Innenglieder durch eine gemeinsame Vor- spanneinrichtung, die vorteilhafterweise eine Feder ist axial vorspannbar. Durch Verwendung einer gemeinsamen Vorspanneinrichtung kann die Anzahl der die Vorrichtung bildenden Teile verringert werden.According to a further embodiment of the invention, the outer and inner links can be axially pretensioned by a common pretensioning device, which is advantageously a spring. The number of parts forming the device can be reduced by using a common pretensioning device.
Um die Relativbewegung der Glieder zueinander zu beschränken und um ein Auseinanderkommen der Glieder zu vermeiden, weist das Außenglied in einem nicht aufweitbaren Endbereich eine Schulter im Innenumfang auf.In order to limit the relative movement of the links to one another and to avoid the links coming apart, the outer link has a shoulder in the inner circumference in an end region which cannot be expanded.
Vorteilhafterweise weist das Innenglied einen aus dem Außenglied herauserstreckbaren Vorsprung auf, um auf einfache Weise durch Druck auf den Vorsprung eine Relativbewegung zwischen den Gliedern zu ermöglichen.Advantageously, the inner member has a protrusion that can be extended out of the outer member in order to allow relative movement between the members in a simple manner by pressure on the protrusion.
Gemäß einer weiteren bevorzugten Ausführungsform der Erfindung ist das die bewegbaren Außen- und Innenglieder aufnehmende Gehäuse stationär , um eine feste Aufnahmevorrichtung zu bilden.According to a further preferred embodiment of the invention, this is the movable outer and inner members receiving housing stationary to form a fixed receiving device.
Um dem oder den fixierten Substrat(en) einen besseren Halt zu geben weist das Gehäuse vorteilhafterweise eine Substratauflagefläche auf.In order to give the fixed substrate (s) a better hold, the housing advantageously has a substrate contact surface.
Vorteilhafterweise weist das Gehäuse an einem Ende eine Bodenwand auf, um eine Gegenfläche für die das Außen- und/oder Innenglied vorspannende Vorspanneinrichtung zu bilden.The housing advantageously has a bottom wall at one end in order to form a counter surface for the prestressing device that prestresses the outer and / or inner member.
Die Erfindung wird nachstehend anhand bevorzugter Ausführungsbeispiele unter Bezugnahme auf die Figuren erläu- tert. Es zeigen:The invention is explained below on the basis of preferred exemplary embodiments with reference to the figures. Show it:
Figur 1 eine schematische Darstellung einer erfindungsgemäßen Fixiervorrichtung in einem aufgeweiteten Zustand, wie sie in einer Trocknungsvor- richtung verwendet wird;FIG. 1 shows a schematic illustration of a fixing device according to the invention in an expanded state, as is used in a drying device;
Figur 2 die erfindungsgemäße Fixiervorrichtung gemäß Figur 1 in einem nicht aufgeweiteten Zustand, wobei zur Vereinfachung Teile der Trocknungsvorrichtung weggelassen wurden; Figur 3 eine schematische Darstellung der erfindungsgemäßen Fixiervorrichtung gemäß Figur 1 in einer nicht aufgeweiteten und zurückgezogenen Position, wobei wiederum Teile der Trocknungsvorrichtung weggelassen wurden. Figuren 4a und b eine schematische Draufsicht auf die erfindungsgemäße Vorrichtung bzw. eine schematische Schnittansicht eines Gehäuses und eines Außengliedes der erfindungsgemäßen Fixiervorrichtung; Figur 5 eine vergrößerte schematische Darstellung eines weiteren Ausführungsbeispiels der erfindungsgemäßen Fixiervorrichtung. Figur 1 zeigt eine schematische Darstellung einer erfindungsgemäßen Fixiervorrichtung 1, wie sie in einer - zumindest teilweise dargestellten - Trocknungsvorrichtung für Halbleitersubstrate 2 verwendet wird. Die in Figur 1 dargestellte Trocknungsvorrichtung 2 kann von der Bauart sein, die in der nicht vorveröffentlichten, auf dieselbe Anmelderin zurückgehenden DE 197 721 689 beschrieben ist. Zur Vermeidung von Wiederholungen wird der Inhalt dieser Anmeldung zum Gegenstand der vorliegenden Anmeldung gemacht.2 shows the fixing device according to the invention according to FIG. 1 in an unexpanded state, parts of the drying device being omitted for simplification; 3 shows a schematic representation of the fixing device according to the invention according to FIG. 1 in an unexpanded and retracted position, parts of the drying device again being omitted. FIGS. 4a and b show a schematic plan view of the device according to the invention and a schematic sectional view of a housing and an outer member of the fixing device according to the invention; Figure 5 is an enlarged schematic representation of another embodiment of the fixing device according to the invention. FIG. 1 shows a schematic illustration of a fixing device 1 according to the invention, as is used in a drying device for semiconductor substrates 2, which is at least partially shown. The drying device 2 shown in FIG. 1 can be of the type described in DE 197 721 689, which is not prepublished and goes back to the same applicant. To avoid repetition, the content of this application is made the subject of the present application.
