EP0659590B1 - Procédé de formation de surfaces structurées sur un substrat - Google Patents

Procédé de formation de surfaces structurées sur un substrat Download PDF

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Publication number
EP0659590B1
EP0659590B1 EP94810707A EP94810707A EP0659590B1 EP 0659590 B1 EP0659590 B1 EP 0659590B1 EP 94810707 A EP94810707 A EP 94810707A EP 94810707 A EP94810707 A EP 94810707A EP 0659590 B1 EP0659590 B1 EP 0659590B1
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EP
European Patent Office
Prior art keywords
surface layer
structuring
process according
plastic film
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP94810707A
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German (de)
English (en)
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EP0659590A1 (fr
Inventor
Walter Hotz
Klaus Stoll
Roman Fuchs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3A Composites International AG
Original Assignee
Alusuisse Lonza Services Ltd
Alusuisse Technology and Management Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH03839/93A external-priority patent/CH688371A5/de
Priority claimed from CH147594A external-priority patent/CH687512A5/de
Application filed by Alusuisse Lonza Services Ltd, Alusuisse Technology and Management Ltd filed Critical Alusuisse Lonza Services Ltd
Publication of EP0659590A1 publication Critical patent/EP0659590A1/fr
Application granted granted Critical
Publication of EP0659590B1 publication Critical patent/EP0659590B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C3/00—Processes, not specifically provided for elsewhere, for producing ornamental structures
    • B44C3/08—Stamping or bending
    • B44C3/085—Stamping or bending stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/24—Pressing or stamping ornamental designs on surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44D—PAINTING OR ARTISTIC DRAWING, NOT OTHERWISE PROVIDED FOR; PRESERVING PAINTINGS; SURFACE TREATMENT TO OBTAIN SPECIAL ARTISTIC SURFACE EFFECTS OR FINISHES
    • B44D5/00—Surface treatment to obtain special artistic surface effects or finishes
    • B44D5/10—Mechanical treatment

