EP0500367A2 - Spulenanordnung und statische Messvorrichtung - Google Patents

Spulenanordnung und statische Messvorrichtung Download PDF

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Publication number
EP0500367A2
EP0500367A2 EP92301401A EP92301401A EP0500367A2 EP 0500367 A2 EP0500367 A2 EP 0500367A2 EP 92301401 A EP92301401 A EP 92301401A EP 92301401 A EP92301401 A EP 92301401A EP 0500367 A2 EP0500367 A2 EP 0500367A2
Authority
EP
European Patent Office
Prior art keywords
coil arrangement
token
inductor
superposed
inductive coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP92301401A
Other languages
English (en)
French (fr)
Other versions
EP0500367A3 (en
Inventor
Omar Farouk Variawa
Edward Shane Simmonds
Jacobus Theron Botha
Edgar Herbert Chinneck
Piotr Leonard Kowalczyk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TELKOR Pty Ltd
Original Assignee
TELKOR Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TELKOR Pty Ltd filed Critical TELKOR Pty Ltd
Publication of EP0500367A2 publication Critical patent/EP0500367A2/de
Publication of EP0500367A3 publication Critical patent/EP0500367A3/en
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D5/00—Testing specially adapted to determine the identity or genuineness of coins, e.g. for segregating coins which are unacceptable or alien to a currency
    • G07D5/08—Testing the magnetic or electric properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

