EP0954881A1 - Optoelectric voltage-phase switch using photodiodes - Google Patents

Optoelectric voltage-phase switch using photodiodes

Info

Publication number
EP0954881A1
EP0954881A1 EP97950833A EP97950833A EP0954881A1 EP 0954881 A1 EP0954881 A1 EP 0954881A1 EP 97950833 A EP97950833 A EP 97950833A EP 97950833 A EP97950833 A EP 97950833A EP 0954881 A1 EP0954881 A1 EP 0954881A1
Authority
EP
European Patent Office
Prior art keywords
light
photodiode
voltage
switch
photodiodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97950833A
Other languages
German (de)
French (fr)
Inventor
Alan Y. Chow
Vincent Y. Chow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0954881A1 publication Critical patent/EP0954881A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors

Definitions

  • This invention relates in general to a voltage-phase optoelectronic switch (referred to as an "opsistor”), and in particular to a wavelength-controllable opsistor (referred to as an "OPS-F”) fabricated as a monolithic integrated circuit with capabilities of extremely rapid switch frequencies, high resistance to external noise and interference, precise optical position sensing, and long-distance signal sensing.
  • opsistor voltage-phase optoelectronic switch
  • OPS-F wavelength-controllable opsistor
  • This invention also relates to several applications of the opsistor and OPS-F of this invention including long-distance open-air data transmission devices; high-speed fiber optic data transmission devices; the basic logic and/or memory unit of a hybrid optoelectronic based state machine; high resolution optical encoders; and sensitive edge and target sensors that are useful for image and pattern recognition applications; information transfer devices when a physical electrical interconnect is not practical such as to and from moving devices.
  • Many other optical switch applications may benefit from the opsistor.
  • optical switches were typically based on optosensors
  • circuitry increase the complexity and cost of such devices. Further, the transmitter and
  • Another aspect of the present invention is a new
  • wavelength-controllable opsistor that allows voltage-phase switch events of the
  • the opsistor to be controlled by light.
  • the opsistor is comprised of
  • cathode of the first photodiode is electrically connected via a second conductor to the
  • the voltage-phase of the opsistor (positive or negative) is signal controlled by relative illumination changes to the two photodiodes
  • the voltage-phase of the opsistor is
  • TM2 transmitter
  • HSFODT high-speed fiber optic data transmission
  • opsistor high speed, high-sensitivity, high noise resistance, high linear discrimination, and long transmitter-receiver distance.
  • the opsistor in its most basic form comprises two inverse parallel
  • photodiodes (the "first” and the “second” photodiode) disposed in close proximity
  • photodiode is electrically connected to the cathode of the second photodiode via a
  • the cathode of the first photodiode is electrically connected to the anode of the second photodiode via a second common conductor.
  • the voltage-phase will be of the opposite direction. In comparison to the
  • the voltage-phase of the opsistor is actively driven by its two opsistor photodiodes and
  • OPS-F is controllable by varying the illumination balance of the first and second
  • the first and second bandwidth light sources can include light emitting diodes (“LED”s) and/or lasers either of which are LEDs.
  • inventions are many, and include, high-speed optocouplers and optoisolators used for
  • artificial retina devices are designed to restore vision to certain blind individuals by
  • the opsistor In its use as the receiving unit of a high speed optocoupler, the opsistor
  • the intensity of two transmitter light sources providing signal to the two opsistor photodiodes is driven by varying the intensity of two transmitter light sources providing signal to the two opsistor photodiodes. This is accomplished by using two LEDs or lasers each positioned over one of the two photodiode subunits, each driven by a signal source.
  • each transmitter is closer to one of the opsistor photodiodes, each transmitter will preferentially stimulate the photodiode that it is closest to. In this manner, small
  • Figure 1 is a schematic diagram of the basic opsistor according to the
  • FIG. 2 is a schematic diagram of the OPS-F according to the second
  • Figure 3 is a plan view of the OPS-F constructed as a monolithic
  • Figure 4 is a three-dimensional section view of the OPS-F constructed as a monolithic integrated circuit according to the second preferred embodiment of the present invention taken along the plane of line IV-IV of FIG. 3;
  • FIG. 5 is a diagram illustrating a TM2/OPS-F combination used for long-distance open-air data transmission ("LDOADT");
  • Figure 6 is a diagram illustrating a TM2/OPS-F combination used in
  • Figure 7a is a cross-sectional diagram of a TM2/OPS-F monolithic
  • Figure 7b is a diagram illustrating the laser write of a OPS-F disposed
  • the laser write changing the voltage-phase state of the OPS-F to one of three states of the tri-state
  • Figure 8 is a diagram illustrating two opsistors used as the
  • Figures 9A-C are diagrams illustrating an opsistor disposed on a
  • LOPS linear optical position sensor
  • Figure 10 is a diagram illustrating a first thin substrate opsistor-based
  • opsistor-based LOPS rotated at 90 degrees relative to the first LOPS to produce a
  • the opsistor (10) (Fig. 1) comprises two PIN photodiodes, the first photodiode (12) and the second photodiode (14), electrically connected in an inverse parallel
  • cathode of the first photodiode (12) is connected to the anode of the second photodiode (14) via a second common conductor (18).
  • the second photodiode (14) is represented by the arrows (26).
  • photodiodes (12,14) produces a higher voltage which is dependent on the relative
  • the first output terminal (20) will be positive and the voltage-phase measured from the
  • a preferred embodiment is a bandwidth-filtered opsistor ("the OPS-F") (30).
  • the OPS-F (30) comprises two PIN photodiodes (32,34), the first photodiode (32) filtered with the first bandwidth-portion filter (33), and the second
  • photodiode (34) filter with the second bandwidth-portion filter (35), electrically
  • first bandwidth-portion filter (33) passes a different bandwidth of transmitter signal
  • the OPS-F (30) is measured from the first output terminal (40) and the second output
  • first photodiode (32) is represented by the arrows (44).
  • second photodiode (42) is represented by the arrows (44).
  • bandwidth-portion signal light source (“WPSLS-2")(46) to the second photodiode (34)
  • photodiode (32, 34) responds only to its own specific bandwidth of light, WPSLS-1
  • photodiode (32) receives a greater illumination from WPSLS-1 (44) and thus produces a higher voltage than the second photodiode (34) being illuminated by PSLS-2 (46), then the voltage-phase measured from the first output terminal (40) will be negative
  • first output terminal (40) will be positive and the voltage-phase measured from the
  • the OPS-F device (30) is constructed
  • the OPS-F (30) consists of two PIN photodiodes
  • first photodiode (32) is electrically connected to the anode (34a) of the second photodiode (34) via a first common conductor (36), and the anode (32a) of the first
  • photodiode (32) is connected to the cathode (34c) of the second photodiode (34) via a
  • the first bandwidth-portion filter (33) passes a different bandwidth of stimulating light than the second bandwidth-portion filter (35).
  • the voltage-phase developed by the OPS-F (30) is measured from the first common
  • the voltage-phase developed at the common conductors (36,38) is determined by which of the two photodiodes (32,34) produces a higher voltage which
  • the illumination of the entire OPS-F (30) contains a
  • P+ surface (40) of the first photodiode (32) has its anode (32a) deposited around the
