EP0741839A1 - Mikromembranpumpe - Google Patents
MikromembranpumpeInfo
- Publication number
- EP0741839A1 EP0741839A1 EP95903302A EP95903302A EP0741839A1 EP 0741839 A1 EP0741839 A1 EP 0741839A1 EP 95903302 A EP95903302 A EP 95903302A EP 95903302 A EP95903302 A EP 95903302A EP 0741839 A1 EP0741839 A1 EP 0741839A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- pump
- membrane
- adhesive
- valve
- pump housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
Definitions
- the invention relates to a micromembrane pump according to the preamble of claim 1.
- micromembrane pumps are known, e.g. two differently driven pumps, which in H.T.G. van Lin ⁇ tel, F.CM. van de Pol, "A piezoelectric micropump based on micromachining of Silicon", Sensors and Actuators, 15 1988 153-167 and H.T.G. van Lintel, H.T.G. van Lintel, M. Elwen-spoek, J.H.J. Fluitman, "A thermopneumatic pump based on micro-engineering techniques", Sensors and Actuators, A21-A23 1990, 198-202.
- the first pump has a pump membrane with attached piezoceramic
- the second pump has a thermopneumatic drive above the pump membrane in the form of an expanding air volume when heat is added. Both pumps have integrated inlet and outlet valves.
- the fixed and moving parts of the mentioned micromembrane pumps which represent the current state of the art, are essentially made of the basic materials silicon and glass.
- the elastic parts of the pumps described, that is above all the pump and valve membranes, are thinly etched using different etching processes.
- the smallest membrane thicknesses are of the order of 20 mm.
- the thickness of the membranes and the material properties of glass or silicon in these pumps provide the boundary conditions which essentially limit the pump performance.
- With relatively large membrane diameters only small deflections are possible. As a result, such pump membranes do not achieve the compression ratios required to convey gases.
- the diameters of the valves must be chosen to be very large in order to keep the flexibility of the valve membranes and thus the pressure loss in the direction of passage small.
- the pump is driven by an external pneumatic actuator and is able to convey gaseous media.
- the pump has a pump membrane made of titanium and valves which consist of a titanium and a polyimide membrane.
- the pump membrane can be deflected to the bottom of the pump chamber and in this way has a high compression ratio.
- a relatively high pressure is required for the deflection of the pump diaphragm, which cannot be generated by an integrated actuator.
- all pumps must be glued individually for manufacture, which requires a lot of effort. The manufacture of this pump requires many individual steps to be carried out one after the other.
- the object of the invention is to provide a pump of the e. G. Design in such a way that it can be assembled in a few steps with a simple construction.
- a particular advantage of the pump is that the simultaneous, parallel production of many pumps with few manufacturing steps is possible with as little effort as possible.
- the lowest possible manufacturing effort relates both to the manufacture of the individual components of the pump such as pump housings, pump membranes and valves as well as the simultaneous and exact bonding of many micro components in one step.
- the pressure losses are minimized by designing the membrane in the area of the actuator chamber.
- Fig. 1 shows a schematic cross section through a pump and Fig. 2 shows a mold for its manufacture.
- FIG. 6 shows an example of the manufacture of a membrane with a heating coil.
- Figure 1 shows schematically the basic structure of the micropump.
- a polyimide membrane 3 with a thickness of 2 mm is glued on its upper side to the pump housing upper part 1 and on its lower side to the pump housing lower part 2.
- the pump housing contains the non-moving functional components of the pump. These are in the upper part 1 of the pump housing, the actuator chamber 17, various flow channels 6, the valve chamber 8 and the valve seat of the inlet valve 10, the valve chamber of the outlet valve 13, fluid inlet 5, fluid outlet 7, a coherent cavity system 19 for Filling with adhesive, and filling openings 20 and outlet openings for filling with adhesive. Furthermore, openings for the electrical contacting of the pump are not shown.
- the functional components in the lower part of the pump housing are the pump chamber 16, the flow channels 6 between the valves and the pump chamber, the valve chamber of the inlet valve 9, the valve seat of the outlet valve 14, a cavity system 18 for filling with adhesive, Adhesive inlet 22 and adhesive outlet 23.
- the cavities 18, 19 for the filling process and the cavities 6, 8, 9, 12, 13, 16, 17 are delimited from one another by webs 24, with the aid of which the lateral structures are formed and the structure height is precisely defined .
- the polyimide membrane 3 is characterized by a high elasticity and forms the pump membrane in the area of the actuator chamber 17. In the area of the inlet valve 8, 9, 10 and the outlet valve 12, 13, 14 there are holes 11 and 15 in the polyimide membrane 3.
- the valve effect results from the fact that the hole in the membrane is closed by the flat valve seat. if there is an overpressure on the side opposite the valve seat, or that the diaphragm lifts from the valve seat in such a way that the hole in the diaphragm is released and a flow occurs.
- the micromembrane pump is driven by the thermal expansion of a fluid which is located in the actuator chamber 17 and is heated by a metallic heating coil 4 applied to the polyimide membrane.
