EP0870597A2 - Method and apparatus for adjusting a punch relative to a die in a sintering press - Google Patents

Method and apparatus for adjusting a punch relative to a die in a sintering press Download PDF

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Publication number
EP0870597A2
EP0870597A2 EP98103086A EP98103086A EP0870597A2 EP 0870597 A2 EP0870597 A2 EP 0870597A2 EP 98103086 A EP98103086 A EP 98103086A EP 98103086 A EP98103086 A EP 98103086A EP 0870597 A2 EP0870597 A2 EP 0870597A2
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EP
European Patent Office
Prior art keywords
die
stamp
punch
monitor
adjusting
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Granted
Application number
EP98103086A
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German (de)
French (fr)
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EP0870597A3 (en
EP0870597B1 (en
Inventor
Jürgen Hinzpeter
Ulrich Zeuschner
Elke Wittenberg
Peter Lüneburg
Hans-Joachim Pierags
Ulrich Arndt
Stephan Mallon
Klaus-Peter Rüssmann
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Fette GmbH
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Wilhelm Fette GmbH
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Publication of EP0870597A2 publication Critical patent/EP0870597A2/en
Publication of EP0870597A3 publication Critical patent/EP0870597A3/en
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Publication of EP0870597B1 publication Critical patent/EP0870597B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/026—Mounting of dies, platens or press rams

Definitions

  • the invention relates to a method for adjustment of a punch relative to a die in sintering presses according to the preamble of claim 1.
  • a burr is with Compacts not desired, especially with such compacts, which are then coated. It is known, for example cutting inserts for milling, turning and Manufacture drilling tools in the sintering process. It is further known, such compacts with a hard material layer to coat. Now the compact shows a ridge there is a risk that the ridge will break and thereby at crucial points, namely the cutting edges, the necessary hardness can no longer be found. On the contrary, the tool wears out particularly quickly. To such Facing consequences is removing the ridge required.
  • the invention has for its object a method for setting a stamp relative to a die Sintering presses to create a small and uniform Gap over the scope can be realized.
  • the method according to the invention relates to sintering presses, who work with an upper and a lower stamp, i.e. where a through die hole is provided is.
  • the lower punch usually in the die hole
  • the upper stamp releases them so powder from can be introduced above.
  • the upper stamp into the die hole with the specified force and retracted via a predetermined path, if necessary with simultaneous Actuation of the lower stamp.
  • the punch is moved towards the die hole until it is in a position just before immersion.
  • the area the stamp is illuminated, and on the side facing away from the stamp
  • the side of the die becomes an optical pickup positioned, which engages the die hole. It understands themselves that for this purpose the lower stamp is so far from the The die is withdrawn as an optical pickup can be positioned below the die hole. With the help of the optical pickup, the die hole is made recorded and displayed on a monitor.
  • the diameter of the stamp is for obvious reasons minimally smaller than the diameter of the die hole, so that the stamp can move relatively freely in it. Therefore there is a gap between the stamp and the wall the die hole, even if it is extremely small. Such a gap can be detected by the optical pickup if sufficient brightness is available stands.
  • the gap is displayed on a monitor so that the operator using the known adjustment device for the stamp so far adjusted that get a uniform gap width over the circumference becomes.
  • the stamp is then attached to its sensor finally fixed, for example with the help of a suitable one Clamping device.
  • the method according to the invention has further the advantage that a minimal game realizes can be without risk of collision with the Hole wall of the die comes.
  • the device for performing the method sees one Lamp in front of the area between the stamp holder and Die off lights up.
  • a ring lamp is provided for this purpose, which the stamp surrounds in the measuring position.
  • the ring lamp can with the help suitable precautions temporarily mounted on the stamp with a suitable clamping device.
  • an endoscope On the opposite side is the optical pickup arranged, for example formed by an endoscope can be.
  • An endoscope has the advantage that it has relatively small dimensions and thereby in the Area between the die and the other press punches (lower punches) can be introduced.
  • Fig. 1 shows part of a sinter press, namely one Die 10 in a corresponding receptacle 12 and one Upper stamp 14 in a corresponding recording 16. The associated lower stamp is not shown.
  • the die 12 has a continuous one smooth-walled bore 18, the diameter of which is slight is larger than the outer diameter of the stamp 14. At coaxial alignment of bore 18 and punch 14 results a circumferentially extending gap of the width S.
  • a section 20 of the stamp which is enlarged in diameter 14 lies over a plate 22 against the bottom of a recess 24 of the stamp holder 16.
  • the Recess 24 dimensioned larger than the outer diameter of the Section 20.
  • Threaded holes 26 formed (see also Fig. 2), can accommodate the set screws that match the section 20 interact.
  • the one diametrically opposite Pair of screws can be adjusted in the X axis (Fig. 2) and with the diametrically opposite pair offset by 90 ° in the Z direction make.
  • one Clamping plate 28 which surrounds the stamp 14 and against the Section 20 is applied, only slightly tightened (the clamping screws are indicated by dashed lines at 30).
  • Fig. 3 it can be seen how the stamp 14 from a Ring 32 is surrounded, which is a ring lamp, the illuminates an area between ring 32 and stamp 14, as shown at 34.
  • the stamp is similar to that in FIG Arranged in Fig. 3 shortly before immersion in the bore 18.
  • the output of the camera 36 goes over a processing unit 39 on a monitor 40.
  • the bore 18 added, largely shaded by the stamp 14 is with the exception of the gap S (Fig. 1).
  • the operator can now see on the monitor 40 when this gap approximately over the circumference of the stamp has the same width.
  • the stamp 14 in the manner described above transverse to it Axis can be adjusted until the gap is approximately even is.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The press system has a stamp (14) held in a support. It is moved over a die (10) into which the sintered powder is loaded. The stamp is positioned closely over the die to ensure that it is correctly aligned. A closed-circuit television system is used which focuses onto the small spacing between the edge of the stamp and the edge of the die. This allows a fine precision adjustment to ensure maximum quality pressed parts without eccentric burrs etc.