  • the P+ surface (42) of the second photodiode (34) has its anode (34a) deposited around the
  • silicon may also be use as a starting monolithic silicon substrate by altering the fabrication of the OPS-F's photodiodes. As illustrated in Fig. 4, the construction of the OPS-F (30) follows
  • N-region (60) are fabricated in close proximity to each other in the starting undoped
  • a first N+ region (52), and a second N+ region (62) are then fabricated
  • doped P-region (48) and a second heavily doped P-region (56) are then fabricated in
  • a first intrinsic layer is first intrinsic layer
  • intrinsic layer (58) then forms at the junction of the P-region (56) and the N-region
  • a first P+ region (40) is then fabricated in the first P-region (48), and a second
  • P+-region (42) is then fabricated in the second P-region (56).
  • a first metallic cathode (32c) is deposited on the entirety of the first N+ region (52) to permit a large
  • wavelength-portion filter (35) which in the preferred embodiment is a multilayer
  • Filter layers (33,35) each pass a different bandwidth of light within the
  • the first filter layer (33) has a bandwidth pass
  • the second filter layer (35) has a bandwidth pass from
  • a silicon dioxide insulating layer (70) is fabricated on the areas of the
  • common conductor (36) is then deposited to connect the first cathode (32c) to the second anode (34a), and a second common conductor (38) is deposited to connect the
  • FIG. 5 illustrates a TM2/OPS-F combination used for long-distance open-air data transmission (“LDOADT”) with characteristic high resistance to
  • the TM2 (70) is provided signal coding and powered by the transmitter (72).
  • the WPSLS-1(44) and the WPSLS-2 are provided signal coding and powered by the transmitter (72).
  • TM2 examples include LEDs, lasers, or any light source capable of producing
  • bandwidth signal light (“WPSL-2”) (76), is highly resistant to common mode noise
  • the TM2 signal (78) is sensed by the OPS-F (30) and differentially converted
  • OPS-F (30) is decoded and reconstructed by a receiver (86) in an industry standard manner.
  • OPS-F receiver may receive serial communication
  • a subcutaneously implanted OPS-F sensor may receive serial communications via an external TM2 transmitter to provide power and programming to an implanted drug delivery pump.
  • a transmission LED is modulated at a carrier
  • a carrier frequency approximately 15X higher than the target data rate or baud rate.
  • the maximum data rate reliably received is limited by
  • the TM2/OPS-F combination uses an active
  • This TM2 bi-phasic drive system transmits two wavelengths alternately to produce the effect of a carrier signal at
  • GREEN is ON during the positive excursion of the carrier and RED is
  • FIG. 6 illustrates a TM2/OPS-F combination used for High-Speed
  • the TM2 (70) is provided signal
  • TM2 examples include LEDs, lasers, or any light source capable of producing
  • the TM2 digital signal (78) comprised of the first bandwidth signal light (“WPSL-1”) (74) and the second
  • bandwidth signal light (WPSL-2) (76) is highly resistant to fiber attenuations such as
  • the TM2 signal (78) is sensed by the OPS-F (30) and differentially converted into positive or negative voltage-phase signals by the first photodiode (32) and the second photodiode (34) of
  • the voltage-phase developed by the OPS-F (30) is decoded and
  • the S/N ratio of a fiber link can be improved upon compared to the current
  • a DC-coupled amplifier can be used that eliminates many capacitor-related issues (e.g., phase and time delays) for processing ultra-fast signals. Balanced detection also eliminates the
  • application may be usage of a lower grade fiber for connection into single family homes that satisfies the required data bandwidth but has higher cost effectiveness.
  • Figure 7a is a is a cross-sectional diagram of a TM2/OPS-F monolithic
  • optical fiber link used in an optoelectronic based state machine.
  • preferably is composed of amorphous silicon LEDs, is fabricated within the monolithic
  • the OPS-F (30) is also fabricated within the monolithic silicon substrate (92) using techniques standard to the industry. Digital
  • informational data is optically transmitted from a TM2 (70) to a target OPS-F (30) via
  • micro-optical fiber light conduit (90) fabricated upon the silicon substrate (92) using
  • Figure 7b illustrates a laser write of a OPS-F subunit (30a) disposed as
  • OPS-F (30) is used as the basic switch component of an optoelectronic based state
  • the TM2 laser beam (94) can rapidly write
  • OPS-F based optoelectronic state machine functions in the
  • a state machine performs a specific function determined
  • Field programmable logic silicon devices such as gate arrays, and one-time programmable devices are state machines
  • UV-erasable OTP the computer chip is "dormant" after erasure but becomes
  • the OPS-F device of this invention also has a
  • toggle switch When OPS-F receiver is activated by TM2 light transmission, the switch can "toggle” to the UP or DOWN position for logic 1 (positive voltage vector)
  • the OPS-F is the
  • FIFO First In First Out
  • the entire state machine can be quickly reprogrammed for functionality as the
  • the OPS-F "building block” permits integration of many "smart state machine” blocks
  • a "smart state machine” block can, for example, change from a
  • TM2/OPS-F combination over the present art include: (1) faster optocoupler
  • fluids may surround the silicon, and (4) field programmable devices where isolation
  • the photo-sensing portion (101) within an optical encoder utilizing the device of this invention employs a first opsistor (30) and a
  • the first opsistor (30) has a first
  • the second opsistor (100) has a first photodiode subunit (102) designated “E”, and a second photodiode subunit (104) designated "F”.
  • the slot widths (106) are thus functionally split into two portions each.
  • two-slot, two-opsistor quadrature encoder can achieve twice the resolution of the same encoder using two standard photodiodes.
  • FIGS. 9a-9c illustrate the opsistor of the present invention used as a
  • photodiode subunits (32, 34) which may be fabricated together very closely on a monolithic silicon substrate, the opsistor's rejection of common mode attenuations
  • micro-beam balances include micro-beam balances, optical alignment applications, motion
  • Figures 10 A-C illustrate a two-dimensional target sensor (130)
  • LOPS opsistor consisting of photodiode subunits (112, 114), which is fabricated
  • Such a target sensor (130) uses one LOPS opsistor sensor (110, 120) for each axis of position sensing of a light target (94). Characteristics and quality of such
  • a two-dimensional target sensor (130) include simple fabrication and minimal
  • dead-spot area in additional to all of the characteristics of the single LOPS sensor.
  • Uses of such a LOPS device include those requiring high precision two-dimensional

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Transform (AREA)

Abstract

A wavelength-portion controllable optoelectronic switch ('Opsistor') capable of rapid switch frequencies fabricated as a monolithic integrated circuit is disclosed. The Opsistor is comprised of two inverse parallel photodiodes in close proximity, preferably on a monolithic silicon substrate, such that the anode of one photodiode is electrically connected via a first conductor to the cathode of the second photodiode, and the cathode of the first photodiode is electrically connected via a second conductor to the anode of the second photodiode. The voltage-phase of the Opsistor is determined by the relative illumination of the Opsistor's two photodiodes and is rapidly switchable. Applications suitable for the Opsistor include high speed optocouplers, linear optical position sensors, edge and target detection sensors, image recognition sensors, the basic subunits of optically based state computers, and high resolution optical encoders.