- a short current pulse is applied to the heating coil 4. This heats up and gives off heat both to the medium in the actuator chamber 17 and to the medium in the pump chamber. If there are gaseous media in the actuator chamber 17 and pump chamber 16, the pressure increase in the actuator gas resulting from the heating deflects the pump membrane. The deflection of the pump membrane 3 reduces the volume of the pump chamber 16 and, together with the simultaneous heating of the pump gas, leads to an increase in pressure in the pump chamber 16.
- the use of a liquid medium at low temperature in the actuator chamber 17 increases the expansion of the medium is achieved by its evaporation, which means that very high actuator pressures can be generated.
- the consequence of the pressure increase in the actuator chamber 17 here is again the deflection of the pump membrane 3 in the direction of the pump chamber 16.
- the cooling of the medium in the actuator chamber 17 begins by means of heat conduction and heat radiation.
- pressure and volume in the interior of the actuator chamber decrease in accordance with the gas laws, in the case of the vaporized liquid, condensation leads back to the initial state.
- the pump membrane moves back to its starting position and thus generates a negative pressure in the pump chamber 16 and on the valves as a result of the pump medium previously pushed out.
- the outlet valve now closes, while the inlet valve opens and pumps medium into the pump chamber.
- the heating coil applied directly to the pump membrane has further significant advantages.
- the heat transfer to the pump housing is minimized in the heating phase.
- the recondensation of the actuator medium by the medium conveyed is initiated at the location of the heating coil. This ensures that the heating coil is in optimal thermal contact with the actuator liquid at the beginning of the next heating phase.
- FIG. 3 shows an embodiment of a valve.
- the valves are characterized in that they consist of a flexible, freely stretched membrane 3, which has a microstructured opening 11 in the central area.
- the outline the valve opening 11 and the diaphragm clamping 25 can, as shown by way of example in FIG. 4, be round, oval or can be described by a polygon.
- Figure 3 explains the basic structure of a valve as it is implemented in the pumps manufactured.
- On one side of the membrane there is a flat, firm valve seat 10, which covers the opening of the valve membrane by at least the width of the required sealing surface between the membrane and the valve seat.
- the valve seat is part of one of the two pump bodies that are connected to the diaphragm.
- the tightness of the valves in the blocking direction is determined by the degree of coverage, the surface roughness of the valve membrane and valve seat and essentially by the flexibility of the valve membrane. Thanks to a very thin polyimide membrane, the sealing effect can be maintained even under unclean conditions, since it is able to nestle around small dirt particles.
- FIG. 5a shows the relationships of the example carried out.
- Membrane clamping and valve seat are on one level.
- FIG. 5b shows the exemplary embodiment of a high valve seat, which bulges the membrane upwards in the load-free state.
- a considerable pressure difference is already necessary to open the valve; the valve remains closed in the forward direction until this pressure difference is reached.
- the pressure drop at a given flow and therefore the power drop is higher than in FIG. 5a.
- the return flow during load changes is reduced due to the smaller stroke volume and the lower flexibility of the free, more tight membrane. This configuration is advantageous if small volume flows are to be rectified under large pressure differences or if the load change frequencies are high.
- the height of the valve seat does not reach the level of the membrane clamping, the membrane is freely stretched over its entire area in the no-load case.
- the valve has a lower flow resistance than in the forward direction in case a, it closes in the blocking direction only after a blocking pressure has been reached.
- the adhesive technology mentioned in claim 5 overcomes all these disadvantages and, due to its simplicity and the small number of work steps, is outstandingly suitable for the parallel bonding of microstructures.
- the prerequisites for successful gluing are already created in the design of the microstructures.
- the basic idea is that there are concave structures around the microstructures on a substrate, which can contain a large number of microstructures, which can be contiguous or partially contiguous and depend on the functional areas. microstructures are separated by bars of constant height.
- the concave structures have the task of taking up the adhesive in the actual adhesive step, so that after the adhesive has been bonded, separated by the webs, the adhesive is located around the microstructures.
- the adhesive takes on the function of mechanically linking the joining partners, the sealing of individual microstructures and the joining partners to one another and, through internal relaxation processes, helps to reduce internal stresses which, for. B. caused by temperature changes between the adhesive partners, at.
- the task of the webs is to use their height to specify a precisely reproducible reference height for setting the adhesive joint thickness and to prevent the adhesive from flowing into the microstructures during the adhesive process.
- FIG. 6 explains the conditions on the basis of a view of the lower housing part of the micropumps as they were manufactured.
- 18 mean the concave structure into which adhesive is poured
- 24 the webs that delimit the adhesive area
- 16, 9, 6, 14 are the functional areas pump chamber, valve chamber, flow channels of the pump and valve seat, which are free of adhesive have to stay.
- 22 is the opening into which the adhesive flows and 23 is the opening from which excess adhesive can emerge again or can enter a further microstructure.
- FIG. 12 shows a detail of the cross section through a concave structure for holding the adhesive between two microstructures.
- 24 means the webs that separate the adhesive area from the actual microstructures, 26 and 31 are the locally involved adhesive partners.
- FIG. 12b shows the concave structure for receiving the adhesive in areas of great structure height 36, which are primarily used for charging the adhesive, and in areas of low structure height, which allows the actual adhesive thickness to be adjusted precisely to the adhesive. O 95/2
- the adhesive process begins with the adjustment of the adhesive partners relative to one another (FIG. 7a) and the subsequent fixing of the joining partners by means of a tensioning device (FIG. 7b).