Die Trocknungsvorrichtung weist ein Unterteil 4 und ein nicht dargestelltes Oberteil auf. Das Unterteil 4 weist einen Auflageteller 5 mit einer Auflageglasplatte 6 auf, auf der eine Substratscheibe 8 liegt. Der Auflageteller 5 ist durch Rollen 9 und 10 drehbar und gleichzeitig in seiner Lage geführt. Obwohl in Figur 1 nur zwei Rollen 9, 10 dargestellt sind, weist die Trocknungsvorrichtung in der Regel drei jeweils um 120° zueinander winkelmäßig versetzt angeordnete Rollen auf.The drying device has a lower part 4 and an upper part, not shown. The lower part 4 has a support plate 5 with a support glass plate 6 on which a substrate disk 8 is located. The support plate 5 is rotatable by rollers 9 and 10 and at the same time guided in its position. Although only two rollers 9, 10 are shown in FIG. 1, the drying device generally has three rollers, each offset by 120 ° to one another.
Das Unterteil 4 weist ferner ein mittleres Führungselement 12 zu Aufnahme der erfindungsgemäßen Fixiervorrich- tung 1 auf.The lower part 4 also has a central guide element 12 for receiving the fixing device 1 according to the invention.
Die Fixiervorrichtung 1 weist, wie am besten in Figur 2 zu sehen ist, ein stationäres, in dem Führungselement 12 aufgenommenes Gehäuse 15 auf. Das Gehäuse 15 besitzt eine hohlzylindrische Form mit einem Ringflansch 16 an einem oberen Ende des Gehäuses. Der Ringflansch 16 steht über den Außenumfang des zylindrischen Gehäuses 15 vor und bildet auf der Oberseite eine Substratauflagefläche 17.As can best be seen in FIG. 2, the fixing device 1 has a stationary housing 15 accommodated in the guide element 12. The housing 15 has a hollow cylindrical shape with an annular flange 16 at an upper end of the housing. The annular flange 16 projects beyond the outer circumference of the cylindrical housing 15 and forms a substrate contact surface 17 on the upper side.
Innerhalb des zylindrischen Gehäuses 15 befindet sich konzentrisch ein beweglich aufgenommenes Außenglied 20 mit einem oberen, aufweitbaren Endteil 21 und einem nicht aufweitbaren Teil 22. Das Außenglied 20 ist wiederum hohlzylindrisch mit einem Innenumfang 24, der sich in dem Bereich des aufweitbaren Teils 21 nach oben verjüngt. Im Bereich des aufweitbaren Endteils 21 sind drei Schlitze 23 vorgesehen, wie am besten in Fig. 4 zu sehen ist.Within the cylindrical housing 15 there is concentrically a movably received outer member 20 with an upper, expandable end part 21 and one not expandable part 22. The outer member 20 is in turn hollow cylindrical with an inner circumference 24 which tapers upward in the region of the expandable part 21. In the area of the expandable end part 21, three slots 23 are provided, as can best be seen in FIG. 4.
Der nicht aufweitbare Teil 22 des Außengliedes ist an seinem unteren Ende mittels eines einschraubbaren Stopfens 25 verschlossen.The non-expandable part 22 of the outer member is closed at its lower end by means of a screwable plug 25.
Das Außenglied 20 ist mittels einer Feder 27, die sich einerseits an dem Stopfen 25 und andererseits an dem Führungselement 12 abstützt nach oben vorgespannt. Das Führungselement 12 weist einen zentrierten Führungsvorsprung 28 auf, der sich in die Feder 27 erstreckt, welche alsThe outer member 20 is biased upwards by means of a spring 27, which is supported on the one hand on the plug 25 and on the other hand on the guide element 12. The guide element 12 has a centered guide projection 28 which extends into the spring 27, which as
Druckfeder ausgebildet ist. Hierdurch wird ein seitliches Verrutschen und Verkanten der Feder 27 verhindert.Compression spring is formed. This prevents the spring 27 from slipping and tilting to the side.
