EP0888641A1 - Laminated structure which is stable with respect to climate and corrosion - Google Patents
Laminated structure which is stable with respect to climate and corrosionInfo
- Publication number
- EP0888641A1 EP0888641A1 EP97908285A EP97908285A EP0888641A1 EP 0888641 A1 EP0888641 A1 EP 0888641A1 EP 97908285 A EP97908285 A EP 97908285A EP 97908285 A EP97908285 A EP 97908285A EP 0888641 A1 EP0888641 A1 EP 0888641A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- barrier
- barrier layer
- corrosion
- climate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000007797 corrosion Effects 0.000 title claims abstract description 23
- 238000005260 corrosion Methods 0.000 title claims abstract description 23
- 230000004888 barrier function Effects 0.000 claims abstract description 70
- 238000002161 passivation Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 abstract description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052719 titanium Inorganic materials 0.000 abstract description 5
- 239000010936 titanium Substances 0.000 abstract description 5
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 2
- -1 silicon oxide nitride Chemical class 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 193
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 16
- 239000011521 glass Substances 0.000 description 10
- 239000011787 zinc oxide Substances 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 238000006731 degradation reaction Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004831 Hot glue Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- BYFGZMCJNACEKR-UHFFFAOYSA-N aluminium(i) oxide Chemical compound [Al]O[Al] BYFGZMCJNACEKR-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- XIMIGUBYDJDCKI-UHFFFAOYSA-N diselenium Chemical compound [Se]=[Se] XIMIGUBYDJDCKI-UHFFFAOYSA-N 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical class [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to a layer structure with at least one moisture and / or corrosion sensitive layer arranged on a substrate, in particular an optically and / or electrically active thin layer.
- a layer structure with at least one moisture and / or corrosion sensitive layer arranged on a substrate, in particular an optically and / or electrically active thin layer.
- Such layers are found, for example, in optical or electrical components. Examples of this are radiation-sensitive components such as detectors, solar cells or solar modules, or optoelectronic components such as display devices and in particular LCD screens.
- solar modules In order to meet the quality requirements in demand on the market, solar modules have to successfully undergo a number of different test procedures.
- One of these methods which is intended to check the climate resistance of the solar modules, is the steam-heat climate test.
- the modules According to the well-known standard IEC 1215, the modules are exposed to a temperature of 85 ° C at 85 percent relative air humidity for 1000 hours, among other things.
- Laminated solar modules with boron-doped zinc oxide electrode layers show an unusually strong degradation in this test method, ie an inadmissibly high decrease in efficiency after the climate test.
- the main reason for this is their instability with regard to the conductivity of the boron-doped CVD zinc oxide layers against water vapor at elevated temperature.
- the surface resistance of such layers increases after the test by a factor of over 10 ⁇ to a value of more than 1 k ⁇ / square.
- a value of less than 10 ⁇ / square is required. This can be achieved by simple encapsulation with a laminate structure using a ner adhesive film and possibly a second glass pane can not be reached.
- CIGS Iron diselenide
- the absorber shows degradation phenomena on the surfaces that are exposed to the climate test conditions unprotected or only covered with a conventional laminate structure.
- the back electrode consisting of molybdenum, additional climate-independent degradations occur at the interface with the CIGS absorber layer.
- One way of preventing moisture from diffusing into a laminate and in particular into a solar module is to extend the diffusion path for the moisture.
- the degradation of a boron-doped zinc oxide layer is delayed sufficiently.
- such a wide margin is unacceptable for a solar module because of the then high proportion of inactive module surface.
- the glass panes are coated with a moisture-sensitive thin layer, which has hitherto been costly to protect by including moisture-absorbing agents in laminated double glass panes, for example.
- this object is achieved by a
- a moisture and / or corrosion-sensitive layer can be protected in a simple manner from an environmental and, in particular, moisture or corrosion-related degradation by an additional barrier layer applied directly above the layer.
- an additional barrier layer it is possible, for example, to obtain thin-film solar modules which pass the steam-heat climate test mentioned at the outset without any appreciable loss in performance and without visible corrosion damage.
- Layer structure Part of an electrical or optical component in which the barrier layers have a vapor barrier and / or a corrosion protection effect, parts of the component which are optically active and / or working with electrical potential differences being covered with electrically insulating barrier layers, layers there without potential difference ⁇ against with conductive barrier layers.
