EP0585816B1 - Plug connector with soldered circuit board - Google Patents

Plug connector with soldered circuit board Download PDF

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Publication number
EP0585816B1
EP0585816B1 EP93113661A EP93113661A EP0585816B1 EP 0585816 B1 EP0585816 B1 EP 0585816B1 EP 93113661 A EP93113661 A EP 93113661A EP 93113661 A EP93113661 A EP 93113661A EP 0585816 B1 EP0585816 B1 EP 0585816B1
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EP
European Patent Office
Prior art keywords
circuit board
carrier
printed circuit
connection
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP93113661A
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German (de)
French (fr)
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EP0585816A1 (en
Inventor
Hans Preinfalk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atto Di Fusione itt Automative Europe GmbH
Original Assignee
SWF Auto Electric GmbH
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Filing date
Publication date
Application filed by SWF Auto Electric GmbH filed Critical SWF Auto Electric GmbH
Publication of EP0585816A1 publication Critical patent/EP0585816A1/en
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Publication of EP0585816B1 publication Critical patent/EP0585816B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes

Definitions

  • the invention relates to a connection between a carrier and a circuit board seated on the carrier.
  • a terminal block is known which is equipped with cutting connectors in which a circuit board can be inserted.
  • the cutting connectors protrude from the bottom of the terminal block through the bottom, so that the terminal block can be locked with a larger circuit board via the connector.
  • the circuit board is neither soldered to the terminal block nor does the terminal block have plugs via which it can be electrically connected in an integrated housing.
  • DE-AS 12 57 235 shows a structure similar to that in the aforementioned DE-GM 72 15 109, and here too a soldered connection between the printed circuit board and the carrier has been dispensed with. With regard to the carrier, no plug contacts are provided.
  • the disadvantage here is that the printed circuit board and contact plate must first be mechanically sufficiently firmly connected to one another in order to be able to solder them to one another.
  • the unit created in this way must subsequently be inserted into the carrier (i.e. printed circuit board carrier) and mechanically connected to it.
  • the invention is therefore based on a combination of the genus resulting from the preamble of claim 1.
  • the object of the invention is to provide an inexpensive and permanent connection between a carrier provided with plug contacts and a printed circuit board.
  • the invention therefore consists in arranging the printed circuit board and plug-in contact with one another and both relative to the carrier in such a way that the soldering points on the printed circuit board and the terminal lugs are soldered in a single soldering process.
  • the main advantage of the invention is that it becomes possible to use e.g. Wave soldering to solder all contacts of the carrier with the associated conductor tracks on the circuit board in a single soldering process. This gives you a very clean and well-adhering soldering in a single operation.
  • connection points to be soldered to one another lie along the front edge of the carrier in a plane not far from this front edge.
  • the front edge of the carrier should be as straight as possible so that it does not hinder the immersion of the circuit board in the solder surge. Accordingly, it is also necessary that the distance from the circuit board level from the front edge of the carrier is kept as small as possible.
  • slots of the printed circuit board at the edge area of the printed circuit board assigned to the connection areas enclose the connection areas, as a result of which a comparatively large connection area between the connection areas and the plug contacts forms.
  • the slots can also be non-positively seated on the connecting surfaces by pushing the slots under force onto the connecting surfaces.
  • the connection between the slots and the connection surfaces before the soldering process can contribute to a mechanical locking of the printed circuit board with respect to the carrier or can also form the entire mechanical locking device until finally after the soldering process the printed circuit board is firmly connected to the connection surfaces by means of the soldered connection.
  • the features of claim 2 result in a particularly secure electrical connection but also a mechanical connection between the printed circuit board and the connection surfaces.
  • the edge of the slots is surrounded by a conductive solderable material into which the conductor tracks open. A particularly large contact area is therefore obtained on the circuit board, which can be soldered to the connection areas.
  • connection surfaces In order to be able to simply plug the printed circuit board onto the connection surfaces, the combination of features according to claim 4 is recommended in a further development of the invention. This avoids threading the connection surfaces into the slots on the printed circuit board.
  • circuit board is to be perpendicular to the surface of the carrier and at the same time be pluggable onto the carrier (see claim 3), then in a further development of the invention the combination of features according to claim 4 is recommended.
  • the main advantage here is that the length along the Surface of the carrier extending pads the pins protruding downward from the plug can be distributed as desired on the lower surface of the carrier.
  • the pins themselves can serve for an improved mechanical connection between the support serving as a base and the body, in which they are simultaneously inserted in an electrically connecting manner.
  • the combination of features according to claim 5 describes a particularly simple embodiment for such plug contacts.
  • the plug contact is L-shaped, the connecting lug extending parallel to the surface of the carrier forming the second leg, while the first leg forms the pin which protrudes from the lower surface of the carrier .
  • a particularly simple connection between the plug contact and the carrier results from the combination of features specified in claim 6. Then the plug contacts are after the injection molding of the carrier subsequently inserted into this insoluble or difficult to remove.
  • the injection molding process of the carrier is thus independent of the assembly through the plug contacts, which serves for increased flexibility in the use of the connection according to the invention. In addition, the injection molding process can be greatly simplified.
  • a particularly simple bracket for this is given by the measure according to claim 8.
  • the parallel displacement of the circuit board on the surface of the carrier is reliably prevented at least in one direction.
  • the carrier has connecting lugs, these can be provided with projections running parallel to the carrier, so that the printed circuit board can be clamped between these projections and the stamp and is therefore locked.
  • Protrusions and stamps can be attached to the terminal lug of the plug contacts, on the carrier itself or distributed over the components.
  • the resilient locking lug can additionally also take on the task described above in connection with projections on the connecting lugs or the stamps, so that the printed circuit board is also clamped between the stamp and the locking lug and a parallel displacement of the printed circuit board along the surface of the carrier is prevented.
  • the latch can also prevent movement of the circuit board in the plane of the circuit board, so that the latch prevents the circuit board from moving in two directions.
  • a further possibility for an improved mounting of the circuit board of the carrier results from the combination of features according to claim 11. This precludes a parallel displacement of the circuit board on the surface of the carrier. By locking projections within the area of the grooves can also be excluded after a movement of the circuit board in the circuit board level, so that thereby the task of the locking lug described above can be taken over.
  • the connecting lugs running parallel to the surface of the carrier and extending parallel to one another can have lengths according to claim 12, so that the position of the contact pins on the lower surface of the carrier can be determined as desired.
  • the contact pins should preferably be a contact knife, so that the plug contacts can be produced in a simple manner from metal sheets.
  • the terminal lugs with the edge regions of the slots are made by the same soldering process (eg wave soldering) and the connection surfaces of the components are soldered to the conductor tracks on the circuit board.
  • FIG. 1 shows in the upper half of the drawing three circuit boards 1 which are connected to one another in the multiple use and which are assigned in the lower part of FIG. 1 to the carriers 2 shown.
  • 1 also shows one of several plug contacts 3 which are each inserted into one of the carriers 2.
  • the printed circuit board 1 is provided with slots 4 to 7 which are located at the lower end of the respective printed circuit board 1 in FIGS. 1 and 2.
  • the slots 4, 5 and 7 each have soldering edges 8 to 11 on their circumference which open into the associated conductor tracks 12 on the printed circuit board 1.
  • the soldering edges 8 to 11 are produced by the same method as the conductor tracks 12 themselves, so that they are formed at the same time and can be regarded as part of the conductor tracks 12.
  • the individual circuit boards 1 are of multiple use manufactured, ie only separated after completion of the individual conductor tracks and soldering to the carrier.
  • Fig. 1 shows a perspective view of the carrier 2, which are designed as molded plastic parts.
  • the carriers 2 have e.g. Four through openings, only 13, 14, are shown, into each of which a plug contact 3 shown at the top right in FIG. 1 can be inserted.
  • the plug contact 3 has a simplified configuration compared to FIG. 1 and can be seen in a side view in FIG. 4, which has a first leg 15 acting as a plug pin and a second leg 16 acting as a soldering lug.
  • the two legs 15, 16 of the plug contact 3 abut L-shaped. Since the plug contact is preferably punched out of sheet metal and provided with a conductive layer, the plug pin is a knife contact, while the connection surfaces formed by the leg 15 essentially represent a soldering lug, the knife and lug lying in the same plane. Due to the bent course of the connecting lug 16, the flag end 20 can also lie outside the plane of the leg.
  • FIG. 3 shows the plug contacts 3 inserted into the carrier 2, only the back of the respective connecting lug being visible from above. It is important that the connecting lugs, which run essentially parallel to the surface 18 of the respective carrier 2, all end approximately at a predetermined distance b from the front edge 19 of the respective carrier 2, as a result of which the individual flag ends 20 are aligned with one another.
  • Fig. 4 shows one in one Carrier 2 inserted plug contact 3.
  • the circuit board 1 is arranged with its slots 4 to 7 on the back the connecting lugs 3 attached. This can be imagined, as indicated in FIG. 1, by placing the circuit board 1 on the connecting lugs 16 and perpendicular to the surface 18 of the carrier 2. In this state, this circuit board 1 sits vertically and held over the inner surface of your legs on the connecting lugs.
  • the advantage of the invention lies essentially in the fact that by tilting the connection from the carrier and the printed circuit board and by keeping the distance b between the flag end 20 and the leading edge 19, both the soldering edges 8 to 11 and the flag ends 20 can be reached by a soldering surge in a solder bath .
  • the circuit board 1 with the flag ends 20 can be soldered in a soldering process by just aligning the circuit board 1 to the soldering bath and immersing it in the soldering bath.
  • Both the electrical components 21 and the soldering points 22 on the circuit board can advantageously be soldered to the corresponding conductor tracks 12 at the same time.
  • the soldering process also simultaneously sufficiently fixes the circuit board 1 with respect to the carrier 2.
  • Fig. 5 shows the manufacture of the circuit boards 1 and their connection to the carriers 2 in multiple use. That is, first all carriers 2 are fitted with plug contacts 3 and mechanically connected to the associated printed circuit boards 1 via the plug contacts. Then the interconnected circuit boards 1 with the associated Plug contacts 3 and soldered to carriers 2 and then finally separate the individual circuit boards from one another, for example by breaking at pre-scored separation points.
  • the openings 13, 14 can be designed in such a way that they have comparatively large inner surfaces which form an extensive contact surface for the first legs 15. If the thickness of the carrier is not to be too great, a hollow cylindrical projection 23 can be cast onto the carrier 2, into which the first leg 15 forming the knife pin is inserted.
  • the 1 shows two spaced-apart projections 25, 26 on the plug contact 3, the spacing of which is slightly larger than the thickness of the printed circuit board 1.
  • the protrusions 25, 26 protruding upward from the conductor track engage on the front surface or rear surface of the printed circuit board 1 and thus prevent the printed circuit board 1 from itself can move in the longitudinal direction of the terminal lugs 16.
  • Such movement of the circuit board can be prevented, for example, by providing the carrier with a locking lug 27 which is fastened to a resilient beam 28.
  • the cantilever 28 is cast with the carrier 2. Instead of the projection 25 on the plug contact 3 in FIG.
  • a carrier projection 29 can optionally or additionally be provided, which prevents movement of the printed circuit board 1 to the front edge 19 of the carrier 2. It goes without saying that the projections 25, 26 on the plug contact 3 can be dispensed with when using the detent 27 and the carrier projection 29.
  • the locking lug preferably engages in a circuit board opening 30 in the circuit board 1. In order to obtain sufficient length for the spring bar 28 and the support projection 29 for the spring action, the bar 28 and the projection 29 sit at the bottom of a recess 31 in the support 2.
  • FIG. 3 in a top view, there is a first item 32 and a second item 33 are provided, which are perpendicular to the viewer plane in FIG. 3 and which are each provided with a groove 34, 35.
  • the grooves 34, 35 act as a guide rail for the circuit board 1 indicated by dashed lines, the movement of which in all directions except for the insertion direction coming vertically from above or the opposite lifting direction is prevented. Movement of the printed circuit board in these directions is in turn prevented by the latch 27, which engages in the printed circuit board opening 30, as already described above.
  • the carrier After assembly with plug contacts 3 and the printed circuit board 1 and their soldering, the carrier is shielded with a housing cover 36, which is latched to the carrier 2 via the latching points 37, 38 and corresponding openings in the housing cover 36.
  • the carrier 2 To assemble the carrier 2 with a carrier plate (not shown in the drawing), the carrier 2 also has latching tabs 39, 40, which engage behind the edge surfaces of corresponding recesses in the carrier plate and thus pull the detachable carrier 2 against the carrier plate (not shown). In this way, a good detachable electrical connection between the male connector 15 and the corresponding contacts on the carrier plate is achieved.
  • the invention it is also possible to apply the invention to the edge 41 opposite the front edge 19, so that a second circuit board on the carrier can be soldered to the carrier by means of a second soldering process.
  • the connecting lugs 16 can optionally be used to connect conductor tracks of two printed circuit boards 1 at the two opposite ends of the carrier 2. But it is also conceivable that each circuit board 1 has its own contact connectors are assigned.
  • the remaining edges of the carrier can also be used for connecting additional circuit boards.
  • a plurality of printed circuit boards can be connected to the terminal lugs 16 extending along the surface, it being possible for a plurality of printed circuit boards with their associated slots 4 to 7 to be seated on each of the connecting lugs.