In dem Außenglied 20 ist ein relativ zu dem Außenglied verschiebbares Innenglied 30 konzentrisch aufgenommen. Das Innenglied 30 weist einen hohlzylindrischen Endteil 32, einen sich konisch verjüngenden Mittelteil 30 und einen einen Vorsprung bildenden Endteil 34 auf.An inner member 30, which is displaceable relative to the outer member, is received concentrically in the outer member 20. The inner member 30 has a hollow cylindrical end part 32, a conically tapering middle part 30 and an end part 34 forming a projection.
Der hohlzylindrische Endteil 32 weist einen Aufnahmehohlraum 36 auf, in dem eine Feder 37 aufgenommen ist. Die Feder 37, die als Druckfeder ausgebildet ist, stützt sich mit ihrem einen Ende an dem Stopfen 25 ab und mit ihrem anderen Ende an einer Wand des Innengliedes, um dieses nach oben vorzuspannen.The hollow cylindrical end part 32 has a receiving cavity 36 in which a spring 37 is received. The spring 37, which is designed as a compression spring, is supported at one end on the plug 25 and at the other end on a wall of the inner member in order to bias it upward.
Der sich konisch verjüngende Mittelteil 33 besitzt eine schräge Außenumfangsflache 39, welche komplementär zu der sich konisch verjüngenden Innenumfangsflache des aufweit- baren Endteils 21 des Außengliedes 20 ist. Der zylindrische Endteil 34 bildet einen Vorsprung der sich durch den aufweitbaren Endteil 21 hindurcherstrecken kann, wie in Figur l dargestellt ist.The conically tapering central part 33 has an inclined outer peripheral surface 39 which is complementary to the conically tapering inner peripheral surface of the expandable end part 21 of the outer member 20. The cylindrical end part 34 forms a projection which can extend through the expandable end part 21, as shown in FIG.
In den Figuren 1 bis 3 ist oberhalb der erfindungsgemäßen FixierVorrichtung 1 ein sogenannter Innenlochgreifer 40 dargestellt.A so-called inner hole gripper 40 is shown in FIGS. 1 to 3 above the fixing device 1 according to the invention.
Dieser Innenlochgreifer 40 ist durch einen nicht näher dargestellten Mechanismus axial bewegbar. Ferner besitzt der Innenlochgreifer 40 einen kugelkopfförmigen Endteil 41, der in ein Innenloch eines Substrates 8 einführbar ist, und innerhalb des Innenlochs aufgeweitet werden kann, um das Substrat 8 zu ergreifen und ggf. zu trans- portieren. Innenlochgreifer dieser Art sind in der Technik bekannt, und der Innenlochgreifer wird daher hier nicht weiter beschrieben.This inner hole gripper 40 is axially movable by a mechanism, not shown. Furthermore, the inner hole gripper 40 has a spherical head-shaped end part 41 which can be inserted into an inner hole of a substrate 8 and which can be expanded within the inner hole in order to grip the substrate 8 and, if necessary, to transport it. Inner hole grippers of this type are known in the art, and the inner hole gripper is therefore not described further here.
Die Funktionsweise der erfindungsgemäßen Fixiervorrich- tung 1 wird nun anhand der Figuren 1 bis 3 erläutert. Wie in Figur 1 zu sehen ist, ist das Außenglied über die Feder 27 innerhalb des stationären Gehäuses 15 nach oben vorgespannt. Dabei erstreckt sich das Außenglied 20 durch ein Innenloch eines Substrats 8 hindurch. Ferner ist das Innenglied 30 durch die Feder 37 innerhalb des Außengliedes 20 nach oben vorgespannt. Dabei kommt die Schräge 39 mit dem sich verjüngenden Innenumfang 24 des aufweitbaren Endteils 21 in Kontakt und weitet den aufweitbaren Endteil 21 auf. Der aufweitbare Endteil 21 kommt dadurch mit seinem Außenumfang fest mit dem Innenloch des Wafers 8 inThe functioning of the fixing device 1 according to the invention will now be explained with reference to FIGS. 1 to 3. As can be seen in FIG. 1, the outer member is biased upward by means of the spring 27 within the stationary housing 15. The outer member 20 extends through an inner hole of a substrate 8. Furthermore, the inner member 30 is biased upward by the spring 37 within the outer member 20. The bevel 39 comes into contact with the tapering inner circumference 24 of the expandable end part 21 and expands the expandable end part 21. The expandable end part 21 comes with its outer circumference firmly with the inner hole of the wafer 8 in
Eingriff. Hierdurch wird der Wafer bezüglich der Fixiervorrichtung 1 zentriert und fixiert. In der in Figur 1 dargestellten Position erstreckt sich der zylindrische Endteil 34 axial aus dem ausweitbaren Endteil 21 des Au- ßengliedes 20 heraus. Intervention. As a result, the wafer is centered and fixed with respect to the fixing device 1. In the position shown in FIG. 1, the cylindrical end part 34 extends axially out of the expandable end part 21 of the outer member 20.