Description

OPTΌEI_,ECTRIC VOLTAGE-PHASE SWITCH USING PHOTODIODES
BACKGROUND OF THE INVENTION
This invention relates in general to a voltage-phase optoelectronic switch (referred to as an "opsistor"), and in particular to a wavelength-controllable opsistor (referred to as an "OPS-F") fabricated as a monolithic integrated circuit with capabilities of extremely rapid switch frequencies, high resistance to external noise and interference, precise optical position sensing, and long-distance signal sensing. This invention also relates to several applications of the opsistor and OPS-F of this invention including long-distance open-air data transmission devices; high-speed fiber optic data transmission devices; the basic logic and/or memory unit of a hybrid optoelectronic based state machine; high resolution optical encoders; and sensitive edge and target sensors that are useful for image and pattern recognition applications; information transfer devices when a physical electrical interconnect is not practical such as to and from moving devices. Many other optical switch applications may benefit from the opsistor. Previously, optical switches were typically based on optosensors
consisting of a single photodiode, phototransistor, photodarlington, and the like are two-state, current-driven devices that have an "on" or "off" current state. For applications such as optocouplers and optoisolators, these devices responded to an "on" or "off" pre-couple signal with a corresponding "on" or "off' post-couple current-signal. The inherent speed of such devices was limited by the rate at which they could switch their currents "on" and "off," the limiting factor often being the passive return-to-ground period. Also for an "on" current state to be recognized, the
current had to be at a significantly greater amplitude than background noise.
However, the higher the signal current that was needed to generate this recognition,
the longer it would take for the switch device to generate that current level, and the even longer period before the switch device would return to the ground level. These
characteristics of previous optoelectronic switches resulted in relatively slow switching
speeds of usually less than 1 MHz for a standard photodiode, and even slower speeds
for more complicated devices such as phototransistors. Although optoelectronic switches can be designed to respond with
faster switch frequencies by using special circuitry, the additional components of such
circuitry increase the complexity and cost of such devices. Further, the transmitter and
receiving elements of fast optoelectronic switches have to be in close proximity,
usually in a single package, for efficient function and to minimize extraneous light
interference.
SUMMARY OF THE INVENTION
One aspect of the present invention (the "opsistor") that addresses the
limitations of prior optical switches is the use of active voltage-phase shifts to signal switch events. Another aspect of the present invention is a new
wavelength-controllable opsistor that allows voltage-phase switch events of the
opsistor to be controlled by light. In its most basic form, the opsistor is comprised of
two inverse parallel photodiodes in close proximity (preferably disposed close together on a monolithic substrate) such that the anode of a first photodiode is electrically connected via a first conductor to the cathode of the second photodiode, and the
cathode of the first photodiode is electrically connected via a second conductor to the
anode of the second photodiode. The voltage-phase of the opsistor (positive or negative) is signal controlled by relative illumination changes to the two photodiodes
and is rapidly switchable. In addition, by using a different light bandwidth pass-filter
for each of the two opsistor photodiodes (each pass-filter passing a different
bandwidth of light from the other pass-filter), the voltage-phase of the opsistor is
rapidly switchable by utilizing small changes in illumination of the two different
bandwidths of signaling light matched to the bandwidth response of each of the two
opsistor photodiodes. This characteristic an opsister with photodiodes that respond to
different bandwidths, allows wavelength-controlled switching using a signal-controlled
transmitter ("TM2") that produces light signals of the two specified wavelengths at
substantially greater transmitter-receiver distances than is possible with standard
optocouplers. Applications for the opsistor include long-distance open-air data
transmission ("LDOADT") that has high resistance to background noise, and is capable
of high data transmission rates; high-speed fiber optic data transmission ("HSFODT")
that has high resistance to background noise, and is capable of long-distance and high
data transmission rates through non-premium optical fibers; the basic logic and/or memory unit of an optical/electronic based computer; high resolution optical encoders;
sensitive edge and target sensors that are useful for image and pattern recognition
applications; information transfer when a physical electrical interconnect is not practical such as to and from moving devices, artificial vision retinal stimulation devices that are implanted into the eye of certain blind persons; and virtually any
application that can benefit from any and/or all of the following characteristics of an
opsistor: high speed, high-sensitivity, high noise resistance, high linear discrimination, and long transmitter-receiver distance.
The opsistor in its most basic form comprises two inverse parallel
photodiodes (the "first" and the "second" photodiode) disposed in close proximity
preferably as an integrated circuit on a monolithic substrate. The anode of the first
photodiode is electrically connected to the cathode of the second photodiode via a
common conductor, and the cathode of the first photodiode is electrically connected to the anode of the second photodiode via a second common conductor. Upon light
stimulation of both photodiodes, a voltage-phase, either positive or negative, is obtained when measured from the two common conductors of the opsistor. If the light
source produces greater illumination of one photodiode than the other, the
voltage-phase will be of one direction, and if such illumination is greater for the second
photodiode, the voltage-phase will be of the opposite direction. In comparison to the
alternating active and passive current states of standard optoelectronic switches, the voltage-phase of the opsistor is actively driven by its two opsistor photodiodes and
may occur very rapidly, limited only by parasitic capacitances. An "inactive neutral
balanced state" occurs in the absence of light, and an "active neutral balanced state" occurs when the illuminating light source(s) is/are equally stimulating both
photodiodes. The two forms of this balance state, in addition to the positive voltage-phase state and the negative voltage-phase state, are employed in applications of the opsistor. In another embodiment of the present invention (the so-called
"OPS-F"), the photodiode subunits of the opsistor are filtered using different
bandwidth pass-filters, the "first" and "second" light filters. The voltage-phase of the
OPS-F is controllable by varying the illumination balance of the first and second
different bandwidths of stimulating light matched to each of the OPS-F photodiode
subunits. The first and second bandwidth light sources (hereinafter referred to as "TM2") can include light emitting diodes ("LED"s) and/or lasers either of which are
modulated by signal-coding circuitry. The use of different bandwidths of light to
switch the OPS-F receiver allows long transmitter-receiver distances, and
dimensionally very small OPS-F devices to be signalled.