Description

Die Erfindung betrifft eine Verbindung zwischen einem Träger und einer auf dem Träger sitzenden Leiterplatte. Aus der US-PS 41 29 351 ist eine Klemmleiste bekannt, die mit Schneidsteckverbindern bestückt ist, in welcher eine Leiterplatte eingesteckt werden kann. Die Schneidsteckverbinder ragen dabei am unteren Ende der Klemmleiste durch deren Boden, so daß die Klemmleiste über die Verbinder mit einer größeren Leiterplatte verrastet werden kann. Die Leiterplatte ist weder mit der Klemmleiste verlötet noch besitzt die Klemmleiste Stecker, über welche sie in ein integriertes Gehäuse elektrisch anschließbar ist.The invention relates to a connection between a carrier and a circuit board seated on the carrier. From US-PS 41 29 351 a terminal block is known which is equipped with cutting connectors in which a circuit board can be inserted. The cutting connectors protrude from the bottom of the terminal block through the bottom, so that the terminal block can be locked with a larger circuit board via the connector. The circuit board is neither soldered to the terminal block nor does the terminal block have plugs via which it can be electrically connected in an integrated housing.

Aus dem DE-GM 72 15 109 sind ähnliche Klemmleisten mit seitlicher Führung für die Leiterplatten bekannt, wobei die Klemmleisten auf einer Verdrahtungsplatte sitzen, deren Leiterbahnen mit den Anschlüssen der Klemmleisten elektrisch verbunden sind. Die Leiterplatten sind dabei lösbar mit der Klemmleiste verbunden.Similar terminal strips with lateral guidance for the printed circuit boards are known from DE-GM 72 15 109, the terminal strips sitting on a wiring board, the conductor tracks of which are electrically connected to the terminals of the terminal strips. The circuit boards are detachably connected to the terminal block.

