EP0884783A3 - Dispositif micromagnétique de traitement de puissance et son procédé de fabrication - Google Patents

Dispositif micromagnétique de traitement de puissance et son procédé de fabrication Download PDF

Info

Publication number
EP0884783A3
EP0884783A3 EP98304525A EP98304525A EP0884783A3 EP 0884783 A3 EP0884783 A3 EP 0884783A3 EP 98304525 A EP98304525 A EP 98304525A EP 98304525 A EP98304525 A EP 98304525A EP 0884783 A3 EP0884783 A3 EP 0884783A3
Authority
EP
European Patent Office
Prior art keywords
power processing
manufacture therefor
processing applications
micromagnetic device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98304525A
Other languages
German (de)
English (en)
Other versions
EP0884783A2 (fr
Inventor
Dean Paul Kossives
Ashraf Wagih Lotfi
Lynn Frances Schneemeyer
Michael Louis Steigerwald
Robert Bruce Van Dover
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of EP0884783A2 publication Critical patent/EP0884783A2/fr
Publication of EP0884783A3 publication Critical patent/EP0884783A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
EP98304525A 1997-06-10 1998-06-09 Dispositif micromagnétique de traitement de puissance et son procédé de fabrication Withdrawn EP0884783A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/872,250 US6118351A (en) 1997-06-10 1997-06-10 Micromagnetic device for power processing applications and method of manufacture therefor
US872250 1997-06-10

Publications (2)

Publication Number Publication Date
EP0884783A2 EP0884783A2 (fr) 1998-12-16
EP0884783A3 true EP0884783A3 (fr) 1999-08-18

Family

ID=25359170

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98304525A Withdrawn EP0884783A3 (fr) 1997-06-10 1998-06-09 Dispositif micromagnétique de traitement de puissance et son procédé de fabrication

Country Status (8)

Country Link
US (4) US6118351A (fr)
EP (1) EP0884783A3 (fr)
JP (1) JPH1174126A (fr)
KR (1) KR100305070B1 (fr)
CN (1) CN1203446A (fr)
CA (1) CA2237819C (fr)
SG (1) SG64491A1 (fr)
TW (1) TW373196B (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
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US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US8421158B2 (en) 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same

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US6303423B1 (en) 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US6255714B1 (en) 1999-06-22 2001-07-03 Agere Systems Guardian Corporation Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor
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US7180395B2 (en) * 2004-11-10 2007-02-20 Enpirion, Inc. Encapsulated package for a magnetic device
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US6163234A (en) 2000-12-19
KR100305070B1 (ko) 2001-11-02
JPH1174126A (ja) 1999-03-16
CN1203446A (zh) 1998-12-30
EP0884783A2 (fr) 1998-12-16
US6160721A (en) 2000-12-12
CA2237819C (fr) 2001-02-13
CA2237819A1 (fr) 1998-12-10
SG64491A1 (en) 1999-04-27
KR19990006843A (ko) 1999-01-25
US20030150898A1 (en) 2003-08-14
US7021518B2 (en) 2006-04-04
US6118351A (en) 2000-09-12
TW373196B (en) 1999-11-01

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