- the moisture and / or corrosion sensitive layer in the sense of the invention is a substrate-bound layer, which can be applied as a thin or thick layer and is amorphous, polycrystalline or metallic.
- the additional barrier layer is a thin layer which is selected from aluminum oxide Al2O 3 , silicon nitride Si 3 N 4 , titanium nitride TiN, molybdenum nitride MoN and silicon oxynitride SiO x N v .
- a thin layer is simple and inexpensive to produce and can be easily incorporated into the manufacturing process for the moisture or corrosion-sensitive layer or the layer structure or layer containing this layer Integrate component, especially if the layer or the layer structure itself is a thin layer structure.
- the barrier layer adapts to the function of the covered layer and is, for example, optically transparent, electrically conductive or insulating, it shows no negative influence on the layer structure. It neither impairs the operation of an optical or electrical component containing the layer structure, nor does it impair its properties.
- the thin-film barrier layers mentioned can be used in known processes as dense, i.e. Deposit non-porous, optically transparent and edge-covering layers. Depending on the density or the freedom from pores with which such a layer can be produced, a barrier layer of 100 nm thickness may be sufficient to ensure complete protection against moisture and / or corrosion . A thicker barrier layer is of course possible, but not necessary. In the case of deposition processes which lead to barrier layers which are not completely pore-free or not completely homogeneous or which do not cover edges well, a higher layer thickness is preferably selected. If there are high topography levels on the layer structure, a layer thickness of up to approx. 2 ⁇ m is selected for good edge coverage of the barrier layer.
- Plasma-assisted CVD processes are particularly preferred for the production of both tight and well-covering barrier layers of small layer thickness with the lowest possible deposition temperatures.
- the barrier layer has a good quality on most materials used as electrical or optical functional layers Liability on. If necessary, an adhesion promoter layer may also be required.
- the layer structure according to the invention has the barrier layer as an additional layer to the conventional layer structure, which comprises one or any number of layers, it can also be covered with a conventional cover, for example with a laminate structure.
- a conventional cover for example with a laminate structure.
- it is in particular a laminate which at least also comprises a plastic layer and, if appropriate, a protective film and / or a glass cover plate.
- the plastic layer is preferably a hot-melt adhesive layer on which the cover film and optionally the glass pane are also laminated.
- Other components can additionally or alternatively be covered or encased with other covers, for example with cast resin layers or other casting compounds, over the barrier layer.
- the barrier layer as the uppermost and covering layer is sufficient to protect the solar cell.
- the barrier layer according to the invention is particularly suitable for a laminate structure, since it has good adhesion to or under conventional hotmelt adhesive layers used for this purpose.
- the good adhesion of the hot-melt adhesive film and thus of the entire laminate structure leads to an additionally improved seal which prevents the diffusion of moisture along the interfaces between the layer structure and the laminate or between the barrier layer and the laminate.
- the barrier layer is arranged over the edge of the layer to be protected in such a way that its entire surface, including the side walls, is covered.
- On the side of the sensitive layer closes the barrier layer with a climate-stable layer.
- Such layers are impervious to moisture and / or hot and humid environments and do not show any corrosion or other disadvantageous change even after prolonged exposure.
- the barrier layer preferably encloses the moisture-sensitive thin layer from above and from the side and closes at the lower edge with the substrate, which is made of glass, for example, or a metal layer or
- the passivation layer can also be a barrier layer.
- silicon oxide is also suitable for special applications.
- Titanium and molybdenum nitride can be made electrically conductive and are also particularly hard and scratch-resistant. They are therefore suitable as a passivation layer for a particularly metallic and therefore in principle corrosion-sensitive electrode layer, as is used in particular as a lower electrode for thin-layer components.
- the barrier layers show good adhesion to all of the layers mentioned and thus form moisture-tight and chemically stable interfaces to these layers.
- the layer structure is an electrical component with at least two electrodes, in which an electrode is formed from an electrode layer arranged directly above the substrate.
- This electrode layer can be structured to produce the above-mentioned electrode and thus represent an electrode structure as is particularly suitable for integrated series-connected thin-film solar modules.
- the electrical connections for the at least two electrodes can also be formed from this lower electrode layer and can be led out laterally from the region of the component. the.