- the tension ensures that the webs 24 of one joining partner are pressed onto the second joining partner, which ensures close contact. This close contact enables the exact structural spacing of the two joining partners to be maintained and offers sufficient sealing during the actual gluing process.
- the adjustment and tensioning process takes place without the presence of adhesive, which has the advantage that the problems of adhesive handling cannot have a negative effect on the precision of the bonding.
- the adhesive is poured into the hollow structures created by the joining. Either microstructures which have an adhesive inlet and outlet 21 can be filled individually (see FIG.
- the adhesive can be supplied via a cannula, which is placed tightly on the adhesive inlet. Depending on the viscosity and wettability of the adhesive, as well as the desired flow rate, the adhesive is conveyed into the microstructures with overpressure until it emerges at the outlet opening. Adhesive flow and distribution are controlled by the geometry of the cavity system. A further control of the flow process can be achieved by applying negative pressure to outlet openings 21. This may be necessary above all if the fluid dynamic requirements for uniform filling could not be taken into account sufficiently precisely in the construction of complex channel systems.
- the adhesive is cured according to its specification.
- this effect does not lead to a malfunction in the function of the microcomponent, provided that the adhesive does not flow over the edge of the webs which face away from the adhesive cavities and wets the microstructures which are to remain free of adhesive.
- the adhesive process can be expanded by a non-adjusted intermediate step which ensures a complete seal underneath the webs.
- the microstructures which contain the webs are brought into contact in a stamping process with a highly viscous, chemically stable layer which has been applied to a flat substrate with a constant thickness. It can be z.
- an industrial grease which can be rinsed out without residue after bonding with a solvent.
- the layer applied in the order of magnitude of the surface roughness completely seals the adhesive cavities from the functional areas free of adhesive. Penetration of the adhesive as a result of the capillary action no longer takes place.
- hot-melt adhesives are also conceivable, provided that the processing temperature of the joining partners does not disturbing or impaired.
- the adhesive partners must be brought to the processing temperature of the adhesive before the filling process.
- auxiliary structure 32 ensures that the areas that are to contain adhesive are separated from the areas that must remain free of adhesive and ensures that a desired distance between the adhesive partners is exactly maintained. It can consist of one or more parts, it can be inserted discretely or it can have been built on one of the adhesive partners.
- FIG. 2 shows an example of the structure of a molding tool for the upper housing part of FIG. 1.
- Both the structures for the valve seats according to claim 2 are included, as well as the structures for separating the adhesive area from the functional ons range of the micropump according to claim 1.
- the structures for twelve pump upper parts 1 were on a first molding tool, and the structures for twelve pump lower parts were on a second mold insert
- the parameters of both the vacuum embossing device and the injection molding machine were chosen such that the total thickness of the molded parts was 1 mm.
- the materials used were polysulfone (PSU) (in the injection molding machine) and polyvinyl difluoride (PVDF) (in the vacuum embossing machine).
- PSU polysulfone
- PVDF polyvinyl difluoride
- the materials mentioned are characterized by high chemical resistance, optical transparency and temperature resistance.
- An unfavorable material property of all plastics for pump operation is their low thermal conductivity in comparison to metals and semiconductors.
- the consequence of using plastic pump housings is that the thermal power dissipated during operation of the pump is small in relation to pump housings made of metal of the same thickness, and the pump may consequently only be operated at low power in order to avoid overheating .
- the disadvantage can be overcome by selecting the overall thickness of the pump housing to be very small and by making intensive heat contact with a base substrate of high thermal conductivity and possibly a heat sink.
- the layer thickness can be reduced by the choice of the molding parameters, by post-processing with the aid of an ultra-milling machine or by a plasma etching step.
- the holes for the fluid inlet and outlet (5, 7 in FIG. 1), adhesive feed and venting (20, 21, 22, 23 in FIG. 1), and the holes for electrical through-plating have not yet been taken into account in the design of the mold inserts , but subsequently drilled with twist drills with a diameter of 0.45 mm and 0.65 mm. O 95/20105
- the core of the micropump is a polyimide film with a directly applied heating coil.
- the polyimide film which is structured lithographically for a large number of individual pumps with a single mask, takes on the task of both the individual pump membranes and the valve membranes.
- an electrically conductive layer was applied to the polyimide film, which was structured into heating coils in the area of the individual pump membranes.
- the contact surfaces for the electrical connection of the heating helixes were each outside the pump membrane.
- the manufacturing process of the structured polyimide film and the heating coils will now be explained in more detail using the example of the pumps produced (see FIG. 8).
- a silicon wafer with a diameter of 100 mm was used as the carrier substrate for the thin-film processes.
- FIG. 8a Since the film must be separated from the wafer after the first bonding, a thin gold separating layer 27 was sputtered onto the wafer, FIG. 8a. An edge 33 of 5 mm was covered around the wafer during the sputtering process in order to maintain the adhesion of the polyimide to the silicon substrate there and thereby prevent premature detachment of the polyimide film from the wafer. Subsequently (FIG. 8b), a polyimide layer 28 of the photostructurable polyimide Probimide 408 from CIBA-GEIGY was spun to a thickness of 3 ⁇ m with a varnish spinner and dried in a tempering step. The dried lacquer layer was then exposed to UV light 34 using the contact method.