Definitions

  • the invention relates to a method for structuring the surface layer of bodies made of non-ferrous, light or precious metals and the use of the method.
  • the structuring of the surface layer of bodies made of non-ferrous, light or precious metals can be carried out by mechanical, chemical or electrochemical treatment of the surface layer.
  • mechanical treatment of the surface layer such as by embossing, the surface layer of bodies made of non-ferrous, light or precious metals can be given a certain surface structure, surface quality or surface enlargement.
  • a desired relief-like surface is produced by printing, for example, a two-part tool, at least one part having a structuring structure, or by pressurizing a correspondingly structured embossing tool, such as an embossing film, which is located on the surface to be structured.
  • the pressurization can take place in mechanical or hydraulic presses, roll stands with, for example, engraved or etched steel rolls, embossing stands, deflection rolls or generally with two rolls lying opposite one another.
  • Such an embossing process allows the essentially mirror-image transfer of a structure located on an embossing tool to the surface layer of a body made of non-ferrous, light or precious metals.
  • the structure can be transferred with or without a decrease in the average thickness of the embossed body.
  • hollow embossing the embossed embossment on one side is caused by corresponding depressions on the other side, so that the embossed body does not undergo any significant change in thickness.
  • the embossments remain essentially limited to the surface layer of the embossed body, or both sides can be structured differently.
  • the counter-roller can, for example, have a paper or rubber covering and, in some cases, for example in the case of hollow embossing, a corresponding counter-shape.
  • embossing processes dot and line grids or any pattern, company or brand name can be transferred to a smooth or patterned background. Embossing can also be carried out on painted and / or coated surfaces of bodies made of non-ferrous, light or precious metals.
  • Embossing processes require the essentially mirror-image application of the desired structure to the embossing tool.
  • the stamping tool usually has a higher hardness and strength than the surface layer to be structured.
  • the pre-structured embossing tool is directed against the surface to be structured and subjected to a predetermined pressure.
  • the pressure is applied by means of rollers
  • the body to be structured on its surface is pushed between at least two rotating rollers, the distance of which is slightly less than the thickness of the body to be embossed.
  • the rollers take the body to be embossed due to friction, compress the body to the distance between the rollers and at the same time emboss their structure essentially in mirror image on the surface of the body.
  • Such a transfer of structure causes material deformation at least in the surface layer of the embossed body.
  • the average decrease in thickness of the embossed body is small in such an embossing process and is usually between 0 and 15%.
  • the corresponding structuring can also be located on a steel sheet as an embossing tool, for example.
  • the surface layer is then embossed by placing the embossing tool on the surface layer to be structured and then applying pressure in a rolling operation with rollers which have a smooth surface.
  • the embossing of surface layers of bodies made of non-ferrous, light or precious metals is usually done by a cold forming process, ie the structuring takes place at room temperature.
  • the pressurization applied during the embossing process mechanically deforms at least the surface layer in question, ie during the embossing process there is always an embossing and deformation process in the surface layer.
  • the structuring transferred to the surface layer can have exactly the structuring that is mirror image of the structuring on the embossing tool or in terms of its structure depth and / or in accordance with the selected method parameters of the embossing process geometric shape deviate from the structuring of the embossing tool.
  • the term mirror-image structuring in the present text is always understood to mean the image of the structuring of the embossing tool obtained by an embossing process on the embossed surface layer - essentially a mirror image, but in some cases deformed.
  • the pressurization applied in an embossing process can change the forming zone of the surface layer, i.e. solidify the surface area influenced by the embossing process.
  • soft annealing i.e. a heat treatment
  • solidification of the material can be broken down on a case-by-case basis.
  • Embossing tools such as embossing rollers or structured steel sheets can be produced, for example, by chemical etching processes or by engraving the steel surface.
  • Such processes for the production of structures or patterns on, for example, steel surfaces are complex and thus generally represent an essential cost factor for the embossing of surface layers of bodies made of non-ferrous, light or noble metals.
  • embossing process Due to the embossing process, small amounts of the material of the embossed surface layer always remain on the embossing tool and thus cause contamination depending on the time in which the embossing tools are used.
  • the embossing tools must be cleaned again and again at certain intervals. Such cleaning can be done by chemical methods, such as chemical etching, or physical methods, such as brushing, plasma etching, sandblasting or the like.
  • cleaning processes are usually cost-intensive and, moreover, usually necessitate an interruption in production in the production line.
  • embossing processes because of the processes for structuring the materials used for embossing tools, such as, for example, etching processes or engraving, are limited with regard to the fineness of the structural elements that can be transferred to the surface layer of bodies made of non-ferrous, light or precious metals.
  • the object of the present invention is to provide a method of the type mentioned at the outset which prevents the disadvantages set out above, substantially reduces the costs for the production and cleaning of the embossing tools and, moreover, the production of fine structural elements in the surface layer of bodies made of colored, light or Precious metals allowed.