- Such an arrangement has the advantage that, compared to a conventional arrangement with, for example, soldered electrical connections, it can be made particularly flat without additional structural steps. This facilitates an edge covering covering with the barrier layer according to the invention.
- the electrical connections led out of the layer structure of the component under the barrier layer and formed from the first electrode layer can consist of a corrosion-resistant metal. However, they are preferably covered with the electrically conductive passivation layer mentioned, in particular a titanium or molybdenum nitride layer.
- the passivation layer can completely cover the lower electrode layer and can be structured accordingly. It is also possible to cover the lower electrode layer only in the area of the electrical connections with the passivation layer, and in particular only in the area of the implementation of the connections under the barrier layer.
- a further advantageous embodiment of the invention relates to the CIGS thin-film solar modules already mentioned.
- a defined alkali content is required in the CIGS absorber layer for maximum efficiency of the solar cell.
- a barrier layer according to the invention designed as a passivation layer can advantageously be used for such a barrier layer insert the base or back electrode.
- a barrier layer made of titanium or molybdenum nitride can simultaneously serve as a passivation layer for the electrical connections leading to the outside or as a barrier layer for the entire lower electrode.
- An additional The barrier layer over the solar cell has particularly good adhesion and thus forms a particularly good and dense interface with the barrier layer.
- FIG. 1 shows a schematic cross section through a test arrangement with a climate-sensitive thin layer.
- FIGS. 2 to 5 show schematic cross sections through climate-stable layer arrangements.
- FIG. 6 shows a schematic cross section
- FIGS. 7 and 8 show a special application of the invention on the basis of schematic cross sections through a series-connected thin-film solar cell.
- FIG. 1 shows a thin-film arrangement serving as a test structure with a known encapsulation.
- a carrier consisting of a 2 mm thick window glass (soda lime glass)
- a 1.5 ⁇ m thick boron-doped zinc oxide layer 2 is applied by means of the CVD method in such a way that the carrier 1 remains free in the entire peripheral edge region.
- Metallic contact strips 3 are now soldered on two opposite sides so that the electrical surface conductivity of the zinc oxide layer 2 can be reliably determined.
- a conventional laminate structure 5 is now produced above this, for example by laminating a cover with the aid of an approximately 0.5 mm thick EVA film at approximately 160 ° C.
- the Laminate construction has an overlap area of 1 cm with the substrate on the side of the thin-layer arrangement.
- FIG. 2 now shows a first structure according to the invention, in which again a boron-doped zinc oxide layer 2 arranged on a substrate 1 with electrode strips 3 applied thereon is used as test structure.
- a barrier layer 4 is now applied over this arrangement.
- a plasma CVD method is used for application, which can be carried out at low process temperatures of, for example, 200 to 300 ° C.
- a barrier layer 4 of approximately 0.5 to 2 ⁇ m and in particular 0.8 ⁇ m thick silicon nitride is deposited at 200 ° C. This is done in such a way that the thin layer 2 is completely covered with the barrier layer 4.
- the likewise electrically insulating A1 2 0 3 and SiO x N y layers can also be deposited as barrier layers using a similar method.
- a laminate structure 5 is applied above this, as already described in FIG.
- the thin-layer arrangement according to the invention survives the climatic test without detectable degradation, that is to say without the initial surface conductivity of the thin layer being reduced. Since, as stated, this parameter is an excellent probe for the detection of exposure to moisture, this measurement result shows the high effectiveness of the encapsulation according to the invention.
- FIG. 3 shows a schematic cross section of a layer structure in which a moisture-sensitive layer and in particular a thin layer 2 between a lower electrode 3a and an upper electrode 3b is arranged on a substrate 1.
- electrical connections 6 are provided which are formed directly on the substrate by structuring the lower electrode layer 3a. While the lower electrode 3a is contacted via an electrical connection 6, the upper electrode 3b is connected to the electrical connection 6 ', which is electrically insulated from the lower electrode 3a by a structure line.
- a barrier layer 4 is now applied over this arrangement, which completely covers the upper electrode 3b and the thin layer 2. The masked application or subsequent structuring of the barrier layer exposes the electrical connections 6 and 6 'and does not cover the barrier layer 4.
- the climate-tight encapsulation of the component shown here can be reinforced by applying a laminate structure 5 corresponding to FIGS. 1 or 2.