Definitions

  • This invention relates to a coil arrangement, as well as to a static measuring device employing such an arrangement.
  • an inductive coil arrangement for measuring at least one physical characteristic of an object, the coil arrangement comprising at least one inductor formed out of at lest two superposed planar spiral tracks separated by an insulating layer of a multilayer electrical device and having a conductive path extending between the tracks.
  • the inductive coil arrangement comprises a plurality of superposed inductors, each inductor being arranged to measure different physical characteristics of an object.
  • Each spiral track is conveniently etched from a conductive layer on one face of an insulating substrate wafer, and each inductor preferably comprises a plurality of alternating insulating substrate wafers and the spiral tracks laminated together.
  • the conductive path between the tracks may extend through the insulating layer from a centre terminal of one track to the centre terminal of the superposed track.
  • the conductive path may also extend through the insulating layer from an outer peripheral terminal of one spiral track to an outer peripheral terminal of the superposed spiral track.
  • the inductive coil arrangement comprises first, second and third superposed inductors forming part of a token validation apparatus, the first inductor being arranged to measure the core resistivity of a tocken, the second inductor being arranged to measure the surface resistivity of the token, and the third inductor being arranged to measure the size of the token.
  • the invention extends to a method of manufacturing an inductive coil arrangement comprising the steps of:
  • the step of forming the conductive paths includes the steps of providing conductive terminals at the ends of each spiral track, aligning the conductive terminals, forming holes through successive conductive terminals, and filling the holes a conductive material.
  • a token validation device for statically measuring one or more physical characteristics of a token comprising a coil arrangement having at least two superposed planar spiral tracks which are separated by an insulating layer of a multi-layer electrical device, a signal generator for generating a signal having a predetermined magnitude and frequency for receipt by the inductor, and signal processing means for receiving from the inductor a signal representative of the physical characteristics of the token.
  • the token validation device includes comparator means for comparing the signal processed by the signal processing means with a reference signal, for assessing the validity of the token being measured.
  • the token validation device includes at least two superposed inductors, and sequential switching means for selectively energising the inductors one at a time, for static measurement of at least two physical characteristics of the token.
  • the token validation device preferably comprises three superposed inductors arranged to measure sequentially the respective core resistivity, the surface resistivity and the size of the token.
  • the invention includes a token validation device which is fitted with a coil arrangement of the type described above.
  • a coin validator circuit 10 has first, second and third respective measuring inductors, or coils 12, 14 and 16 having respective inductances of 15wH, 5f..lH and 85wH.
  • the inductors 12,14 and 16 together constitute an inductive coil arrangement 18 formed on a series of multi-layer printed circuit boards, details of which will be described further on in the specification.
  • the first, second and third inductors 12, 14 and 16 form part of respective LC oscillators 20, 22 and 24.
  • the oscillator 20, which includes the first coil 12 and an appropriately sized separate capacitor 20A, operates at a resonant frequency of approximately 100kHz, and energises the first coil at this frequency in order to measure the core resistivity of a coin 26 which is held in a stationary position adjacent the inductive coil arrangement 18 by means of a coin validator mechanism.
  • a RAM or EEPROM memory module 30 is linked to the central processing unit 28, and stored within it is data relating to the physical characteristics of various standard coin types and configurations.
  • the three LC oscillators 20,22 and 24 are activated sequentially for coin data measurements.
  • the first oscillator 20 is activated first, and energises the first coil 14.
  • the core resistivity of the coin 26 causes the peak-to-peak signal level from the first oscillator to drop.
  • the attenuated signal from the coil 12 is rectified and smoothed by means of a rectifier 32, and is subsequently digitised by means of an A/D converter 34 for reception at the CPU 28.
  • the second oscillator 22 is enabled to measure the coin plating resistivity.
  • the second coil 14 is energised, and the resulting signal is smoothed and rectified by the rectifier 32, is digitised at the A/D converter 34, and is subsequently received by the CPU 28.
  • the second oscillator is turned off and the third oscillator 24 then energises the coil 16 for measuring the size of the coin 26 on the basis of the coin 26 causing a change of inductance in the coil 16, thereby altering the frequency of the oscillator 24.
  • the return frequency is measured by means of a counter 36 which is enabled for a predetermined period.
  • the CPU in turn reads a digital value from the counter 36.
  • the three digital values are compared with corresponding digital values representative of valid coin types, which have been stored in the RAM or EEPROM memory module 30. If the stored and measured values correspond, this indicates that the coin 26 is valid and a signal from the CPU energises a mechanical gate or other steering means for accepting the coin 26. On the other hand, if the various values do not coincide, then a rejection signal is transmitted to the coin validation apparatus, causing the coin 26 to be rejected.
  • the entire token validation measuring process takes approximately 150ms.
  • the first inductor 12 is formed from four superposed printed circuit boards 72 to 78, comprising respective insulating substrate wafers 72A to 78A carrying respective spiral tracks 38, 46, 52 and 58 which are etched from conductive copper carried on the upper surfaces of the substrate wafers 72A to 78A.
  • the top spiral track 38 of the first inductor 12 has an output which is linked to an output terminal 40.
  • the top spiral track 38 spirals inwardly to a centre terminal 42 from where it is plated through to a centre terminal 44 provided in the following spiral track 46 on the wafer 74A.
  • the spiral track 46 whorls outwardly in a clockwise direction, and terminates at an outer peripheral terminal 48 which is plated through to a corresponding terminal 50 in the following spiral track 52.
  • the spiral track 52 whorls inwardly to a centre point 54, from where it in turn passes to a corresponding centre point in the next spiral track 58, which spirals outwardly and terminates at an output terminal 60.
  • a single extremely compact inductive coil arrangement may be provided, having a number of measuring inductors with a relatively high inductance.
  • the second inductor 14 in the inductive coil arrangement is illustrated schematically in Figure 5, and comprises a pair of overlapping spiral tracks 61 and 61A carried on respective substrate wafers 80A and 82A.
  • the next two printed circuit boards 84 and 86 form the third coil 16, which comprises two spiral tracks, which are illustrated in respective Figures 3 and 4.
  • the spiral track 62 illustrated in Figure 3 has an input terminal 64 which spirals inwardly towards a centre terminal 66.
  • the centre terminal 66 is plated through to a corresponding centre terminal 68 in the spiral track 70.
  • FIG. 5 an exploded perspective view illustrating the manner in which the coil arrangement is assembled is shown.
  • Eight separate printed circuit boards 72 to 86 are provided for forming the three aforementioned inductors 12, 14 and 16.
  • Each printed circuit board 72 to 86 has a respective insulating substrate wafer 72A to 86A with a conductive copper cladding on its upper face.
  • Each of the eight spiral tracks are printed onto the copper cladding using an etchant resistant material, and the unprinted areas are removed by a photosensitive or other etchant.
  • the eight suitably prepared printed circuit boards 72 to 86 are then arranged in the correct sequence, together with an uncladded insulating end wafer 88, are aligned, and are laminated or bonded together to form a multi-layer device. Holes, such as those illustrated at 90 in Figure 2D, are then drilled through the multi-layer device at the various terminals, and a conductive solder is injected through the holes so as to provide the appropriate conductive paths, such as the paths extending between the centre terminals 42 and 44, between the outer peripheral terminals 48 and 50 and between the centre terminals and 54 and 56.
  • the end wafer 88 ensures that the spiral tracks remain unaffected while through-plating is taking place.
  • the internal connections between the spiral tracks are illustrated schematically at 92 in Figure 5. Blind or buried vias may be used in place of holes and solder in order to effect connections between adjacent spiral tracks.
  • the inductive coil arrangement 18 may take a variety of forms. Several single-layer inductors may be etched out of successive conductive layers of a multi-layer printed circuit board. Alternatively, a single coil may comprise three or more overlapping spiral tracks of three or more single printed circuit boards which have been sandwiched together. In the specific embodiment described above, the eight double layered printed circuit boards 72 to 86 may be replaced by four triple layered pcb's having conductive layers on opposite faces of the wafer substrate. Spiral tracks are etched onto the conductive layers, and the four pcb's are then sandwiched between five insulating wafers. Any other multi-layer electrical device, in which conductive and insulating layers alternate, may be utilised.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coils Or Transformers For Communication (AREA)
EP19920301401 1991-02-20 1992-02-20 Coil arrangement and static measuring device Withdrawn EP0500367A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ZA911248 1991-02-20
ZA911248 1991-02-20