- the chromium mask 29 used for this purpose provided an exposure of the areas in which a polyimide film should be kept and a covering of the areas which should be removed during development .
- the latter are the holes in the valves 15 and various alignment marks.
- a titanium layer 30 was applied by magnetron sputtering to a thickness of 2 ⁇ m. in order to structure heating coils 15 which have good adhesion to the polyimide.
- the titanium layer 30 was structured lithographically by the positive lacquer AZ4210 and by a subsequent etching process in a solution containing hydrofluoric acid.
- the exposure of the photoresist used was adjusted using the alignment marks in the polyimide layer and using alignment marks on the mask for structuring the titanium layer.
- Figure 8e shows the finished membrane structure located on the auxiliary substrate.
- the sputtering parameters (temperature, bias voltage, gas flow and the electrical power generating the plasma) were set so that an internal tensile stress was formed in the titanium.
- the heating coils were therefore also under tensile stress after the titanium layer.
- the titanium which has a much higher modulus of elasticity than polyimide, contracted together with the polyimide film.
- the polyimide film was compressed.
- the shape of the applied heating coils ensured that the pump membrane was not only free of tensile stress, but sagged slack. Almost no energy needs to be used to deflect such a slack pump membrane.
- the heating coil is designed as a double spiral
- the reduction in tension of the heating spiral after detaching from the substrate leads to a reduction in its length, which, according to geometric laws, means that the inner areas of the polyimide membrane cause a large radial displacement in relation to the elastic material expansions Experience center. This shift leads to the curvature of the membrane.
- a curvature of a membrane can also be achieved if any other structures of tangential orientation are attached around the membrane or in the membrane.
- the structures can be closed or interrupted circles, closed or act interrupted polygons or spirally arranged closed or interrupted polygons.
- the heating coil applied directly to the heating coil has two major advantages. Firstly, the heat transfer to the pump housing is minimized during the heating phase. Secondly, when a low-boiling liquid is used as the actuator medium, the recondensation of the actuator medium by the medium conveyed is initiated at the location of the heating coil. This ensures that at the beginning of the next heating phase the heating coil is in optimal thermal contact with the actuator liquid.
- polyimide instead of polyimide as the membrane material, other plastics or metals can also be used, with an additional electrically insulating layer between the membrane and the heating coil being provided in the case of metal membranes.
- the individual components of the upper part of the pump housing, the lower part of the pump housing, and the polyimide membrane with titanium heating coil could be examined for errors and were now ready for gluing.
- the three individual components were glued together by means of two adhesive processes (FIG. 7) of the type described.
- a simple device 35 was created, into which the adhesive partners were inserted, adjusted with respect to one another and then braced against one another.
- the polyimide film located on the silicon substrate 26 was glued to the pump housing upper part 1, which, among other things, contains the actuator chamber and all pump connections (FIGS. 7a-c).
- the structural dimensions of the membrane and the heating coils on the substrate 26 are larger than the corresponding dimensions of the pump housing. If the adhesive partners cool down to room temperature after bonding, then the contraction of the plastic pump housing causes the membranes to compress.
- the wafer with the connected, glued-on pump housing upper part 1 was removed from the clamping device 35 and the polyimide film was cut around the rectangular plastic part. As the cooling progressed, the polyimide film detached from the cut edge and supported by the contraction of the plastic part 1 due to the cooling independently of the silicon wafer (FIG. 7d).