  • this is achieved in that the structuring desired on the surface layer is stamped onto a plastic film with a thickness of 5 ⁇ m to 1 mm, the structuring of the plastic film is directed against the surface layer to be structured and the transfer of the structuring on the plastic film to the Surface layer is done by pressurizing the plastic film lying on the surface layer, the transferred structuring having a structure depth between 0.001 and 20 ⁇ m.
  • the plastic films used for the process according to the invention preferably have a thickness of between 5 and 500 ⁇ m.
  • the method according to the invention is preferably used for structuring surface layers of non-ferrous, light or precious metals with a submicron structure depth between 0.001 and 1 ⁇ m and in particular between 0.01 and 0.5 ⁇ m.
  • the structured surface layer is mechanically deformed, i.e.
  • a mechanical deformation process always takes place in the surface layer.
  • the structuring transferred to the surface layer can have exactly the structuring which is mirror image for structuring the plastic film, or can differ in structure depth and / or in its geometric shape from the structuring of the plastic film in accordance with the selected process parameters.
  • mirror image structuring is also understood to mean the essentially mirror image, but in some cases deformed image of a structure.
  • the pressurization required for the method according to the invention is preferably carried out by rolling, rolling, pressing, reeling or rolling.
  • the average decrease in thickness caused by the pressurization of at least in its surface layer structured body made of non-ferrous, light or precious metals is preferably between 0 and 15% and in particular between 0.5 and 10%.
  • the structured surface layers of non-ferrous, light or precious metals at least partially have structural elements whose dimensions in the plane horizontal to the structured surface layer are between 1 nm (nanometer) and 1 mm, particularly preferably between 0.01 and 100 ⁇ m and in particular between 0.1 and 10 ⁇ m, the dimensions of the structural elements relating to the plane parallel to the structured surface layer at the location of its greatest structural depth.
  • plastics which have a structure on their surface can be used as embossing tools for the structure of surface layers made of non-ferrous, light or precious metals.
  • plastics can be used for the process according to the invention which, because of their material properties such as anisotropy and their pseudoplastic, entropy-elastic and viscoelastic properties, have a hardness and material strength which are sufficiently high for the embossing of surface layers of non-ferrous, light or noble metals.
  • the preferred plastics are films made of thermoplastics or thermosets and particularly preferably polyolefins, polyethylene terephthalate (PET), polyacrylates such as polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), polyacetate, polyacetal (POM), linear or crosslinked polyurethane (PU), urea Formaldehyde (UF), polyimide (PI), cellulose such as cellulose acetate (CA), cellulose propionate (CP), cellulose acetobutyrate (CAB) or cellulose nitrate (CN) and mixtures of the above-mentioned polymer classes.
  • Such films can be present as a monofilm or as a film composite of two or more films. In the case of composites, the films can consist of the same material or the films can be constructed from films of different plastics.
  • polyolefins for polyolefin films are polyethylenes, for example high-density polyethylene (HDPE, density greater than 0.944 g / cm 3 ), medium-density polyethylene (MDPE, density 0.926-0.940 g / cm 3 ), linear medium-density polyethylene (LMDPE, density 0.926 -0.940 g / cm 3 ), low density polyethylene (LDPE, density 0.910-0.925 g / cm 3 ) and linear low density polyethylene (LLDPE, density 0.916-0.925 g / cm 3 ), polypropylene, such as axial or biaxially oriented polypropylene or cast polypropylene, amorphous or crystalline polypropylene or mixtures thereof, atactic or isotactic polypropylene or mixtures thereof, poly-1-butene, poly-3-methylbutene, poly-4-methylpentene and copolymers thereof, such as, for example of polyethylene with vinyl acetate, vinyl alcohol, acrylic
  • plastic films made of polymethyl methacrylate are, for example, high-polymer PMMA, mixtures of PMMA with soft graft polymers containing a tough component with modified polyacrylic ester or other elastomers, copolymers of PMMA with acrylonitrile, copolymers of acrylonitrile-methyl methacrylate (AMMA) and copolymers of methylacryl Butadiene styrene.
  • PMMA polymethyl methacrylate
  • the structuring of the plastic films can take place, for example, by means of screen printing, gravure printing, pad printing or hot stamping printing processes, for example in the transition area from the plastic to the entropy-elastic state, the surface structuring being produced using stamping tools such as stamps or stamping rollers.
  • the hot stamping printing process is preferably used for this.
  • Another method for structuring plastic films is to emboss a solvent-containing plastic film by means of a structured roller (roll embossing) with a subsequent drying process or one that takes place simultaneously with the roll embossing.
  • Another possibility for structuring a plastic surface is, for example, a corresponding shaping process the production of the plastic film while the plastic is still in the melt.
  • the hot stamping of the plastic film is preferably carried out at a processing temperature which is dependent on the plastic and, in some cases, is higher than room temperature, at least on the surface of the film to be stamped, by applying pressure by means of, for example, a cooled embossing roller and an, for example, rubber-coated counter roller.
  • the optimum processing temperature is usually in the thermoplastic temperature range of the plastic and depends on the plastic in addition to other parameters, such as processing steps previously carried out for hot stamping, the anisotropy achieved in this process and the stamping structure to be transferred, and is usually determined by preliminary tests.
  • the necessary for embossing the plastic film The film surface can be heated, for example, by a heatable embossing roller or by an infrared radiator.
  • plastic films used for the method according to the invention can also be coated.