Aus der DE-OS 16 65 337 ist es bekannt, die Leiterplatten in einem Gehäuse parallel zueinander anzuordnen und die Leiterplatten über senkrecht zu den Leiterplatten verlaufende Leitungen miteinander zu verbinden. Dabei werden die Leitungen durch Schlitze an den Rändern der Leiterplatten geführt, wobei in die Leiterplattenschlitze Leiterbahnen der Leiterplatten münden. Die Leiterplatten sind daher nicht direkt mit Anschlüssen eines Sockels verlötet.From DE-OS 16 65 337 it is known to arrange the circuit boards in a housing parallel to one another and to connect the circuit boards to one another via lines running perpendicular to the circuit boards. The Cables are guided through slots on the edges of the circuit boards, conductor tracks of the circuit boards opening into the circuit board slots. The circuit boards are therefore not directly soldered to the connections of a base.

Einen ähnlichen Aufbau wie in der genannten DE-GM 72 15 109 zeigt die DE-AS 12 57 235 und auch hier wurde wiederum auf eine Lötverbindung zwischen Leiterplatte und dem Träger verzichtet. Hinsichtlich des Trägers sind keine Steckkontakte vorgesehen.DE-AS 12 57 235 shows a structure similar to that in the aforementioned DE-GM 72 15 109, and here too a soldered connection between the printed circuit board and the carrier has been dispensed with. With regard to the carrier, no plug contacts are provided.

Eine andere vorbekannte Lehre besteht darin, daß gemäß Fig. 3 der DE-B-1 139 902 sowie gemäß Spalte 2, Abs. 1 dieser Schrift vorbekannt ist, neben den Bauelementen auch gleichzeitig ein Kontaktblech mit der Leiterplatte zu verlöten. Die verlötete Einheit wird dann gemäß Fig. 6 mit einem Träger verbunden. Dabei stützt dann der Träger die Verbindungsstelle zwischen Leiterplatte und Kontaktblech durch seitlich hochgezogene Wände ab.Another previously known teaching is that according to FIG. 3 of DE-B-1 139 902 and column 2, paragraph 1 of this document, it is known to solder a contact plate to the circuit board in addition to the components. The soldered unit is then connected to a carrier as shown in FIG. 6. The carrier then supports the connection point between the printed circuit board and the contact plate by means of laterally raised walls.

Nachteilig hierbei ist, daß Leiterplatte und Kontaktblech erst mechanisch hinreichend fest miteinander verbunden sein müssen, um sie miteinander verlöten zu können. Die so geschaffene Einheit muß nachfolgend in den Träger (d.h. Leiterplattenträger) eingefügt und mit diesen mechanisch verbunden werden.The disadvantage here is that the printed circuit board and contact plate must first be mechanically sufficiently firmly connected to one another in order to be able to solder them to one another. The unit created in this way must subsequently be inserted into the carrier (i.e. printed circuit board carrier) and mechanically connected to it.

Die Erfindung geht daher aus von einer Verbindung der sich aus dem Oberbegriff des Anspruches 1 ergebenden Gattung. Aufgabe der Erfindung ist es, eine preiswerte und dauerhafte Verbindung zwischen einem mit Steckkontakten versehenen Träger und einer Leiterplatte zu schaffen.The invention is therefore based on a combination of the genus resulting from the preamble of claim 1. The object of the invention is to provide an inexpensive and permanent connection between a carrier provided with plug contacts and a printed circuit board.

Die Aufgabe wird durch die sich im kennzeichnenden Teil des Anspruchs 1 ergebende Merkmalskombination gelöst. Die Erfindung besteht im Prinzip also darin, Leiterplatte und Steckkontakt zueinander und beide gegenüber dem Träger derart anzuordnen, daß die Lötstellen der Leiterplatte und die Anschlußfahnen in einem einzigen Lötvorgang verlötet werden. Der wesentliche Vorteil der Erfindung besteht nun darin, daß es möglich wird, durch ein automatisches Lötverfahren z.B. Schwallöten, sämtliche Kontakte des Trägers mit den zugeordneten Leiterbahnen auf der Leiterplatte in einem einzigen Lötvorgang zu löten. Hierdruch erhält man eine sehr saubere und gut haftende Lötung mittels eines einzigen Arbeitsgangs.The object is achieved by the combination of features resulting in the characterizing part of claim 1. In principle, the invention therefore consists in arranging the printed circuit board and plug-in contact with one another and both relative to the carrier in such a way that the soldering points on the printed circuit board and the terminal lugs are soldered in a single soldering process. The main advantage of the invention is that it becomes possible to use e.g. Wave soldering to solder all contacts of the carrier with the associated conductor tracks on the circuit board in a single soldering process. This gives you a very clean and well-adhering soldering in a single operation.

Die miteinander zu verlötenden Verbindungsstellen liegen entlang der Vorderkante des Trägers in einer nicht weit von dieser Vorderkante entfernten Ebene. Die Vorderkante des Trägers sollte dabei möglichst gerade sein, damit sie das Eintauchen der Leiterplatte in den Lötschwall nicht behindert. Dem entsprechend ist es auch notwendig, daß der Abstand von der Leiterplattenebene von der Vorderkante des Trägers so gering wie möglich gehalten ist.The connection points to be soldered to one another lie along the front edge of the carrier in a plane not far from this front edge. The front edge of the carrier should be as straight as possible so that it does not hinder the immersion of the circuit board in the solder surge. Accordingly, it is also necessary that the distance from the circuit board level from the front edge of the carrier is kept as small as possible.

Einen besonders zweckmäßigen Aufbau erhält man, wenn man ergänzend die weiteren Merkmale nach Anspruch 2 anwendet. Dabei umfassen Schlitze der Leiterplatte an dem den Anschlußflächen zugeordneten Randbereich der Leiterplatte die Anschlußflächen, wodurch sich eine vergleichsweise große Verbindungsfläche zwischen den Anschlußflächen und den Steckkontakten bildet. Dabei können zur mechanischen Halterung die Schlitze auch kraftschlüssig auf den Anschlußflächen aufsitzen, in dem die Schlitze unter Kraft auf die Anschlußflächen aufgeschoben werden. Hierdurch kann die Verbindung zwischen den Schlitzen und den Anschlußflächen vor dem Lötvorgang zu einer mechanischen Arretierung der Leiterplatte gegenüber dem Träger beitragen oder auch die gesamte mechanische Arretierung bildet, bis schließlich nach dem Lötvorgang die Leiterplatte mit den Anschlußflächen mittels der Lötverbindung fest verbunden ist.A particularly expedient structure is obtained if the additional features according to claim 2 are used in addition. In this case, slots of the printed circuit board at the edge area of the printed circuit board assigned to the connection areas enclose the connection areas, as a result of which a comparatively large connection area between the connection areas and the plug contacts forms. For mechanical mounting, the slots can also be non-positively seated on the connecting surfaces by pushing the slots under force onto the connecting surfaces. As a result, the connection between the slots and the connection surfaces before the soldering process can contribute to a mechanical locking of the printed circuit board with respect to the carrier or can also form the entire mechanical locking device until finally after the soldering process the printed circuit board is firmly connected to the connection surfaces by means of the soldered connection.

Weiterhin ergibt sich durch die Merkmale nach Anspruch 2 eine besonders sichere elektrische Verbindung aber auch mechanische Verbindung zwischen der Leiterplatte und den Anschlußflächen. Dazu ist der Rand der Schlitze von einem leitfähigen lötbaren Material umgeben, in welches die Leiterbahnen münden, Man erhält daher eine besonders große Kontaktfläche auf der Leiterplatte, die mit den Anschlußflächen verlötet werden kann.Furthermore, the features of claim 2 result in a particularly secure electrical connection but also a mechanical connection between the printed circuit board and the connection surfaces. For this purpose, the edge of the slots is surrounded by a conductive solderable material into which the conductor tracks open. A particularly large contact area is therefore obtained on the circuit board, which can be soldered to the connection areas.