Description

Die Erfindung bezieht sich auf ein Verfahren zur Einstellung eines Stempels relativ zu einer Matrize bei Sinterpressen nach dem Oberbegriff des Patentanspruchs 1.The invention relates to a method for adjustment of a punch relative to a die in sintering presses according to the preamble of claim 1.

Bei Sinterpressen, jedoch auch bei anderen Pressen oder Stanzen muß der Stempel relativ zur Matrizenbohrung oder -ausnehmung justiert werden. Gewünscht ist ein möglichst gleichmäßiger Spalt, d.h. Spiel zwischen Stempel und Matrize. Je genauer die Positionierung des Stempels zur Matrize erfolgt, desto gleichmäßiger ist auch das Spiel zwischen Stempel und Matrize über den Umfang gesehen. For sintering presses, but also for other presses or The punch must punch relative to the die hole or - Recess can be adjusted. One is desired if possible uniform gap, i.e. Game between stamp and die. The more precise the positioning of the stamp to the die the more even the game between Stamp and die seen over the circumference.

Ist zwischen Stempel und Matrize zum Beispiel bei Sinterpressen ein Spiel vorhanden, läßt sich ein wenn auch geringer Grat nicht vermeiden. Eine Gratbildung ist bei Preßlingen nicht erwünscht, insbesondere bei solchen Preßlingen, die anschließend noch beschichtet werden. Es ist bekannt, zum Beispiel Schneidplatten für Fräs-, Dreh- und Bohrwerkzeuge im Sinterverfahren herzustellen. Es ist ferner bekannt, derartige Preßlinge mit einer Hartstoffschicht zu beschichten. Weist nun der Preßling einen Grat auf, besteht die Gefahr, daß der Grat bricht und dadurch an entscheidenden Stellen, nämlich den Schneidkanten, nicht mehr die notwendige Härte anzutreffen ist. Im Gegenteil, das Werkzeug verschleißt besonders rasch. Um derartigen Folgen zu begegnen, ist eine Entfernung des Grats erforderlich.Is between the punch and the die, for example in sintering presses if there is a game, there can be a slight one Do not avoid burrs. A burr is with Compacts not desired, especially with such compacts, which are then coated. It is known, for example cutting inserts for milling, turning and Manufacture drilling tools in the sintering process. It is further known, such compacts with a hard material layer to coat. Now the compact shows a ridge there is a risk that the ridge will break and thereby at crucial points, namely the cutting edges, the necessary hardness can no longer be found. On the contrary, the tool wears out particularly quickly. To such Facing consequences is removing the ridge required.