The applications for the opsistor and OPS-F device of the present
invention are many, and include, high-speed optocouplers and optoisolators used for
LDOADT and HSFODT; the basic logic and memory subunits of optoelectronic based
state machines; optocouplers for information transfer to and from rapidly moving
devices; very sensitive optical edge and target detectors; high resolution optical
encoders; embedded controllers for micromachines; and an artificial retina disclosed in one of applicants' prior U.S. patent applications (i.e. U.S. Patent Application Serial
No. 08/642,702 filed June 3, 1996 which is incorporated herein by reference). Such
artificial retina devices are designed to restore vision to certain blind individuals by
stimulating portions of the retina.
In its use as the receiving unit of a high speed optocoupler, the opsistor
is driven by varying the intensity of two transmitter light sources providing signal to the two opsistor photodiodes. This is accomplished by using two LEDs or lasers each positioned over one of the two photodiode subunits, each driven by a signal source.
Because each transmitter is closer to one of the opsistor photodiodes, each transmitter will preferentially stimulate the photodiode that it is closest to. In this manner, small
variations in the stimulating intensity of the two transmitter light sources, controlled by
their signal sources, will cause voltage-phase shifts in the Opsistor which are then
identified as the transmitted signal.
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a schematic diagram of the basic opsistor according to the
first preferred embodiment of the present invention;
Figure 2 is a schematic diagram of the OPS-F according to the second
preferred embodiment of the present invention;
Figure 3 is a plan view of the OPS-F constructed as a monolithic
integrated circuit according to the second preferred embodiment of the present
invention;
Figure 4 is a three-dimensional section view of the OPS-F constructed as a monolithic integrated circuit according to the second preferred embodiment of the present invention taken along the plane of line IV-IV of FIG. 3;
Figure 5 is a diagram illustrating a TM2/OPS-F combination used for long-distance open-air data transmission ("LDOADT");
Figure 6 is a diagram illustrating a TM2/OPS-F combination used in
conjunction with a fiber optic for high-speed fiber optic data transmission ("HSFODT"); Figure 7a is a cross-sectional diagram of a TM2/OPS-F monolithic
optical fiber link used in an optoelectronic based state machine; Figure 7b is a diagram illustrating the laser write of a OPS-F disposed
as one of a plurality of subunits on a monolithic silicon substrate that is used as the
basic switch component of an optoelectronic based state machine, the laser write changing the voltage-phase state of the OPS-F to one of three states of the tri-state
OPS-F;
Figure 8 is a diagram illustrating two opsistors used as the
photodetectors in a high-resolution optical encoder;
Figures 9A-C are diagrams illustrating an opsistor disposed on a
monolithic substrate and used as a linear optical position sensor ("LOPS"), a voltage null being produced when the illuminating light spot is equally illuminating both
photodiodes of the opsistor, and a voltage-phase in one direction or in the opposite
direction occurring as soon as a small misalignment of the light spot occurs that would
favor one or the other photodiode subunit of the opsistor; and
Figure 10 is a diagram illustrating a first thin substrate opsistor-based
LOPS, transparent to the light source being sensed, placed over a second
opsistor-based LOPS rotated at 90 degrees relative to the first LOPS to produce a
two-dimensional target sensor.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The opsistor (10) (Fig. 1) comprises two PIN photodiodes, the first photodiode (12) and the second photodiode (14), electrically connected in an inverse parallel
manner such that the anode of the first photodiode (12) is electrically connected to the
cathode of the second photodiode (14) via a first common conductor (16), and the
cathode of the first photodiode (12) is connected to the anode of the second photodiode (14) via a second common conductor (18). The voltage phase developed
by the opsistor (10) is measured from the first output terminal (20) and the second
output terminal (22). A first transmitter signal light source (24) to the first photodiode
(12) is represented by the arrows (24). A second transmitter signal light source (26) to
the second photodiode (14) is represented by the arrows (26). The voltage-phase
developed at the output terminals (20,22) is determined by which of the two
photodiodes (12,14) produces a higher voltage which is dependent on the relative
intensity of illumination they receive from the transmitter signal light sources (24,26).
For example if the first photodiode (12) produces a higher voltage than the second photodiode (14), then the voltage phase measured from the first output terminal (20)
will be negative and the voltage-phase from the second output terminal (22) will be
positive. On the other hand, if the voltage from the second photodiode (14) is greater than the voltage from the first photodiode (12), then the voltage-phase measured from
the first output terminal (20) will be positive and the voltage-phase measured from the
second output terminal (22) will be negative. Thus if the two photodiodes (12,14) are
similar or identical as possible, the voltage-phase from the output terminals (20,22) is
controlled by relative intensity of illumination of the two photodiodes, i.e. changes in
the relative illumination from transmitter signal light sources (24,26) to the two photodiodes (12,14). A preferred embodiment (Fig. 2) is a bandwidth-filtered opsistor ("the OPS-F") (30). The OPS-F (30) comprises two PIN photodiodes (32,34), the first photodiode (32) filtered with the first bandwidth-portion filter (33), and the second
photodiode (34) filter with the second bandwidth-portion filter (35), electrically
connected in an inverse parallel manner such that the anode of the first photodiode
(32) is electrically connected to the cathode of the second photodiode (34) via a first
common conductor (36), and the cathode of the first photodiode (32) is connected to
the anode of the second photodiode (34) via a second common conductor (38). The
first bandwidth-portion filter (33) passes a different bandwidth of transmitter signal
light than the second wavelength-portion filter (35). The voltage-phase developed by
the OPS-F (30) is measured from the first output terminal (40) and the second output
terminal (42). The first bandwidth-portion signal light source ("WPSLS-1 ")(44) to the
first photodiode (32) is represented by the arrows (44). The second
bandwidth-portion signal light source ("WPSLS-2")(46) to the second photodiode (34)
is represented by the arrows (46). Because each wavelength-portion filtered
photodiode (32, 34) responds only to its own specific bandwidth of light, WPSLS-1
(44) for photodiode (32) and WPSLS-2 (46) for photodiode (34) can be provided from a distant location without cross-talk interference. The term "light" is not
restricted to visible light, but also include wavelengths from the far ultraviolet to the far infrared.
The voltage-phase developed at the output terminals (40,42) is
determined by which of the two photodiodes (32,34) produces a higher voltage which
in turn is dependent on the relative illumination they receive from the transmitter signal light sources, WPSLS-1 (44) and WPSLS-2 (46). For example in Fig. 2, if the first
photodiode (32) receives a greater illumination from WPSLS-1 (44) and thus produces a higher voltage than the second photodiode (34) being illuminated by PSLS-2 (46), then the voltage-phase measured from the first output terminal (40) will be negative
