EP0572701A1 - Empfangsvorrichtung - Google Patents

Empfangsvorrichtung Download PDF

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Publication number
EP0572701A1
EP0572701A1 EP92109486A EP92109486A EP0572701A1 EP 0572701 A1 EP0572701 A1 EP 0572701A1 EP 92109486 A EP92109486 A EP 92109486A EP 92109486 A EP92109486 A EP 92109486A EP 0572701 A1 EP0572701 A1 EP 0572701A1
Authority
EP
European Patent Office
Prior art keywords
antenna
receiver device
low
receiving circuit
receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP92109486A
Other languages
English (en)
French (fr)
Inventor
Nobuo C/O Yokohama Works Of Sumitomo Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CA002070204A priority Critical patent/CA2070204A1/en
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to EP92109486A priority patent/EP0572701A1/de
Publication of EP0572701A1 publication Critical patent/EP0572701A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H01Q21/0093—Monolithic arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/247—Supports; Mounting means by structural association with other equipment or articles with receiving set with frequency mixer, e.g. for direct satellite reception or Doppler radar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • This invention relates to a plane antenna for receiving microwave signals from communications satellites or broadcasting satellites.
  • MMIC microwave monolithic integrated circuits
  • a plane antenna is being put in practical use as an antenna for receiving microwave signals from communication satellites or broadcasting satellites.
  • the plane antenna is made up of a number of antenna elements which are arranged in a plane, and conductors to combine signal powers received by those antenna elements.
  • a microwave receiving plane antenna was much inferior to a parabolic antenna both in performance and cost; however, it is now sufficiently practical in use owing to the research on a microstrip antenna which has been made since the latter half of 1970, and to improvement of a microwave printed circuit board.
  • an object of this invention is to eliminate the above-described difficulties accompanying a conventional signal receiver.
  • the foregoing object of the invention has been achieved by the provision of a signal receiver in which a plane antenna comprising at least one antenna element, and a receiving circuit connected to the plane antenna are formed on one and the same semi-insulating compound semiconductor substrate.
  • the plane antenna and the receiving circuit 3 are formed on one and the same semi-insulating compound semiconductor substrate. Therefore, the antenna and the receiving circuit can be connected with the microstrip line, and the resultant signal receiver is reduced both in size and in weight. Furthermore, the plane antenna, the receiving circuit, and the microstrip line can be integrated by ordinary IC manufacturing process.
  • FIG. 1 is a plan view showing the arrangement of an example of a signal receiver which constitutes a first embodiment of this invention.
  • FIG. 2 is a plan view showing the arrangement of another example of the signal receiver, which constitutes a second embodiment of the invention.
  • FIG. 3 is a plan view showing the arrangement of another example of the signal receiver, which constitutes a third embodiment of the invention.
  • FIG. 1 is a plan view showing a first embodiment of this invention.
  • a plane antenna section 2 and a receiving circuit section 3 are provided on a semi-insulating compound semiconductor substrate (a GaAs substrate in this case) on the surface of which a semiconductor layer has been formed by epitaxial growth. Those sections 2 and 3 are electrically connected to each other.
  • the plane antenna section 2 is made up of four antenna elements 4. Each of the antenna elements 4 is a conventional microstrip patch antenna of two-point feed type. The feeders of the four antenna elements 4 are commonly connected to the receiving circuit section 3.
  • the receiving circuit section 3 is a low-noise amplifier which is formed by integrating MESFETs which are formed by using the epitaxial growth semiconductor layer on the semiconductor substrate. That is, a plurality of antennas and a receiving circuit are formed on one and the same substrate. Hence, the resultant signal receiver is small in size and light in weight, and can therefore be handled with ease.
  • the receiving circuit section 3 is the low-noise amplifier as was described above.
  • a frequency converter circuit for down-converting the frequency of the output signal thereof, and a circuit for amplifying the output signal of the frequency converter circuit may be integrated on the substrate.
  • the receiving circuit section 3 means for electronically tracking a communications satellite or broadcasting satellite to receive microwave signals therefrom, namely, a phase shifter circuit for shifting the phase of a microwave signal received.
  • the patch antenna are employed as the antenna elements 4; however, they may be replaced with other printed antennas such as line antennas and spiral antennas.
  • FIG. 2 is a plan view showing a second embodiment of the invention.
  • the second embodiment has more antenna elements 4 than the above-described first embodiment. That is, the number of antenna elements 4 can be increased as much as permitted by the area of the substrate.
  • FIG. 3 is a plan view showing a third embodiment of the invention.
  • a plurality of antenna element arrays 11 (four antenna element arrays in this case) are arranged on a semiconductor substrate 10.
  • Each of the antenna element arrays 11 comprises four antenna elements 4.
  • the antenna element arrays 11 are connected to low-noise amplifiers 12, respectively.
  • the output terminals of the low-noise amplifiers 12 are commonly connected to a microstrip line 13.
  • the low-noise amplifiers 12 are provided for the antenna element arrays 11, respectively, and therefore the noise factor is greatly improved.
  • all the antenna element arrays 11, and all the low-noise amplifiers 12 are monolithically integrated on one semi-insulating compound semiconductor substrate 10.
  • a signal receiver equivalent in arrangement to the above-described one may be formed by hybrid integration as follows: One antenna element array 11 and one low-noise amplifier 12 are monolithically formed on one semi-insulating compound semiconductor substrate, to form a signal receiver unit. A plurality of the signal receivers units thus formed are mounted on a substrate such as a foamed polyethylene substrate which is suitable for a plane antenna and low in dielectric constant and small in tan ⁇ , and the output terminals of the low-noise amplifiers 12 are commonly connected to a microstrip line.
  • each of those signal receivers may be used as a primary horn for a parabolic antenna.
  • the plane antennas and the receiver circuits are formed on one and the same semi-insulating compound semiconductor substrate, and therefore they can be connected with the microstrip lines. Therefore, the resultant signal receiver is smaller both in weight and in size. Furthermore, since the plane antennas, the receiving circuits, and the microstrip lines can be integrated by ordinary IC manufacturing process, the receiver device of the invention is considerably low in manufacturing cost.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
EP92109486A 1992-06-02 1992-06-04 Empfangsvorrichtung Withdrawn EP0572701A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CA002070204A CA2070204A1 (en) 1992-06-02 1992-06-02 Receiver device
EP92109486A EP0572701A1 (de) 1992-06-02 1992-06-04 Empfangsvorrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA002070204A CA2070204A1 (en) 1992-06-02 1992-06-02 Receiver device
EP92109486A EP0572701A1 (de) 1992-06-02 1992-06-04 Empfangsvorrichtung