Es ist bekannt, dem Stempel geeignete Verstelleinrichtungen zuzuordnen, um diese quer zur Längsachse gegenüber der Matrize auszurichten. Herkömmlich geschieht das Ausrichten visuell, ggf. mit einer Lupe.It is known to use suitable stamping devices assign to this across the longitudinal axis opposite the Align die. Alignment is traditionally done visually, if necessary with a magnifying glass.

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zum Einstellen eines Stempels relativ zu einer Matrize bei Sinterpressen zu schaffen, bei dem ein kleiner und gleichmäßiger Spalt über den Umfang verwirklicht werden kann. The invention has for its object a method for setting a stamp relative to a die Sintering presses to create a small and uniform Gap over the scope can be realized.

Diese Aufgabe wird durch die Merkmale des Patentanspruchs 1 gelöst.This object is achieved through the features of the patent claim 1 solved.

Das erfindungsgemäße Verfahren bezieht sich auf Sinterpressen, die mit einem Ober- und einem Unterstempel arbeiten, d.h. bei denen eine durchgehende Matrizenbohrung vorgesehen ist. Beim Herstellen der Preßlinge befindet sich der Unterstempel üblicherweise in der Matrizenbohrung, während der Oberstempel diese freigibt, damit Pulver von oben eingeführt werden kann. Anschließend wird der Oberstempel in die Matrizenbohrung mit vorgegebener Kraft und über einen vorgegebenen Weg eingefahren, ggf. bei gleichzeitiger Betätigung des Unterstempels.The method according to the invention relates to sintering presses, who work with an upper and a lower stamp, i.e. where a through die hole is provided is. When manufacturing the compacts there is the lower punch usually in the die hole, while the upper stamp releases them so powder from can be introduced above. Then the upper stamp into the die hole with the specified force and retracted via a predetermined path, if necessary with simultaneous Actuation of the lower stamp.

Zum Einstellen bzw. Justieren einer derartigen Anordnung wird der Stempel zur Matrizenbohrung hin bewegt, bis er in einer Position kurz vor dem Eintauchen ist. Der Bereich des Stempels wird beleuchtet, und auf der dem Stempel abgewandten Seite der Matrize wird ein optischer Aufnehmer positioniert, der die Matrizenbohrung erfaßt. Es versteht sich, daß zu diesem Zweck der Unterstempel so weit von der Matrize zurückgezogen ist, daß ein optischer Aufnehmer unterhalb der Matrizenbohrung positioniert werden kann. Mit Hilfe des optischen Aufnehmers wird die Matrizenbohrung erfaßt und auf einem Monitor abgebildet. For setting or adjusting such an arrangement the punch is moved towards the die hole until it is in a position just before immersion. The area the stamp is illuminated, and on the side facing away from the stamp The side of the die becomes an optical pickup positioned, which engages the die hole. It understands themselves that for this purpose the lower stamp is so far from the The die is withdrawn as an optical pickup can be positioned below the die hole. With the help of the optical pickup, the die hole is made recorded and displayed on a monitor.

Der Durchmesser des Stempels ist aus naheliegenden Gründen minimal kleiner als der Durchmesser der Matrizenbohrung, damit der Stempel sich relativ frei in dieser bewegen kann. Daher besteht auch ein Spalt zwischen Stempel und Wandung der Matrizenbohrung, wenn dieser auch äußerst klein ist. Ein solcher Spalt kann von dem optischen Aufnehmer erfaßt werden, wenn eine ausreichende Helligkeit zur Verfügung steht. Der Spalt wird auf einem Monitor abgebildet, so daß die Bedienungsperson mit Hilfe der an sich bekannten Verstellvorrichtung für den Stempel diesen so weit verstellt, daß über den Umfang eine gleichmäßige Spaltbreite erhalten wird. Anschließend wird der Stempel an seinem Aufnehmer endgültig fixiert, beispielsweise mit Hilfe einer geeigneten Klemmvorrichtung.The diameter of the stamp is for obvious reasons minimally smaller than the diameter of the die hole, so that the stamp can move relatively freely in it. Therefore there is a gap between the stamp and the wall the die hole, even if it is extremely small. Such a gap can be detected by the optical pickup if sufficient brightness is available stands. The gap is displayed on a monitor so that the operator using the known adjustment device for the stamp so far adjusted that get a uniform gap width over the circumference becomes. The stamp is then attached to its sensor finally fixed, for example with the help of a suitable one Clamping device.

