EP0888570A1 - Reticular objective for microlithography-projection exposure installations - Google Patents
Reticular objective for microlithography-projection exposure installationsInfo
- Publication number
- EP0888570A1 EP0888570A1 EP97952867A EP97952867A EP0888570A1 EP 0888570 A1 EP0888570 A1 EP 0888570A1 EP 97952867 A EP97952867 A EP 97952867A EP 97952867 A EP97952867 A EP 97952867A EP 0888570 A1 EP0888570 A1 EP 0888570A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- rema
- lens
- plane
- objective
- lens according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000009434 installation Methods 0.000 title 1
- 239000011521 glass Substances 0.000 claims abstract description 13
- 210000001747 pupil Anatomy 0.000 claims description 15
- 230000000873 masking effect Effects 0.000 claims description 9
- 238000001393 microlithography Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 4
- 206010073261 Ovarian theca cell tumour Diseases 0.000 claims description 2
- 208000001644 thecoma Diseases 0.000 claims description 2
- 241000022563 Rema Species 0.000 claims 21
- 238000012937 correction Methods 0.000 abstract description 5
- 230000002708 enhancing effect Effects 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- 239000010453 quartz Substances 0.000 description 17
- 230000005540 biological transmission Effects 0.000 description 7
- 230000006978 adaptation Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 2
- 241000478345 Afer Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/18—Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70066—Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
- G02B13/143—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation for use with ultraviolet radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
Definitions
- the invention relates to a REMA lens.
- This is a lens with which a reticle masking device (REMA) is imaged in the plane of the reticle that carries the structured mask for the lithography.
- the area illuminated on the reticle is thus sharply outlined.
- the reticle masking device is usually constructed with adjustable cutting edges.
- the picture is usually magnifying.
- a REMA lens is used in microlithography projection exposure systems (steppers or scanners).
- an illumination device for a microlithographic projection exposure system in which the following are provided: light source, shutter, coupling lens (zoom axicon), glass rod as integrator, reticle masking system, REMA lens for imaging the intermediate field level lying in the reticle masking system onto the reticle, containing a first lens group, an intermediate pupil level, a second lens group, a deflecting mirror, a third lens group and the reticle level with the reticle.
- a projection lens which is normally reduced in size and - for example with a non-telecentric entrance - contains an internal pupil plane, then the afer in the image plane.
- a projection objective is provided after the integrator, here a honeycomb condenser, before the reticle masking system follows.
- the reticle masking system is optically conjugated to the reticle plane via two lens groups and mirrors, i.e. is imaged.
- the aperture at the exit of the integrator - the secondary light source - through the two lens groups and parts of the projection lens onto the pupil of the projection Lens shown. None is said about image errors.
- WO 95/32446 by the applicant describes a high-aperture catadioptric reduction lens for microlithography, the embodiment of a REMA lens shown here being exactly suitable for the embodiment according to FIG. 3 and Table 2.
- the object of the invention is to provide a REMA lens which has considerably fewer interfaces - at which reflection losses occur - and considerably less glass path - in which absorption takes place - and thus has a significantly improved transmission efficiency. No compromise can be made on the optical properties.
- Claim 1 makes this relationship clear.
- Claim 2 is based on the structure, with condenser, intermediate and field lens part.
- the sub-claims 3 to 15 relate to advantageous execution forms.
- Claim 3 quantifies the reduced glass path to below 30%, preferably below 25%, of the object-reticle distance.
- Claims 7 and 8 relate to the adaptation to the special preferred environment with REMA at the exit of a glass rod or with a reducing catadioptric projection object.
- Claim 15 describes the adaptation to the pupil function of a projection lens with very good telecentricity with very small deviations.
- the small deviations of the main rays of the projection lens from the parallelism are very well hit by the REMA lens.
- Independent claim 16 takes up this good adaptation of the REMA objective with the few elements described to the associated projection objective for an entire microlithography projection exposure system.
- FIG. 1 shows the lens section of a REMA objective with three aspheres
- FIG. 2 schematically shows a microlithography projection exposure system
- Figure 3 shows a given pupil function
- FIG. 4 shows in the example deviations of the pupil function from FIG. 3.
- FIG. 5 shows the lens section of another embodiment with four aspheres.
- the exemplary embodiment of a REMA objective with the lens section of FIG. 1 has the data in Table 1. It consists of a condenser part 100, designed as a partial objective, in front of the aperture diaphragm 8, an intermediate part 200 and a field lens part 300. In each of these parts there is an asphere 7, 11, 17 provided. So the REMA lens has only seven lenses.
- the flat surfaces 9 and 14 only have a placeholder function.
- a deflecting mirror (240 in FIG. 2) can be arranged in the region of 14.