  • metal, plastic or ceramic layers can be applied.
  • thin aluminum layers with a layer thickness of typically 0.001 to 1 ⁇ m can be evaporated or sputtered in a vacuum onto the plastic surface or, if appropriate, onto an adhesive layer previously applied to the plastic surface.
  • the method according to the invention is particularly suitable for structuring the surface layers of bodies, such as foils with a thickness of 5 ⁇ m to 1.5 mm, in particular foils with a thickness of 5 to 20 ⁇ m and strips, sheets or plates with a thickness of 1.5 to 50 mm, made of non-ferrous, light or precious metals.
  • Metal bodies preferred for the process according to the invention are the noble metals gold (Au), silver (Ag) and platinum (Pt) and their alloys, the light metal aluminum (Al) and its alloys and the non-ferrous metals copper (Cu), nickel (Ni), zinc (Zn) and tin (Sn) and their alloys.
  • the method according to the invention is particularly preferably used for structuring the surface layer of aluminum foils, strips or sheets with a thickness of 0.01 to 5 mm.
  • the method according to the invention is preferably used for structuring the surface layer of aluminum strips with a thickness between 0.05 and 2 mm.
  • the body made of non-ferrous, light or precious metals can be deformed in its entire thickness or only in a certain thickness range, the surface layer.
  • the body to be structured at least in a certain surface layer can consist of non-ferrous, light or noble metals and their alloys, or else can be a composite material, at least the surface layer to be embossed consisting of a previously mentioned material.
  • all commercially available non-ferrous, light and precious metals can be structured using the method according to the invention.
  • the method according to the invention is also particularly suitable for structuring a plastic coated or metallized with one of the aforementioned materials (non-ferrous, light and noble metals and their alloys).
  • the term non-ferrous, light and precious metals always means all corresponding metals and their alloys.
  • the surface layer of a body made of non-ferrous, light or noble metals with a plastic film lying on it and softer than the surface layer made of non-ferrous, light or noble metal was previously, for example, due to a hot stamping process, a pattern was transferred, this being directed during the method according to the invention against the surface layer to be structured, which allows the structuring on the plastic film to be transferred essentially in mirror image to the surface layer made of a non-ferrous, light or noble metal.
  • patterns with a structure depth between 0.001 and 20 ⁇ m can be realized in a surface layer made of a non-ferrous, light or precious metal.
  • structure depth refers to the greatest height difference between structure valley and structure height that is achieved in an embossing process.
  • the structure depth advantageously lies in the submicron range between 0.001 and 1 ⁇ m and in particular between 0.01 and 0.5 ⁇ m.
  • the size of the pressurization required for the respective embossing process depends, for example, on the surface layer to be embossed, in particular its material properties, the material properties of the plastic film, the process temperature, the structural fineness, the structural depth, the structural shape, the embossing speed and the required surface properties of the pattern to be embossed from.
  • process parameters relating to the surface layer are, for example, the layer thickness of the forming zone, its material composition and surface properties, such as roughness, surface hardness and formability.
  • process parameters relating to the plastic film are, for example, its material composition, its pseudoplastic, entropy-elastic and visco-elastic properties as well as the embossed structuring.
  • the optimal process parameters can easily be determined by preliminary tests.
  • the pressurization is advantageously selected such that the plastic film is not deformed over its elastic region during the process according to the invention.
  • the plastic film can also be deformed in its plastic area.
  • the process temperature to be selected for the process according to the invention depends, inter alia, on on the mechanical properties of the plastic film and the surface layer to be structured.
  • the process is preferably carried out at room temperature or at a temperature which is lower than this.
  • the plastic film provided with the embossed pattern can already be applied to the surface layer to be structured, for example by electrostatic charging, partial adhesive bonding, winding or simply by being placed on it, before the structuring process according to the invention, and can thus serve as a protective film, or it can only be used immediately before or during the inventive process Methods are applied to the surface layer to be structured.
  • the plastic film can be removed from the structured surface layer or left. In the latter case, it serves as a protective film, for example.
  • the surface layers to be structured with the method according to the invention can be supplied to a surface treatment prior to the structuring process, for example for mechanical or chemical polishing of their surface.
  • the structured surface layers can subsequently be subjected to a further surface treatment using, for example, mechanical or chemical processes or can be protected with a thin, organic or inorganic coating compared to the structure depth against the chemical or physical influences possibly acting on the structured surface layer during its intended use.
  • Anodizing is one of the preferred surface treatments.
  • Coating processes are also particularly suitable as aftertreatment of the surface layers structured by the process according to the invention such as electroplating, dispersion coating, enamelling, painting, laminating, thermal spraying or vacuum coating processes such as sputtering, vapor deposition or the deposition of thin organic (e.g. by plasma polymerization) or inorganic layers.
  • the present invention also relates to the use of the method according to the invention for producing functional or decorative surface layers from non-ferrous, light or precious metals, such as surfaces provided with logos or patterns, mirror or reflector surfaces, diffraction gratings, scatter patterns or filters.