- the thin-film component can be a solar cell, for example.
- Figure 4 shows a further embodiment of the invention. This differs from the embodiment according to FIG. 3 in that the lower electrode layer 3a is completely covered with a metallically conductive passivation layer 7 before the structuring.
- the further structure corresponds to the exemplary embodiment described with reference to FIG. 3.
- the lower electrode layer which can consist, for example, of a corrosion-sensitive metal, is likewise protected against moisture and other external corrosion-demanding effects by the electrically conductive passivation layer 7.
- This arrangement is realized, for example, in a CIGS solar cell, which has a glass substrate 1, a molybdenum back electrode 3a, a titanium or molybdenum nitride passivation layer 7, the thin layer 2 with the CIGS absorber layer having a semiconductor junction, and an upper electrode 3b, for example a boron doped zinc oxide electrode.
- the barrier layer 4 is a thin layer of aluminum oxide, silicon nitride or silicon oxynitride applied by CVD or plasma CVD.
- the embodiment according to FIG. 5 differs from the embodiment described with reference to FIG. 4 in that the lower electrode layer 3a is covered with an electrically conductive passivation layer 7 and 7 'only in the area of the electrical connections 6 and 6'.
- the passivation layer can either be applied in a masked manner or applied over the entire area immediately before the structuring of the lower electrode layer 3a and then structured.
- the passivation layer is deposited or sputtered on using a thin-film process such as reactive sputtering or a plasma-assisted CVD process.
- a thin-film process such as reactive sputtering or a plasma-assisted CVD process.
- a titanium nitride layer for example, 100 to 150 nm layer thickness are sufficient.
- FIG. 6 shows a schematic cross section
- a barrier layer 4 (not shown) to achieve climate-tight adhesion of the barrier layer on the underlying climate-stable layer.
- 6 shows a passivation layer 7 above the lower electrode 3a as a climate-stable layer.
- FIGS. 7 and 8 show a further embodiment of the invention on the basis of schematic cross sections through a solar module with integrated series-connected solar cells in thin-film construction.
- the solar cell is applied, for example, to a substrate 1 and comprises a lower electrode 3a, a thin layer 2 with the semiconductor structure and an upper electrode 3b.
- the solar cells are structured, for example, in the form of strips, with a series connection with the respectively adjacent strip-shaped solar cell being achieved by leading a strip-shaped upper electrode 3b down onto the respectively adjacent strips of the lower electrode 3a.
- the first structuring step serves for structuring the lower electrode 3a, the second for structuring the semiconductor layers (thin layer) 2 and the third for separating the upper electrode 3b.
- the latter structuring step either the semiconductor layer (thin layer 2) or the lower electrode layer 3a is exposed.
- FIG. 7 shows structuring trenches P3 reaching as far as the lower electrode 3a.
- FIG. 8 now shows how the structuring trenches P3 are filled in by applying an edge-covering barrier layer 4 and leveled out by growth.
- the barrier layer 4 is applied to a surface which projects beyond the layer structure on all sides and also overlaps the electrical connections 6 and 6 '. Via the electrical connections 6 and 6 ', the barrier layer 4 can then be partially removed again, so as to make an external electrical connection possible, for example by soldering on metal strips 9.
- the barrier layer can also be applied after the metal strips 9 have been soldered on so that the solder joint of the barrier layer 4 is covered. In this way, the passivation layer (7) for the lower electrode 3a can be omitted.
- any layer structures and in particular large-area thin-layer arrangements which have climate- and corrosion-stable layers and have layers which are sensitive to climate and corrosion. It is particularly suitable for the climate-tight encapsulation of solar cells, but of course it is not restricted to such.
- the invention is particularly suitable for those thin-film arrangements which are exposed to hot and / or humid environments. Of course, this also applies to layer structures that are usually not exposed to such corrosion-supporting environmental conditions.
