Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D1/00—Processes for applying liquids or other fluent materials
  • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
  • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
  • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
  • B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
  • B05B12/26—Masking elements, i.e. elements defining uncoated areas on an object to be coated for masking cavities
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D1/00—Processes for applying liquids or other fluent materials
  • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
  • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
  • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work

Definitions

• the present invention relates to the manufacture of cards with integrated circuit (s), commonly called smart cards and, in particular, a method for depositing a layer of mechanical protection varnish on smart cards.
• smart card is meant a portable object, the dimensions of which can be standardized, for example by the ISO 7810 standard, and comprising a microcircuit contained in a module.
• This chip card can have a so-called “contact” operation via a contact terminal block arranged on the front face of the chip card in accordance with ISO 7816 standard or a so-called “contactless” operation, namely by means of electromagnetic waves (radiofrequencies, hyper-frequencies) which make it possible to feed and dialogue with the microcircuit or else a so-called “hybrid” operation, which means that the microcircuit can operate by the two "contact” interfaces and "without touching”.
• Chip cards can be manufactured using a number of processes which can be grouped into two broad categories, colamination and injection.
• Colamination calls for the use of extruded and calendered thermoplastic sheets which are first printed and varnished. These sheets are then "co-laminated” with, optionally, a covering sheet of transparent thermoplastic, usually called “overlay”, which serves as a mechanical protective layer. Colamination consists of welding or hot gluing the different thermoplastic sheets. This operation is often carried out by means of a press comprising two parallel plates by applying a pressure and temperature cycle. The smart card is then cut to standard dimensions in the sheet obtained by colamination. The injection consists in making a smart card body by molding, by injecting the thermoplastic into a metal mold. This operation makes it possible to obtain a chip card with standardized dimensions from the start. In this case, the printing and varnishing operations are carried out thereafter.
• the covering layer makes it possible to obtain a thickness sufficient for the mechanical protection of the smart card against abrasion, but there often occurs phenomena of peeling, or "delamination", of the protective layer.
• the colamination process has a high cost price.
• the offset process makes it possible to deposit only a few microns, from 1 to 5, of varnish comprising 100% of dry extract and crosslinking, under the effect of ultraviolet radiation, on the chip card.
• Screen printing allows to deposit a layer whose thickness is between 1 and 10 microns of protective varnish on the smart card. Varnishes cross-linking with ultraviolet radiation or in the aqueous phase or with a solvent. Depending on the type of varnish, the thickness obtained is limited to 1 to 10 microns.
• the problem underlying the invention is to provide a method which makes it possible to obtain a layer of protective varnish whose thickness is greater without using the method of the overlay layer by colamination.
• the subject of the invention is a method of depositing a layer of mechanical protection varnish on a chip card comprising a cavity intended to receive a module comprising a microcircuit, characterized in that the varnish is sprayed by means of at least one spray gun supplied with pressurized varnish and pressurized air during a relative movement of the smart card and of the spray gun (s).
• This method known per se, of spraying consists in spraying varnish by passing it under pressure, by the action of air under pressure, in a "gun” provided with a nozzle which sprays the varnish in the form of very fine droplets.
• This spraying process allows a thickness of varnish of between 1 and 40 microns to be deposited on a smart card body.
• This range of thickness which could not previously be obtained, makes it possible to produce smart cards having improved abrasion resistance without using of an overlay which is obtained by . an expensive colamination process and often deteriorates by
• the invention makes it possible to double abrasion resistance compared to conventional processes by offset or screen printing.