Publications (1)

Publication Number Publication Date
EP0572701A1 true EP0572701A1 (de) 1993-12-08

Family

ID=25675176

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92109486A Withdrawn EP0572701A1 (de) 1992-06-02 1992-06-04 Empfangsvorrichtung

Country Status (2)

Country Link
EP (1) EP0572701A1 (de)
CA (1) CA2070204A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4431071A1 (de) * 1994-09-01 1996-03-07 Daimler Benz Ag Resonatoranordnung
EP1069644A2 (de) * 1999-07-16 2001-01-17 Mitsubishi Materials Corporation Antennenanordnung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE32369E (en) * 1980-11-17 1987-03-10 Ball Corporation Monolithic microwave integrated circuit with integral array antenna
EP0346125A2 (de) * 1988-06-08 1989-12-13 Nec Corporation Integrierte Mikrowellenvorrichtung für einen Rundfunksatellitenempfänger

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE32369E (en) * 1980-11-17 1987-03-10 Ball Corporation Monolithic microwave integrated circuit with integral array antenna
EP0346125A2 (de) * 1988-06-08 1989-12-13 Nec Corporation Integrierte Mikrowellenvorrichtung für einen Rundfunksatellitenempfänger

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 278 (E-941)15 June 1990 & JP-A-02 087703 ( NEC CORP. ) 28 March 1990 *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 459 (E-1136)21 November 1991 & JP-A-03 196705 ( HITACHI LTD. ) 28 August 1991 *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 188 (E-1198)7 May 1992 & JP-A-04 025046 ( NEC CORP. ) 28 January 1992 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4431071A1 (de) * 1994-09-01 1996-03-07 Daimler Benz Ag Resonatoranordnung
DE4431071C2 (de) * 1994-09-01 2002-04-18 Daimler Chrysler Ag Resonatoranordnung
EP1069644A2 (de) * 1999-07-16 2001-01-17 Mitsubishi Materials Corporation Antennenanordnung
EP1069644A3 (de) * 1999-07-16 2002-05-02 Mitsubishi Materials Corporation Antennenanordnung
US6531983B1 (en) 1999-07-16 2003-03-11 Mitsubishi Materials Corporation Method for antenna assembly and an antenna assembly with a conductive film formed on convex portions
KR100702089B1 (ko) * 1999-07-16 2007-04-02 미츠비시 마테리알 가부시키가이샤 안테나 구조체

Also Published As

Publication number Publication date
CA2070204A1 (en) 1993-12-03

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