Claims

Um die Fixierung des Wafers 8 zu lösen, wird der kugelförmige Kopf 41 des Innenlochgreifers mit einer Oberseite des zylindrischen Endteils 34 des Innengliedes 30 in Kontakt gebracht, wie in Figur 1 zu sehen ist. Dann wird das Innenglied 21 durch den Innenlochgreifer 40 in dem Außenglied nach unten gedrückt, und zwar entgegen der Vorspannung der Feder 37. Aufgrund der Tatsache, daß die Federkonstante der Feder 37 kleiner ist als die Federkonstante der Feder 27, welche das Außenglied nach oben vor- spannt, bleibt das Außenglied 20 zunächst in seiner Position. Wenn sich das Innenglied 30 in der in Figur 2 dargestellten Position befindet, steht die Schräge 39 nicht mehr in Kontakt mit dem sich verjüngenden Teil des Innen- umfangs 24 Außengliedes und der aufweitbare Endteil 21 kehrt elastisch in seine nicht ausgeweitete Position zurück. Dadurch wird der Kontakt mit dem Innenloch des Wafers 8 gelöst, der somit nicht mehr fixiert ist.In order to release the fixation of the wafer 8, the spherical head 41 of the inner hole gripper is brought into contact with an upper side of the cylindrical end part 34 of the inner member 30, as can be seen in FIG. 1. Then the inner member 21 is pressed down by the inner hole gripper 40 in the outer member, against the bias of the spring 37. Due to the fact that the spring constant of the spring 37 is smaller than the spring constant of the spring 27 which the outer member upwards - Tensions, the outer member 20 initially remains in its position. When the inner member 30 is in the position shown in FIG. 2, the slope 39 is no longer in contact with the tapering part of the inner circumference 24 of the outer member and the expandable end part 21 elastically returns to its non-expanded position. This releases the contact with the inner hole of the wafer 8, which is therefore no longer fixed.
Nach dem Lösen der Fixierung wird nun der Innenlochgrei- fer 40 noch weiter nach unten bewegt, wodurch nun auch das Außenglied 20 entgegen der Federkraft der Feder 27 nach unten, aus dem Innenloch des Wafers 8 herausgedrückt wird. Diese Position ist in Figur 3 dargestellt. In dieser Position kann der kugelförmige Kopf 41 des Innenloch- greifers 40 aufgeweitet werden, um mit dem Innenloch inAfter loosening the fixation, the inner hole gripper 40 is now moved further downward, as a result of which the outer member 20 is now also pressed downward against the spring force of the spring 27, out of the inner hole of the wafer 8. This position is shown in Figure 3. In this position, the spherical head 41 of the inner hole gripper 40 can be expanded in order to align with the inner hole in
Eingriff zu kommen und den Wafer 8 zu ergreifen. Wenn der Innenlochgreifer nun nach oben bewegt wird, nimmt er den Wafer 8 mit. Dabei kehren das Außenglied 20 und das Innenglied 30 in umgekehrter Weise in die in Figur 1 ge- zeigte Position zurück, wobei sich diesmal das Außenglied nicht durch ein Innenloch des Wafers 8 erstreckt.To come and take the wafer 8. If the inner hole gripper is now moved upwards, it takes the wafer 8 with it. The outer member 20 and the inner member 30 return in the opposite manner to the position shown in FIG. 1, this time the outer member does not extend through an inner hole in the wafer 8.