- Aspherical surfaces are all optical surfaces with a rotationally symmetrical deviation from the best-matched sphere above approx. 5 micrometers
- the useful asphericities are predominantly of the order of 0.1 to 1 mm (typically up to 2 mm).
- the objective forms the object plane 1, in which the reticle masking system is arranged, with the object-image distance of 1200 mm on the reticle level 19.
- the air spaces at the object level 1, at the aperture level 8, between the intermediate part 200 and the field lens portion 300, and at the reticle level 19 are generously dimensioned so that the parts to be arranged there - the REMA system 90, correction elements in the aperture level, a deflecting mirror 240 and the handling system 330 (see FIG. 2) for the reticle - can be accommodated without problems.
- the main function of a REMA objective the imaging of a light-dark edge (cutting edge of the REMA diaphragm) from the object plane 1 to the reticle plane 19 with an edge profile whose brightness values are 5% and 95% by less than 5%, preferably less than 0.5% of the field of view diameter are spaced apart:
- the distance is 0.4% of the image field diameter of 42.1 mm. This information provides an integral measure of all image defects in the entire image field, which is directly based on the function of the REMA lens.
- the magnification of the REMA lens is 4.444: 1.
- the incoming main beam ie the heavy beam of the incident light cone
- the incoming main beam differs only slightly from the specified main beam of a subsequent projection lens at every point of the image plane 19, namely by less than 3 mrad.
- This is equivalent to the requirement that a given pupil function - see FIG. 3 - must be reproduced with the smallest deviations in the reticle plane 19.
- FIG. 4 shows, this is achieved perfectly.
- the sine of the main beam angle sin (i) is shown as a function of the image height YB in the reticle plane 19, in Figure 4, the deviation sin (i), which is in a band of +/- 0.11 mrad around zero .
- the design of the field lens group 300 is decisive for the adaptation. In the example, it is reduced to the minimum of two lenses, the converging lens 15, 16 and the diverging lens 17, 18.
- One of the surfaces preferably the last surface 18, can also be made flat so that it is suitable for carrying a gray filter as a thin layer to control the intensity distribution on the reticle.
- the condenser part 100 is designed as a partial objective whose object plane is at infinity.
- the aperture lies in the object plane 1 of the overall lens and the image plane in the aperture 8 of the overall lens.
- the marginal rays of the partial objective thus correspond to telecentric main rays of the overall objective, the main rays of the partial objective correspond to the marginal rays of the overall objective.
- the image of this partial objective (condenser part 100) in the plane of the diaphragm 8 should be corrected as well as possible, since 8 correction elements can be accommodated in this plane and a clean diaphragm function is achieved.
- the coma expressed as the transverse deviation, is made in its maximum value less than 1%, preferably less than 0.2%, of the image field diameter of this partial image. For example 0.08% are achieved.
- the condenser part contains at least one hollow surface that is curved toward the object 1, for which the opening ratio of the radius of curvature to the lens diameter is close to the minimum of 0.5 for the hemisphere.
- the value on area 2 is 0.554. In general, it should be chosen less than 0.65.
- the intermediate part 200 also has an asphere 11. He now manages with a pair of lenses 10/11, 12/13, surface 13 fulfilling the following condition:
- this edge beam angle is in any case greater than 0.6 NAO.
- the REMA lens according to the invention thus has all the functions of the REMA lens according to DE 195 48 805.9; the embodiment of the example according to FIG. 1 can directly replace the exemplary embodiment of FIG. 1 there.
- the effect of the few aspheres 7, 11, 17 is drastic:
- the condenser part 100 shrinks from 5 to 3 lenses, the intermediate part 200 only needs 2 to 4 lenses, and in the field lens part 300 the number of lenses is also halved to 2. In this example there are only 7 lenses left (a maximum of 10 for others Versions).
- the glass path that is the sum of all glass thicknesses of the lenses on the optical axis, amounts to only 235 mm here compared to 396 mm in the earlier application, with a lens-image distance 1-19 of 1200 mm in both cases.
- the glass path is therefore reduced by over 40%, the proportion of the cutting width is only 20%, and in other versions only up to 25-30% of the cutting width.
- the transmission of high quality quartz glass at 248 nm is approx. 99.9% / cm. Aging processes (radiation damage, color center formation) reduce the value during operation.
- high-quality antireflection layers at 248 nm can achieve transmission levels of approx. 99.5%.
- the value in the example in FIG. 1 is at least 91.1%.
- the present design can be adapted to the conditions at other, especially lower, wavelengths taking into account the changed refractive index, the invention is particularly valuable for this development towards lower wavelengths.
- FIG. 2 shows a schematic overview of the optical part of an entire projection exposure system (wafer stepper), in which the REMA lens 123 according to the invention is integrated.