Mit Hilfe des erfindungsgemäßen Verfahrens läßt sich ein gleichmäßiger Spalt einstellen mit der Folge, daß am Preßling ein gleichmäßig geringer Grat entsteht, der sich bei der weiteren Verarbeitung besser beseitigen läßt als einseitige Gratbildungen. Das erfindungsgemäße Verfahren hat ferner den Vorteil, daß ein minimales Spiel realisiert werden kann ohne Gefahr, daß es zu Kollisionen mit der Bohrungswandung der Matrize kommt.With the help of the method according to the invention one can Set a uniform gap with the result that the compact a uniformly small ridge arises, which the further processing can be eliminated better than one-sided Ridges. The method according to the invention has further the advantage that a minimal game realizes can be without risk of collision with the Hole wall of the die comes.

Die Vorrichtung zur Durchführung des Verfahrens sieht eine Lampe vor, welche den Bereich zwischen Stempelaufnahme und Matrize aus leuchtet. Nach einer Ausgestaltung der Erfindung ist hierzu eine Ringlampe vorgesehen, die den Stempel in der Meßposition umgibt. Die Ringlampe kann mit Hilfe geeigneter Vorkehrungen vorübergehend am Stempel montiert werden, zum Beispiel mit einer geeigneten Klemmvorrichtung.The device for performing the method sees one Lamp in front of the area between the stamp holder and Die off lights up. According to an embodiment of the invention a ring lamp is provided for this purpose, which the stamp surrounds in the measuring position. The ring lamp can with the help suitable precautions temporarily mounted on the stamp with a suitable clamping device.

Auf der gegenüberliegenden Seite ist der optische Aufnehmer angeordnet, der beispielsweise von einem Endoskop gebildet sein kann. Ein Endoskop hat den Vorteil, daß es relativ geringe Abmessungen aufweist und dadurch in den Bereich zwischen Matrize und den anderen Preßstempel (Unterstempel) eingeführt werden kann.On the opposite side is the optical pickup arranged, for example formed by an endoscope can be. An endoscope has the advantage that it has relatively small dimensions and thereby in the Area between the die and the other press punches (lower punches) can be introduced.

Es versteht sich, daß der beschriebene Einstellvorgang auch wiederholt werden kann, beispielsweise nach dem Festsetzen des Stempels in der Aufnahme.It is understood that the adjustment process described can also be repeated, for example after fixing of the stamp in the recording.

Die Erfindung wird nachfolgend anhand von Zeichnungen näher erläutert.

Fig. 1
zeigt einen Schnitt durch ein Teil einer Sinterpresse.
Fig. 2
zeigt einen Schnitt durch die Darstellung nach Fig. 1 entlang der Linie 2-2.
Fig. 3
zeigt die Sinterpresse nach Fig. 1 während des Einstellvorgangs mit einer Vorrichtung zur Durchführung des Verfahrens nach der Erfindung.
The invention is explained in more detail below with reference to drawings.
Fig. 1
shows a section through part of a sinter press.
Fig. 2
shows a section through the representation of FIG. 1 along the line 2-2.
Fig. 3
shows the sintering press of FIG. 1 during the setting process with a device for performing the method according to the invention.

Fig. 1 zeigt einen Teil einer Sinterpresse, nämlich eine Matrize 10 in einer entsprechenden Aufnahme 12 und einen Oberstempel 14 in einer entsprechenden Aufnahme 16. Der zugehörige Unterstempel ist nicht gezeigt.Fig. 1 shows part of a sinter press, namely one Die 10 in a corresponding receptacle 12 and one Upper stamp 14 in a corresponding recording 16. The associated lower stamp is not shown.