Das Fixieren eins Wafers mit der Fixiervorrichtung 1 erfolgt in umgekehrter Reihenfolge.The fixing of a wafer with the fixing device 1 takes place in the reverse order.
Figur 5 zeigt ein weiteres Ausführungsbeispiel der erfindungsgemäßen Fixiervorrichtung. Die erfindungsgemäße Fi- 10Figure 5 shows a further embodiment of the fixing device according to the invention. The fi 10
xiervorrichtung gemäß dem zweiten Ausführungsbeispiel weist ein hohlzylindrisches Gehäuse 45 auf. Ein Endteil des Hohlzylinders weist eine sich radial erstreckende Wand 46 auf, welche den Hohlzylinder abschließt. Die Wand 46 weist einen zentrierten Mittelvorsprung 47 auf.Xiervorrichtung according to the second embodiment has a hollow cylindrical housing 45. An end part of the hollow cylinder has a radially extending wall 46 which closes off the hollow cylinder. The wall 46 has a centered central projection 47.
In dem Gehäuse 45 ist ein axial innerhalb des Gehäuses verschiebbares Außenglied 49 mit einem aufweitbaren Endteil 51 und einem nicht aufweitbarem Teil 52. Das Au- ßenglied 49 ist hohlzylindrisch und weist einen Innenumfang 54 auf, der sich im oberen Bereich verjüngt und eine Schräge 55 bildet. Im Bereich des nicht aufweitbaren Bereich 52 befindet sich am Innenumfang 54 ein ringförmiges Glied 56, welches in geeigneter Weise, zum Beispiel durch eine Schraubverbindung, mit dem Innenumfang 54 verbunden ist.In the housing 45 there is an axially displaceable outer member 49 with an expandable end part 51 and a non-expandable part 52. The outer member 49 is hollow cylindrical and has an inner circumference 54 which tapers in the upper region and forms a bevel 55 . In the area of the non-expandable area 52 there is an annular member 56 on the inner circumference 54, which is connected to the inner circumference 54 in a suitable manner, for example by a screw connection.
Innerhalb des Außenglieds 49 ist konzentrisch ein Innenglied 58 angeordnet, das im wesentlichen dem In- nenglied 30 gemäß dem ersten Ausführungsbeispiel gleicht. Das Innenglied weist wiederum einen im wesentlichen hohlzylindrischen Endteil 60, einen sich konisch verjüngenden Mittelteil 61 sowie einen zylindrischen Endteil 62 auf. Der hohlzylindrische Teil 60 definiert einen Aufnah- mehohlraum 64 für eine Feder 65, welche das Innenglied 58 axial nach oben vorspannt. Die Feder 65 erstreckt sich in den Aufnahmehohlraum 64, stützt sich an einer Wand desselben ab und erstreckt sich von dort durch das Ringelement 56 zu der sich radial erstreckenden Endwand 46 des Gehäuses 45. Der Führungsvorsprung 47 der Endwand 46 erstreckt sich in die als Druckfeder ausgebildete Feder 65 und führt diese.An inner member 58 is arranged concentrically within the outer member 49 and is essentially the same as the inner member 30 according to the first exemplary embodiment. The inner member in turn has an essentially hollow cylindrical end part 60, a conically tapering middle part 61 and a cylindrical end part 62. The hollow cylindrical part 60 defines a receiving cavity 64 for a spring 65 which biases the inner member 58 axially upward. The spring 65 extends into the receiving cavity 64, is supported on a wall thereof and extends from there through the ring element 56 to the radially extending end wall 46 of the housing 45. The guide projection 47 of the end wall 46 extends into the one designed as a compression spring Spring 65 and leads this.
Der sich radial verjüngende Mittelteil 61 weist wiederum eine Schräge 68 auf, die komplementär zu der Schräge 55 ist, und in der in Figur 5 gezeigten Position mit dieser in Eingriff kommt, um den aufweitbaren Endteil 51 des Au- 11The radially tapering central part 61 in turn has a bevel 68 which is complementary to the bevel 55 and in the position shown in FIG. 5 engages with it in order to extend the expandable end part 51 11
ßenglieds 49 aufzuweiten. Der zylindrische Teil 62 erstreckt sich axial nach außen aus dem Außenglied 49.widening pontic 49. The cylindrical part 62 extends axially outward from the outer member 49.