- the pumps were operated with an electrical voltage of 15 V and a frequency of 3 Hz. The voltage was applied for 58 ms each. The average power supplied was 0.27 W. A delivery rate for air of 26 ml / min was measured. The deflection of the pump membrane 3 to the bottom of the pump chamber 16 could be clearly seen with the naked eye and the opening and closing of the valve membranes synchronized with the movement of the pump membrane could be observed in the microscope.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Reciprocating Pumps (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4402119A DE4402119C2 (de) | 1994-01-25 | 1994-01-25 | Verfahren zur Herstellung von Mikromembranpumpen |
DE4402119 | 1994-01-25 | ||
PCT/EP1994/003954 WO1995020105A1 (de) | 1994-01-25 | 1994-11-29 | Mikromembranpumpe |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0741839A1 true EP0741839A1 (de) | 1996-11-13 |
EP0741839B1 EP0741839B1 (de) | 1998-04-15 |
Family
ID=6508647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95903302A Expired - Lifetime EP0741839B1 (de) | 1994-01-25 | 1994-11-29 | Mikromembranpumpe |
Country Status (6)
Country | Link |
---|---|
US (1) | US5725363A (de) |
EP (1) | EP0741839B1 (de) |
JP (2) | JPH09503569A (de) |
DE (1) | DE4402119C2 (de) |
DK (1) | DK0741839T3 (de) |
WO (1) | WO1995020105A1 (de) |
Families Citing this family (116)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5705018A (en) * | 1995-12-13 | 1998-01-06 | Hartley; Frank T. | Micromachined peristaltic pump |
WO1997029538A1 (en) * | 1996-02-10 | 1997-08-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bistable microactuator with coupled membranes |
US5941501A (en) * | 1996-09-06 | 1999-08-24 | Xerox Corporation | Passively addressable cantilever valves |
EP0956449B1 (de) * | 1996-12-11 | 2002-05-29 | Gesim Gesellschaft für Silizium-Mikrosysteme mbH | Mikroejektionspumpe |
DE19719862A1 (de) * | 1997-05-12 | 1998-11-19 | Fraunhofer Ges Forschung | Mikromembranpumpe |
DE29708678U1 (de) * | 1997-05-16 | 1997-08-07 | Institut für Mikrotechnik Mainz GmbH, 55129 Mainz | Mikromembranpumpe |
DE19720482C5 (de) * | 1997-05-16 | 2006-01-26 | INSTITUT FüR MIKROTECHNIK MAINZ GMBH | Mikromembranpumpe |
US5836750A (en) * | 1997-10-09 | 1998-11-17 | Honeywell Inc. | Electrostatically actuated mesopump having a plurality of elementary cells |
US6106245A (en) * | 1997-10-09 | 2000-08-22 | Honeywell | Low cost, high pumping rate electrostatically actuated mesopump |
US6148635A (en) * | 1998-10-19 | 2000-11-21 | The Board Of Trustees Of The University Of Illinois | Active compressor vapor compression cycle integrated heat transfer device |
JP3620316B2 (ja) * | 1998-11-16 | 2005-02-16 | 株式会社日立製作所 | マイクロポンプとその製造方法 |
US6273687B1 (en) * | 1998-11-26 | 2001-08-14 | Aisin Seiki Kabushiki Kaisha | Micromachined pump apparatus |
US20020019059A1 (en) * | 1999-01-28 | 2002-02-14 | Calvin Y.H. Chow | Devices, systems and methods for time domain multiplexing of reagents |
DE50003276D1 (de) * | 1999-05-17 | 2003-09-18 | Fraunhofer Ges Forschung | Mikromechanische pumpe |
US6406605B1 (en) * | 1999-06-01 | 2002-06-18 | Ysi Incorporated | Electroosmotic flow controlled microfluidic devices |
US6179586B1 (en) * | 1999-09-15 | 2001-01-30 | Honeywell International Inc. | Dual diaphragm, single chamber mesopump |
DE19948613C2 (de) * | 1999-10-08 | 2003-04-30 | Hahn Schickard Ges | Elektromechanisches Bauelement mit einem Polymerkörper und Verfahren zur Herstellung desselben |
DE19964218C2 (de) * | 1999-10-08 | 2003-04-10 | Hahn Schickard Ges | Elektromechanisches Bauelement mit einem Polymerkörper und Verfahren zur Herstellung desselben |
DE19949912C2 (de) * | 1999-10-16 | 2003-02-27 | Karlsruhe Forschzent | Vorrichtung für eine Kraftübersetzung, Verfahren zu deren Herstellung und deren Verwendung |
JP3734394B2 (ja) * | 1999-11-18 | 2006-01-11 | 旭有機材工業株式会社 | 定圧レギュレータ |
US6568286B1 (en) | 2000-06-02 | 2003-05-27 | Honeywell International Inc. | 3D array of integrated cells for the sampling and detection of air bound chemical and biological species |
US7420659B1 (en) * | 2000-06-02 | 2008-09-02 | Honeywell Interantional Inc. | Flow control system of a cartridge |
US6837476B2 (en) | 2002-06-19 | 2005-01-04 | Honeywell International Inc. | Electrostatically actuated valve |
US6589229B1 (en) | 2000-07-31 | 2003-07-08 | Becton, Dickinson And Company | Wearable, self-contained drug infusion device |
