Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01079—Gold [Au]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01087—Francium [Fr]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/102—Material of the semiconductor or solid state bodies
  • H01L2924/1025—Semiconducting materials
  • H01L2924/10251—Elemental semiconductors, i.e. Group IV
  • H01L2924/10253—Silicon [Si]

Definitions

• the present invention relates to a method for manufacturing a thin and flexible flexible and foldable contactless electronic device (10), such as a card, a label, a ticket or a token, comprising at least one electronic microcircuit (20) which is arranged in the thickness of a support and which has studs connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite sheets, lower (12) and upper (16 ), protective, said method comprising the following consecutive steps
• a thin and flexible flexible and foldable contactless electronic device such as a card, a label, a ticket or a token
• a thin and flexible flexible and foldable contactless electronic device comprising at least one electronic microcircuit (20) which is arranged in the thickness of a support and which has studs connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite sheets, lower (12) and upper (16 ), protective, said method comprising the following consecutive steps
• smart cards which are either rigid cards whose support is made of plastic, or labels
• an electronic device of the type mentioned above for example a thin contactless smart card (thickness less than, for example, about 400 ⁇ m, even 280 ⁇ m) and flexible or even foldable in two, which can be used several times, the cost of which is particularly reduced as well as its thickness in order to be able to be used in numerous applications using an electronic memory chip for which it is today impossible, for reasons of cost and / or thickness support, using cards, 2 labels, tickets or contactless electronic memory tokens.
• the invention provides a method of manufacturing an electronic device of the type mentioned above, comprising the following consecutive steps: a) producing a lower protective sheet by: ai) placing at least one electronic microcircuit on the internal face from the bottom sheet; a2) producing at least one interface antenna on the internal face of the lower sheet, in particular by screen printing; a3) electrically connecting pads of the electronic microcircuit to the interface antenna; b) making a stack by superimposing the lower protective sheet, an intermediate bonding sheet whose two opposite lower and upper faces are provided with adhesive, and an upper protective sheet; c) assemble the three overlapping sheets by compressing them.
• step c) of assembly consists of a hot rolling operation
• the intermediate bonding sheet has a recess in line with the electronic microcircuit
• the intermediate bonding sheet is a sheet of hot-melt adhesive;
• the intermediate bonding sheet is a sheet of paper, the two opposite lower and upper faces of which are provided with a layer of hot-melt adhesive;
• step a) of making the lower protective sheet the operations ai), a2) and a3) are carried out successively;
• At least one of the protective sheets is based on paper.
• the method includes an additional printing step on one and / or the other of the outer faces of the two upper and lower sheets for protecting the support.
• the printing is carried out before the postponement of the antenna and / or the chip.
• the invention also relates to a contactless electronic device of the type mentioned above, characterized in that it comprises a stack:
• the intermediate bonding sheet has a recess in line with the electronic microcircuit
• the intermediate bonding sheet is a sheet of hot-melt adhesive
• the intermediate bonding sheet is a sheet of paper, the two opposite lower and upper faces of which are provided with a layer of hot-melt adhesive;
• At least one of the protective sheets is based on paper.
• the device has a thickness of less than 400 ⁇ m, or even 280 ⁇ m.
• the sheet supporting the antenna and the microcircuit (the chip) has a thickness less than or equal to 75 ⁇ m.
• FIG. 1 is a schematic view in longitudinal section of a first embodiment of a smart card produced in accordance with the teachings of the invention and on which the stacking of the three sheets which constitute it is illustrated before the operation hot rolling;
• Figure 2 is a view similar to that of Figure 1 which illustrates a second embodiment of a smart card produced in accordance with the teachings of the invention
• FIG. 4 is a schematic view illustrating the production of stacking by superposition of the three sheets constituting the support of a smart card produced in accordance with the teachings of the invention.
• identical, similar or analogous elements will be designated by the same reference numerals, and in the description and the claims, the terms lower, upper, vertical, etc. will be used without limitation with reference to the figures to facilitate explanations.
• flexible means a mechanical property identical to that of playing cards.
• the product of the invention is designed so that it can be handled like a metro ticket, rolled up or even folded by hand without altering its transceiver operation.
• FIG. 1 a smart card 10 which is constituted by a vertical stack of three sheets 12, 14 and 16.
• the bottom sheet 1 2 is a first sheet of paper whose thickness is for example equal to 75 microns made of “Maine” paper sold by the company Arjo-Wiggins.
• the lower sheet of paper 12 constitutes a lower protective sheet of the card 10 while the upper sheet 16, of the same constitution and the same thickness as the lower sheet 12 constitutes an upper protective sheet of paper of the card 10.
• the intermediate sheet 14 is a sheet for mutual bonding of the two lower 12 and upper 16 sheets which, in this first embodiment, is a sheet or film of hot-melt adhesive, also called a "Hot Melt" sheet of a 6 thickness of 100 microns marketed by the company Polyconcept.
• This hot melt sheet has the advantage of being soft at room temperature and of not damaging the chip during stacking.
• the intermediate bonding sheet 14 when it is hard like paper, it may optionally include a recess or window 18 which is arranged vertically in line with an electronic microcircuit 20, or chip, placed on the internal upper face 22 of the lower sheet 12.
• the electronic microcircuit 20 is connected to an interface antenna 24 which, according to a known technique, is for example produced by screen printing on the upper face 22 by means of a conductive silver-based ink which is for example the ink E520 sold by Dupont de Nemours.