Um die Leiterplatte in einfacher Weise auf die Anschlußflächen aufstecken zu können empfiehlt sich in Weiterbildung der Erfindung die Merkmalskombination nach Anspruch 4. Hierdurch wird ein Einfädeln der Anschlußflächen in die Schlitze auf die Leiterplatte vermieden.In order to be able to simply plug the printed circuit board onto the connection surfaces, the combination of features according to claim 4 is recommended in a further development of the invention. This avoids threading the connection surfaces into the slots on the printed circuit board.

Soll die Leiterplatte senkrecht zu der Oberfläche des Trägers stehen und gleichzeitig auf den Träger aufsteckbar sein (s. Anspruch 3), so empfiehlt sich in Weiterbildung der Erfindung die Merkmalskombination nach Anspruch 4. Der wesentliche Vorteil besteht dabei darin, daß durch die sich längs der Oberfläche des Trägers erstreckenden Anschlußflächen die nach unten aus dem Stecker ragenden Steckstifte beliebig auf der Unterfläche des Trägers verteilt sein können. Hierdurch können die Steckstifte selber für eine verbesserte mechanische Verbindung zwischen den als Sockel dienenden Träger und dem Körper dienen, in welchen sie gleichzeitig elektrisch verbindend eingesteckt werden.If the circuit board is to be perpendicular to the surface of the carrier and at the same time be pluggable onto the carrier (see claim 3), then in a further development of the invention the combination of features according to claim 4 is recommended. The main advantage here is that the length along the Surface of the carrier extending pads the pins protruding downward from the plug can be distributed as desired on the lower surface of the carrier. As a result, the pins themselves can serve for an improved mechanical connection between the support serving as a base and the body, in which they are simultaneously inserted in an electrically connecting manner.

Eine besonders einfache Ausführung für derartige Steckkontakte beschreibt die Merkmalskombination nach Anspruch 5. Dabei ist der Steckkontakt L-förmig, wobei sich die parallel zur Oberfläche des Trägers erstreckende Anschlußfahne den zweiten Schenkel bildet, während der erste Schenkel den aus der Unterfläche des Trägers hervorragenden Steckstift formt.The combination of features according to claim 5 describes a particularly simple embodiment for such plug contacts. The plug contact is L-shaped, the connecting lug extending parallel to the surface of the carrier forming the second leg, while the first leg forms the pin which protrudes from the lower surface of the carrier .

Eine besonders einfache Verbindung zwischen Steckkontakt und Träger ergibt sich durch die in Anspruch 6 angegebene Merkmalskombination. Danach werden die Steckkontakte nach dem Spritzgießen des Trägers in diesen unlösbar oder schwer lösbar nachträglich eingesteckt. Der Spritzgießvorgang des Trägers wird damit von der Bestückung durch die Steckkontakte unabhängig, was zu einer vergrößerten Flexibilität in der Anwendung der erfindungsgemäßen Verbindung dient. Außerdem kann der Spritzgußvorgang stark vereinfacht werden.A particularly simple connection between the plug contact and the carrier results from the combination of features specified in claim 6. Then the plug contacts are after the injection molding of the carrier subsequently inserted into this insoluble or difficult to remove. The injection molding process of the carrier is thus independent of the assembly through the plug contacts, which serves for increased flexibility in the use of the connection according to the invention. In addition, the injection molding process can be greatly simplified.

Weiter oben war schon erwähnt worden, daß ggf. die mechanische Haftung der über die Schlitze auf die Anschlußfahnen aufgesetzten Leiterplatte als für den Lötvorgang notwendige Fixierung ausreichen kann. Eine bessere mechanische Halterung gegenüber dem Träger, insbesondere auch bei einer während ihres Betriebs stark mechanisch beanspruchte Verbindung ergibt sich die Merkmalskombination nach Anspruch 7. Hierdurch wird die Leiterplatte gegenüber dem Träger mechanisch zusätzlich gesichert und gleichzeitig eine verbesserte Fixierung für den Lötvorgang erreicht.It was already mentioned above that the mechanical adhesion of the printed circuit board placed over the slots on the connecting lugs may be sufficient as the fixation necessary for the soldering process. The combination of features according to claim 7 results in better mechanical mounting relative to the carrier, in particular also in the case of a connection that is subject to high mechanical stresses during operation. This additionally mechanically secures the printed circuit board relative to the carrier and, at the same time, improves fixation for the soldering process.

Eine besonders einfache Halterung hierzu ist durch die Maßnahme nach Anspruch 8 gegeben. Hierdurch wird die Parallelverschiebung der Leiterplatte auf der Oberfläche des Trägers zumindest in einer Richtung sicher verhindert. Besitzt der Träger Anschlußfahnen, so können diese mit parallel zum Träger verlaufenden Vorsprüngen versehen sein, so daß die Leiterplatte zwischen diesen Vorsprüngen und dem Stempel sich einklemmen läßt und damit arretiert ist. Vorsprünge und Stempel können an der Anschlußfahne der Steckkontakte, am Träger selbst oder verteilt auf die Bauelemente angebracht sein.A particularly simple bracket for this is given by the measure according to claim 8. As a result, the parallel displacement of the circuit board on the surface of the carrier is reliably prevented at least in one direction. If the carrier has connecting lugs, these can be provided with projections running parallel to the carrier, so that the printed circuit board can be clamped between these projections and the stamp and is therefore locked. Protrusions and stamps can be attached to the terminal lug of the plug contacts, on the carrier itself or distributed over the components.

In Weiterbildung der Erfindung empfiehlt es sich, eine Bewegung der Leiterplatte senkrecht zur Oberfläche des Trägers durch die in Anspruch 9 geschilderte Maßnahme zu verhindern.In a development of the invention, it is recommended to prevent movement of the circuit board perpendicular to the surface of the carrier by the measure described in claim 9.

Dabei kann die federnde Rastnase zusätzlich auch gleich noch die oben im Zusammenhang mit Vorsprüngen an den Anschlußfahnen oder den Stempeln geschilderte Aufgabe übernehmen, so daß auch die Leiterplatte zwischen Stempel und Rastnase eingeklemmt ist und eine Parallelverschiebung der Leiterplatte längs der Oberfläche des Trägers verhindert ist. Durch die Rastnase läßt sich auch eine Bewegung der Leiterplatte in der Leiterplattenebene verhindern, so daß durch die Rastnase die Bewegung der Leiterplatte in zwei Richtungen verhindert ist.The resilient locking lug can additionally also take on the task described above in connection with projections on the connecting lugs or the stamps, so that the printed circuit board is also clamped between the stamp and the locking lug and a parallel displacement of the printed circuit board along the surface of the carrier is prevented. The latch can also prevent movement of the circuit board in the plane of the circuit board, so that the latch prevents the circuit board from moving in two directions.

Eine weitere Möglichkeit für eine verbesserte Halterung der Leiterplatte der Träger ergibt die Merkmalskombination nach Anspruch 11. Hierdurch wird eine Parallelverschiebung der Leiterplatte auf der Oberfläche des Trägers ausgeschlossen. Durch Rastvorsprünge innerhalb des Bereichs der Nuten läßt sich aber auch nach einer Bewegung der Leiterplatte in der Leiterplattenebene ausschließen, so daß hierdurch auch die Aufgabe der schon weiter oben beschriebenen Rastnase übernommen werden kann.A further possibility for an improved mounting of the circuit board of the carrier results from the combination of features according to claim 11. This precludes a parallel displacement of the circuit board on the surface of the carrier. By locking projections within the area of the grooves can also be excluded after a movement of the circuit board in the circuit board level, so that thereby the task of the locking lug described above can be taken over.

