EP0843892A4 - TOP LOADING FOR BALL GRILLE ASSEMBLY - Google Patents
TOP LOADING FOR BALL GRILLE ASSEMBLYInfo
- Publication number
- EP0843892A4 EP0843892A4 EP96923548A EP96923548A EP0843892A4 EP 0843892 A4 EP0843892 A4 EP 0843892A4 EP 96923548 A EP96923548 A EP 96923548A EP 96923548 A EP96923548 A EP 96923548A EP 0843892 A4 EP0843892 A4 EP 0843892A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- ball grid
- top loading
- grid arrays
- loading socket
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US510763 | 1990-04-18 | ||
US101495P | 1995-07-10 | 1995-07-10 | |
US601014 | 1995-07-10 | ||
US08/510,763 US5578870A (en) | 1995-08-03 | 1995-08-03 | Top loading test socket for ball grid arrays |
US08/657,517 US5646447A (en) | 1996-06-03 | 1996-06-03 | Top loading cam activated test socket for ball grid arrays |
US657517 | 1996-06-03 | ||
PCT/US1996/011102 WO1997003467A1 (en) | 1995-07-10 | 1996-07-03 | Top loading socket for ball grid arrays |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0843892A1 EP0843892A1 (en) | 1998-05-27 |
EP0843892A4 true EP0843892A4 (en) | 1998-09-16 |
Family
ID=27356798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP96923548A Withdrawn EP0843892A4 (en) | 1995-07-10 | 1996-07-03 | TOP LOADING FOR BALL GRILLE ASSEMBLY |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0843892A4 (zh) |
JP (1) | JPH11509034A (zh) |
CN (1) | CN1192825A (zh) |
CA (1) | CA2226856A1 (zh) |
WO (1) | WO1997003467A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11233216A (ja) * | 1998-02-16 | 1999-08-27 | Nippon Denki Factory Engineering Kk | テスト用icソケット |
KR100385876B1 (ko) * | 2000-12-20 | 2003-06-02 | 한미반도체 주식회사 | 반도체 패키지장치 절단용 핸들러 시스템 |
JP2005339894A (ja) | 2004-05-25 | 2005-12-08 | Three M Innovative Properties Co | ボールグリッドアレイ集積回路装置の試験用ソケット |
JP4729346B2 (ja) * | 2005-06-30 | 2011-07-20 | 株式会社エンプラス | 電気部品用ソケット |
CN101063625B (zh) * | 2006-04-30 | 2010-08-11 | 中芯国际集成电路制造(上海)有限公司 | 用于测试bga封装的bga封装保持器装置和方法 |
JP6548607B2 (ja) * | 2016-05-18 | 2019-07-24 | 三菱電機株式会社 | 電子部品用ソケットおよびこれを用いた評価工程を有する製造方法 |
CN106785764A (zh) * | 2016-11-18 | 2017-05-31 | 珠海格力节能环保制冷技术研究中心有限公司 | 一种用于电路板的球栅矩阵芯片卡座及开发板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0613335A1 (en) * | 1993-02-24 | 1994-08-31 | Texas Instruments Incorporated | Socket apparatus for IC package testing |
US5419710A (en) * | 1994-06-10 | 1995-05-30 | Pfaff; Wayne K. | Mounting apparatus for ball grid array device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4381131A (en) * | 1981-05-04 | 1983-04-26 | Burroughs Corporation | Levered system connector for an integrated circuit package |
US5006792A (en) * | 1989-03-30 | 1991-04-09 | Texas Instruments Incorporated | Flip-chip test socket adaptor and method |
-
1996
- 1996-07-03 JP JP9505857A patent/JPH11509034A/ja active Pending
- 1996-07-03 WO PCT/US1996/011102 patent/WO1997003467A1/en not_active Application Discontinuation
- 1996-07-03 EP EP96923548A patent/EP0843892A4/en not_active Withdrawn
- 1996-07-03 CN CN 96196192 patent/CN1192825A/zh active Pending
- 1996-07-03 CA CA 2226856 patent/CA2226856A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0613335A1 (en) * | 1993-02-24 | 1994-08-31 | Texas Instruments Incorporated | Socket apparatus for IC package testing |
US5419710A (en) * | 1994-06-10 | 1995-05-30 | Pfaff; Wayne K. | Mounting apparatus for ball grid array device |
Non-Patent Citations (1)
Title |
---|
See also references of WO9703467A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP0843892A1 (en) | 1998-05-27 |
WO1997003467A1 (en) | 1997-01-30 |
CN1192825A (zh) | 1998-09-09 |
JPH11509034A (ja) | 1999-08-03 |
CA2226856A1 (en) | 1997-01-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19980204 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE ES FR GB IE IT PT |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 19980803 |
|
AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): DE ES FR GB IE IT PT |
|
17Q | First examination report despatched |
Effective date: 20011213 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20020424 |