and the voltage-phase from the second output terminal (42) will be positive. On the
other hand, if the second photodiode (34) receives a greater illumination from
WPSLS-2 (46) and thus produces a higher voltage than the first photodiode (32)
receiving illumination from WPSLS-1 (44), then the voltage-phase measured from the
first output terminal (40) will be positive and the voltage-phase measured from the
second output terminal (42) will be negative. Thus if the two photodiodes (32,34) are
similar or identical, the voltage-phase from the output terminals (40,42) is controlled
by relative illumination and changes in the relative illumination of WPSLS-1 (44) and
WPSLS-2(46) to the two photodiodes (32,34). Preferably, as shown in Figs. 3-4, the OPS-F device (30), is constructed
as a monolithic integrated circuit. The OPS-F (30) consists of two PIN photodiodes
(32,34), the first photodiode (32) filtered with the first bandwidth-portion filter (33),
and the second photodiode (34) filter with the second bandwidth-portion filter (35),
electrically connected in an inverse parallel manner such that the cathode (32c) of the
first photodiode (32) is electrically connected to the anode (34a) of the second photodiode (34) via a first common conductor (36), and the anode (32a) of the first
photodiode (32) is connected to the cathode (34c) of the second photodiode (34) via a
second common conductor (38). The first bandwidth-portion filter (33) passes a different bandwidth of stimulating light than the second bandwidth-portion filter (35). The voltage-phase developed by the OPS-F (30) is measured from the first common
conductor (36) and the second common conductor (38) which are also the output
terminals. The voltage-phase developed at the common conductors (36,38) is determined by which of the two photodiodes (32,34) produces a higher voltage which
is dependent on the relative illumination which they receive from their respective signal
light sources.
For example if the illumination of the entire OPS-F (30) contains a
greater proportion of bandwidths that can stimulate the first photodiode (32) than can
stimulate the second photodiode (34), then a higher voltage will be developed by the
first photodiode (32) than the second photodiode (34), and the voltage-phase
measured from the first common conductor (36) will be negative and the voltage-phase
measured from the second common conductor (38) will be positive. On the other
hand, if the illumination to the entire OPS-F (30) contains a greater proportion of
bandwidths that can stimulate the second photodiode (34) than can stimulate the first photodiode (32), then a higher voltage will be developed by the second photodiode
(34) than the first photodiode (32), and the voltage-phase measured from the first
common conductor (36) will be positive and the voltage-phase measured from the
second common conductor (38) will be negative.
In the preferred embodiment of the OPS-F (30) shown in Figs. 3-4, the
P+ surface (40) of the first photodiode (32) has its anode (32a) deposited around the
entire edge of the P+ region (40), and the cathode (32c) of the first photodiode (32) is
deposited completely over a large area of the N+ region (52) under the cathode (32c).
Similarly in the preferred embodiment of the OPS-F (30) shown in FIG. 3, the P+ surface (42) of the second photodiode (34) has its anode (34a) deposited around the
entire edge of its P+ region (42), and the cathode (34c) of the second photodiode (34) is deposited completely over a large area of the N+ region (62) under the cathode (34c). The starting P-type silicon substrate (44) is shown surrounding the two
photodiodes (32, 34). Although, the starting monolithic silicon substrate (44) for the
illustrated preferred embodiment of the OPS-F device (30) of the present invention is
undoped silicon (44), those skilled in the art will recognize that P-type or N-type
silicon may also be use as a starting monolithic silicon substrate by altering the fabrication of the OPS-F's photodiodes. As illustrated in Fig. 4, the construction of the OPS-F (30) follows
standard semiconductor fabrication processes. PIN photodiodes (32,34) each with a
distinct intrinsic layer (50,58) are used in this embodiment because of their higher
switching speeds. A first heavily doped N-region (54) and a second heavily doped
N-region (60) are fabricated in close proximity to each other in the starting undoped
substrate (44). A first N+ region (52), and a second N+ region (62) are then fabricated
in the first N-region (54) and the second N-region (60) respectively. A first heavily
doped P-region (48) and a second heavily doped P-region (56) are then fabricated in
the first N-region (54) and second N-region (60) respectively. A first intrinsic layer
(50) then forms at the junction of the P-region (48) and the N-region (54). A second
intrinsic layer (58) then forms at the junction of the P-region (56) and the N-region
(60). A first P+ region (40) is then fabricated in the first P-region (48), and a second
P+-region (42) is then fabricated in the second P-region (56). A first metallic anode
(32a) is deposited on the first P+ region (40) on its perimeter to permit a large area of electrical contact and a second metallic anode (34a) is deposited on the second P+
region (42) on its perimeter to permit a large area of electrical contact. A first metallic cathode (32c) is deposited on the entirety of the first N+ region (52) to permit a large
area of electrical contact. A second metallic cathode (34c) is deposited on the entirety of the second N+ region (62) to permit a large area of electrical contact. The first wavelength-portion filter (33), which in the preferred embodiment is a multilayer
dielectric layer, is deposited on the first photodiode (32). The second
wavelength-portion filter (35), which in the preferred embodiment is a multilayer
dielectric filter, is deposited on the second photodiode (34). Filter layers (33,35) each pass a different bandwidth of light within the
spectrum from 450 nm to 1150 nm, the spectral response of silicon photodiodes. In
the preferred embodiment for example, the first filter layer (33) has a bandwidth pass
from 600 nm to 850 nm, and the second filter layer (35) has a bandwidth pass from
850 nm to 1100 nm. Those skilled in the art however will recognize that other
bandwidths, both greater and smaller, are also useful. A silicon dioxide insulating layer (70) is fabricated on the areas of the
OPS-F (30) not covered by the filter layers (33,35). Openings are etched in filter
layers (33,35) to exposed the anodes (32a, 34a) and the cathodes (32c, 34c). A first
common conductor (36) is then deposited to connect the first cathode (32c) to the second anode (34a), and a second common conductor (38) is deposited to connect the
first anode (32a) to the second cathode (34c). The common conductors (36,38) also
serve as the output terminals (42,40) illustrated in Fig. 2.
Figure 5 illustrates a TM2/OPS-F combination used for long-distance open-air data transmission ("LDOADT") with characteristic high resistance to
background noise, and high data transmission rates. The TM2 (70) is provided signal coding and powered by the transmitter (72). The WPSLS-1(44) and the WPSLS-2
(46) of the TM2 (70) include LEDs, lasers, or any light source capable of producing
specific bandwidths of light in a rapid pulsed manner. The TM2 digital signal (78), comprised of the first bandwidth signal light ("WPSL-1) (74), and the second
bandwidth signal light ("WPSL-2") (76), is highly resistant to common mode noise
such as ambient light (80), 60 Hz interference (82), and atmospheric attentuations