  • a preferred use of the method according to the invention is in the manufacture of reflector surfaces or mirrors with a predetermined direction of reflection for the targeted deflection or scattering of electromagnetic radiation, for example for the targeted iridescence of reflector surfaces or for reflector surfaces of photovoltaic substrates, reflectors in lighting technology, as display surfaces for information signs or the like Street signaling, retroreflective surfaces or for the production of flat one- and two-dimensional, focusing or scattering mirrors, in particular as converging lenses for e.g. headlights or other reflectors from everyday light sources, as mirrors for the targeted deflection of the incident electromagnetic radiation into a predetermined solid angle range and as diffraction - or Fresnel mirror.
  • Another preferred use of the method according to the invention is in the production of reflector surfaces or mirrors as filters or diffraction gratings with reflection properties which are selective with regard to the wavelength and / or the polarization of the incident electromagnetic radiation.
  • the method according to the invention is very particularly preferably used to produce corresponding filters for UV (ultraviolet) radiation, electromagnetic radiation in the visible range or IR (infrared) radiation.
  • the method according to the invention is preferred for decorative surface layers with variable colors and / or structures depending on the viewing angle and / or the incidence of light, for use, for example, in building construction (for example as facades) or civil engineering (for example as tunnel cladding).
  • Another preferred use of the method according to the invention is the embossing of holograms, company and manufacturer logos or user instructions on packaging, Device housings or panels as well as the production of identification patterns, logos or labels, the structured surface layers being highly counterfeit-proof.
  • Another preferred use of the method according to the invention is in the production of lithographic substrates.
  • the method according to the invention is also particularly suitable for the production of structured surface layers from non-ferrous, light or precious metals as the base material, which can be used after further chemical or physical surface treatments, for example for the production of finely structured conductor tracks.
  • Figure 1 shows a plastic film made of polyethylene with a linear structure as it can be used as an embossing tool for the inventive method.
  • the plan view shown in FIG. 1 shows a scanning electron microscope (SEM) image in 1000 times magnification of a submicron structure located on a hot-stamped polyethylene film before it was used for the method according to the invention.
  • SEM scanning electron microscope
  • the substrate surface was compared the incident electron beam of the SEM is tilted by an angle of 30 °.
  • the structure valleys (in the picture: dark lines) and structure heights (in the picture: light lines) are easy to recognize.
  • the plan view shown in FIG. 2 on an aluminum surface structured according to the invention represents an SEM image in 1000 times magnification Aluminum surface that of a commercially available aluminum high-gloss tape according to a structuring method according to the invention with an average decrease in thickness of the aluminum high-gloss tape of about 6%.
  • a polyethylene film with the pattern shown in FIG. 1 and the same dimensions as the high-gloss tape was used as the embossing tool.
  • the embossed side of the polyethylene film was then placed on the high-gloss tape piece.
  • the structure transfer itself was carried out by a cold rolling embossing process.
  • the polyethylene film used in this case had a thin evaporated aluminum protective layer.
  • the substrate surface was tilted by an angle of 30 ° with respect to the incident electron beam from the REM.
  • the image shows the linear pattern that is embossed in mirror image for structuring on the plastic film.
  • the grid spacing (line spacing) of the pattern embossed on the aluminum surface in this case is 1.2 ⁇ m.
  • the structure depth is in the range of 0.02 to 0.2 ⁇ m.
  • FIG. 3 shows the surface structure of the plastic film shown in FIG. 1 after its use in an embossing process carried out according to the invention on an aluminum reflector film.
  • FIG. 3 shows an SEM image of the plan view described above in a magnification of 1000 times.
  • the substrate surface was tilted by an angle of 30 ° with respect to the incident electron beam from the SEM.
  • FIGS. 1 and 3 A comparison of FIGS. 1 and 3 shows that the hot-stamped polyethylene film used here by way of example for the method according to the invention has essentially the same linear pattern before and after the method according to the invention and thus was deformed essentially only entropy-elastically during the stamping method according to the invention, i.e. the plastic film was not deformed after the stamping process.
  • FIGS. 1 and 2 show the result, found surprisingly during the inventive step, of the essentially mirror image of the pattern embossed on the plastic film made of polyethylene on the surface of a commercially available high-gloss aluminum strip by the process according to the invention enables the structure to be transferred from a plastic film that is softer than aluminum to an aluminum surface by means of pressurization.
  • the method according to the invention thus allows the cost-effective transfer of almost any pattern, in particular in the submicron structural depth range, to the surface layer of a body made of non-ferrous, light or precious metals by pressurizing a structured plastic film located on the surface layer and thus enables the production of large-area functional or decorative surface layers
  • Non-ferrous, light or precious metals for broad commercial applications such as for facades in building construction, tunnel cladding in civil engineering, directional signs, reflector surfaces, mirrors, diffraction gratings, filters, lenses, lithographic substrates or substrates for photovoltaic cells as well as for embossing e.g. holograms , Company and manufacturer logos or user information on packaging, device housings or panels as well as for identification samples, logos or labels.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Orthopedics, Nursing, And Contraception (AREA)
  • Adornments (AREA)
  • Decoration By Transfer Pictures (AREA)