Wie erkennbar, weist die Matrize 12 eine durchgehende glattwandige Bohrung 18 auf, deren Durchmesser geringfügig größer ist als der Außendurchmesser des Stempels 14. Bei koaxialer Ausrichtung von Bohrung 18 und Stempel 14 ergibt sich ein in Umfangsrichtung sich erstreckender Spalt von der Breite S.As can be seen, the die 12 has a continuous one smooth-walled bore 18, the diameter of which is slight is larger than the outer diameter of the stamp 14. At coaxial alignment of bore 18 and punch 14 results a circumferentially extending gap of the width S.

Ein im Durchmesser vergrößerter Abschnitt 20 des Stempels 14 liegt über eine Platte 22 gegen den Grund einer Ausnehmung 24 der Stempelaufnahme 16. Wie erkennbar, ist die Ausnehmung 24 größer bemessen als der Außendurchmesser des Abschnitts 20. In der Aufnahme 16 sind vier um 90° versetzte Gewindebohrungen 26 geformt (siehe auch Fig. 2), die Einstellschrauben aufnehmen können, die mit dem Abschnitt 20 zusammenwirken. Mit dem einen diametral gegenüberliegenden Schraubenpaar läßt sich eine Einstellung in der X-Achse (Fig. 2) und mit dem diametral gegenüberliegenden um 90° versetzten Paar eine Verstellung in Z-Richtung vornehmen. Während einer solchen Verstellung ist eine Klemmplatte 28, die den Stempel 14 umgibt und gegen den Abschnitt 20 anliegt, nur schwach angezogen (die Klemmschrauben sind durch strichlierte Linien bei 30 angedeutet).A section 20 of the stamp which is enlarged in diameter 14 lies over a plate 22 against the bottom of a recess 24 of the stamp holder 16. As can be seen, the Recess 24 dimensioned larger than the outer diameter of the Section 20. In the receptacle 16 are four offset by 90 ° Threaded holes 26 formed (see also Fig. 2), can accommodate the set screws that match the section 20 interact. With the one diametrically opposite Pair of screws can be adjusted in the X axis (Fig. 2) and with the diametrically opposite pair offset by 90 ° in the Z direction make. During such an adjustment is one Clamping plate 28 which surrounds the stamp 14 and against the Section 20 is applied, only slightly tightened (the clamping screws are indicated by dashed lines at 30).

In Fig. 3 ist zu erkennen, wie der Stempel 14 von einem Ring 32 umgeben ist, der eine Ringlampe darstellt, die einen Bereich zwischen Ring 32 und Stempel 14 beleuchtet, wie bei 34 gezeigt. Ähnlich wie in Fig. 1 ist der Stempel in Fig. 3 kurz vor dem Eintauchen in die Bohrung 18 angeordnet.In Fig. 3 it can be seen how the stamp 14 from a Ring 32 is surrounded, which is a ring lamp, the illuminates an area between ring 32 and stamp 14, as shown at 34. The stamp is similar to that in FIG Arranged in Fig. 3 shortly before immersion in the bore 18.

Auf der gegenüberliegenden Seite der Matrize 10 ist eine Kamera 36 mit einem optischen Aufnehmer 38, z.B. einem Endoskop, angeordnet. Der Ausgang der Kamera 36 geht über eine Verarbeitungseinheit 39 auf einen Monitor 40.On the opposite side of the die 10 is one Camera 36 with an optical pickup 38, e.g. one Endoscope. The output of the camera 36 goes over a processing unit 39 on a monitor 40.

Mit Hilfe der optischen Anordnung 38 wird die Bohrung 18 aufgenommen, die weitgehend durch den Stempel 14 verschattet ist mit Ausnahme des Spaltes S (Fig. 1). Der Bediener kann nunmehr auf dem Monitor 40 erkennen, wann dieser Spalt über den Umfang des Stempels annähernd gleiche Breite hat. Um dies zu erreichen, kann der Stempel 14 in der oben beschriebenen Art und Weise quer zu seiner Achse verstellt werden, bis der Spalt annähernd gleichmäßig ist. Anschließend wird der Stempel 14 mit Hilfe der Klemmplatte 28 fest gegen die Aufnahme 16 gezogen. Ggf. kann die Überprüfung danach noch einmal erfolgen.With the help of the optical arrangement 38, the bore 18 added, largely shaded by the stamp 14 is with the exception of the gap S (Fig. 1). The operator can now see on the monitor 40 when this gap approximately over the circumference of the stamp has the same width. To achieve this, the stamp 14 in the manner described above transverse to it Axis can be adjusted until the gap is approximately even is. Then the stamp 14 with the help of Clamping plate 28 pulled firmly against the receptacle 16. Possibly. the check can then be carried out again.

