EP0995808A4 - Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold - Google Patents

Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Info

Publication number
EP0995808A4
EP0995808A4 EP99939202A EP99939202A EP0995808A4 EP 0995808 A4 EP0995808 A4 EP 0995808A4 EP 99939202 A EP99939202 A EP 99939202A EP 99939202 A EP99939202 A EP 99939202A EP 0995808 A4 EP0995808 A4 EP 0995808A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
metal mold
thin sheet
improved wear
exhibiting improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99939202A
Other languages
German (de)
French (fr)
Other versions
EP0995808B1 (en
EP0995808A1 (en
Inventor
Akihito Mori
Takeshi Suzuki
Tadao Sakakibara
Yoshiharu Mae
Keishi Nogami
Yutaka Koshiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP15454598A external-priority patent/JP4186199B2/en
Priority claimed from JP4432299A external-priority patent/JP4186201B2/en
Application filed by Mitsubishi Shindoh Co Ltd, Mitsubishi Materials Corp filed Critical Mitsubishi Shindoh Co Ltd
Publication of EP0995808A1 publication Critical patent/EP0995808A1/en
Publication of EP0995808A4 publication Critical patent/EP0995808A4/en
Application granted granted Critical
Publication of EP0995808B1 publication Critical patent/EP0995808B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
EP99939202A 1998-03-10 1999-03-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold Expired - Lifetime EP0995808B1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP5798998 1998-03-10
JP5798998 1998-03-10
JP15454598 1998-06-03
JP15454598A JP4186199B2 (en) 1998-06-03 1998-06-03 Copper alloy with excellent die wear resistance, repeated bending fatigue resistance and solderability
JP4432299A JP4186201B2 (en) 1998-03-10 1999-02-23 Copper alloy and copper alloy thin plate with excellent die wear resistance and resin adhesion
JP4432299 1999-02-23
PCT/JP1999/001116 WO1999046415A1 (en) 1998-03-10 1999-03-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Publications (3)

Publication Number Publication Date
EP0995808A1 EP0995808A1 (en) 2000-04-26
EP0995808A4 true EP0995808A4 (en) 2006-04-12
EP0995808B1 EP0995808B1 (en) 2009-08-26

Family

ID=27291858

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99939202A Expired - Lifetime EP0995808B1 (en) 1998-03-10 1999-03-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Country Status (7)

Country Link
EP (1) EP0995808B1 (en)
KR (1) KR100562790B1 (en)
CN (1) CN1102177C (en)
DE (1) DE19980583T1 (en)
HK (1) HK1028425A1 (en)
TW (1) TW442576B (en)
WO (1) WO1999046415A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2783336B1 (en) 1998-09-11 2001-10-12 Schlumberger Ind Sa DATA TRANSMISSION METHOD AND CARD FOR SUCH TRANSMISSION
JP3918397B2 (en) 2000-04-11 2007-05-23 三菱マテリアル株式会社 Adhesion-resistant oxygen-free copper rough wire, its manufacturing method and manufacturing apparatus
KR100415959B1 (en) 2000-03-14 2004-01-24 닛코 킨조쿠 가부시키가이샤 Copper alloy foil for hard disc drive suspension
DE10240777A1 (en) * 2002-08-30 2004-03-11 Röhm GmbH & Co. KG Wasserkalibrator
JP3999676B2 (en) * 2003-01-22 2007-10-31 Ｄｏｗａホールディングス株式会社 Copper-based alloy and method for producing the same
JP5866411B2 (en) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 Copper alloy sheet and method for producing copper alloy sheet
JP5866410B2 (en) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 Copper alloy sheet and method for producing copper alloy sheet
CN103952587B (en) * 2014-04-30 2016-02-03 北京科技大学 A kind of complex phase Cu alloy material and preparation method thereof
CN104481420B (en) * 2014-09-22 2016-08-03 铁岭米勒石油新材料有限公司 A kind of Novel sucker rod box cupling and preparation technology thereof
CN105400988A (en) * 2015-11-10 2016-03-16 太仓捷公精密金属材料有限公司 Copper alloy metallic material
CN105543538A (en) * 2015-12-23 2016-05-04 常熟市三荣装饰材料有限公司 Goods shelf
CN105908008A (en) * 2016-06-25 2016-08-31 聂超 Ship propeller high-strength casting material and casting process thereof
CN106244949A (en) * 2016-08-01 2016-12-21 宁波达尔机械科技有限公司 A kind of rolling bearing inner ring alloy material and preparation method thereof
CN106381417A (en) * 2016-11-15 2017-02-08 扬州丰泽轨道交通科技有限公司 Carbon brush holder for high-speed railway and manufacturing method thereof
CN107805731A (en) * 2017-10-23 2018-03-16 江苏都盛科技发展有限公司 A kind of new alloy material for electric heater
CN115747558A (en) * 2022-11-17 2023-03-07 安徽鑫科铜业有限公司 Copper alloy strip for integrated circuit lead frame and manufacturing method and application thereof

