EP1030410A1 - Modularstecker mit Leiterrahmeneinsatz - Google Patents

Modularstecker mit Leiterrahmeneinsatz Download PDF

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Publication number
EP1030410A1
EP1030410A1 EP00102284A EP00102284A EP1030410A1 EP 1030410 A1 EP1030410 A1 EP 1030410A1 EP 00102284 A EP00102284 A EP 00102284A EP 00102284 A EP00102284 A EP 00102284A EP 1030410 A1 EP1030410 A1 EP 1030410A1
Authority
EP
European Patent Office
Prior art keywords
support member
terminals
transition
modular jack
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00102284A
Other languages
English (en)
French (fr)
Inventor
Robert E. Marshall
Gregory A. Hull
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Berg Electronics Manufacturing BV
Original Assignee
Berg Electronics Manufacturing BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Berg Electronics Manufacturing BV filed Critical Berg Electronics Manufacturing BV
Publication of EP1030410A1 publication Critical patent/EP1030410A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/717—Structural association with built-in electrical component with built-in light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/717—Structural association with built-in electrical component with built-in light source
    • H01R13/7175—Light emitting diodes (LEDs)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6641—Structural association with built-in electrical component with built-in single component with diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve

Definitions

  • the present invention relates generally to electrical connectors and more particularly to an improved modular jack type connector.
  • Modular jacks are well known in the telecommunications and computer networking fields and are typically employed to connect electrical terminals extending from one electrical device to another device. More specifically, modular jacks are customarily employed to provide an interface between a modular plug terminal and a printed circuit board.
  • a modular jack typically comprises a housing with a plug receiving socket located therein.
  • the plug receiving socket is formed from an entrance surface with a plug receiving orifice therein, two opposing side walls, the internal surfaces of which define the internal side surfaces of the socket, and a top wall joining the two opposing side walls.
  • An opening is formed in the rear end of the housing into which is placed a modular jack insert for carrying electrical contacts.
  • a modular plug terminal upon being inserted into the plug receiving socket, makes electrical contact with the electrical contacts on the modular jack insert.
  • existing modular jack housing and insert is disclosed in U.S. Patent No. 5,759,070.
  • existing modular jack inserts comprise a vertical support member with a top support member extending therefrom. Electrical terminals form a contact area and extend therefrom around a leading edge of the top support member, across the top support member, and down through the vertical support member where the terminals are placed in electrical communication with an electrical device such as a printed circuit board.
  • the terminals of an insert must be spaced apart from one another at a pre-set distance in the contact region so as to be compatible with plug terminators.
  • terminals may be required to be spaced at .040 inch intervals at the contact area.
  • the inter-spacing between terminals at the interface with the printed circuit board may be a pre-set value in order to insure compatibility with printed circuit boards.
  • insert terminals may be spaced at .050 inch intervals at the circuit board contact area. Because terminal spacing is typically greater at the circuit board interconnection in comparison to the contact area, it is necessary to transition the terminals from the first inter-spacing to the second inter-spacing. In existing systems this transition typically takes place along the top support member of the insert.
  • the inter-spacing of terminals across the top support member is non-constant, i.e. the spacing between terminals changes across the length of the top support member.
  • Some applications such as those employing LED's (light emitting diodes) require a constant spacing between terminals and therefore cannot be easily applied to existing modular jack insert designs which have a transition area across the top surface of the terminal.
  • LED's light emitting diodes
  • alternating terminals of the insert are offset from each other at the location where the terminals contact the printed circuit board.
  • the terminals are typically offset prior to being routed through the vertical support portion of the insert.
  • an insert In order to accommodate the routing of terminals through an insert, an insert must often be especially designed and manufactured for through mounted applications as opposed to surface mounted applications. Thus, there is a need in the art for an insert which is capable of being employed in both through-mounted and surface-mounted applications.
  • an improved modular jack insert there is a need in the art for an improved modular jack insert. Specifically, there is a need for an insert providing for a constant inter-spacing of terminals across the top surface of the insert. Further, the insert should be capable of being applied in both through-mounted and surface-mounted embodiments. Finally, there is a need in the art for a modular jack insert which is adaptable for receiving lead frame terminals as opposed to round diameter wire terminals.
  • a modular jack in accordance with the present invention addresses these and other shortcomings in the art.
  • a modular jack in accordance with the present invention comprises a modular housing and a modular jack insert.
  • the modular housing has a plug receiving socket located therein into which is inserted the modular jack insert.