Die parallel zur Oberfläche des Träger verlaufenden Anschlußfahnen, die sich zueinander parallel erstrecken, können gemäß Anspruch 12 Längen besitzen, so daß sich hierdurch die Lage der Kontakstifte an der Unterfläche des Träger beliebig festlegen läßt. Die Kontaktstifte sollte dabei vorzugsweise Kontaktmesser sein, so daß sich die Steckkontakte in einfacher Weise aus Blechen herstellen lassen.The connecting lugs running parallel to the surface of the carrier and extending parallel to one another can have lengths according to claim 12, so that the position of the contact pins on the lower surface of the carrier can be determined as desired. The contact pins should preferably be a contact knife, so that the plug contacts can be produced in a simple manner from metal sheets.

Um den elektrisch leitenden Rand gemäß Anspruch 2 herstellen zu können, ist gemäß einer vorteilhaften Weiterbildung der Erfindung nach Anspruch 13 kein gesonderter Arbeitsgang notwendig. Vielmehr kann dieser Rand gleichzeitig mit den sonstigen Leiterbahnen auf der Leiterplatte in einem Arbeitsgang durch die für die Schaffung von Leiterbahnen üblichen Maßnahmen (z.B. Ätzverfahren) gebildet werden).In order to be able to produce the electrically conductive edge according to claim 2, according to an advantageous development of the invention according to claim 13, no separate operation is necessary. Rather, this edge can be formed at the same time as the other conductor tracks on the circuit board in one work step by the measures customary for creating conductor tracks (e.g. etching processes).

Sollen die Bauelemente auf der Leiterplatte gleichzeitig mit den Anschlußfahnen des Trägers durch einen einzigen Lötvorgang verbunden werden, so empfiehlt sich in Weiterbildung der Erfindung die Merkmalskombination nach Anspruch 14. Dabei werden durch den gleichen Lötvorgang (z.B. Schwallöten) sowohl die Anschlußfahnen mit den Randbereichen der Schlitze als auch die Anschlußflächen der Bauelemente mit den Leiterbahnen auf der Leiterplatte verlötet.If the components on the circuit board are to be connected to the terminal lugs of the carrier at the same time by a single soldering process, the combination of features according to claim 14 is recommended in a further development of the invention. In this case, the terminal lugs with the edge regions of the slots are made by the same soldering process (eg wave soldering) and the connection surfaces of the components are soldered to the conductor tracks on the circuit board.

Um die erfindungsgemäße Verbindung herzustellen, empfehlen sich in Weiterbildung der Erfindung die Verfahren nach Ansprüche 15 und 16.In order to produce the connection according to the invention, the methods according to claims 15 and 16 are recommended in a development of the invention.

Ein Ausführungsbeispiel der Erfindung wird nachfolgend anhand der Zeichnung erläutert. Nachfolgend zeigt:

Fig. 1
in auseinandergezogener Darstellung drei abgebrochen dargestellte Leiterplatten zum Einbau in drei zugehörige, ebenfalls abgebrochen dargestellte Träger,
Fig. 2
in abgebrochener Darstellung eine einzelne Leiterplatte nach Fig. 1
Fig. 3
die Draufsicht auf einen mit Steckkontakten bestückten Träger,
Fig. 4
einen Schnitt durch den Träger nach Fig. 3 mit eingeschobener Leiterplatte und
Fig. 5
Leiterplatten im Mehrnutzen und zugehörige Träger vor deren Bestückung.
An embodiment of the invention is explained below with reference to the drawing. The following shows:
Fig. 1
in an exploded view three circuit boards shown broken off for installation in three associated, also shown broken off Carrier,
Fig. 2
in broken representation a single circuit board according to FIG. 1
Fig. 3
the top view of a carrier equipped with plug contacts,
Fig. 4
a section through the carrier of FIG. 3 with inserted circuit board and
Fig. 5
Printed circuit boards in multiple use and associated carriers before assembling them.

Fig. 1 zeigt in der oberen Hälfte der Zeichnung drei im Mehrnutzen miteinander verbundene Leiterplatten 1, die in dem unteren Teil von Fig. 1 dargestellten Trägern 2 zugeordnet sind.FIG. 1 shows in the upper half of the drawing three circuit boards 1 which are connected to one another in the multiple use and which are assigned in the lower part of FIG. 1 to the carriers 2 shown.

Fig. 1 zeigt weiterhin noch einen von mehreren Steckkontakten 3 die jeweils in einen der Träger 2 eingesteckt werden.1 also shows one of several plug contacts 3 which are each inserted into one of the carriers 2.

Wie aus Fig. 1 und 2 ersichtlich ist die Leiterplatte 1 mit Schlitzen 4 bis 7 versehen, die sich am in Fig. 1 und Fig. 2 unteren Ende der jeweiligen Leiterplatte 1 befinden. Die Schlitze 4,5 und 7 besitzen jeweils an ihrem Umfang Lötränder 8 bis 11 in die zugehörige Leiterbahnen 12 auf der Leiterplatte 1 münden. Die Lötränder 8 bis 11 werden durch das gleiche Verfahren wie die Leiterbahnen 12 selbst hergestellt, so daß sie gleichzeitig gebildet werden und als Teil der Leiterbahnen 12 aufgefaßt werden können. Dabei werden die einzelnen Leiterplatten 1 im Mehrnutzen gefertigt, d.h. erst nach Fertigstellung der einzelnen Leiterbahnen und dem Verlöten mit dem Träger voneinander getrennt.As can be seen from FIGS. 1 and 2, the printed circuit board 1 is provided with slots 4 to 7 which are located at the lower end of the respective printed circuit board 1 in FIGS. 1 and 2. The slots 4, 5 and 7 each have soldering edges 8 to 11 on their circumference which open into the associated conductor tracks 12 on the printed circuit board 1. The soldering edges 8 to 11 are produced by the same method as the conductor tracks 12 themselves, so that they are formed at the same time and can be regarded as part of the conductor tracks 12. The individual circuit boards 1 are of multiple use manufactured, ie only separated after completion of the individual conductor tracks and soldering to the carrier.

Fig. 1 zeigt in perspektivischer Darstellung noch die Träger 2, die als Kunststoffspritzteile ausgebildet sind. Die Träger 2 besitzen z.B. vier Durchgangsöffnungen, nur 13,14, dargestellt, in die jeweils eine in Fig. 1 oben rechts gezeigten Steckkontakte 3 eingesteckt werden kann.Fig. 1 shows a perspective view of the carrier 2, which are designed as molded plastic parts. The carriers 2 have e.g. Four through openings, only 13, 14, are shown, into each of which a plug contact 3 shown at the top right in FIG. 1 can be inserted.

Dabei hat der Steckkontakt 3 eine gegenüber Fig. 1 vereinfachte und in Seitenansicht in Fig. 4 ersichtliche Ausgestaltung, die einen als Steckerstift wirkenden ersten Schenkel 15 und einen als Lötfahne wirkenden zweiten Schenkel 16 aufweist. Die beiden Schenkel 15, 16 des Steckkontaktes 3 stoßen L-förmig aufeinander. Da der Steckkontakt vorzugsweise aus Blech ausgestanzt und mit einer leitenden Schicht versehen ist, ist der Steckerstift ein Messerkontakt, während die durch den Schenkel 15 gebildeten Anschlußflächen im wesentlichen eine Lötfahne darstellen, wobei Messer und Fahne in der gleichen Ebene liegen. Durch abgeknickten Verlauf der Anschlußfahne 16, kann das Fahnenende 20 aber auch außerhalb der Ebene des Schenkels liegen.The plug contact 3 has a simplified configuration compared to FIG. 1 and can be seen in a side view in FIG. 4, which has a first leg 15 acting as a plug pin and a second leg 16 acting as a soldering lug. The two legs 15, 16 of the plug contact 3 abut L-shaped. Since the plug contact is preferably punched out of sheet metal and provided with a conductive layer, the plug pin is a knife contact, while the connection surfaces formed by the leg 15 essentially represent a soldering lug, the knife and lug lying in the same plane. Due to the bent course of the connecting lug 16, the flag end 20 can also lie outside the plane of the leg.

