EP0823983A1 - Präzisions-spannvorrichtung und verfahren zum einspannen von thyristoren mit elektronischen analogen hochleistungsbauteilen - Google Patents
Präzisions-spannvorrichtung und verfahren zum einspannen von thyristoren mit elektronischen analogen hochleistungsbauteilenInfo
- Publication number
- EP0823983A1 EP0823983A1 EP96913585A EP96913585A EP0823983A1 EP 0823983 A1 EP0823983 A1 EP 0823983A1 EP 96913585 A EP96913585 A EP 96913585A EP 96913585 A EP96913585 A EP 96913585A EP 0823983 A1 EP0823983 A1 EP 0823983A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- flange
- clamping
- sensor
- leaf spring
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to the technical sector of the clamping of electronic components especially designed in housings, and more particularly to the clamping of semiconductors used in high voltage and high current electronics, in particular diodes, thyristors, IGBT (“Insulated Gâte Based Thyristors ”Or field effect control thyristors), and the like.
- a lock nut can, in a first type of prior art, cooperate with a washer which, by the moment of its release, is supposed to indicate that the nominal clamping force is reached.
- the problem is approached in a radically different way.
- the result is a very simple system which radically solves the problem by allowing the use of modern measurement technologies, which have been known in themselves for a very long time, but which the old clamping systems did not allow. 'to employ.
- the clamping system intimately incorporates the force measurement system, the two systems therefore being both inseparable and interdependent, and the serious drawbacks due to the "mechanical" structure inevitably having an impact on the precision of the measurement system.
- the measures are "indirect”.
- the invention radically simplifies the concept of tightening and eliminates any “mechanical” interference, therefore brutal and coarse, on the measurement.
- Fig. 1 shows the closest prior art, with a witness washer and lock nut.
- - Fig. 2 shows a complete system of the prior art allowing a good understanding of the technology concerned.
- - Fig. 3 shows the clamping system according to the invention according to a nonlimiting embodiment, with sensor mounted on the "head”.
- - Fig. 4 shows another embodiment of the invention with a sensor mounted on the leaf spring, also without limitation.
- - Figs. 5 to 8 represent several variants of the invention.
- the clamping system (1) comprises nuts (A, B) tightening the flanges (3) by means of the "tie rods" (2), and the application of force on the component (13) (here in the housing) is made by an assembly which integrates both the head (4) / application ball joint (8) with their central pin (7) and the “measurement” device consisting of a lock nut (9) under which is arranged a washer (10).
- the assembly is made integral by the rod 5 'which crosses the flange.
- the part (5) or pressure screw of the head (4) makes it possible to accommodate "Belleville” washers (6) which must be pre-tightened in the workshop at a nominal force called “calibration value". It is easily understood that, when tightening, when the nominal force is reached, the lock nut (9) releases the washer (10).
- (12) represents a form coated with epoxy resin for electrical insulation and (11) designates heat dissipators or connection pads, this only for understanding the drawing.
- the lateral clamping means (A, B, 2) are not modified.
- leaf spring is meant according to the invention, and in the description and the claims, a blade based on a material which has elastic possibilities in bending, extension and compression, which correspond either to its initial elastic limits, or to those obtained by well known heat treatments and which make it possible to raise very strongly, for example from 300 to 1400-1600 MPa, the elastic limits.
- the new "head” according to the invention no longer has a measuring element which mechanically and actively interferes with the tightening.
- the new head now only has a passive precision sensor disposed between two suitable parts (14) and (15), (14) being positioned by a centering part (18).
- the Belleville washers (6) are not essential because their taring function has indeed disappeared according to the invention. They are used here only for their role of elastic damping and absorption of expansion of tight parts, of thermal origin, and reduction of the tightening forces induced.
- the blade (20) does not participate in the measurement and that its functions are to transmit force and to produce elastic damping.
- the senor is associated with an adapter (17) itself connected to (or comprising) a system for displaying the instantaneous force value for example. It is important to note that such a possibility of clear and real-time display of the value of the clamped force, in particular directly S.l. (N, kgf, decaN, t), represents a decisive practical advantage in the industry considered, and also a decisive securing of the tightening operation.
- Fig. 4 shows a preferred embodiment, even simpler, where the elastic function of the flange (20) is used very directly to activate the sensor (16).
- the "head” is simplified by the same amount, which represents a considerable development in technology and an even greater reduction in costs.