  • the plug receiving socket is formed from an entrance surface with a plug receiving orifice therein, two opposing side walls, the internal surfaces of the two opposing side walls defining internal side surfaces of the plug receiving socket, a top wall joining the two opposing side walls, and a rear end surface having an insert opening therein.
  • the modular jack insert is inserted into the insert opening in the rear end surface of the housing.
  • the modular jack insert comprises a vertical support member, a top support member extending from the vertical support member, and a plurality of terminals extending from the top support member.
  • the vertical support member has a transition surface with a bottom edge.
  • the top support member extends from the vertical support member and has a leading edge as well as a transition edge at an intersection with the transition surface of the vertical support member.
  • the plurality of terminals extend from the leading edge of the top support member, over the transition edge, and along the transition surface of the vertical support member to the bottom edge of the transition surface.
  • the terminals are equidistant spaced from each other at a first equidistant spacing at both the leading edge of the top support member and the transition edge.
  • the terminals are equidistant spaced from each other at a second equidistant spacing at the bottom edge of the transition surface.
  • Figures 1A through 1F provide various views of a modular jack insert in accordance with the present invention.
  • Figures 1A through 1F illustrate a through mounted embodiment of the present invention in which terminals of the modular jack are received into or through a receptacle in a printed circuit board.
  • a surface mounted embodiment of a modular jack in accordance with the present invention is described below with reference to Figures 2A through 2D.
  • jack insert 110 comprises vertical support member 112 and top support member 114.
  • Vertical support member 112 extends vertically from printed circuit board 116 and comprises transition surface 118, bottom surface 120 adjacent to printed circuit board 116, and bottom edge 122 at the intersection of the two surfaces 118 and 120.
  • Top support member 114 extends in a cantilevered fashion from vertical support member 112 and comprises top surface 124 which intersects transition surface 118 at transition edge 126.
  • Terminals 128 extend around leading edge 130 of top support member 114 to provide terminal contact area 132. Terminals 128 extend also over top surface 124 and along transition surface 118 and ultimately terminate in printed circuit board 116.
  • Figure 1B provides a top plan view of modular jack insert 110.
  • top support member 114 extends from leading edge 130 to transition edge 126.
  • Top support member 114 comprises a plurality of leading edge retention members 134 for positioning a plurality of terminals 128 proximate to leading edge 130.
  • eight terminals A, B, C, D, E, F, G, H may be positioned by leading edge retention members 134.
  • Leading edge retention members 134 may comprise raised walls between which are formed channels 136 for receiving terminals 128. The walls or leading edge retention members 134 extend from at or proximate leading edge 130 toward transition edge 126.
  • transition edge retention members 138 for positioning or securing in place terminals 128.
  • transition edge retention members 138 extend from transition surface 118 as described in further detail below with reference to Figure 1C. It should be noted, however, that transition edge retention members could likewise extend from top surface 124 proximate transition edge 126.
  • Leading edge retention members 134 and transition edge retention members 138 provide for positioning terminals on top surface 124 of top support member 114.
  • terminals 128 extend across top surface at equidistant spacing between adjacent terminals. In other words, terminals 128 have a constant pitch across the top surface 124. In one embodiment this equidistant spacing or pitch is .040 inches.
  • the equidistant spacing between terminals 128 is accomplished by forming leading edge retention members 134 at an equidistant spacing.
  • Transition edge retention members 138 are similarly formed at the same equidistant spacing.
  • For each leading edge retention member 134 there exists a corresponding transition edge retention member 138 which is similarly aligned and spaced so as to maintain the equidistant spacing of terminals 128 across top support member 114.
  • the equidistant spacing of terminals 128 across top support member 114 provides an area of modular jack insert 110 for application of LED's and similar devices which may be more easily attached to terminals with a consistent equidistant spacing.
  • Figure 1C provides a plan view of transition surface 118 of vertical support member 112.
  • proximate transition edge 126 are formed a plurality of transition edge retention members 138.
  • Transition edge retention members 138 comprise upstanding walls between which are formed channels 140.
  • Terminals 128 are retained or positioned in channels 140.
  • transition edge retention members 126 are positioned to form channels 140 which correspond to and are aligned with channels 136 formed by leading edge retention members 134.
  • terminals 128 retained or positioned by leading edge retention members 134 and transition edge retention members 138 are equidistant spaced across top surface 124 of top support member 114.
  • Bottom edge retention members 142 are formed proximate bottom edge 122.
  • bottom edge retention members 142 comprise walls upstanding from transition surface 118.
  • Bottom edge retention members 142 extend from at or proximate bottom edge 122 toward transition edge retention members 138.
  • channels 144 for retaining or positioning terminals 128 proximate bottom edge 122.