• the electronic microcircuit 20 is for example a "Chip Mifare Amtel AT 8100" whose thickness is reduced to for example 70 microns. It can be fixed on the face 22 for example by gluing.
• the electrical connection of the pad of the electronic microcircuit or electronic module 20 to the interface antenna 24 is carried out, according to a known technique, preferably by cords 26 of conductive glue which is for example glue sold under the name "Ablestick Silver Glue ”.
• the second embodiment illustrated in FIG. 2 differs from the first embodiment which has just been described by the structure of the intermediate bonding sheet 14.
• the bonding sheet 14 is here constituted by an intermediate sheet of paper 14A, the two opposite external faces of which are coated with a layer of adhesive 7
• FIG. 3A we start from a sheet of paper 12 on the upper face 22 from which we glue, for each electronic device to be produced, an electronic microcircuit or module 20.
• the antennas 24 are produced, preferably by screen printing on the upper face 22. Alternatively, the antenna can be produced before the module is fixed and connected. Finally, as illustrated in FIG. 3C, electrical connections or connections are made to the electronic microcircuits 20 to the antennas 24 by depositing cords 26 of conductive adhesive.
• FIG. 4 This next step is illustrated in FIG. 4 in which the stacking of the lower sheet 12 previously produced, of an intermediate bonding sheet 14 in which there is, if necessary, previously produced, has been shown schematically in exploded perspective. windows or cutouts 1 8, and an upper sheet 16 of paper protection.
• the stack or sandwich thus produced is then, during a following step, not shown in the figures, assembled by hot pressing the three superimposed sheets 12, 14 and 16, for example during a rolling operation with hot, that is to say at a temperature making it possible to cause the melting of the hot-melt adhesive constituting in itself the intermediate sheet 14 (FIG. 1) or constituting the layers 14B of glue of the intermediate bonding sheet 14 (FIG.
• This laminating operation also called lamination, makes it possible to permanently associate the three sheets of the stack and to reduce the total thickness of the electronic device thus produced to a value less than or equal to 260 microns.
• the invention thus makes it possible to have electronic devices with electronic memory without contact of reduced cost and of reduced thickness making it possible to replace other products comprising means of identification, such as for example the flexible tickets with magnetic strip or with code bar, these new electronic devices being more biodegradable.
• the invention is not limited to the embodiments and to the method which have just been described.
• the various operations making it possible in particular to achieve the production of the bottom protective sheet of paper 12 provided with the electronic microcircuit 20 and the antenna 24 can be carried out according to other known technologies, the antenna being able for example to be produced in firstly and the connection of the electronic microcircuit being carried out automatically when the latter is installed with its conductive contact pads turned towards the upper face 22 and placed directly on conductive sections of the antenna 24 (“Flip Chip”).
• connection of an electronic microcircuit 20 to the antenna 24 could be carried out according to a technique of micro-wiring or welding of the connections (“Wire Bonding”) but would be more fragile and more bulky in thickness. 10
• Hot-melt adhesive whatever the structure of the intermediate bonding sheet 14, makes it possible to avoid resorting to a housing coating (“Potting”) consisting in protecting the electronic microcircuit 20 and its connections using a resin .
• Potting housing coating
• the nature of the hot-melt adhesive used can also be such that it is slightly tacky on cold contact so as to ensure pre-assembly of the stack of three sheets prior to the hot rolling operation.
• the protective paper sheet (12, 16) as well as the sheet 14 can also be made of a polymer in particular from those commonly used in the field of smart cards (PVC, PE, PP).
• These sheets can also be made from cellulose-laden polymer to improve some of its properties (sealing, mechanical strength, etc.).
• the invention required to combine several parameters. Beyond the use of small chips (less than 70 ⁇ m), and thin protective sheets, it was preferable to use a heat-fusible or fusible intermediate layer called "hot melt" for the assembly of the together. This layer due to its cold ductility has the advantage of not damaging the silicon chip coming directly into contact with it during rolling. In this regard, obviously in the intermediate layer is not essential.
• Screen printing according to the above request has the advantage of producing antenna tracks with a precise contour, of good conduction quality (silver particles).
• the ink being polymer-based and being partially dried according to the method described in the above application, the device can be folded several times by hand, 5 times for example without damaging the antenna.
• a screen-printed antenna loaded with silver makes it easier to connect the antenna to the chip by a connection element below compared to the use of an antenna produced by etching.
• connection element is preferably either a bead of conductive adhesive charged with silver, the chip being fixed. 12 in the place is a point of conductive adhesive, the chip being fixed upside down (flip-chip).
• connections have the advantage, compared to the type of welded wire (wire-bonding) connections, of being thin and better able to withstand mechanical stresses.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Credit Cards Or The Like (AREA)
• Devices For Checking Fares Or Tickets At Control Points (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=9523715

Family Applications (1)

Country Status (8)

Families Citing this family (41)

Family Cites Families (6)

• 1998
  • 1998-02-27 FR FR9802727A patent/FR2775533B1/fr not_active Expired - Fee Related
• 1999
  • 1999-02-10 CA CA002321893A patent/CA2321893A1/fr not_active Abandoned
  • 1999-02-10 JP JP2000533853A patent/JP2002505488A/ja active Pending
  • 1999-02-10 CN CN 99803383 patent/CN1292129A/zh active Pending
  • 1999-02-10 WO PCT/FR1999/000291 patent/WO1999044172A1/fr not_active Application Discontinuation
  • 1999-02-10 AU AU24286/99A patent/AU2428699A/en not_active Abandoned
  • 1999-02-10 BR BR9907751-5A patent/BR9907751A/pt not_active IP Right Cessation
  • 1999-02-10 EP EP99903730A patent/EP1057139A1/de not_active Withdrawn

Non-Patent Citations (1)

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