EP1072066A1 - Systeme de contact a bus a haute vitesse - Google Patents

Systeme de contact a bus a haute vitesse

Info

Publication number
EP1072066A1
EP1072066A1 EP99912295A EP99912295A EP1072066A1 EP 1072066 A1 EP1072066 A1 EP 1072066A1 EP 99912295 A EP99912295 A EP 99912295A EP 99912295 A EP99912295 A EP 99912295A EP 1072066 A1 EP1072066 A1 EP 1072066A1
Authority
EP
European Patent Office
Prior art keywords
speed bus
contact system
grounding member
contacts
bus contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99912295A
Other languages
German (de)
English (en)
Other versions
EP1072066A4 (fr
EP1072066B1 (fr
Inventor
Frank P. Hart
Raviprakash Nagaraj
Leonard O. Turner
Arthur L. Spurrell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of EP1072066A1 publication Critical patent/EP1072066A1/fr
Publication of EP1072066A4 publication Critical patent/EP1072066A4/fr
Application granted granted Critical
Publication of EP1072066B1 publication Critical patent/EP1072066B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/83—Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]

Definitions

  • This invention relates to the field of electrical interconnection devices, and more specifically to the field of bus connectors for portable computers.
  • Memory modules for example, have become much smaller and as such the memory bus connectors within the computer itself have become smaller and more delicate.
  • computer users want to be able to easily upgrade the memory modules in their existing computer systems.
  • it is important in the design of memory modules and memory bus connectors that they are able to withstand some abuse by the computer user when upgrading the memory modules while still maintaining the smaller and more dense layouts.
  • memory bus connector 120 holds the memory module 100 in a horizontal fashion such that the memory module 100 is parallel to motherboard 130.
  • the parallel memory module 100 allows the portable computer to be manufactured in thinner and smaller cases improving the portability of the computer.
  • memory bus connector 220 holds memory module 200 in a vertical fashion such that the memory module 200 is perpendicular to motherboard 230.
  • a vertical memory module 200 would increase the thickness and overall size of the portable computer making the portable computer too big and bulky.
  • a Small Outline Dual In Line Memory Module contains about 144 individual contacts.
  • the memory bus connector that connects the SO-DIMM to the -2- motherboard has a corresponding number of contacts (or leads).
  • a prior art memory bus connector 120 which would hold the memory module 100 parallel to the motherboard, contains top leads 141 and bottom leads 142 which interconnect to the memory module 100.
  • memory bus connector 120 would have seventy-two (72) individual top leads 141 and seventy-two (72) individual bottom leads 142, as illustrated in Figure 4.
  • Figure 5 illustrates an enlargement of a portion of the memory bus connector 120 illustrated in Figure 4.
  • the individual top leads 141 and individual bottom leads 142 may be any combination of data signal contacts and ground members depending upon the contact layout of the particular memory module being used. Thus, there could be data signal contacts in both the top and bottom leads and there could also be ground members in both the top and bottom leads. Because the memory module 100 is parallel to the motherboard (i.e. horizontal), the top and bottom leads 141 & 142 are different lengths. The top leads 141 must be longer and bend up and over in order to connect the upper portion of the memory module to the motherboard and the bottom leads 142 are shorter since they connect the lower portion of the memory module to the motherboard.
  • top leads 141 are longer, they necessarily have higher inductances. These higher inductances are not an issue for memory buses at present speeds (typically 66-100 MHz), but will become impediments to proper operation of future memory buses, where speeds of 400 MHz to 1 GHz are anticipated.
  • the connecting leads in the memory bus connector 220 are all the same length and are very short (simply the distance from the motherboard to the connection on the memory module).
  • the leads for the vertical memory module do not have to reach up and around the vertical memory module as they do in the horizontal (or parallel) memory module.
  • the vertical memory module and memory bus connector used in desktop computers do not have a significant problem with inductance.
  • the present invention is a memory bus connector.
  • the memory bus connector of the present invention has a plurality of individual contacts and a sheet grounding member.
  • Figure 1 illustrates a parallel memory module and a motherboard.
  • Figure 2 illustrates a vertical memory module and a motherboard.
  • Figure 3 illustrates a prior art memory bus connector for holding a memory module parallel to a motherboard.
  • Figure 4 illustrates the prior art memory bus connector of Figure 3.