  • Bottom edge retention members 142 are positioned so as to form channels 144 which are equidistant spaced from each other. The spacing, however, is typically different from the first equidistant spacing between channels 140 provided by transition edge retention members 138.
  • the second equidistant spacing, or pitch at bottom edge 122 is typically larger than the first equidistant spacing at transition edge 126.
  • the equidistant spacing between channels 144 formed by bottom edge retention members 142 is .050 inches. As shown, channels 144 are offset from channels 140 formed by transition edge retention members 138.
  • transition area 146 On transition surface 118 between transition edge retention members 138 and bottom edge retention members 142 is formed transition area 146. In transition area 146 terminals 128 are transitioned from the first equidistant spacing that exists across top surface 124 of top support member 114, to the second equidistant spacing between terminals 128 that exists at bottom edge 122.
  • terminals 128 have barbs 148 formed therein.
  • Barbs 148 are formed to come into contact with bottom retention members 142 when the terminal is inserted into bottom edge retention member 142.
  • barbs 148 have an interference fit with the walls of bottom edge retention member 142 so as to secure terminals 128 in place.
  • modular jack insert 110 shown in Figures 1A through 1F is employed in through-mounted modular jack embodiments. Accordingly, referring to Figure 1A proximate bottom surface 120 alternating terminals B, D, F, and H in the plurality of terminals transition from a first plane adjacent to transition surface 118 to a second plan that is parallel to the first plane but which is offset into vertical support member 112 from transition surface 118. Thus, solder tails of terminals A, C, E, and G extend into printed circuit board 116 at a first plane 150 adjacent to transition surface 118 while solder tails of terminals B, D, F, and H extend into printed circuit board 116 at a second plane 152 offset from transition surface 118.
  • Figures 1D through 1F illustrate the offset area of modular jack insert 110.
  • Figure 1D is shown a cross section of modular jack insert taken at line A-A of Figure 1C.
  • proximate bottom edge 122 offset channel 156 extends from transition surface 118 into vertical support member 112.
  • Offset channel 156 forms a recess in bottom surface 120.
  • the walls of offset channel 156 are formed by the body of vertical support member 112.
  • Figure 1E provides a detailed view of offset channel 156.
  • offset channel is formed at about 90 degrees relative to transition surface 118.
  • terminal 128 representative of terminals B, D, F, and H extends along transition surface 118 and bends away from transition surface 118 into offset channel 156. Thereafter, terminal 128 bends about 90 degrees and extends out of bottom surface 120.
  • terminals B, D, F, and H extends from bottom surface 120 parallel to terminals A, C, E, G but offset by about .100 inches.
  • Figure 1F shows a cross section of modular jack insert 110 taken at line B-B of Figure 1B.
  • Line B-B designates an area of modular jack insert where the terminal is not free to be offset from transition surface 118.
  • vertical support member 112 is solid through bottom surface 120 as indicated by cross hatching.
  • terminals A, C, E, and G extend from bottom edge 122 at transition surface 118.
  • terminals 128 are lead frame as opposed to round diameter wire. Because terminals 128 are generally applied to the exterior of insert 110 and are not routed through the body of insert 110, terminals 128 can comprise lead frame which is readily applied to the exterior of terminal 110.
  • FIGS 2A through 2D illustrate a modular jack insert in accordance with the present invention wherein terminals 128 are surface mounted to the printed circuit board 116. As shown, terminals 128 extend across top surface 124 in a parallel fashion at a constant spacing or pitch across the entire surface 124. After traversing transition surface 118, wherein a transition pitch occurs as described above, in the proximity of bottom edge 122 terminals 128 bend parallel to printed circuit board 116. This is in contrast to the configuration of Figure 1A wherein terminals 128 are mounted into printed circuit board 116.
  • FIGURES 3A and 3B illustrate a modular jack which is essentially identical to the embodiment shown in FIGURES 1A through 1F except that there is a light emitting or conveying source such as light pipes 140 and 142 adjacent the top surface in an outward position relative the terminals.
  • a light emitting or conveying source such as light pipes 140 and 142 adjacent the top surface in an outward position relative the terminals.
  • Such light pipes may be illuminated directly from their rear ends or may alternatively curve downwardly and be illuminated from a lower position.
  • Light Emitting Diodes LED's
  • LED's may be also be positioned in a similar position at the front of the top section outwardly from the terminals.
  • an insert in accordance with the present invention may be manufactured to accommodate any number of terminals.
  • various different types of retention members may employed such as channels, bumps, or ridges.
  • the transition retention members may be attached to either top support member or vertical support member.
  • the pitches at which the terminals are spaced may vary from those mention above. Accordingly, the scope of protection of the following claims is not limited to the presently preferred embodiment disclosed above.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
EP00102284A 1999-02-19 2000-02-17 Modularstecker mit Leiterrahmeneinsatz Withdrawn EP1030410A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25190499A 1999-02-19 1999-02-19
US251904 1999-02-19

