EP1050607A3 - Verfahren und Einrichtung für die elektrolytische Abscheidung von Gold oder Goldlegierungen - Google Patents

Verfahren und Einrichtung für die elektrolytische Abscheidung von Gold oder Goldlegierungen Download PDF

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Publication number
EP1050607A3
EP1050607A3 EP00500086A EP00500086A EP1050607A3 EP 1050607 A3 EP1050607 A3 EP 1050607A3 EP 00500086 A EP00500086 A EP 00500086A EP 00500086 A EP00500086 A EP 00500086A EP 1050607 A3 EP1050607 A3 EP 1050607A3
Authority
EP
European Patent Office
Prior art keywords
gold
electrolytic cell
replenishing
electrodeposition
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00500086A
Other languages
English (en)
French (fr)
Other versions
EP1050607A2 (de
EP1050607B1 (de
Inventor
Josep Ferre Torres
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP1050607A2 publication Critical patent/EP1050607A2/de
Publication of EP1050607A3 publication Critical patent/EP1050607A3/de
Application granted granted Critical
Publication of EP1050607B1 publication Critical patent/EP1050607B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • C25D21/14Controlled addition of electrolyte components
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Contacts (AREA)
  • Electroplating Methods And Accessories (AREA)
EP00500086A 1999-05-06 2000-05-03 Einrichtung für die elektrolytische Abscheidung von Gold oder Goldlegierungen Expired - Lifetime EP1050607B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ES009900931A ES2166660B1 (es) 1999-05-06 1999-05-06 Procedimiento y equipo para la electrodeposicion de oro o aleaciones de oro.
ES9900931 1999-05-06

Publications (3)

Publication Number Publication Date
EP1050607A2 EP1050607A2 (de) 2000-11-08
EP1050607A3 true EP1050607A3 (de) 2002-11-13
EP1050607B1 EP1050607B1 (de) 2005-10-05

Family

ID=8308255

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00500086A Expired - Lifetime EP1050607B1 (de) 1999-05-06 2000-05-03 Einrichtung für die elektrolytische Abscheidung von Gold oder Goldlegierungen

Country Status (4)

Country Link
EP (1) EP1050607B1 (de)
AT (1) ATE305988T1 (de)
DE (1) DE60022940D1 (de)
ES (2) ES2166660B1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2383337A (en) * 2001-12-21 2003-06-25 Accentus Plc Electroplating plant and method
US8361290B2 (en) 2006-09-05 2013-01-29 Oerlikon Trading, Ag, Trubbach Coating removal installation and method of operating it
DE102010043206A1 (de) * 2010-11-02 2012-05-03 Robert Bosch Gmbh Beschichtungsvorrichtung und Verfahren zum geregelten galvanischen Beschichten eines Objekts
CN105803512B (zh) * 2016-06-03 2018-01-30 东莞市艺神五金制品有限公司 一种中央阳极电镀设备及电镀方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288298A (en) * 1979-03-14 1981-09-08 Rogers Olbert W Method and apparatus for electroplating or electroforming metal objects
JPH06192866A (ja) * 1992-12-25 1994-07-12 Tokuriki Honten Co Ltd ジシアノ金酸カリウムの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH529843A (fr) * 1971-07-09 1972-10-31 Oxy Metal Finishing Europ S A Bain pour le dépôt électrolytique d'alliages d'or et son utilisation en galvanoplastie
US4075065A (en) * 1975-07-07 1978-02-21 Handy & Harman Gold plating bath and process
DE2852078A1 (de) * 1978-12-01 1980-06-12 Linde Ag Verfahren und vorrichtung zum abkuehlen von erdgas
KR830003601A (ko) * 1979-09-06 1983-06-21 오. 이. 앨버 첨가제가 없는 강금 전기도금 및 그 산물
CA1180674A (en) * 1981-02-17 1985-01-08 Kenneth D. Baker Gold electroplating bath and process

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288298A (en) * 1979-03-14 1981-09-08 Rogers Olbert W Method and apparatus for electroplating or electroforming metal objects
JPH06192866A (ja) * 1992-12-25 1994-07-12 Tokuriki Honten Co Ltd ジシアノ金酸カリウムの製造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Method for lowering free-cyanide concentration in gold-plating baths", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 29, no. 12, 12 May 1987 (1987-05-12), pages 5164 - 5166, XP002213699 *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 547 (C - 1262) 19 October 1994 (1994-10-19) *

Also Published As

Publication number Publication date
ES2166660A1 (es) 2002-04-16
DE60022940D1 (de) 2006-02-16
ES2166660B1 (es) 2003-02-16
EP1050607A2 (de) 2000-11-08
EP1050607B1 (de) 2005-10-05
ATE305988T1 (de) 2005-10-15
ES2250092T3 (es) 2006-04-16

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