Die Funktionsweise der Fixiervorrichtung gemäß dem zwei- ten Ausführungsbeispiel ist im wesentlichen dieselbe wie die Funktionsweise der Vorrichtung gemäß dem ersten Aus- führungsbeispiel.The functioning of the fixing device according to the second exemplary embodiment is essentially the same as the functioning of the device according to the first exemplary embodiment.
Der wesentliche Unterschied liegt darin, daß nur eine Fe- der 65 vorgesehen ist, die dazu dient, sowohl das Innenglied 58 als auch das Außenglied 49 axial nach oben vorzuspannen. Dies geschieht dadurch, daß die Feder zunächst das Innenglied 58 axial nach oben vorspannt und über das Innenglied 58 indirekt das Außenglied 49 axial nach oben vorspannt. Wenn mittels eines Innenlochgreifers von oben auf das Innenglied 58 gedrückt wird, bewegt sich dieses nach unten bezüglich des Außengliedes 49, und zwar entgegen der Federvorspannung der Feder 65. Dadurch wird in gleicher Weise wie bei dem ersten AusführungsbeispieJ die AufWeitung des aufweitbaren Teils 51 des Außengliedes gelöst. Bei einer weiter, nach unten gerichteten Bewegung des Innenlochgreifers kommt das Innenglied 58 mit dem Ringelement 56 in Eingriff. Bei einer weiteren, nach unten gerichteten Bewegung des Innenlochgreifers wird nun auch das Außenglied nach unten gedrückt.The main difference is that only one spring 65 is provided, which serves to axially bias both the inner member 58 and the outer member 49 upward. This is done in that the spring initially biases the inner member 58 axially upward and indirectly biases the outer member 49 axially upward via the inner member 58. When the inner member 58 is pressed from above by means of an inner hole gripper, the inner member 58 moves downward with respect to the outer member 49, against the spring preload of the spring 65. This causes the expansion of the expandable part 51 of the outer member in the same way as in the first embodiment solved. With a further downward movement of the inner hole gripper, the inner member 58 comes into engagement with the ring element 56. With a further, downward movement of the inner hole gripper, the outer link is now also pressed down.
Die erfindungsgemäße Fixiervorrichtung wurde anhand spezifischer Ausführungsbeispiele, insbesondere in Verbindung mit einer Trocknungsvorrichtung 2 für Halbleitersub- strate beschrieben. Dem Fachmann sind jedoch Ausgestaltungen und Abwandlungen möglich, ohne daß dadurch der Erfindungsgedanke verlassen wird. Beispielsweise ist die Fixiervorrichtung auch bei anderen Vorrichtungen einsetzbar, bei denen ein Substrat mit einem Innenloch fixiert werden muß. The fixing device according to the invention has been described on the basis of specific exemplary embodiments, in particular in connection with a drying device 2 for semiconductor substrates. However, refinements and modifications are possible for the person skilled in the art without departing from the inventive concept. For example, the fixing device can also be used in other devices in which a substrate has to be fixed with an inner hole.
EP99917978A 1998-04-24 1999-04-14 Device for fixing substrates Withdrawn EP1080486A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19818478 1998-04-24
DE19818478A DE19818478A1 (en) 1998-04-24 1998-04-24 Device for fixing substrates
PCT/EP1999/002500 WO1999056306A1 (en) 1998-04-24 1999-04-14 Device for fixing substrates

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EP1080486A1 true EP1080486A1 (en) 2001-03-07

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US (1) US6612558B1 (en)
EP (1) EP1080486A1 (en)
JP (1) JP2002513206A (en)
KR (1) KR100371014B1 (en)
CN (1) CN1298552A (en)
AU (1) AU3606299A (en)
CA (1) CA2329118A1 (en)
DE (1) DE19818478A1 (en)
IL (1) IL138880A0 (en)
TW (1) TW541273B (en)
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US8204690B2 (en) * 2008-06-03 2012-06-19 Los Alamos National Security, Llc Analytical effective tensor for flow-through composites

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US6612558B1 (en) 2003-09-02
KR100371014B1 (en) 2003-02-06
CN1298552A (en) 2001-06-06
IL138880A0 (en) 2001-11-25
AU3606299A (en) 1999-11-16
CA2329118A1 (en) 1999-11-04
JP2002513206A (en) 2002-05-08
WO1999056306A1 (en) 1999-11-04
KR20010042999A (en) 2001-05-25
TW541273B (en) 2003-07-11
DE19818478A1 (en) 1999-11-04

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