US7000330B2 (en) * | 2002-08-21 | 2006-02-21 | Honeywell International Inc. | Method and apparatus for receiving a removable media member |
US6508947B2 (en) * | 2001-01-24 | 2003-01-21 | Xerox Corporation | Method for fabricating a micro-electro-mechanical fluid ejector |
US6572218B2 (en) | 2001-01-24 | 2003-06-03 | Xerox Corporation | Electrostatically-actuated device having a corrugated multi-layer membrane structure |
US6729856B2 (en) | 2001-10-09 | 2004-05-04 | Honeywell International Inc. | Electrostatically actuated pump with elastic restoring forces |
DE10216146A1 (de) * | 2002-04-12 | 2003-10-30 | Bayer Ag | Membranpumpe |
US20040136843A1 (en) * | 2002-04-12 | 2004-07-15 | Bayer Aktiengesellschaft | Diaphragm pump |
US20040109769A1 (en) * | 2002-04-12 | 2004-06-10 | Bayer Aktiengesellschaft | Diaphragm pump |
US20050238506A1 (en) * | 2002-06-21 | 2005-10-27 | The Charles Stark Draper Laboratory, Inc. | Electromagnetically-actuated microfluidic flow regulators and related applications |
US7867193B2 (en) * | 2004-01-29 | 2011-01-11 | The Charles Stark Draper Laboratory, Inc. | Drug delivery apparatus |
JP3725109B2 (ja) * | 2002-09-19 | 2005-12-07 | 財団法人生産技術研究奨励会 | マイクロ流体デバイス |
EP1403519A1 (de) * | 2002-09-27 | 2004-03-31 | Novo Nordisk A/S | Membranpumpe mit dehnbarer Pumpenmembran |
DE10255325B4 (de) * | 2002-11-27 | 2005-09-29 | Robert Bosch Gmbh | Vorrichtung und Verfahren zur Bestimmung eines Siedepunkts einer Flüssigkeit |
US20040120836A1 (en) * | 2002-12-18 | 2004-06-24 | Xunhu Dai | Passive membrane microvalves |
US20040188648A1 (en) * | 2003-01-15 | 2004-09-30 | California Institute Of Technology | Integrated surface-machined micro flow controller method and apparatus |
US7889877B2 (en) * | 2003-06-30 | 2011-02-15 | Nxp B.V. | Device for generating a medium stream |
DE10335492B4 (de) * | 2003-08-02 | 2007-04-12 | Forschungszentrum Karlsruhe Gmbh | Verfahren zum selektiven Verbinden von mikrostrukturierten Teilen |
US7284966B2 (en) * | 2003-10-01 | 2007-10-23 | Agency For Science, Technology & Research | Micro-pump |
US7867194B2 (en) | 2004-01-29 | 2011-01-11 | The Charles Stark Draper Laboratory, Inc. | Drug delivery apparatus |
JP3952036B2 (ja) * | 2004-05-13 | 2007-08-01 | コニカミノルタセンシング株式会社 | マイクロ流体デバイス並びに試液の試験方法および試験システム |
US20060073035A1 (en) * | 2004-09-30 | 2006-04-06 | Narayan Sundararajan | Deformable polymer membranes |
US20060099733A1 (en) * | 2004-11-09 | 2006-05-11 | Geefay Frank S | Semiconductor package and fabrication method |
US20060134510A1 (en) * | 2004-12-21 | 2006-06-22 | Cleopatra Cabuz | Air cell air flow control system and method |
US7222639B2 (en) * | 2004-12-29 | 2007-05-29 | Honeywell International Inc. | Electrostatically actuated gas valve |
US7328882B2 (en) * | 2005-01-06 | 2008-02-12 | Honeywell International Inc. | Microfluidic modulating valve |
US7445017B2 (en) * | 2005-01-28 | 2008-11-04 | Honeywell International Inc. | Mesovalve modulator |
JP4887652B2 (ja) * | 2005-04-21 | 2012-02-29 | ソニー株式会社 | 噴流発生装置及び電子機器 |
US7320338B2 (en) * | 2005-06-03 | 2008-01-22 | Honeywell International Inc. | Microvalve package assembly |
US8197231B2 (en) | 2005-07-13 | 2012-06-12 | Purity Solutions Llc | Diaphragm pump and related methods |
US7517201B2 (en) * | 2005-07-14 | 2009-04-14 | Honeywell International Inc. | Asymmetric dual diaphragm pump |
US20070051415A1 (en) * | 2005-09-07 | 2007-03-08 | Honeywell International Inc. | Microvalve switching array |
US7624755B2 (en) | 2005-12-09 | 2009-12-01 | Honeywell International Inc. | Gas valve with overtravel |
US7539016B2 (en) * | 2005-12-30 | 2009-05-26 | Intel Corporation | Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls |
US7523762B2 (en) | 2006-03-22 | 2009-04-28 | Honeywell International Inc. | Modulating gas valves and systems |
WO2007111049A1 (ja) * | 2006-03-29 | 2007-10-04 | Murata Manufacturing Co., Ltd. | マイクロポンプ |
US8007704B2 (en) * | 2006-07-20 | 2011-08-30 | Honeywell International Inc. | Insert molded actuator components |
US7543604B2 (en) * | 2006-09-11 | 2009-06-09 | Honeywell International Inc. | Control valve |
US8202267B2 (en) * | 2006-10-10 | 2012-06-19 | Medsolve Technologies, Inc. | Method and apparatus for infusing liquid to a body |
US7644731B2 (en) | 2006-11-30 | 2010-01-12 | Honeywell International Inc. | Gas valve with resilient seat |