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180893A (en) * 1967-06-26 1970-02-11 Olin Mathieson Copper Base Alloy.
US3522039A (en) * 1967-06-26 1970-07-28 Olin Mathieson Copper base alloy
US3522038A (en) * 1967-06-26 1970-07-28 Olin Corp Copper base alloy
US4668471A (en) * 1985-05-08 1987-05-26 Mitsubishi Shindoh Co., Ltd. Copper alloy lead material for leads of a semiconductor device
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPH02111850A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacture of copper alloy for lead frame
JPH02111829A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Copper alloy for lead frame
JPH02111828A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacture of copper alloy for lead frame
EP0384260A1 (en) * 1989-02-21 1990-08-29 Mitsubishi Shindoh Co., Ltd. Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated
JPH0441631A (en) * 1990-06-04 1992-02-12 Mitsubishi Shindoh Co Ltd High strength cu alloy for lead frame of semiconductor device
JPH07242965A (en) * 1994-03-03 1995-09-19 Mitsubishi Materials Corp Copper alloy excellent in plating property and electrical conductivity and thin sheet or strip constituted of the same copper alloy
EP0767244A1 (en) * 1995-08-10 1997-04-09 Mitsubishi Shindoh Co., Ltd. High-strength copper based alloy free from smutting during pretreatment for plating
JPH1017956A (en) * 1996-06-27 1998-01-20 Mitsubishi Materials Corp Method for inoculating c into molten ferrum-containing copper alloy

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270541A (en) * 1985-09-20 1987-04-01 Mitsubishi Metal Corp Cu-alloy lead material for semiconductor device
JPS6293325A (en) * 1985-10-18 1987-04-28 Mitsubishi Shindo Kk Cu alloy lead material for semiconductor device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180893A (en) * 1967-06-26 1970-02-11 Olin Mathieson Copper Base Alloy.
US3522039A (en) * 1967-06-26 1970-07-28 Olin Mathieson Copper base alloy
US3522038A (en) * 1967-06-26 1970-07-28 Olin Corp Copper base alloy
US4668471A (en) * 1985-05-08 1987-05-26 Mitsubishi Shindoh Co., Ltd. Copper alloy lead material for leads of a semiconductor device
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPH02111850A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacture of copper alloy for lead frame
JPH02111829A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Copper alloy for lead frame
JPH02111828A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacture of copper alloy for lead frame
EP0384260A1 (en) * 1989-02-21 1990-08-29 Mitsubishi Shindoh Co., Ltd. Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated
JPH0441631A (en) * 1990-06-04 1992-02-12 Mitsubishi Shindoh Co Ltd High strength cu alloy for lead frame of semiconductor device
JPH07242965A (en) * 1994-03-03 1995-09-19 Mitsubishi Materials Corp Copper alloy excellent in plating property and electrical conductivity and thin sheet or strip constituted of the same copper alloy
EP0767244A1 (en) * 1995-08-10 1997-04-09 Mitsubishi Shindoh Co., Ltd. High-strength copper based alloy free from smutting during pretreatment for plating
JPH1017956A (en) * 1996-06-27 1998-01-20 Mitsubishi Materials Corp Method for inoculating c into molten ferrum-containing copper alloy

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 318 (C - 0738) 9 July 1990 (1990-07-09) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 219 (C - 0943) 22 May 1992 (1992-05-22) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 01 31 January 1996 (1996-01-31) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) *
See also references of WO9946415A1 *

Also Published As

Publication number Publication date
TW442576B (en) 2001-06-23
EP0995808B1 (en) 2009-08-26
EP0995808A1 (en) 2000-04-26
WO1999046415A1 (en) 1999-09-16
CN1256715A (en) 2000-06-14
KR100562790B1 (en) 2006-03-21
KR20010012450A (en) 2001-02-15
CN1102177C (en) 2003-02-26
HK1028425A1 (en) 2001-02-16
DE19980583T1 (en) 2000-04-13

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