• This spraying can advantageously be carried out in continuous mode in a spraying installation comprising several stations, the smart cards moving continuously in front of the different stations.
• the spraying is carried out in step-by-step mode in a spraying installation comprising several stations, the smart cards moving so sequential between different positions.
• a varnish can be used for drying by evaporation of solvent and drying is then carried out by infrared radiation.
• a crosslinkable two-component varnish can be used and drying is carried out by infrared radiation. It is also possible to use a varnish crosslinked by ultraviolet radiation and drying is carried out by ultraviolet radiation.
• the varnish may contain a solvent and drying is carried out by infrared radiation.
• the invention also relates to an installation for the implementation of the above method, characterized in that it comprises a loading station in which the cards to chip are placed on a support, a varnishing station comprising at least one spray gun, a drying and / or crosslinking varnish station, and an unloading station in which the smart cards are removed from their support and put in Battery.
• This installation may include a masking station arranged after the loading station and a masking station arranged before the drying and / or crosslinking station.
• a masking station arranged after the loading station and a masking station arranged before the drying and / or crosslinking station.
• This cleaning is done with brushes and solvent, and the masks are clean and ready for new use when they return to the masking station.
• the cards are extracted from their support and transferred to a conveyor belt and the supports pass through a cleaning module then are returned to the loading station.
• the cleaning is carried out using brushes and solvent and this makes it possible to avoid the cleaning of the supports after the drying and the crosslinking of the varnish and, consequently, to reduce the cost price.
• FIG. 3 is a side view of the varnishing station
• - Figure 4 is a top view of the varnishing station;
• - Figure 5 illustrates, in top view, the transfer of smart cards;
• - Figure 6 illustrates, in side view, the transfer of smart cards
• - Figure 7 illustrates the principle of masking the cavity receiving the module
• FIG. 9 is a schematic representation of a varnishing installation according to the invention.
• FIGS 1 and 2 illustrate the principle of varnish deposition by spraying.
• a spray gun has a nozzle 10 which is supplied with varnish under pressure and by compressed air and it projects a conical jet 12 of very fine droplets of varnish onto a smart card 14.
• the gun moves in translation by compared to the smart card 14 either along the longitudinal axis of the latter ( Figure 1), or along its transverse axis ( Figure 2).
• the diameter of the jet is adapted to the movement carried out so as to cover the entire width (FIG. 1) or the entire length (FIG. 2) of the smart card.
• the thickness of the varnish deposit can be adjusted by acting on one or more of the following parameters:
• the varnishing is carried out in an installation which is shown diagrammatically in FIG. 9. It comprises six stations in sequence, a card loading station 50, a masking station 52, which is optional, a varnishing station 54, a unmasking 56, which is optional, a drying and crosslinking station 58 and a card unloading station 60.
• the complete operation can be done in continuous mode, the smart card moving continuously at an adjustable speed and known to pass in front of the various stations.
• a mask In the case where it is necessary not to deposit varnish in the cavity which must receive the module comprising the microcircuit which is fixed there by gluing, a mask must be provided as illustrated in FIGS. 7 and 8.
• the mask is constituted by a metal "pin" 16 which has the same shape and the same dimensions as the cavity 18 provided in the smart card 20.
• This pin 16 is provided with a gripping rod 22. It can be produced by means of electrochemical processes or by any other process making it possible to obtain a reliable and precise reproduction of the shape of the cavity 18, for example by machining.
• the optional masking stations 52 and unmasking stations 56 are then provided, which are respectively arranged before and after the varnishing station 54.
• the masking pin 16 is placed in the cavity 18 just before depositing the varnish and it is removed therefrom right after.
• the masking pins 16 are removed from the cavity and are placed on a conveying system.
• the masking pins are then cleaned with brushes and solvent to be returned clean to the masking station to be used there again, as shown diagrammatically at 62 in FIG. 9.
• the cards 20 are taken in a stack and are placed on an appropriate support 24 (see FIGS. 3, 5 and 6). These supports 24 can carry several cards and they must not hinder the deposition of the varnish, no shadow zone masking the spray of varnish 12.