US20080161754A1 (en) * | 2006-12-29 | 2008-07-03 | Medsolve Technologies, Inc. | Method and apparatus for infusing liquid to a body |
WO2008094672A2 (en) | 2007-01-31 | 2008-08-07 | Charles Stark Draper Laboratory, Inc. | Membrane-based fluid control in microfluidic devices |
DE102008012826B4 (de) * | 2007-04-02 | 2012-11-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Erzeugung einer dreidimensionalen mikromechanischen Struktur aus zweidimensionalen Elementen und mikromechanisches Bauelement |
DE102007035721B4 (de) * | 2007-07-30 | 2019-02-07 | Robert Bosch Gmbh | Mikroventil, Verfahren zum Herstellen eines Mikroventils sowie Mikropumpe |
US8206025B2 (en) | 2007-08-07 | 2012-06-26 | International Business Machines Corporation | Microfluid mixer, methods of use and methods of manufacture thereof |
DE102007045637A1 (de) * | 2007-09-25 | 2009-04-02 | Robert Bosch Gmbh | Mikrodosiervorrichtung zum Dosieren von Kleinstmengen eines Mediums |
CN101463808B (zh) * | 2007-12-21 | 2010-12-08 | 研能科技股份有限公司 | 流体输送装置 |
US8708961B2 (en) * | 2008-01-28 | 2014-04-29 | Medsolve Technologies, Inc. | Apparatus for infusing liquid to a body |
US20090246035A1 (en) * | 2008-03-28 | 2009-10-01 | Smiths Medical Asd, Inc. | Pump Module Fluidically Isolated Displacement Device |
JP5769964B2 (ja) * | 2008-07-11 | 2015-08-26 | ローム株式会社 | Memsデバイス |
TW201014977A (en) * | 2008-10-02 | 2010-04-16 | Univ Nat Taiwan | Thermo-pneumatic peristaltic pump |
US10065403B2 (en) | 2009-11-23 | 2018-09-04 | Cyvek, Inc. | Microfluidic assay assemblies and methods of manufacture |
US10022696B2 (en) | 2009-11-23 | 2018-07-17 | Cyvek, Inc. | Microfluidic assay systems employing micro-particles and methods of manufacture |
US9759718B2 (en) | 2009-11-23 | 2017-09-12 | Cyvek, Inc. | PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use |
US9700889B2 (en) | 2009-11-23 | 2017-07-11 | Cyvek, Inc. | Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results |
US9855735B2 (en) | 2009-11-23 | 2018-01-02 | Cyvek, Inc. | Portable microfluidic assay devices and methods of manufacture and use |
WO2013134742A2 (en) | 2012-03-08 | 2013-09-12 | Cyvek, Inc | Micro-tube particles for microfluidic assays and methods of manufacture |
US9500645B2 (en) | 2009-11-23 | 2016-11-22 | Cyvek, Inc. | Micro-tube particles for microfluidic assays and methods of manufacture |
JP2011177851A (ja) * | 2010-03-03 | 2011-09-15 | Fuji Electric Co Ltd | Mems部品の製造方法 |
EP2469089A1 (de) * | 2010-12-23 | 2012-06-27 | Debiotech S.A. | Elektronisches Steuerungsverfahren und System für eine piezoelektrische Pumpe |
EP2479466A1 (de) * | 2011-01-21 | 2012-07-25 | Biocartis SA | Mikropumpe oder Normal-Aus-Mikroventil |
US8876795B2 (en) | 2011-02-02 | 2014-11-04 | The Charles Stark Draper Laboratory, Inc. | Drug delivery apparatus |
FR2974598B1 (fr) * | 2011-04-28 | 2013-06-07 | Commissariat Energie Atomique | Micropompe a debitmetre et son procede de realisation |
US10016562B2 (en) | 2011-11-16 | 2018-07-10 | Sanofi-Aventis Deutschland Gmbh | Medicament guiding assembly for a drug delivery device |
US9835265B2 (en) | 2011-12-15 | 2017-12-05 | Honeywell International Inc. | Valve with actuator diagnostics |
US8839815B2 (en) | 2011-12-15 | 2014-09-23 | Honeywell International Inc. | Gas valve with electronic cycle counter |
US9074770B2 (en) | 2011-12-15 | 2015-07-07 | Honeywell International Inc. | Gas valve with electronic valve proving system |
US8899264B2 (en) | 2011-12-15 | 2014-12-02 | Honeywell International Inc. | Gas valve with electronic proof of closure system |
US9851103B2 (en) | 2011-12-15 | 2017-12-26 | Honeywell International Inc. | Gas valve with overpressure diagnostics |
US8947242B2 (en) | 2011-12-15 | 2015-02-03 | Honeywell International Inc. | Gas valve with valve leakage test |
US9557059B2 (en) | 2011-12-15 | 2017-01-31 | Honeywell International Inc | Gas valve with communication link |
US9846440B2 (en) | 2011-12-15 | 2017-12-19 | Honeywell International Inc. | Valve controller configured to estimate fuel comsumption |
US8905063B2 (en) | 2011-12-15 | 2014-12-09 | Honeywell International Inc. | Gas valve with fuel rate monitor |
US9995486B2 (en) | 2011-12-15 | 2018-06-12 | Honeywell International Inc. | Gas valve with high/low gas pressure detection |
CN107654358B (zh) * | 2012-04-19 | 2020-02-21 | 株式会社村田制作所 | 流体控制装置 |