Fig. 3 zeigt die in den Träger 2 eingesteckten Steckkontakte 3, wobei von oben nur der Rücken der jeweiligen An-schlußfahne zu erkennen ist. Wichtig ist, daß die Anschlußfahnen, welche im wesentlichen parallel zur Oberfläche 18 des jeweiligen Trägers 2 verlaufen, alle etwa in einem vorgegebenen Abstand b von der Vorderkante 19 des jeweiligen Trägers 2 enden, wodurch die einzelnen Fahnenenden 20 miteinander fluchten. Fig. 4 zeigt einen in einen Träger 2 eingesetzten Steckkontakt 3. Um nun die Leiterplatte 1 mit den Anschlußfahnen 16 des Steckkontaktes 3 miteinander verlöten zu können, wird die Leiterplatte 1, wie in Fig. 3 in Draufsicht gestrichelt gezeigt, also angeordnet, mit ihren Schlitzen 4 bis 7 auf die Rücken der Anschlußfahnen 3 aufgesteckt. Dies kann man sich wie in Fig. 1 angedeutet, durch ein Aufsetzen der Leiterplatte 1 auf die Anschlußfahnen 16 und senkrecht zur Oberfläche 18 des Trägers 2 vorstellen. In diesem Zustand sitzt dise Leiterplatte 1 senkrecht und über die Innenfläche Ihrer Schenkel gehalten, auf den Ansdchlußfahnen auf.3 shows the plug contacts 3 inserted into the carrier 2, only the back of the respective connecting lug being visible from above. It is important that the connecting lugs, which run essentially parallel to the surface 18 of the respective carrier 2, all end approximately at a predetermined distance b from the front edge 19 of the respective carrier 2, as a result of which the individual flag ends 20 are aligned with one another. Fig. 4 shows one in one Carrier 2 inserted plug contact 3. In order to be able to solder the circuit board 1 with the connecting lugs 16 of the plug contact 3 to one another, the circuit board 1, as shown in broken lines in FIG. 3 in plan view, is arranged with its slots 4 to 7 on the back the connecting lugs 3 attached. This can be imagined, as indicated in FIG. 1, by placing the circuit board 1 on the connecting lugs 16 and perpendicular to the surface 18 of the carrier 2. In this state, this circuit board 1 sits vertically and held over the inner surface of your legs on the connecting lugs.

Der Vorteil der Erfindung liegt nun im wesentlichen darin, daß durch Kippen der Verbindung aus Träger und Leiterplatte und durch Geringhalten des Abstands b zwischen Fahnenende 20 und Vorderkante 19 sowohl die Lötränder 8 bis 11 als auch die Fahnenenden 20 durch einen Lötschwall in einem Lötbad erreichbar sind. Die Leiterplatte 1 mit den Fahnenenden 20 kann in einem Lötvorgang dadurch verlötet werden, daß man die Leiterplatte 1 eben zum Lötbad ausrichtet und sie in das Lötbad taucht. Dabei können vorteilhaft sowohl die elektrischen Bauelemente 21 als auch die Lötpunkte 22 auf der Leiterplatte mit den entsprechenden Leiterbahnen 12 gleichzeitig verlötet werden. Durch den Lötvorgang wird gleichzeitig auch die Leiterplatte 1 gegenüber dem Träger 2 hinreichend fixiert.The advantage of the invention lies essentially in the fact that by tilting the connection from the carrier and the printed circuit board and by keeping the distance b between the flag end 20 and the leading edge 19, both the soldering edges 8 to 11 and the flag ends 20 can be reached by a soldering surge in a solder bath . The circuit board 1 with the flag ends 20 can be soldered in a soldering process by just aligning the circuit board 1 to the soldering bath and immersing it in the soldering bath. Both the electrical components 21 and the soldering points 22 on the circuit board can advantageously be soldered to the corresponding conductor tracks 12 at the same time. The soldering process also simultaneously sufficiently fixes the circuit board 1 with respect to the carrier 2.

Fig. 5 zeigt die Herstellung der Leiterplatten 1 und deren Verbindung mit den Trägern 2 im Mehrnutzen. D.h., daß zuerst alle Träger 2 mit Steckkontakten 3 bestückt und über die Steckkontakte mit den zugehörigen Leiterplatten 1 mechanisch verbunden werden. Daraufhin werden die noch miteinander verbundenen Leiterplatten 1 mit den zugehörigen Steckkontakten 3 und mit Trägern 2 verlötet und daraufhin schließlich die einzelnen Leiterplatten voneinander getrennt, z.B. durch Brechen an vorgeritzten Trennstellen.Fig. 5 shows the manufacture of the circuit boards 1 and their connection to the carriers 2 in multiple use. That is, first all carriers 2 are fitted with plug contacts 3 and mechanically connected to the associated printed circuit boards 1 via the plug contacts. Then the interconnected circuit boards 1 with the associated Plug contacts 3 and soldered to carriers 2 and then finally separate the individual circuit boards from one another, for example by breaking at pre-scored separation points.

Um eine gute Verankerung der Steckkontake 3 gegenüber den Trägern 2 zu erhalten können die Durchbrüche 13, 14 derart ausgestaltet werden, daß sie vergleichsweise große Innenflächen haben, die für die ersten Schenkel 15 eine umfangreiche Anlagefläche bilden. Dabei kann, wenn die Dicke des Trägers nicht zu groß werden soll, an den Träger 2 ein hohlzylinderförmigen Ansatz 23 angegossen sein, in den der den Messerstift bildende erste Schenkel 15 eingesteckt ist.In order to obtain a good anchoring of the plug contacts 3 with respect to the supports 2, the openings 13, 14 can be designed in such a way that they have comparatively large inner surfaces which form an extensive contact surface for the first legs 15. If the thickness of the carrier is not to be too great, a hollow cylindrical projection 23 can be cast onto the carrier 2, into which the first leg 15 forming the knife pin is inserted.

Durch widerhakenförmige Vorsprünge 24 einmal am in Fig. 4 oberen Ende des ersten Schenkels 15 und entsprechende Ausnehmungen an der Innenfläche des zylinderförmigen Ansatzes 23 läßt sich eine dauerhafte Rastverbindung zwischen Träger 2 und Steckkontakt 3 erreichen, der für einen guten Halt des Kontaktes 3 selbst und damit auch für die Leiterplatte 1 sorgt.By barb-shaped projections 24 once at the upper end in FIG. 4 of the first leg 15 and corresponding recesses on the inner surface of the cylindrical projection 23, a permanent snap connection between the carrier 2 and the plug contact 3 can be achieved, which ensures a good hold of the contact 3 itself and thus also provides for the circuit board 1.

Um die mechanische Halterung der Leiterplatte 1 gegenüber dem Träger 1 sowohl vor als auch nach dem Lötvorgang zu verbessern, ergeben sich mehreren Möglichkeiten.In order to improve the mechanical mounting of the circuit board 1 relative to the carrier 1 both before and after the soldering process, there are several possibilities.

