EP0665560A3 - Hybrid integrated circuit device. - Google Patents

Hybrid integrated circuit device. Download PDF

Info

Publication number
EP0665560A3
EP0665560A3 EP94119166A EP94119166A EP0665560A3 EP 0665560 A3 EP0665560 A3 EP 0665560A3 EP 94119166 A EP94119166 A EP 94119166A EP 94119166 A EP94119166 A EP 94119166A EP 0665560 A3 EP0665560 A3 EP 0665560A3
Authority
EP
European Patent Office
Prior art keywords
integrated circuit
circuit device
ceramic
strip
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP94119166A
Other languages
German (de)
French (fr)
Other versions
EP0665560B1 (en
EP0665560A2 (en
Inventor
Karl-Gerd Dipl-Ing F Drekmeier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0665560A2 publication Critical patent/EP0665560A2/en
Publication of EP0665560A3 publication Critical patent/EP0665560A3/en
Application granted granted Critical
Publication of EP0665560B1 publication Critical patent/EP0665560B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Liquid Developers In Electrophotography (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Structure Of Printed Boards (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

Hybrid switching arrangement has a resistance layer applied on one side of plate-like substrate made of glass or ceramic. A ceramic strip (6) is applied on one side of the substrate (1). Pref. the ceramic strip (6) is made of aluminium oxide, beryllium oxide or aluminium nitride, and is secured using heat conducting adhesive. The substrate (1) and strip (6) are both made of aluminium oxide and are both 1mm thick. The ceramic strip is at most 0.5 (pref. 0.1)mm thick.
EP94119166A 1993-12-17 1994-12-05 Hybrid integrated circuit device Expired - Lifetime EP0665560B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE9319473U DE9319473U1 (en) 1993-12-17 1993-12-17 Hybrid circuit arrangement
DE9319473U 1993-12-17

Publications (3)

Publication Number Publication Date
EP0665560A2 EP0665560A2 (en) 1995-08-02
EP0665560A3 true EP0665560A3 (en) 1997-05-02
EP0665560B1 EP0665560B1 (en) 2000-04-05

Family

ID=6902186

Family Applications (1)

Application Number Title Priority Date Filing Date
EP94119166A Expired - Lifetime EP0665560B1 (en) 1993-12-17 1994-12-05 Hybrid integrated circuit device

Country Status (4)

Country Link
US (1) US5581227A (en)
EP (1) EP0665560B1 (en)
AT (1) ATE191581T1 (en)
DE (2) DE9319473U1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914648A (en) 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
DE59805019D1 (en) 1997-07-01 2002-09-05 Tyco Electronics Logistics Ag HYBRID CIRCUIT ARRANGEMENT WITH OVERLOAD PROTECTION
DE19814445C1 (en) * 1998-03-31 1999-06-24 Siemens Ag Hybrid circuit arrangement
US6404324B1 (en) * 1999-09-07 2002-06-11 General Motors Corporation Resistive component for use with short duration, high-magnitude currents

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297670A (en) * 1977-06-03 1981-10-27 Angstrohm Precision, Inc. Metal foil resistor
EP0048938A1 (en) * 1980-09-25 1982-04-07 Siemens Aktiengesellschaft Vertically pluggable "single-in-line" circuit module without case
US4494104A (en) * 1983-07-18 1985-01-15 Northern Telecom Limited Thermal Fuse
EP0185244A1 (en) * 1984-12-07 1986-06-25 TELEFUNKEN electronic GmbH Electrical power component
US4719443A (en) * 1986-04-03 1988-01-12 General Electric Company Low capacitance power resistor using beryllia dielectric heat sink layer and low toxicity method for its manufacture
EP0465812A1 (en) * 1990-07-09 1992-01-15 International Business Machines Corporation Electronic assembly with enhanced heat sinking
EP0508615A1 (en) * 1991-04-10 1992-10-14 Caddock Electronics, Inc. Film-type resistor assembly
DE4234022A1 (en) * 1992-10-09 1994-04-14 Telefunken Microelectron Layered circuit with power resistor(s) - has extra ceramic carrier layer in heat conductive contact with power resistor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3792383A (en) * 1971-06-21 1974-02-12 Motorola Inc Hybrid strip transmission line circuitry and method of making same
US3766440A (en) * 1972-08-11 1973-10-16 Gen Motors Corp Ceramic integrated circuit convector assembly
DE3837974A1 (en) * 1988-11-09 1990-05-10 Telefunken Electronic Gmbh ELECTRONIC CONTROL UNIT
US5254969A (en) * 1991-04-02 1993-10-19 Caddock Electronics, Inc. Resistor combination and method
US5304977A (en) * 1991-09-12 1994-04-19 Caddock Electronics, Inc. Film-type power resistor combination with anchored exposed substrate/heatsink

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297670A (en) * 1977-06-03 1981-10-27 Angstrohm Precision, Inc. Metal foil resistor
EP0048938A1 (en) * 1980-09-25 1982-04-07 Siemens Aktiengesellschaft Vertically pluggable "single-in-line" circuit module without case
US4494104A (en) * 1983-07-18 1985-01-15 Northern Telecom Limited Thermal Fuse
EP0185244A1 (en) * 1984-12-07 1986-06-25 TELEFUNKEN electronic GmbH Electrical power component
US4719443A (en) * 1986-04-03 1988-01-12 General Electric Company Low capacitance power resistor using beryllia dielectric heat sink layer and low toxicity method for its manufacture
EP0465812A1 (en) * 1990-07-09 1992-01-15 International Business Machines Corporation Electronic assembly with enhanced heat sinking
EP0508615A1 (en) * 1991-04-10 1992-10-14 Caddock Electronics, Inc. Film-type resistor assembly
DE4234022A1 (en) * 1992-10-09 1994-04-14 Telefunken Microelectron Layered circuit with power resistor(s) - has extra ceramic carrier layer in heat conductive contact with power resistor

Also Published As

Publication number Publication date
DE59409274D1 (en) 2000-05-11
EP0665560B1 (en) 2000-04-05
ATE191581T1 (en) 2000-04-15
DE9319473U1 (en) 1994-06-23
EP0665560A2 (en) 1995-08-02
US5581227A (en) 1996-12-03

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