- a KrF excimer laser 50 with a wavelength of 248 nm serves as the light source.
- a device 60 is used for beam shaping and coherence reduction.
- a zoom axicon lens 70 enables different types of lighting to be set as required. It is like the entire arrangement (apart from the features of the REMA lens 123 according to the invention), for example, from the EP-A 0 687 956 or from DE-U 94 09 744 (both by the applicant) are known.
- the light is coupled into the glass rod 80, which is used for mixing and homogenization.
- the reticle masking system 90 which lies in the object plane 1 of the REMA objective 123, immediately follows. This consists of the first lens group 100, the pupil plane (diaphragm plane) 14, the second lens group 200, the deflecting mirror 240, the third lens group 300 and the image plane 33.
- the reticle 330 is arranged here, which is precisely positioned by the changing and adjusting unit 331 becomes. This is followed by the catadioptric projection lens 400 according to WO 95/32446 with the pupil plane 410. In the exemplary embodiment of Tables 1 and 2, however, the entrance pupil is almost infinite in front of the projection lens.
- the wafer 500 is arranged in the image plane.
- Figure 5 shows the lens section of another embodiment with 4 aspheres 505, 509, 514, 520 and a total of 18 interfaces of 8 lenses and a flat plate 521, 522.
- Table 2 gives the dimensions. Areas 511 and 516 only serve as governors. Image scale (4.730: 1) and image field (diameter 127 mm) do not differ significantly from the example in Figure 1. However, the light conductance is larger at 16.2 mm.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Lenses (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19653983A DE19653983A1 (en) | 1996-12-21 | 1996-12-21 | REMA lens for microlithography projection exposure systems |
DE19653983 | 1996-12-21 | ||
PCT/EP1997/006760 WO1998028644A1 (en) | 1996-12-21 | 1997-12-03 | Reticular objective for microlithography-projection exposure installations |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0888570A1 true EP0888570A1 (en) | 1999-01-07 |
Family
ID=7815984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97952867A Withdrawn EP0888570A1 (en) | 1996-12-21 | 1997-12-03 | Reticular objective for microlithography-projection exposure installations |
Country Status (7)
Country | Link |
---|---|
US (1) | US6366410B1 (en) |
EP (1) | EP0888570A1 (en) |
JP (1) | JP4044146B2 (en) |
KR (1) | KR100524662B1 (en) |
DE (1) | DE19653983A1 (en) |
TW (1) | TW388798B (en) |
WO (1) | WO1998028644A1 (en) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6680803B2 (en) * | 1996-12-21 | 2004-01-20 | Carl-Zeiss Smt Ag | Partial objective in an illuminating systems |
US7130129B2 (en) | 1996-12-21 | 2006-10-31 | Carl Zeiss Smt Ag | Reticle-masking objective with aspherical lenses |
DE19829612A1 (en) * | 1998-07-02 | 2000-01-05 | Zeiss Carl Fa | Microlithography lighting system with depolarizer |
JP2002531878A (en) * | 1998-11-30 | 2002-09-24 | カール−ツアイス−スチフツング | Large numerical aperture projection lens with minimum aperture aberration |
DE19855157A1 (en) | 1998-11-30 | 2000-05-31 | Zeiss Carl Fa | Projection lens |
DE19942281A1 (en) | 1999-05-14 | 2000-11-16 | Zeiss Carl Fa | Projection lens has system filter screen, constrictions and bulges, negative lens, and positive lenses |
DE19855108A1 (en) * | 1998-11-30 | 2000-05-31 | Zeiss Carl Fa | Microlithographic reduction lens, projection exposure system and method |
US6867922B1 (en) * | 1999-06-14 | 2005-03-15 | Canon Kabushiki Kaisha | Projection optical system and projection exposure apparatus using the same |
DE50000139D1 (en) * | 2000-01-18 | 2002-05-16 | Isco Optic Gmbh | projection lens |
DE10016176A1 (en) * | 2000-03-31 | 2001-10-04 | Zeiss Carl | Microlithographic illumination system, has optical element that can detect entire light beam with continuously differentiable surface in near field and asymmetrical with respect to optical axis |
JP2002055277A (en) * | 2000-08-11 | 2002-02-20 | Nikon Corp | Relay image-formation optical system, and illumination optical device and exposure device equipped with the optical system |
TWI241458B (en) * | 2001-02-23 | 2005-10-11 | Zeiss Carl Smt Ag | Illumination system with reduced energy loading |