Fig. 1 zeigt hierzu zwei im Abstand zueinander befindliche Vorsprünge 25,26 an dem Steckkontakt 3, deren Abstand geringfügig größer als die Dicke der Leiterplatte 1 ist. Die nach oben der Leiterbahn entgegenragenden Vorsprünge 25,26 greifen an der Vorderfläche bzw. Hinterfläche der Leiterplatte 1 an und verhindern so, daß die Leiterplatte 1 sich in Längsrichtung der Anschlußfahnen 16 bewegen kann. Somit ist für die Leiterplatte im nicht gelöteten Zustand nur noch eine Bewegung senkrecht zum Träger 2 möglich. Eine solche Bewegung der Leiterplatte läßt sich beispielsweise dadurch verhindern, daß man den Träger mit einer Rastnase 27 versieht, die an einem federnden Balken 28 befestigt ist. Der Federbalken 28 ist mit dem Träger 2 vergossen. Statt des Vorsprungs 25 an dem Steckkontakt 3 in Fig. 1 kann wahlweise oder zusätzlich ein Trägervorsprung 29 vorgesehen sein, welcher eine Bewegung der Leiterplatte 1 zur Vorderkante 19 des Trägers 2 verhindert. Es versteht sich, daß bei Anwendung der Rastnase 27 und des Trägervorsprungs 29 auf die Vorsprünge 25,26 am Steckkontakt 3 verzichtet werden kann. Die Rastnase greift vorzugsweise in eine Leiterplattenöffnung 30 in der Leiterplatte 1 ein. Um für den Federbalken 28 sowie den Trägervorsprung 29 zur Federwirkung hinreichende Länge zu erhalten, sitzen Balken 28 und Vorsprung 29 am Boden einer Ausnehmung 31 im Träger 2.1 shows two spaced-apart projections 25, 26 on the plug contact 3, the spacing of which is slightly larger than the thickness of the printed circuit board 1. The protrusions 25, 26 protruding upward from the conductor track engage on the front surface or rear surface of the printed circuit board 1 and thus prevent the printed circuit board 1 from itself can move in the longitudinal direction of the terminal lugs 16. Thus, only a movement perpendicular to the carrier 2 is possible for the circuit board in the unsoldered state. Such movement of the circuit board can be prevented, for example, by providing the carrier with a locking lug 27 which is fastened to a resilient beam 28. The cantilever 28 is cast with the carrier 2. Instead of the projection 25 on the plug contact 3 in FIG. 1, a carrier projection 29 can optionally or additionally be provided, which prevents movement of the printed circuit board 1 to the front edge 19 of the carrier 2. It goes without saying that the projections 25, 26 on the plug contact 3 can be dispensed with when using the detent 27 and the carrier projection 29. The locking lug preferably engages in a circuit board opening 30 in the circuit board 1. In order to obtain sufficient length for the spring bar 28 and the support projection 29 for the spring action, the bar 28 and the projection 29 sit at the bottom of a recess 31 in the support 2.

Wie weiter oben schon erläutert, soll der Abstand b zwischen dem Fahnenende 20 und der Vorderkante 19 möglichst gering sein. Da hier u.U. die Tiefe des Trägervorsprungs 29 zu schmal werden könnte, ergibt sich gemäß Fig. 3 und 4 eine weitere Möglichkeit zur mechanischen Halterung der Leiterplatte 1. Dabei ist, wie in Fig. 3 in Draufsicht gezeigt, ein erster Posten 32 und zweiter Posten 33 vorgesehen, die in Fig. 3 senkrecht zur Betrachterebene stehen und die jeweils mit einer Nut 34,35 versehen sind. Die Nuten 34,35 wirken als Führungsschiene für die gestrichelt angedeutete Leiterplatte 1, die deren Bewegung in allen Richtungen bis auf die senkrecht von oben kommende Einschubrichtung bzw. der entgegenstehenden Ausheberichtung verhindert ist. Eine Bewegung der Leiterplatte in diesen Richtungen wird aber wiederum durch die Rastnase 27 verhindert, die in die Leiterplattenöffnung 30 eingreift, wie weiter oben schon beschrieben.As already explained above, the distance b between the flag end 20 and the front edge 19 should be as small as possible. 3 and 4, there is a further possibility for mechanically holding the printed circuit board 1. Here, as shown in FIG. 3 in a top view, there is a first item 32 and a second item 33 are provided, which are perpendicular to the viewer plane in FIG. 3 and which are each provided with a groove 34, 35. The grooves 34, 35 act as a guide rail for the circuit board 1 indicated by dashed lines, the movement of which in all directions except for the insertion direction coming vertically from above or the opposite lifting direction is prevented. Movement of the printed circuit board in these directions is in turn prevented by the latch 27, which engages in the printed circuit board opening 30, as already described above.

In Fig. 3 sind nur zwei Ansätze 23 dargestellt, während die beiden rechten Steckkontakte in Fig. 3 nicht mit derartigen Ansätzen zusammenarbeiten.In Fig. 3 only two approaches 23 are shown, while the two right plug contacts in Fig. 3 do not work with such approaches.

Der Träger wird nach dem Zusammenbau mit Steckkontakten 3 und der Leiterplatte 1 sowie deren Verlötung mit einem Gehäusedeckel 36 abgeschirmt, der über die Rastpunkte 37,38 und entsprechenden Öffnungen im Gehäusedeckel 36 mit dem Träger 2 verrastet ist.After assembly with plug contacts 3 and the printed circuit board 1 and their soldering, the carrier is shielded with a housing cover 36, which is latched to the carrier 2 via the latching points 37, 38 and corresponding openings in the housing cover 36.

Zum Zusammenbau des Trägers 2 mit einer in der Zeichnung nicht dargestellten Trägerplatte besitzt der Träger 2 noch Rastfahnen 39,40, die die-Randflächen entsprechender Ausnehmungen in der Trägerplatte federnd hintergreifen und somit den lösbaren Träger 2 gegen die nicht dargestellte Trägerplatte ziehen. Hierdurch wird eine gute lösbare elektrische Verbindung zwischen dem Messerstecker 15 und den entsprechenden Kontakten an der Trägerplatte erreicht.To assemble the carrier 2 with a carrier plate (not shown in the drawing), the carrier 2 also has latching tabs 39, 40, which engage behind the edge surfaces of corresponding recesses in the carrier plate and thus pull the detachable carrier 2 against the carrier plate (not shown). In this way, a good detachable electrical connection between the male connector 15 and the corresponding contacts on the carrier plate is achieved.

Theoretisch ist es auch möglich, an der der Vorderkante 19 gegenüberliegenden Kante 41, die Erfindung anzuwenden, so daß eine zweite Leiterplatte auf dem Träger mittels eines zweiten Lötvorgangs mit dem Träger verlötet werde kann. Dabei können die Anschlußfahnen 16 ggf. zur Verbindung von Leiterbahnen zweier Leiterplatten 1 an den beiden gegenüberliegenden Enden des Trägers 2 dienen. Es ist aber auch denkbar, daß jeder Leiterplatte 1 ihre eigenen Kontakt stecker zugeordnet sind. Auch die verbleibenden Kanten des Trägers lassen sich sinngemäß zum Anschluß weiterer Leiterplatten ausnutzen. Aus dem oben gesagten ergibt sich aber, daß im Rahmen der Erfindung mehrere Leiterplatten mit den sich längs der Oberfläche erstreckenden Anschlußfahnen 16 verbunden sein können, wobei auf jeder der Anschlußfahnen mehrere Leiterplatten mit ihrem zugehörigen Schlitz 4 bis 7 aufsitzen können.In theory, it is also possible to apply the invention to the edge 41 opposite the front edge 19, so that a second circuit board on the carrier can be soldered to the carrier by means of a second soldering process. In this case, the connecting lugs 16 can optionally be used to connect conductor tracks of two printed circuit boards 1 at the two opposite ends of the carrier 2. But it is also conceivable that each circuit board 1 has its own contact connectors are assigned. The remaining edges of the carrier can also be used for connecting additional circuit boards. However, it follows from the above that, in the context of the invention, a plurality of printed circuit boards can be connected to the terminal lugs 16 extending along the surface, it being possible for a plurality of printed circuit boards with their associated slots 4 to 7 to be seated on each of the connecting lugs.