  • Figure 5 illustrates an enlargement of a portion of the prior art memory bus connector of Figure 4.
  • Figure 6 illustrates an overhead view of a high speed memory bus connector according to one embodiment of the present invention.
  • Figure 7 illustrates one embodiment of an individual contact used in the lower portion of the memory bus connector illustrated in Figure 6.
  • Figure 8 illustrates one embodiment of a sheet grounding member used in the upper portion of the memory bus connector illustrated in Figure 6.
  • Figure 9 illustrates a side view of a high speed memory bus connector according to one embodiment of the present invention.
  • Figure 10 illustrates an overhead view of a high speed memory bus connector according to another embodiment of the present invention.
  • Figure 11 illustrates an overhead view of a high speed memory bus connector according to yet another embodiment of the present invention.
  • a High Speed Bus Connector Contact System is disclosed.
  • numerous specific details are set forth such as specific materials, layouts, dimensions, etc. in order to provide a thorough understanding of the present invention. It will be obvious, however, to one skilled in the art that these specific details need not be employed to practice the present invention. In other instances, well known materials or methods have not been described in detail in order to avoid unnecessarily obscuring the present invention.
  • the present invention is a high speed bus connector system that establishes a parallel contact between the memory module and a motherboard for use in computers where space is limited, for example, portable computers or laptops.
  • SO-DIMM Small Outline Dual In Line Memory Module
  • the high speed memory bus connector (memory bus connector) of the present invention has individual contacts 642 on the lower portion of the memory bus connector 600 and a sheet ground member 641 on the upper portion of the memory bus connector 600. Although only 16 individual contacts 642 are illustrated in Figure 6, it should be noted and it will be obvious to one with ordinary skill in the art that there may be any number of individual contacts 642 and that the number of individual contacts will be whatever is required to implement a given high-speed bus.
  • Figure 7 illustrates an individual contact 642 used in the lower portion of memory bus connector 600 to connect to the bottom of a memory module.
  • the individual contact 642 is a piece of metal bent to form a solder foot 610 that connects the individual contact 642 to a motherboard.
  • the body 620 of the individual contact pin is usually wider than the solder foot and is used to aid in the control of the characteristic impedance as will be discussed in further detail below.
  • Individual contact 642 also has a connecting portion 630 which is bent and/or shaped to form a contact that will directly connect to the lower surface of the memory module.
  • the individual contacts 642 may be data signal contacts, power supply contacts, ground members, or a combination thereof depending upon the configuration of the particular memory module being used.
  • individual contacts 642 are used for signals in order to reduce the inductance of the connector since the individual contacts 642 have a shorter signal path.
  • FIG. 8 illustrates an embodiment of a sheet grounding member 641 used to connect the memory bus connector to the upper surface of a memory module.
  • the present invention solves the inductance problem exhibited in the prior art memory bus connector that had individual contacts to the upper surface of the memory module.
  • the individual upper contacts 141 of the memory bus connector 120 exhibited a high inductance problem due to their length.
  • the present invention reduces the inductance to an acceptable level even though the sheet contact is still relatively long. Because the contacts would be paralleled together into a sheet, the resulting sheet contact would not likely serve well as a data signal contact for the memory module, however it would serve well as a universal power or ground member for the memory module and the corresponding individual contacts 642 on the lower portion of the memory bus connector 600. In addition, the sheet contact would provide a means of controlling the impedance of signal contacts.
  • the sheet grounding member is made from a solid sheet of metal, as is illustrated in Figure 8.
  • the solid sheet is bent in certain areas to form an upper connection portion 690 for coupling to the upper surface of the memory module.
  • the metal sheet is also cut (or notched) and bent to create solder feet 670 for connecting the sheet grounding member 641 to a motherboard.
  • the sheet grounding member may also be cut and bent to create a reference ground plane 680 that extends outwardly from the sheet grounding member 641 to come into close proximity with the individual contacts 642 on the lower portion of the memory bus connector 600, as is illustrated in Figure 9.