(84). The TM2 signal (78) is sensed by the OPS-F (30) and differentially converted
into positive or negative voltage-phase signals by the first photodiode (32) and the
second photodiode (34) of the OPS-F (30). The voltage-phase developed by the
OPS-F (30) is decoded and reconstructed by a receiver (86) in an industry standard manner.
For LDOADT applications employing the OPS-F embodiment of the
opsistor, by utilizing a different light bandwidth filter over each OPS-F receiver
opsistor photodiode, the two transmitter light sources of the TM2 (each producing the
specified different bandwidths of light) may be located at a great distance from the
OPS-F receiver. In addition the OPS-F receiver may receive serial communication
even though the OPS-F device is in motion, such as if placed on rapidly moving
equipment, or even if blocked by a light diffuser such as biological tissue. For
example, in the latter case, by using red and infrared light as the two TM2 wavelengths
that penetrate the skin into subcutaneous tissues, a subcutaneously implanted OPS-F sensor may receive serial communications via an external TM2 transmitter to provide power and programming to an implanted drug delivery pump.
The advantages of the TM2/OPS-F combination device of this
invention for LDOADT are appreciated when compared to the current art for LDOADT. Typically in the current art, a transmission LED is modulated at a carrier
frequency approximately 15X higher than the target data rate or baud rate. For example, in remote control and low speed serial PC-IR links, a carrier frequency of
about 38 KHz is used to transmit signal bursts to the receiver. The presence of a burst
is interpreted as one logic state and the absence its compliment. By timing the signal burst properly in real time, an equivalent data rate of 300 to 2400 baud can be reliably
achieved. Newer standards today for PCs have improved this data rate to over 100
kilobits per second but the working distance is just a few feet.
Signal integrity between transmitter and receiver must negotiate
ambient light levels and changing attenuation. Even with bandpass filters and signal
processing, the transmission rates must be compromised to obtain the required signal
to noise margin over background. Signal variations from ambient behave similar to dynamic voltage offsets to the LR carrier signal and can be categorized as "noise."
Depending on the receiver circuit, the maximum data rate reliably received is limited by
the signal to noise ratio possible, the better the quality of the incoming signal, the
faster will be the possible data rate. With open air applications ambient noise is highly
dynamic, and ample guardband is reserved to ensure reliable data transmission under all conditions.
Using the TM2/OPS-F transmitter-receiver combination for LDOADT
applications, instead of , for example, an intensity amplitude modulated transmitter LED and a single photodiode receiver, the TM2/OPS-F combination uses an active
wavelength alternation method utilizing two separate color LEDs for transmitting logic
ones and zeros to produce a voltage-phase modulation. This TM2 bi-phasic drive system transmits two wavelengths alternately to produce the effect of a carrier signal at
the OPS-F receiver. For example, if GREEN and RED were the two bi-phasic wavelengths, GREEN is ON during the positive excursion of the carrier and RED is
ON during the negative excursion of the carrier. These PUSH-PULL excursions are
recognized as positive or negative voltage-phases at the OPS-F. This bi-phasic approach forces all ambient factors to become common mode and therefore become automatically canceled at the OPS-F input. Normal signal processing now converts
the carrier into a digital data stream. A gain of better than 20 dB in S/N is obtained
with the TM2/OPS-F combination. Faster data transmission and longer
transmitter-receiver distances are obtainable. Figure 6 illustrates a TM2/OPS-F combination used for High-Speed
Fiber Optic Data Transmission ("HSFODT") with characteristic high data transmission
rates, and high resistance to fiber attenuations. The TM2 (70) is provided signal
coding and powered by the transmitter (72). The WPSLS-1(44) and the WPSLS-2
(46) of the TM2 (70) include LEDs, lasers, or any light source capable of producing
specific bandwidths of light in a rapid pulsed manner. The TM2 digital signal (78) comprised of the first bandwidth signal light ("WPSL-1") (74) and the second
bandwidth signal light ("WPSL-2") (76) is highly resistant to fiber attenuations such as
from temperature effects, mechanical stress, impurity/defect effects, and water
absorption during passage through the conduit optical fiber (88). The TM2 signal (78) is sensed by the OPS-F (30) and differentially converted into positive or negative voltage-phase signals by the first photodiode (32) and the second photodiode (34) of
the OPS-F (30). The voltage-phase developed by the OPS-F (30) is decoded and
reconstructed by the receiver (86) in an industry standard manner.
The advantages of the HSFODT use of this invention are apparent from
comparing it against current art technology. In the current art, a laser source is use to
serially transmit monochromatic light signals through an optical fiber to a PiN or
avalanche type photodiode detector. Data rates from 20 Mbits/second to
Gigabits/second are possible with the proper combination of optics and electronics.
With high end applications like telecommunication, factors such as wavelength
selection, multimode fibers, low loss connectors, repeaters, and low noise detectors are
optimized to achieve the best possible performance. This performance, however, can be further improved if factors such as temperature stress, mechanical stress, and fiber
imperfections can be converted into common mode parameters.
By utilizing bi-phasic TM2 drive and OPS-F bi-phasic opsistor
detection, the S/N ratio of a fiber link can be improved upon compared to the current
art. This increase allows the use σf "longer span distances between repeaters and/or
increased data transmission rates. The majority of noise variables within a fiber are
predominantly single-ended or ground referenced. An example is attenuation
variations from micro mechanical stresses along a fiber experiencing temperature
fluctuations or vibration. The TM2/OPS-F combination used for HSFODT permits
balanced signal detection around zero volts. In this approach, a positive voltage vector
is a Logic One while a negative voltage vector is a Logic Zero. A DC-coupled amplifier can be used that eliminates many capacitor-related issues (e.g., phase and time delays) for processing ultra-fast signals. Balanced detection also eliminates the
need to store a reference voltage (usually by a capacitor) needed to compare input
signals against to test for Logic 1 or Logic 0. Higher data transmission rates can be achieved that increase the information bandwidth of a fiber.
With lower technology applications such as computer network fiber
links, improvements in the signal-to-noise ratio will allow greater tolerance to fiber
imperfections. This in turn can lower fiber cost for consumer applications. One such
application may be usage of a lower grade fiber for connection into single family homes that satisfies the required data bandwidth but has higher cost effectiveness.
Figure 7a is a is a cross-sectional diagram of a TM2/OPS-F monolithic
optical fiber link used in an optoelectronic based state machine. The TM2 (70), which
preferably is composed of amorphous silicon LEDs, is fabricated within the monolithic
silicon substrate (92). Similarly, the OPS-F (30) is also fabricated within the monolithic silicon substrate (92) using techniques standard to the industry. Digital
informational data is optically transmitted from a TM2 (70) to a target OPS-F (30) via