- FIG. 5 shows a variant of the invention according to which the flange (20) consists of at least two flanges or blades of smaller thickness, here the elementary flanges a, b, c, d.
- the flanges with multiple blades have advantages in terms of elasticity characteristics and make it possible to overcome certain constraints and modulate the ranges of use of the same device.
- FIG. 6 The same variant is shown in FIG. 6, with here only two elastic blades, without implied limitation, with application to the preferred mode of the invention represented in FIG. 4.
- Fig. 7 shows two other variants of the invention.
- a complementary elastic system (30) (here, and not limited to, Belleville washers in appropriate number) whose purpose, which will be understood by those skilled in the art, is to create a "fictitious arrow" at the level of the flange.
- This variant is particularly useful for clamping very thick units, for example clamping several components in series. In such a case, it is obviously necessary to increase the deflection of the flange to obtain the desired tightening. There is therefore a choice between either increasing the thickness of the flange, or risking breaking it.
- the variant with complementary elastic means allows to overcome this choice and obtain a correct tightening without oversizing the flange.
- FIG. 8 also represents a variant of the invention according to which the sensor (16) is mounted on a relatively thin spring leaf (40) which forms a "basic sensor element".
- This basic element can then be associated with all the necessary flanges as appropriate.
- Another advantage of the invention is shown diagrammatically on the right-hand part (D) of FIG. 7, which results from the use of one (or more) leaf springs according to the invention.
- This variant consists in using as a flange (20) a preformed leaf spring, that is to say having an arrow (f).
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Bolts, Nuts, And Washers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9505195 | 1995-04-27 | ||
FR9505195A FR2733657B1 (fr) | 1995-04-27 | 1995-04-27 | Bride de serrage de precision, et procede de serrage, de thyristors et composants electroniques de puissance analogues |
PCT/FR1996/000566 WO1996034518A1 (fr) | 1995-04-27 | 1996-04-12 | Bride de serrage de precision, et procede de serrage, de thyristors et composants electroniques de puissance analogues |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0823983A1 true EP0823983A1 (de) | 1998-02-18 |
Family
ID=9478596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP96913585A Withdrawn EP0823983A1 (de) | 1995-04-27 | 1996-04-12 | Präzisions-spannvorrichtung und verfahren zum einspannen von thyristoren mit elektronischen analogen hochleistungsbauteilen |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0823983A1 (de) |
CN (1) | CN1182526A (de) |
FR (1) | FR2733657B1 (de) |
WO (1) | WO1996034518A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102184899A (zh) * | 2011-04-14 | 2011-09-14 | 北京荣科恒阳整流技术有限公司 | 用于大功率晶闸管的两点式夹紧装置 |
JP6400206B2 (ja) * | 2015-07-27 | 2018-10-03 | 三菱電機株式会社 | 半導体装置 |
DE102019211867A1 (de) * | 2019-08-07 | 2021-02-11 | Robert Bosch Gmbh | Ankervorrichtung |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3755719A (en) * | 1969-12-23 | 1973-08-28 | Electric Regulator Corp | Semiconductor assembly |
FR2382099A1 (fr) * | 1977-02-24 | 1978-09-22 | Bbc Brown Boveri & Cie | Dispositif de serrage d'un composant a semi-conducteurs du type a cellule en disque et a contacts thermiques electriques sous compression |
JPS645341A (en) * | 1987-06-24 | 1989-01-10 | Fuji Electric Co Ltd | Measuring device of deflection amount of ring spring for uneven clamping of commutator |
-
1995
- 1995-04-27 FR FR9505195A patent/FR2733657B1/fr not_active Expired - Fee Related
-
1996
- 1996-04-12 CN CN 96193523 patent/CN1182526A/zh active Pending
- 1996-04-12 WO PCT/FR1996/000566 patent/WO1996034518A1/fr not_active Application Discontinuation
- 1996-04-12 EP EP96913585A patent/EP0823983A1/de not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO9634518A1 * |
Also Published As
Publication number | Publication date |
---|---|
FR2733657B1 (fr) | 1997-07-11 |
FR2733657A1 (fr) | 1996-10-31 |
WO1996034518A1 (fr) | 1996-10-31 |
CN1182526A (zh) | 1998-05-20 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 19971127 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): BE CH DE DK ES FI FR GB IT LI LU NL PT SE |
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17Q | First examination report despatched |
Effective date: 20030401 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20030507 |