Claims (16)

  1. Electrical connection (1,2,3) including at least one contact plate (3) which reaches through the base plate of a printed circuit board carrier (2) in the form of a plug contact (15), wherein the terminal lug (16) of the contact plate (3) remote from the plug contact (15) is soldered to an associated contact area (8,9,10,11) of a printed circuit board (1) which is arranged in the area of the substantially straight front edge (19) of the carrier (2), wherein both the contact area (8,9,10,11) of the printed circuit board (1) and further solder points (22) lie on the joint soldering surface of the printed circuit board (1),
    characterized in that the contact area (8,9,10,11) of the printed circuit board (1) is freely accessible from the space encompassing the printed circuit board carrier (2) in the direction being vertical to the soldering surface.
  2. Connection as claimed in claim 1,
    characterized in that, on the fringe area associated with the connecting surfaces (16), the printed circuit board (1) includes slots (4-7) which accommodate the associated connecting surfaces (16), wherein in particular the slots (4-7) have a solder rim (8-11) of a conductive solderable material into which the conductive tracks (12) of the printed circuit board (1) terminate.
  3. Connection as claimed in claim 1 or 2,
    characterized in that the slots (4 to 7) are open to the edge of the printed circuit board (1).
  4. Connection as claimed in any one of the preceding claims,
    characterized in that the connecting surfaces (16) are provided by terminal lugs which extend in parallel to the surface (18) of the carrier (2).
  5. Connection as claimed in any one of the preceding claims,
    characterized in that the plug contacts (3) are substantially L-shaped, wherein the first leg (15) of the plug contact (3) forms the guide pin and the second leg (16) forms the terminal lug.
  6. Connection as claimed in any one of the preceding claims,
    characterized in that the guide pin (15) is inserted into and locked with the cast carrier (2).
  7. Connection as claimed in any one of the preceding claims,
    characterized in that a retaining device (25,26; 28,29; 28,32,33) is provided on the carrier to serve as a mechanical mounting support of the printed circuit board (1) on the carrier (2).
  8. Connection as claimed in claim 7,
    characterized in that the retaining device includes at least one tappet (29) which projects from the surface (18) of the carrier to limit the movement of the printed circuit board (1) in parallel to the surface (18) of the carrier at least in one direction.
  9. Connection as claimed in any one of claims 7 or 8,
    characterized in that the carrier includes a latch (27) which engages a corresponding opening (30) in the printed circuit board (1) and prevents a board movement directed vertically relative to the surface (18) of the carrier (2).
  10. Connection as claimed in claim 9,
    characterized in that the latch (27) is spaced from the tappet (29) and prevents the printed circuit board from moving away from the tappet (29) in parallel to the surface (18) of the carrier (2).
  11. Connection as claimed in any one of the preceding claims,
    characterized in that two tappets (32, 33) include grooves (34, 35) and have their openings face each other, the grooves (34, 35) serving as support bars for the lateral edges of the printed circuit board (1).
  12. Connection as claimed in any one of the preceding claims,
    characterized in that the terminal lugs (16) pertaining to one carrier have different lengthes.
  13. Connection as claimed in any one of claims 2 to 12,
    characterized in that the solder rim (8-11) of the slots (4-7) is fabricated in the same process as the conductive tracks (12) of the printed circuit board (1).
  14. Connection as claimed in any one of the preceding claims,
    characterized in that the solder points (22) of the electric structural elements (21) mounted on the printed circuit board (1) are placed on the board surface facing the front edge (1) of the carrier, and in that the structural elements (21) and the terminal lugs (16) are soldered to the conductive tracks (12) in one operation.
  15. Method of assembly of a printed circuit board carrier (2) as claimed in claim 14,
    characterized in that the printed circuit board carrier (2) is equipped with the printed circuit board (1) and the contact plate (3) and, subsequently, the terminal lug (16) is soldered to the contact area (8,9,10,11) and the solder points (22) in one operation.
  16. Method as claimed in claim 15,
    characterized in that during equipment of the printed circuit board carrier (3), the printed circuit board (1) is mechanically fixed to the printed circuit board carrier (3).
EP93113661A 1992-08-27 1993-08-26 Plug connector with soldered circuit board Expired - Lifetime EP0585816B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE4228491 1992-08-27
DE4228491 1992-08-27
DE4328426A DE4328426A1 (en) 1992-08-27 1993-08-24 Plug-in base with soldered circuit board
DE4328426 1993-08-24

Publications (2)

Publication Number Publication Date
EP0585816A1 EP0585816A1 (en) 1994-03-09
EP0585816B1 true EP0585816B1 (en) 1997-01-15

Family

ID=25917939

Family Applications (1)

Application Number Title Priority Date Filing Date
EP93113661A Expired - Lifetime EP0585816B1 (en) 1992-08-27 1993-08-26 Plug connector with soldered circuit board

Country Status (3)

Country Link
EP (1) EP0585816B1 (en)
DE (2) DE4328426A1 (en)
ES (1) ES2101181T3 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59712744D1 (en) * 1996-12-13 2006-11-23 Fuba Automotive Gmbh Line connector
DE19651800B4 (en) * 1996-12-13 2009-04-09 Delphi Delco Electronics Europe Gmbh Line connector
DE29808048U1 (en) 1998-05-05 1998-08-13 Festo Ag & Co Connecting device
DE10304542A1 (en) * 2003-02-04 2004-08-12 Taller Automotive Gmbh Leadframe assembly
DE102010044207A1 (en) * 2010-11-22 2012-05-24 Tyco Electronics Amp Gmbh Electrical contact pin arrangement for attaching electric connector, has contact pin electrically connected to electrical contact of carrier, where hole is formed in form of slot and laterally opened to edge of carrier

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Publication number Priority date Publication date Assignee Title
US2946033A (en) * 1956-05-15 1960-07-19 Bell Telephone Labor Inc Polarized connector for printed circuit cards
US2962692A (en) * 1957-05-02 1960-11-29 North American Aviation Inc Electric contact terminal
DE1139902B (en) * 1959-12-15 1962-11-22 Licentia Gmbh Plug or solder connections for printed circuit boards
US3200360A (en) * 1962-06-20 1965-08-10 United Carr Inc Contact-camming printed circuit board
DE1257235B (en) * 1965-02-23 1967-12-28 Buchungsmaschinenwerk Veb Assembly with printed circuit boards arranged in several levels
DE1665337A1 (en) * 1966-09-20 1971-03-18 Pilz Kg Apparatebau Isolierstoffgeraetegehaeuse for electrical and electronic switching elements, switching units and the like.
DE7215109U (en) * 1972-04-20 1972-07-13 Bbc Ag Device with plug-in printed circuit boards
US4129351A (en) * 1974-06-20 1978-12-12 Matsushita Electric Industrial Company, Limited Connector assembly for printed circuit board
DE8717004U1 (en) * 1987-12-24 1988-02-25 Harting Elektronik Gmbh, 4992 Espelkamp, De
CA1306025C (en) * 1988-02-15 1992-08-04 John C. Collier Terminating insulated conductors
JPH01319278A (en) * 1988-05-17 1989-12-25 Thomas & Betts Corp <T&B> Surface mount connector
US4938701A (en) * 1988-09-23 1990-07-03 Hayes Microcomputer Products, Inc. Connecting bracket for modular circuit boards
US5110298A (en) * 1990-07-26 1992-05-05 Motorola, Inc. Solderless interconnect
US5064381A (en) * 1991-03-04 1991-11-12 Lin Yu Chuan Electric connecting device
DE9103960U1 (en) * 1991-04-02 1991-06-27 Amp Inc., Harrisburg, Pa., Us

Also Published As

Publication number Publication date
EP0585816A1 (en) 1994-03-09
DE59305124D1 (en) 1997-02-27
DE4328426A1 (en) 1994-03-03
ES2101181T3 (en) 1997-07-01

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