a micro-optical fiber light conduit (90) fabricated upon the silicon substrate (92) using
standard industry techniques.
Figure 7b illustrates a laser write of a OPS-F subunit (30a) disposed as
one of a plurality of OPS-F subunits (30) on a monolithic silicon substrate (92). The
OPS-F (30) is used as the basic switch component of an optoelectronic based state
machine. Because of direct optical access, the TM2 laser beam (94) can rapidly write
changes to the voltage-phase state of a large number of OPS-F s (30) converting them to one of three OPS-F electrical tri-states. The OPS-F based optoelectronic state machine functions in the
following manner. In general, a state machine performs a specific function determined
by its configuration, which can be actively changed. Field programmable logic silicon devices such as gate arrays, and one-time programmable devices are state machines
that can be reconfigured to meet many different applications. In the case of a
UV-erasable OTP, the computer chip is "dormant" after erasure but becomes
functional again after reprogramming. The OPS-F device of this invention also has a
"dormant" null state that is analogous to the "OFF" position of a mechanical center-off
toggle switch. When OPS-F receiver is activated by TM2 light transmission, the switch can "toggle" to the UP or DOWN position for logic 1 (positive voltage vector)
or logic 0 (negative voltage vector) respectively. Once programming is complete, the
switch goes back to the center or "OFF" state (ground, 0 volts). This OPS-F tri-sate
capability, therefore, allows an OPS-F based optoelectronic state machine to possess
three states, represented by a positive voltage vector, a negative voltage vector, and a
ground, 0 volts null.
With the OPS-F based optoelectronic state machine, the OPS-F is the
input to a configuration FIFO (First In First Out) latch that defines the functionality of
that state machine block, or the function of an OPS-F is latched in a high or low logic
state which in turn "steers" the processing logic of the state machine. Since the OPS-F
normally has a rest state that is not a logic 1 or logic 0, immunity to noise after configuration is very high. By using bi-phasic TM2 light transmission from an external
source such as two laser sources or a tunable laser, or from another section of the state machine, the entire state machine can be quickly reprogrammed for functionality as the
situation requires. Permitting different optoelectronic blocks to change personality or
function on-the-fly minimizes the hardware required for a OPS-F based state machine
(vs. traditional microprocessors that are composites of predefining functional blocks).
The OPS-F "building block" permits integration of many "smart state machine" blocks
based on using bi-phasic TM2 light as the primary link. In this approach, traditional
requirements for serial communications, signal multiplexing, and device programming
are minimized, since a "smart state machine" block can, for example, change from a
"division function" to a "counter function" on-the-fly.
Advantages of such a "smart state machine" block based on the
TM2/OPS-F combination over the present art include: (1) faster optocoupler
transmission data rates from the active on/active off function, (2) direct laser writes
into specific parts of the "smart state machine" to program "smart state machine"
blocks circumvents the complexities of serial communications and signal action
routing. The steering of the lasers is equivalent to traditional functions of wires and
logic clocks resulting in faster operation since silicon elements do not have to be
physically close but may be separated, (3) applications in bio-sensor devices where
fluids may surround the silicon, and (4) field programmable devices where isolation
preservation is important.
Figure 8 (OPTICAL QUADRATURE ENCODER) illustrates the
opsistor device of this invention used in place of standard photodiode detectors
employed in an optical encoder to double the resolution of the encoder without
increasing the slot count of the rotor disk. The photo-sensing portion (101) within an optical encoder utilizing the device of this invention, employs a first opsistor (30) and a
second opsistor (100) as the photodetectors. The first opsistor (30) has a first
photodiode subunit (32), designated "C", and a second photodiode subunit (34) designated "D". The second opsistor (100) has a first photodiode subunit (102) designated "E", and a second photodiode subunit (104) designated "F". Illumination
(112) to the opsistors (30, 100) passes through the rotor slots (106) created between
the rotor vanes (108). Movement of the rotor in FIG. 8 is shown by the arrow (110).
The 2X resolution quadrature signal of the photo-sensing portion (101) of the opsistor
based encoder results because the rotor slots (106) of the optical encoder section (101)
are each effectively split into two portions by each of the opsistors (30, 100). As the
illumination (112) from the rotor disk slots (106) passes over the first photodiode
subunit (32, 102) of either opsistor (30, 100) a voltage-phase in one direction will
developed in that respective opsistor. As the illumination (112) from the rotor disk
slots (106) continues to move over the entirety of either opsistor surface and
illuminates both of the photodiode subunits (32 and 34, or 102 and 104), a voltage-phase null will occur. When the illumination (112) from the rotor disk slots
(106) begin to pass preferentially over the second photodiode subunit (34, 104) of
either opsistor (30, 100), the voltage-phase will become inverted to the opposite
direction. The slot widths (106) are thus functionally split into two portions each. A
two-slot, two-opsistor quadrature encoder can achieve twice the resolution of the same encoder using two standard photodiodes.
Figures. 9a-9c illustrate the opsistor of the present invention used as a
precise linear optical position sensor ("LOPS"). In FIG. 9a, a null of the voltage-phase develops when the illumination (94) of the two photodiode subunits (32, 34) of the opsistor (30) is equal. A rapid shift of the voltage-phase to positive or negative
develops in a flip-flop manner as soon as one of the two opsistor photodiode subunits
(32, 34) become preferentially illuminated as shown in FIGs. 9b and 9c. As the
voltage-phase of the opsistor (30) responds to light balance only over its two
photodiode subunits (32, 34) which may be fabricated together very closely on a monolithic silicon substrate, the opsistor's rejection of common mode attenuations
such as ambient light and temperature effects is high. Uses of a LOPS device such as
that shown include micro-beam balances, optical alignment applications, motion
sensors, and image recognition devices based on edge detection.
Figures 10 A-C illustrate a two-dimensional target sensor (130)
constructed from two "stacked" LOPS opsistors (110, 120) aligned so that the "top"
LOPS opsistor (110), consisting of photodiode subunits (112, 114), which is fabricated
within a thin silicon substrate transparent to infrared light, is aligned at 90 degrees
rotated from the "bottom" LOPS opsistor (120), consisting of photodiode subunits (122, 124). Such a target sensor (130) uses one LOPS opsistor sensor (110, 120) for each axis of position sensing of a light target (94). Characteristics and quality of such
a two-dimensional target sensor (130) include simple fabrication and minimal
dead-spot area, in additional to all of the characteristics of the single LOPS sensor.
Uses of such a LOPS device include those requiring high precision two-dimensional
alignment, weapons targeting, spectrophotometer micro-two-dimensional alignments, and micro-machine/micro-fabrication jig alignment.