DE10113612A1 (en) * | 2001-02-23 | 2002-09-05 | Zeiss Carl | Sub-objective for illumination system has two lens groups, second lens group with at least first lens with negative refractive index and at least second lens with positive refractive index |
US6683728B2 (en) | 2001-03-20 | 2004-01-27 | Carl-Zeiss-Stiftung | Illumination system with reduced energy loading |
DE10138847A1 (en) * | 2001-08-15 | 2003-02-27 | Zeiss Carl | Cover for an integrator unit |
US7289277B2 (en) * | 2002-07-09 | 2007-10-30 | Asml Holding N.V. | Relay lens used in an illumination system of a lithography system |
DE10329793A1 (en) * | 2003-07-01 | 2005-01-27 | Carl Zeiss Smt Ag | Microlithographic projection illumination system projection objective has gray filter with locally varying gray value for compensating polarization distribution disturbance caused by optical element |
WO2005033800A1 (en) | 2003-09-09 | 2005-04-14 | Carl Zeiss Smt Ag | Lithography lens system and projection exposure system provided with at least one lithography lens system of this type |
WO2006029796A2 (en) * | 2004-09-13 | 2006-03-23 | Carl Zeiss Smt Ag | Microlithographic projection exposure apparatus |
US20070285644A1 (en) * | 2004-09-13 | 2007-12-13 | Carl Zeiss Smt Ag | Microlithographic Projection Exposure Apparatus |
US8873151B2 (en) | 2005-04-26 | 2014-10-28 | Carl Zeiss Smt Gmbh | Illumination system for a microlithgraphic exposure apparatus |
JP5156740B2 (en) * | 2006-07-03 | 2013-03-06 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Method for correcting / repairing a lithographic projection objective |
KR101408483B1 (en) * | 2006-11-30 | 2014-06-17 | 칼 짜이스 에스엠티 게엠베하 | Method of manufacturing a projection objective and projection objective manufactured by that method |
EP1927890A1 (en) | 2006-11-30 | 2008-06-04 | Carl Zeiss SMT AG | Method of manufacturing a projection objective and projection objective manufactured by that method |
EP2097789B1 (en) | 2006-12-01 | 2012-08-01 | Carl Zeiss SMT GmbH | Optical system with an exchangeable, manipulable correction arrangement for reducing image aberrations |
DE102007009867A1 (en) * | 2007-02-28 | 2008-09-11 | Carl Zeiss Smt Ag | Imaging device with interchangeable diaphragms and method for this |
WO2008113605A2 (en) * | 2007-03-20 | 2008-09-25 | Carl Zeiss Smt Ag | Method for improving the imaging properties of an optical system and such an optical system |
DE102013202757B4 (en) * | 2013-02-20 | 2014-11-20 | Carl Zeiss Smt Gmbh | Lithography lighting systems with high light conductance and folding mirrors |
KR101704580B1 (en) * | 2015-08-31 | 2017-02-08 | 포항공과대학교 산학협력단 | Condensing lens and lithography apparatus using the same |
DE102023200548A1 (en) | 2023-01-24 | 2024-07-25 | Carl Zeiss Smt Gmbh | Chromatically corrected imaging illumination optics for use in a projection exposure system for lithography |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62266513A (en) | 1986-05-14 | 1987-11-19 | Canon Inc | Projecting exposure optical system |
JP3278896B2 (en) | 1992-03-31 | 2002-04-30 | キヤノン株式会社 | Illumination apparatus and projection exposure apparatus using the same |
DE4417489A1 (en) * | 1994-05-19 | 1995-11-23 | Zeiss Carl Fa | High-aperture catadioptric reduction lens for microlithography |
DE19548805A1 (en) * | 1995-12-27 | 1997-07-03 | Zeiss Carl Fa | REMA lens for microlithography projection exposure systems |
-
1996
- 1996-12-21 DE DE19653983A patent/DE19653983A1/en not_active Ceased
-
1997
- 1997-12-03 EP EP97952867A patent/EP0888570A1/en not_active Withdrawn
- 1997-12-03 JP JP52829398A patent/JP4044146B2/en not_active Expired - Fee Related
- 1997-12-03 WO PCT/EP1997/006760 patent/WO1998028644A1/en not_active Application Discontinuation
- 1997-12-03 US US09/125,621 patent/US6366410B1/en not_active Expired - Lifetime
- 1997-12-03 KR KR1019980706495A patent/KR100524662B1/en not_active IP Right Cessation
- 1997-12-19 TW TW086119289A patent/TW388798B/en not_active IP Right Cessation
Non-Patent Citations (1)
Title |
---|
See references of WO9828644A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2000505916A (en) | 2000-05-16 |
US6366410B1 (en) | 2002-04-02 |
JP4044146B2 (en) | 2008-02-06 |
KR100524662B1 (en) | 2006-01-12 |
WO1998028644A1 (en) | 1998-07-02 |
DE19653983A1 (en) | 1998-06-25 |
TW388798B (en) | 2000-05-01 |
KR19990087107A (en) | 1999-12-15 |
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