• the varnishing station 54 is shown in FIGS. 3 and 4. It has a movable vertical arm 26 which moves in horizontal translation perpendicular to the direction of movement of the cards 20 and which carries two spray guns 28.
• a device for air extraction shown diagrammatically by the arrows 36 and comprising a filter 30 is disposed on the side of the spray guns 28 parallel to the direction of movement of the cards 20. This extraction device makes it possible to evacuate the components of the varnish which does not settle on the cards (varnish mist).
• the arrow 32 designates the direction of movement of the cards 20 and the arrows 34 the direction of movement of the arm 26.
• the varnishing station 54 includes a device for supplying air to the guns, such as compressed air or a turbine.
• a diaphragm pump supplies varnish to the guns. It is also possible to use any other device allowing a supply of varnish with the possibility of adjusting the flow rate.
• the varnishing can be done in continuous mode or in step by step mode.
• the supports 24 advance continuously at an adjustable speed.
• the width of the spray must be adjusted to cover the entire area of movement of the support 24 during the varnishing period.
• This operation can be carried out with one or more guns which can carry out several passes.
• the thickness of the varnish deposit can be adjusted by acting on one or more of the parameters mentioned.
• the varnish deposition operation is carried out in step-by-step mode.
• the support 24 for the cards 20 advances to the height of the arm 26 and stops.
• the gun 28 is open and the arm 26 sweeps the support 24 over its entire length, the width of the varnish jet 12 being adjusted to cover the entire width of the support.
• the arm 26 returns to the initial rest position and the support 24 advances to the next position.
• FIGS 5 and 6 show the transfer operation.
• the support 24 provided with the cards 20 arrives at the level of receiving belt conveyors 40 which are arranged facing the cards 20 in the direction of movement of the cards 32.
• These receiving belts 40 deposit the cards 20 on a conveyor belt 42 which bring them to the drying and crosslinking station 58.
• This transfer operation is carried out after passing through the unmasking station 56 in the case where masking pins are used.
• the drying and crosslinking station 58 comprises a conveyor belt which moves in front of an infrared radiation drying module whose power is adjustable.
• the drying time can be adjusted by also adjusting the speed of the conveyor belt.
• This infrared module allows the extraction of solvents from the varnish and the crosslinking of crosslinkable two-component varnishes.
• the drying and crosslinking station 58 may also include an ultraviolet radiation drying module with the possibility of adjusting the power of the ultraviolet lamp and the drying time by acting on the speed of the conveyor belt.
• This ultraviolet module allows the crosslinking of crosslinking varnishes by ultraviolet radiation.
• the last station is an unloading station 60 in which the cards 20 are grouped in stacks after the varnish has dried.
• the invention makes it possible to obtain, at a low cost price, a layer of protective varnish whose thickness can range up to 40 micrometers. Such a thickness makes it possible to double the abrasion resistance, and, consequently, the lifetime of the smart cards compared to known protection techniques.
• This protective layer is more reliable than the overlay, since it does not present the risk of "delamination” that occurs for the latter and the invention therefore makes it possible to obtain smart cards with a long service life by using the colamination technique.
• the installation according to the invention makes it possible to use any type of varnish, in particular varnishes crosslinking by ultraviolet radiation.
• This installation can easily be adapted to manufacturing with masking by adding two additional stations before and after the varnishing station.

Landscapes

• Coating Apparatus (AREA)
• Non-Metallic Protective Coatings For Printed Circuits (AREA)
• Application Of Or Painting With Fluid Materials (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=9510324

Family Applications (1)

Country Status (5)

Families Citing this family (1)

Family Cites Families (3)

• 1997
  • 1997-08-07 FR FR9710405A patent/FR2767076A1/fr active Pending
• 1998
  • 1998-08-07 CN CN98807752A patent/CN1266385A/zh active Pending
  • 1998-08-07 WO PCT/FR1998/001771 patent/WO1999007482A1/fr not_active Application Discontinuation
  • 1998-08-07 AU AU90746/98A patent/AU9074698A/en not_active Abandoned
  • 1998-08-07 EP EP98942714A patent/EP1007224A1/de not_active Withdrawn

Non-Patent Citations (1)

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