Claims (13)

  1. Procédé de structuration de la couche superficielle de corps en métaux lourds non ferreux, métaux légers ou métaux nobles, caractérisé en ce que la structuration souhaitée sur la couche superficielle est estampée symétriquement sur une feuille plastique de 5 µm à 1 mm d'épaisseur, que la structuration de la feuille plastique est orientée en direction de la couche superficielle à structurer et que le transfert de la structuration se trouvant sur la feuille plastique sur la couche superficielle s'effectue par application d'une pression sur la feuille plastique reposant sur la couche superficielle, la structuration transférée présentant une profondeur de structure comprise entre 0,001 et 20 µm.
  2. Procédé selon la revendication 1, caractérisé en ce que l'application de la pression s'effectue par laminage, aplanissage au rouleau, compression, déroulement ou calandrage.
  3. Procédé selon la revendication 1, caractérisé en ce que la diminution moyenne d'épaisseur lors de l'application de la pression est comprise entre 0 et 15 %.
  4. Procédé selon la revendication 1, caractérisé en ce que la structuration transférée sur la couche superficielle présente une profondeur de structure submicronique comprise entre 0,001 et 1 µm et notamment entre 0,01 et 0,5 µm.
  5. Procédé selon la revendication 1, caractérisé en ce que la structuration transférée sur la couche superficielle contient au moins partiellement des éléments de structure dont les dimensions dans le plan horizontal par rapport à la couche superficielle structurée sont comprises entre 1 nm et 1 mm.
  6. Utilisation du procédé selon la revendication 1 pour la structuration de tôles, bandes ou feuilles en métaux lourds non ferreux, métaux légers ou métaux nobles de 5 µm à 50 mm d'épaisseur.
  7. Utilisation du procédé selon la revendication 1 pour la production de couches superficielles fonctionnelles ou décoratives de corps en métaux lourds non ferreux, métaux légers ou métaux nobles.
  8. Utilisation du procédé selon la revendication 1 pour la production de surfaces réfléchissantes ou spéculaires à sens de réflection prédéterminé pour la déviation ou diffraction ciblée d'un rayonnement électromagnétique.
  9. Utilisation du procédé selon la revendication 1 pour la production de surfaces réfléchissantes ou spéculaires en tant que filtres à propriétés de réflection sélectives en ce qui concerne la longueur d'onde et/ou la polarisation du rayonnement électromagnétique incident.
  10. Utilisation du procédé selon la revendication 1 pour la production de couches superficielles décoratives à couleurs et/ou structures variant en fonction de l'angle de vision et/ou de l'incidence de la lumière.
  11. Utilisation du procédé selon la revendication 1 pour la production d'hologrammes, de logos de sociétés et de fabricants ou de modes d'emploi sur des emballages, des boîtiers d'appareil ou des panneaux ainsi que de dessins, logos ou étiquettes d'identification, les couches superficielles structurées présentant une forte sécurité contre la falsification.
  12. Utilisation du procédé selon la revendication 1 pour la production de substrats lithographiques.
  13. Utilisation du procédé selon la revendication 1 pour la production de substrats pour photopiles.
EP94810707A 1993-12-23 1994-12-07 Procédé de formation de surfaces structurées sur un substrat Expired - Lifetime EP0659590B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH03839/93A CH688371A5 (de) 1993-12-23 1993-12-23 Strukturieren von Oberflaechenschichten
CH3839/93 1993-12-23
CH147594A CH687512A5 (de) 1994-05-11 1994-05-11 Strukturieren von Oberflaechenschichten.
CH1475/94 1994-05-11

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EP0659590A1 EP0659590A1 (fr) 1995-06-28
EP0659590B1 true EP0659590B1 (fr) 1997-11-19

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EP (1) EP0659590B1 (fr)
AT (1) ATE160318T1 (fr)
DE (1) DE59404630D1 (fr)

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DE19803787A1 (de) * 1998-01-30 1999-08-05 Creavis Tech & Innovation Gmbh Strukturierte Oberflächen mit hydrophoben Eigenschaften
CN112599790A (zh) * 2020-12-14 2021-04-02 天津大学仁爱学院 一种空气电极的冷压制备方法

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DE10358812B4 (de) * 2003-12-15 2006-05-11 Universität Kassel System zur Gestaltung von großen Flächen an Gebäuden oder mobilen Systemen durch großflächige Beugungsmuster

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DE59404630D1 (de) 1998-01-02
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