Claims (3)

Verfahren zur Einstellung eines Stempels relativ zu einer Matrize bei Sinterpressen, gekennzeichnet durch folgende Verfahrensschritte: Stempel und Matrize werden so aufeinander zu bewegt, daß der Stempel sich in einer Position kurz vor dem Eintauchen in die Bohrung der Matrize befindet; Der Bereich des Stempels wird beleuchtet; Auf der dem Stempel abgewandten Seite wird ein optischer Aufnehmer positioniert, der die Matrizenbohrung erfaßt; Das von dem Aufnehmer aufgenommene Bild wird auf einem Monitor abgebildet; Nach Maßgabe der Abbildung auf dem Monitor wird der Stempel relativ zur Matrize quer zu seiner Achse so verstellt, daß ein gleichmäßiger Spalt zwischen. Stempel und Matrizenbohrung über den Umfang erhalten wird; und Anschließend wird der Stempel endgültig in seiner Aufnahme fixiert. Process for setting a stamp relative to a die in sintering presses, characterized by the following process steps: The punch and the die are moved towards one another in such a way that the punch is in a position shortly before immersion in the bore of the die; The area of the stamp is illuminated; On the side facing away from the stamp, an optical pickup is positioned, which detects the die hole; The image recorded by the sensor is displayed on a monitor; In accordance with the illustration on the monitor, the stamp is adjusted relative to the die transversely to its axis so that a uniform gap between. Punch and die hole is obtained over the circumference; and The stamp is then finally fixed in its holder. Vorrichtung zur Durchführung des Verfahrens nach Anspruch 1, dadurch gekennzeichnet, daß nahe der Matrize (10) eine den Stempel (14) ausleuchtende Lampe (32) und auf der gegenüberliegenden Seite der Matrize (10) eine Kamera (36) angeordnet ist.Device for performing the method according to claim 1, characterized in that near the die (10) a lamp (32) illuminating the stamp (14) and on the opposite side of the die (10) Camera (36) is arranged. Vorrichtung nach Anspruch 2, dadurch gekennzeichnet, daß eine den Stempel (14) umgebende Ringlampe (32) vorgesehen ist.Device according to claim 2, characterized in that a ring lamp (32) surrounding the stamp (14) is provided is.
EP98103086A 1997-04-08 1998-02-21 Method and apparatus for adjusting a punch relative to a die in a sintering press Expired - Lifetime EP0870597B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19714430A DE19714430C2 (en) 1997-04-08 1997-04-08 Method and device for setting a punch relative to a die in sintering presses
DE19714430 1997-04-08

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EP0870597A2 true EP0870597A2 (en) 1998-10-14
EP0870597A3 EP0870597A3 (en) 1999-03-03
EP0870597B1 EP0870597B1 (en) 2003-10-15

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EP (1) EP0870597B1 (en)
AT (1) ATE251988T1 (en)
DE (2) DE19714430C2 (en)

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DE102008040093A1 (en) 2008-07-02 2008-12-18 Basf Se Producing a ring like oxidic mold, useful e.g. in partial gas phase oxidation of e.g. an organic compound, comprising mechanical packing of a powdery material which is brought into the fill space of a die made of a metal compound
DE102008040094A1 (en) 2008-07-02 2009-01-29 Basf Se Production of an oxidic geometric molded body used as a catalyst in a heterogeneously catalyzed partial gas phase oxidation comprises mechanically compressing a powdered material inserted into a filling chamber of a die

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DE59809894D1 (en) 2003-11-20
EP0870597A3 (en) 1999-03-03
US6181370B1 (en) 2001-01-30
ATE251988T1 (en) 2003-11-15
EP0870597B1 (en) 2003-10-15
DE19714430A1 (en) 1998-10-15
DE19714430C2 (en) 2002-10-24

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