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19611410A DE19611410C1 (en) | 1996-03-22 | 1996-03-22 | Climate-stable electrical thin film structure |
DE19611410 | 1996-03-22 | ||
DE19707280A DE19707280A1 (en) | 1997-02-24 | 1997-02-24 | Climate and corrosion-stable layer structure |
DE19707280 | 1997-02-24 | ||
PCT/EP1997/001451 WO1997036334A1 (en) | 1996-03-22 | 1997-03-21 | Laminated structure which is stable with respect to climate and corrosion |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0888641A1 true EP0888641A1 (en) | 1999-01-07 |
Family
ID=26024048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97908285A Withdrawn EP0888641A1 (en) | 1996-03-22 | 1997-03-21 | Laminated structure which is stable with respect to climate and corrosion |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0888641A1 (en) |
JP (1) | JP2000507393A (en) |
CN (1) | CN1218577A (en) |
WO (1) | WO1997036334A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0969521A1 (en) * | 1998-07-03 | 2000-01-05 | ISOVOLTAÖsterreichische IsolierstoffwerkeAktiengesellschaft | Photovoltaic module and method of fabrication |
JP2002100469A (en) | 2000-09-25 | 2002-04-05 | Pioneer Electronic Corp | Organic electroluminescence display panel |
CN100344019C (en) | 2004-06-16 | 2007-10-17 | 松下电器产业株式会社 | Active material, manufacturing method thereof and nonaqueous electrolyte secondary battery containing the material |
DE602006016008D1 (en) | 2005-12-21 | 2010-09-16 | Saint Gobain | PROCESS FOR MANUFACTURING A PHOTOVOLTAIC THIN FILM COMPONENT |
JP5219538B2 (en) | 2008-02-12 | 2013-06-26 | 大成建設株式会社 | Solar cell with photovoltaic thin film directly formed on substrate |
FR2939240B1 (en) * | 2008-12-03 | 2011-02-18 | Saint Gobain | LAYERED ELEMENT AND PHOTOVOLTAIC DEVICE COMPRISING SUCH A MEMBER |
JP5334645B2 (en) * | 2009-03-31 | 2013-11-06 | 富士フイルム株式会社 | Flexible solar cell module |
US9059349B2 (en) * | 2010-02-09 | 2015-06-16 | Dow Global Technologies Llc | Moisture resistant photovoltaic devices with improved adhesion of barrier film |
JP5667027B2 (en) * | 2010-11-02 | 2015-02-12 | 富士フイルム株式会社 | Solar cell submodule, method for manufacturing the same, and substrate with electrode |
CN110344034A (en) * | 2019-07-30 | 2019-10-18 | 暨南大学 | A kind of nanometer reaction spray deposition process of frosting pure nickel coating |
CN114874731B (en) * | 2022-05-11 | 2023-09-22 | 长春工业大学 | Perovskite photovoltaic packaging material, perovskite photovoltaic packaging device and preparation method of perovskite photovoltaic packaging material |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3996067A (en) * | 1975-12-30 | 1976-12-07 | The United States Of America As Represented By The National Aeronautics And Space Administration | Silicon nitride coated, plastic covered solar cell |
DE3027256A1 (en) * | 1980-07-18 | 1982-02-18 | Robert Bosch Gmbh, 7000 Stuttgart | MULTILAYER SYSTEM FOR HEAT PROTECTION APPLICATIONS AND METHOD FOR THE PRODUCTION THEREOF |
US4780372A (en) * | 1984-07-20 | 1988-10-25 | The United States Of America As Represented By The United States Department Of Energy | Silicon nitride protective coatings for silvered glass mirrors |
JPS61128576A (en) * | 1984-11-27 | 1986-06-16 | Inax Corp | Solar cell with substrate made the ceramic and manufacture thereof |
DE3725338A1 (en) * | 1987-07-30 | 1989-02-09 | Nukem Gmbh | ENCLOSURE OF A PHOTOVOLTAIC ELEMENT |
JPH0435070A (en) * | 1990-05-31 | 1992-02-05 | Taiyo Yuden Co Ltd | Phototransmissive wiring board |
-
1997
- 1997-03-21 CN CN97194657A patent/CN1218577A/en active Pending
- 1997-03-21 WO PCT/EP1997/001451 patent/WO1997036334A1/en not_active Application Discontinuation
- 1997-03-21 JP JP9534021A patent/JP2000507393A/en active Pending
- 1997-03-21 EP EP97908285A patent/EP0888641A1/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
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CN1218577A (en) | 1999-06-02 |
WO1997036334A1 (en) | 1997-10-02 |
JP2000507393A (en) | 2000-06-13 |
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