Claims

WE CLAIM:
1. An optoelectronic switch, comprising: two photodiodes such that the
anode of one photodiode is electrically connected via a first conductor to the cathode
of the second photodiode, and the cathode of the first photodiode is electrically
connected via a second conductor to the anode of the second photodiode, such that
the voltage-phase of the first conductor and the second conductor of the said optoelectronic switch device will depend upon which of the photodiodes of the said optoelectronic switch receives the greater amount of transmitter light signal
illumination.
2. The switch of claim 1 wherein the components of the said
optoelectronic switch are fabricated on a monolithic substrate.
3. The switch of claim 2 wherein the anodes and the cathodes of the
device are fabricated to be at its surface.
4. The switch of claim 1 wherein dielectric light filter layers are used to
selectively allow only certain bandwidths of light from 450 nm to 1150 nm, to
selectively illuminate each of the said photodiodes.
5. The switch of claim 4 wherein the dielectric filter layers are deposited directly on the photoactive surfaces of the said photodiodes.
6. The switch of claim 4 wherein the dielectric filter layers used allow the
same portion of the light spectrum to stimulate both photodiodes of the said device.
7. The switch of claim 5 wherein the dielectric filter layers used allow
different portions of the light spectrum to stimulate each of the photodiodes of the said
device.
8. An optoelectronic coupler, for coupling a source of light signals to a
receiver that can process voltage-phase signals, comprising: a light transmitter capable of generating light signals of two different
first and second bandwidths;
at least one pair of first and second photodiodes to receive light signals
from the light transmitter; a first conductor electrically connecting the anode of the first
photodiode to the cathode of the second photodiode;
a second conductor electrically connecting the cathode of the first
photodiode to the anode of the second photodiode;
a first light filter disposed on the photoactive surface of the first photodiode that allows the first bandwidth of light to pass;
a second light filter disposed on the photoactive surface of the second photodiode that allows the second bandwidth of light to pass; whereby the light transmitter signals utilizing the first and second bandwidths can be converted by said photodiodes into a voltage-phase signals across
the first and second conductors.
9. The optoelectronic coupler of claim 8 further comprising a modulated signal generator for sending data signals to the said optoelectronic coupler's two-wavelength light transmitter for transmission to the photodiodes, and a signal receiver for receiving and decoding voltage-phase data from across the first and second conductors, whereby the combination can function as a telecommunications information transfer device.
10. The optoelectronic coupler of claim 8 wherein the light transmitter
comprises light emitting diodes.
11. The optoelectronic coupler of claim 8 wherein the light transmitter comprises at least one laser.
12 The optoelectronic coupler of claim 8 wherein device is fabricated on a monolithic silicon substrate and wherein the light transmitter comprises amorphous silicon light emitting diodes fabricated on the same monolithic silicon substrate.
13. A state machine comprising: a plurality of the switches of claim 7 disposed on a monolithic silicon substrate wherein the three voltage-phases of each said device are the programmed and reprogrammed rapidly by using a mixture of two bandwidths of light; a source of two bandwidths of light for programming the
switches; and means to read electronically the combination of voltage states produced
as digital information.
14. The state machine of claim 13 wherein the light source comprises a
pair of light emitting diodes for each of the switches, a first member of each light
emitting diode pair emitting the first bandwidth of light for programming the switch, and the second member of each light emitting diode pair emitting the second
bandwidth of light for programming the switch.
15. The state machine of claim 13 wherein the light source comprises a
laser.
16. The state machine of claim 15 wherein the laser comprises a tunable
laser producing a plurality of different pairs of different wavelengths of light to signal
the switches.
17. An optoelectronic position sensor device, comprising: a switch of claim 3;
a focusing lens system to focus a light shape onto the surface of the switch
whereby the switch can sense the position of the focused light shape on its surface by
producing a positive voltage-phase, negative voltage-phase, or a null zero-volt voltage-phage depending upon the balance of illumination of the focused light shape
upon the two photodiode components of the switch; and
means to electronically analyze the resultant voltage-phases so as to indicate
the linear position of the light shape on the said switch's surface.
18. An optoelectronic sensor, comprising:
two stacked device of claim 19 wherein the upper device is fabricated from
thinned silicon substrate such that it iis substantially transparent to the light shape
being targeted and is oriented at 90 degrees rotated from the lower device, and that the
image of the light shape being targeted also passes through the substantially transparent upper device onto the lower device so that together the two devices
function as a two-dimensional target sensor;
and means to electronically analyze the resultant voltage-phases of the devices
so as to indicate the two-dimensional position of the light shape being targeted on the
said target sensor.
19. An optoelectronic encoder, comprising:
a housing;
a slotted rotor disk inside of the housing;
two switches of claim 3 inside the housing on one side of the slotted rotor disk;
an encoder light source inside the housing on the other side of the slotted rotor disk; means for turning the slotted rotor disk, whereby the light pulse signals
created from the said light source pass through the moving slots of the rotating disk to
create voltage-phase changes in the two switches to produce quadrature electrical
signals; and means to electronically read the quadrature electrical signals produced.
EP97950833A 1997-11-26 1997-11-26 Optoelectric voltage-phase switch using photodiodes Withdrawn EP0954881A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1997/022229 WO1999027589A1 (en) 1997-11-26 1997-11-26 Optoelectric voltage-phase switch using photodiodes

Publications (1)

Publication Number Publication Date
EP0954881A1 true EP0954881A1 (en) 1999-11-10

Family

ID=22262204

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97950833A Withdrawn EP0954881A1 (en) 1997-11-26 1997-11-26 Optoelectric voltage-phase switch using photodiodes

Country Status (4)

Country Link
EP (1) EP0954881A1 (en)
JP (1) JP2002511947A (en)
CA (1) CA2274666A1 (en)
WO (1) WO1999027589A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202010001194U1 (en) * 2010-01-21 2011-06-01 Sick Ag, 79183 Optoelectronic sensor
US10373991B2 (en) 2015-08-19 2019-08-06 Semiconductor Energy Laboratory Co., Ltd. Imaging device, operating method thereof, and electronic device
CN107332546B (en) * 2016-04-28 2021-10-22 大日科技股份有限公司 Photoelectric switch

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4477721A (en) * 1982-01-22 1984-10-16 International Business Machines Corporation Electro-optic signal conversion
CH684971A5 (en) * 1989-03-16 1995-02-15 Landis & Gyr Tech Innovat Ultraviolet light sensor.
US5130528A (en) * 1991-03-01 1992-07-14 International Business Machines Corporation Opto-photo-electric switch
ES2218589T3 (en) * 1995-06-06 2004-11-16 Optobionics Corporation RETINAL IMPLANT OF MULTIPHASIC MICROPHOTODYODE.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9927589A1 *

Also Published As

Publication number Publication date
JP2002511947A (en) 2002-04-16
CA2274666A1 (en) 1999-06-03
WO1999027589A1 (en) 1999-06-03

Similar Documents

Publication Publication Date Title
US5837995A (en) Wavelength-controllable voltage-phase photodiode optoelectronic switch ("opsistor")
CN104601244B (en) A kind of 400Gb/s hot plugs High Speeding Optical Transmitter-receiver Circuit
US5859719A (en) Photogenerator for lightwave networks
US6835992B1 (en) Closely-spaced VCSEL and photodetector for applications requiring their independent operation
US6364541B1 (en) Method and apparatus for optical reception
US4764984A (en) Fluorescent sensors for infrared free-space links in data communication systems
EP2873176B1 (en) Method and apparatus providing wave division multiplexing optical communication system with active carrier hopping
WO2001047077A1 (en) Method and apparatus for optical transmission
EP1318490A2 (en) Manufacturing system incorporating telemetry and/or remote control
CN109254365A (en) Light-receiving mould group and preparation method thereof, light receiving element
US6632029B1 (en) Method & apparatus for packaging high frequency components
WO1999027589A1 (en) Optoelectric voltage-phase switch using photodiodes
US5602665A (en) Optical transmitting/receiving apparatus for bidirectional communication systems
US20170237228A1 (en) Microfabricated optical apparatus
JP2791991B2 (en) Light switch
CN109981170B (en) Wireless optical communication system and method
US9185475B1 (en) Signal quality in bi-directional optical links using optical circulators
CN209102958U (en) Light-receiving mould group and light receiving element
EP1864335B1 (en) Integrated optical detector in semiconductor reflector
RU2095943C1 (en) Duplex fiber-optical communication line
KR100810327B1 (en) Optical module and optical comminunication system using the same
CN1127151C (en) Wavelength controllable optoelectric voltage-phase switch using photodiodes
US20190312653A1 (en) Chip-in-connector photonic apparatus
KR100357255B1 (en) Apparatus for transmitting multi-channel and optical communication module
JP2000114582A (en) Photoelectric conversion device

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19990618

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

17Q First examination report despatched

Effective date: 20040316

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RTI1 Title (correction)

Free format text: OPTOELECTRONIC VOLTAGE-PHASE SWITCH USING PHOTODIODES

GRAJ Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted

Free format text: ORIGINAL CODE: EPIDOSDIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20070601