US9610392B2 (en) | 2012-06-08 | 2017-04-04 | Fresenius Medical Care Holdings, Inc. | Medical fluid cassettes and related systems and methods |
US9234661B2 (en) | 2012-09-15 | 2016-01-12 | Honeywell International Inc. | Burner control system |
US10422531B2 (en) | 2012-09-15 | 2019-09-24 | Honeywell International Inc. | System and approach for controlling a combustion chamber |
JP6662776B2 (ja) * | 2013-08-12 | 2020-03-11 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | バルブを用いたマイクロ流体デバイス |
EP2868970B1 (de) | 2013-10-29 | 2020-04-22 | Honeywell Technologies Sarl | Regelungsvorrichtung |
US10024439B2 (en) | 2013-12-16 | 2018-07-17 | Honeywell International Inc. | Valve over-travel mechanism |
US9841122B2 (en) | 2014-09-09 | 2017-12-12 | Honeywell International Inc. | Gas valve with electronic valve proving system |
US9645584B2 (en) | 2014-09-17 | 2017-05-09 | Honeywell International Inc. | Gas valve with electronic health monitoring |
WO2017064768A1 (ja) * | 2015-10-14 | 2017-04-20 | 柴田科学株式会社 | 逆止弁及びダイヤフラムポンプ |
US10228367B2 (en) | 2015-12-01 | 2019-03-12 | ProteinSimple | Segmented multi-use automated assay cartridge |
US10503181B2 (en) | 2016-01-13 | 2019-12-10 | Honeywell International Inc. | Pressure regulator |
US10564062B2 (en) | 2016-10-19 | 2020-02-18 | Honeywell International Inc. | Human-machine interface for gas valve |
JP7150726B2 (ja) * | 2016-12-21 | 2022-10-11 | フレセニウス・メディカル・ケア・ドイチュラント・ゲーエムベーハー | 膜ポンプデバイスおよび膜ポンプデバイスと作動デバイスとを有する膜ポンプ |
DE102016015207A1 (de) * | 2016-12-21 | 2018-06-21 | Fresenius Medical Care Deutschland Gmbh | Betätigungseinrichtung und Verfahren zum Betreiben einer Betätigungseinrichtung sowie Membranpumpe mit einer Betätigungseinrichtung und einer Membranpumpeneinrichtung und eine Blutbehandlungsvorrichtung mit einer Membranpumpe |
DE102017218198A1 (de) * | 2017-10-12 | 2019-04-18 | Robert Bosch Gmbh | Passives Ventil, Mikropumpe und Verfahren zur Herstellung eines passiven Ventils |
US11073281B2 (en) | 2017-12-29 | 2021-07-27 | Honeywell International Inc. | Closed-loop programming and control of a combustion appliance |
US10697815B2 (en) | 2018-06-09 | 2020-06-30 | Honeywell International Inc. | System and methods for mitigating condensation in a sensor module |
EP3772589B1 (de) | 2019-08-06 | 2021-10-20 | Infineon Technologies AG | Mems-pumpe |
EP4028164A4 (de) * | 2019-10-18 | 2022-10-05 | Healtell (Guangzhou) Medical Technology Co., Ltd. | Mikrofluidische chip-pumpen und verfahren dafür |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3606592A (en) * | 1970-05-20 | 1971-09-20 | Bendix Corp | Fluid pump |
FI62587C (fi) * | 1978-11-13 | 1983-01-10 | Elomatic Oy | Avsolens straolningsenergi driven pump |
GB2088965A (en) * | 1980-12-10 | 1982-06-16 | Vari Gyula | Wind Driven Marine Jet Propulsion Arrangement |
US4646781A (en) * | 1985-05-07 | 1987-03-03 | Pacesetter Infusion, Ltd. | Diaphragm valve for medication infusion pump |
JPH02176166A (ja) * | 1988-09-22 | 1990-07-09 | Hitachi Metals Ltd | 冷水用ポンプ装置 |
CH679555A5 (de) * | 1989-04-11 | 1992-03-13 | Westonbridge Int Ltd | |
CA2033181C (en) * | 1989-06-14 | 2000-10-24 | Harald T. G. Van Lintel | Two valve micropump with improved outlet |
DE3926066A1 (de) * | 1989-08-07 | 1991-02-14 | Ibm Deutschland | Mikromechanische kompressorkaskade und verfahren zur druckerhoehung bei extrem niedrigem arbeitsdruck |
DE4220077A1 (de) * | 1992-06-19 | 1993-12-23 | Bosch Gmbh Robert | Mikropumpe |
-
1994
- 1994-01-25 DE DE4402119A patent/DE4402119C2/de not_active Expired - Fee Related
- 1994-11-29 DK DK95903302.8T patent/DK0741839T3/da active
- 1994-11-29 JP JP7519306A patent/JPH09503569A/ja active Pending
- 1994-11-29 WO PCT/EP1994/003954 patent/WO1995020105A1/de active IP Right Grant
- 1994-11-29 EP EP95903302A patent/EP0741839B1/de not_active Expired - Lifetime
-
1996
- 1996-06-24 US US08/669,106 patent/US5725363A/en not_active Expired - Fee Related
-
1999
- 1999-08-26 JP JP1999006494U patent/JP3066925U/ja not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
See references of WO9520105A1 * |
Also Published As
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JPH09503569A (ja) | 1997-04-08 |
DE4402119C2 (de) | 1998-07-23 |
JP3066925U (ja) | 2000-03-07 |
WO1995020105A1 (de) | 1995-07-27 |
EP0741839B1 (de) | 1998-04-15 |
DE4402119A1 (de) | 1995-07-27 |
DK0741839T3 (da) | 1998-05-11 |
US5725363A (en) | 1998-03-10 |
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