  • the embodiment of the sheet grounding member 641 illustrated in Figure 8, also illustrates knit-paths 695 which are holes in the sheet grounding member that enable the molding of a connector body around the grounding member.
  • knit-paths 695 are optional and are merely illustrated as an example of how a connector body may be molded around sheet grounding member 641. It will be obvious to one with ordinary skill in the art that other means for connecting the grounding member 641 to a connector body may be used.
  • the sheet ground member 641 is illustrated in Figures 6-9 as being a single solid piece it may be advantageous and is within the scope of -6- the present invention to make the upper portion of the memory bus connector out of two or more electrically distinct sheet ground members 641 as is illustrated in Figure 10. It should be noted that the number of electrically distinct sheet grounding members 641 used will depend upon the particular specifications required by the manufacturer and the inductance levels tolerable by the corresponding memory module. It should also be noted that it may be advantageous and is within the scope of the present invention to make the sheet grounding member from several different pieces of metal and attaching them together rather than cutting and bending a solid sheet of metal. For example the reference ground plane 680 could be a separate piece of metal that is later soldered onto the frame of the sheet grounding member 641.
  • Reference ground plane 680 is optional in the design of the present invention, however, it enables the manufacturer to "control" the characteristic impedance of the memory bus connector 600 to their desired specifications. By placing the reference ground plane 680 in close proximity with the individual contacts 642 (in particular the individual contacts that are data signal contacts) allows the characteristic impedance to be controlled.
  • the value of the characteristic impedance can be raised or lowered by changing the impedance gap spacing 660 (i.e. increasing or decreasing the gap) between the reference ground plane 680 and the individual contact 642.
  • the characteristic impedance may also be changed by placing a dielectric material (not shown) in the impedance gap spacing 660 between the reference ground plane 680 and the individual contact 642.
  • the characteristic impedance will be inversely proportional to the square root of the dielectric constant of the material used. As an example, air has a dielectric constant of 1 , bakelite has dielectric constant of 4.74, and silica (SiO2) has a dielectric constant of 3.8.
  • the characteristic impedance of the signal contacts would be reduced by approximately 50% from a gap spacing containing only air.
  • the characteristic impedance may be affected by the size of the body 620 of the individual contact 642. In other words the thickness and /or width of the individual contact may be varied in order to increase or decrease the characteristic impedance.
  • Figure 9 illustrates the relative positions of the individual contacts 642 to the sheet grounding member 641 of the memory bus connector of one embodiment of the present invention.
  • the individual contact 642 and the sheet grounding member 641 are positioned such that two gaps are created between them.
  • One gap is the memory module gap 650.
  • the memory module gap 650 is where the memory module plugs into the memory bus -7- connector 600.
  • the upper surface of the memory module couples with the sheet grounding member 641 at the upper connection point 690.
  • the lower surface of the memory module couples with the individual contact 642 at connecting point 630.
  • the second gap which is optional depending upon if the memory bus connector includes the optional reference ground plane 680, is the impedance gap spacing 660.
  • Impedance gap spacing 660 is the gap between the reference ground plane 680 and the body 620 of the individual contact 642. As stated above with regard to the discussion of the "tuning" of the characteristic impedance the impedance gap spacing 660 may be increased, decreased, or filled with a dielectric material in order to control the characteristic impedance of the memory bus connector 600.
  • FIG. 11 illustrates sheet grounding member 641 having much smaller electrically isolated contact members 645.
  • Electrically isolated contact members (contact members) 645 may be power connections or data signal connections.
  • Figure 11 illustrates contact members 645 as being located on both sides of sheet grounding member 641 it should be noted that contact members 645 may be a single electrically isolated member on only one side, there could be several contact members 645 on a side, etc.
  • contact members 645 may be located between the sheet grounding members 641.
  • the individual contacts 642 located opposite the contact members 645 may be data signal contacts, power connections, or ground members where the characteristic impedance would not be a concern.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