Publications (1)

Publication Number Publication Date
EP1030410A1 true EP1030410A1 (de) 2000-08-23

Family

ID=22953893

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00102284A Withdrawn EP1030410A1 (de) 1999-02-19 2000-02-17 Modularstecker mit Leiterrahmeneinsatz

Country Status (6)

Country Link
EP (1) EP1030410A1 (de)
JP (1) JP2000243520A (de)
CN (1) CN1264194A (de)
CA (1) CA2298911A1 (de)
SG (1) SG97846A1 (de)
TW (1) TW444959U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136623B2 (en) 2010-09-03 2015-09-15 Yazaki Corporation Connector

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4210376A (en) * 1978-12-07 1980-07-01 Amp Incorporated Electrical connector receptacle
EP0165490A2 (de) * 1984-05-21 1985-12-27 STEWART STAMPING CORPORATION (a Delaware Corporation) Auf einer gedruckten Schaltungskarte befestigter Aufnahmestecker für einen am Ende eines Kabels befestigten modularen Steckverbinder
US5478261A (en) * 1978-06-14 1995-12-26 Virginia Patent Development Corp. Modular jack for directly coupling modular plug with printed circuit board
EP0692884A1 (de) * 1994-07-14 1996-01-17 Molex Incorporated Modularer Steckverbinder mit verringertem Übersprechen
US5759070A (en) * 1994-11-30 1998-06-02 Berg Technology, Inc. Modular jack insert

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5456619A (en) * 1994-08-31 1995-10-10 Berg Technology, Inc. Filtered modular jack assembly and method of use
US5587884A (en) * 1995-02-06 1996-12-24 The Whitaker Corporation Electrical connector jack with encapsulated signal conditioning components
US5647767A (en) * 1995-02-06 1997-07-15 The Whitaker Corporation Electrical connector jack assembly for signal transmission
US5879199A (en) * 1996-02-29 1999-03-09 Berg Technology, Inc. Modular jack assembly and universal housing for use therein

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478261A (en) * 1978-06-14 1995-12-26 Virginia Patent Development Corp. Modular jack for directly coupling modular plug with printed circuit board
US4210376A (en) * 1978-12-07 1980-07-01 Amp Incorporated Electrical connector receptacle
US4210376B1 (de) * 1978-12-07 1984-03-27
EP0165490A2 (de) * 1984-05-21 1985-12-27 STEWART STAMPING CORPORATION (a Delaware Corporation) Auf einer gedruckten Schaltungskarte befestigter Aufnahmestecker für einen am Ende eines Kabels befestigten modularen Steckverbinder
EP0692884A1 (de) * 1994-07-14 1996-01-17 Molex Incorporated Modularer Steckverbinder mit verringertem Übersprechen
US5759070A (en) * 1994-11-30 1998-06-02 Berg Technology, Inc. Modular jack insert

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136623B2 (en) 2010-09-03 2015-09-15 Yazaki Corporation Connector

Also Published As

Publication number Publication date
JP2000243520A (ja) 2000-09-08
TW444959U (en) 2001-07-01
SG97846A1 (en) 2003-08-20
CA2298911A1 (en) 2000-08-19
CN1264194A (zh) 2000-08-23

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