L'invention concerne un connecteur de bus de mémoire, conçu pour loger un module de mémoire parallèle à une carte-mère. Le connecteur de bus de mémoire de l'invention est constitué de plusieurs contacts séparés qui fonctionnent comme des contacts à signaux de données, et/ou d'éléments de terre qui connectent la partie inférieure du module de mémoire parallèle. Le connecteur de bus de mémoire possède également un élément de mise à la terre en feuille, qui connecte la partie supérieure du module de mémoire.
EP99912295A 1998-04-16 1999-03-04 Systeme de contact a bus a haute vitesse Expired - Lifetime EP1072066B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US61807 1998-04-16
US09/061,807 US6322370B1 (en) 1998-04-16 1998-04-16 High speed bus contact system
PCT/US1999/004896 WO1999054963A1 (fr) 1998-04-16 1999-03-04 Systeme de contact a bus a haute vitesse

Publications (3)

Publication Number Publication Date
EP1072066A1 true EP1072066A1 (fr) 2001-01-31
EP1072066A4 EP1072066A4 (fr) 2002-01-09
EP1072066B1 EP1072066B1 (fr) 2004-06-30

Family

ID=22038263

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99912295A Expired - Lifetime EP1072066B1 (fr) 1998-04-16 1999-03-04 Systeme de contact a bus a haute vitesse

Country Status (6)

Country Link
US (2) US6322370B1 (fr)
EP (1) EP1072066B1 (fr)
KR (1) KR100511405B1 (fr)
AU (1) AU3069699A (fr)
DE (1) DE69918426T2 (fr)
WO (1) WO1999054963A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100897601B1 (ko) * 2006-12-29 2009-05-14 삼성전자주식회사 시스템의 오작동 방지를 위한 비휘발성 메모리 모듈 및이를 구비한 시스템
US7654870B2 (en) * 2008-02-11 2010-02-02 Z-Plane, Inc. Interconnection assembly for printed circuit boards
CN102375796A (zh) * 2010-08-06 2012-03-14 华硕电脑股份有限公司 具有通用串行总线连接器的主板
US8827746B2 (en) 2011-08-01 2014-09-09 Z-Plane, Inc. Crosstalk reduction
US10811794B2 (en) * 2018-01-11 2020-10-20 Te Connectivity Corporation Card edge connector system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478260A (en) * 1994-07-29 1995-12-26 The Whitaker Corporation Grounding for electrical connectors
US5522737A (en) * 1992-03-24 1996-06-04 Molex Incorporated Impedance and inductance control in electrical connectors and including reduced crosstalk

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3203501B2 (ja) * 1995-11-20 2001-08-27 モレックス インコーポレーテッド プリント回路板用のエッジコネクタ
US4932884A (en) * 1988-04-11 1990-06-12 Trigon Industries, Inc. Controlled impedance contacts
JPH0353703A (ja) * 1989-07-21 1991-03-07 Elmec Corp 電子部品の端子構造
JP3126102B2 (ja) * 1995-08-11 2001-01-22 ヒロセ電機株式会社 Ｐｃカード用ソケットコネクタ及びこれを有するｐｃカード
US5634819A (en) * 1996-01-16 1997-06-03 Hon Hai Precision Ind. Co., Ltd. Electrical connector
US5882223A (en) * 1996-02-21 1999-03-16 Japan Aviation Delectronics Industry, Limited Connector which is adapted to connect a flat connection object having a signal pattern and a shield pattern opposite to each other
JPH10134910A (ja) * 1996-10-30 1998-05-22 Amp Japan Ltd メモリカードコネクタ及びそのアダプタ
US5901038A (en) * 1997-03-17 1999-05-04 Cheng; Wing Ling Power supply system for high density printed circuit boards
US5908333A (en) * 1997-07-21 1999-06-01 Rambus, Inc. Connector with integral transmission line bus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5522737A (en) * 1992-03-24 1996-06-04 Molex Incorporated Impedance and inductance control in electrical connectors and including reduced crosstalk
US5478260A (en) * 1994-07-29 1995-12-26 The Whitaker Corporation Grounding for electrical connectors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9954963A1 *

Also Published As

Publication number Publication date
AU3069699A (en) 1999-11-08
WO1999054963A1 (fr) 1999-10-28
KR20010042599A (ko) 2001-05-25
EP1072066A4 (fr) 2002-01-09
DE69918426T2 (de) 2005-07-21
US20020016099A1 (en) 2002-02-07
EP1072066B1 (fr) 2004-06-30
US6322370B1 (en) 2001-11-27
KR100511405B1 (ko) 2005-08-31
US6503091B2 (en) 2003-01-07
DE69918426D1 (de) 2004-08-05

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