Publications (2)

Publication Number Publication Date
EP0500367A2 true EP0500367A2 (de) 1992-08-26
EP0500367A3 EP0500367A3 (en) 1993-07-21

Family

ID=25580544

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19920301401 Withdrawn EP0500367A3 (en) 1991-02-20 1992-02-20 Coil arrangement and static measuring device

Country Status (1)

Country Link
EP (1) EP0500367A3 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411126A (en) * 1992-06-03 1995-05-02 Landis & Gyr Business Support Ag Coin detector
GB2321787A (en) * 1997-01-31 1998-08-05 Nokia Mobile Phones Ltd Multiple layer printed circuit board inductive arrangement
WO1999044012A1 (en) * 1998-02-26 1999-09-02 Valmet Automation Inc. Method and apparatus for measuring caliper of moving web
US6536578B1 (en) 1998-11-02 2003-03-25 Coin Controls Limited Sensor for coin acceptor
EP1443472A1 (de) * 2003-01-21 2004-08-04 International Currency Technologies Corporation Münzsensor für Münzprüfer
WO2009138089A1 (en) * 2008-05-13 2009-11-19 Aalborg Universitet Inductive input device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4441602A (en) * 1981-12-02 1984-04-10 Joseph Ostroski Electronic coin verification mechanism
WO1986000410A1 (en) * 1984-06-27 1986-01-16 Digital Products Corporation Methods and apparatus employing spontaneous resonance
US4742903A (en) * 1985-07-26 1988-05-10 Autelca Ag. Device for coin checking

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4441602A (en) * 1981-12-02 1984-04-10 Joseph Ostroski Electronic coin verification mechanism
WO1986000410A1 (en) * 1984-06-27 1986-01-16 Digital Products Corporation Methods and apparatus employing spontaneous resonance
US4742903A (en) * 1985-07-26 1988-05-10 Autelca Ag. Device for coin checking

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411126A (en) * 1992-06-03 1995-05-02 Landis & Gyr Business Support Ag Coin detector
GB2321787A (en) * 1997-01-31 1998-08-05 Nokia Mobile Phones Ltd Multiple layer printed circuit board inductive arrangement
WO1999044012A1 (en) * 1998-02-26 1999-09-02 Valmet Automation Inc. Method and apparatus for measuring caliper of moving web
US6536578B1 (en) 1998-11-02 2003-03-25 Coin Controls Limited Sensor for coin acceptor
EP1443472A1 (de) * 2003-01-21 2004-08-04 International Currency Technologies Corporation Münzsensor für Münzprüfer
US6892873B2 (en) * 2003-01-21 2005-05-17 International Currency Technologies Corporation Coin detector for use in a coin acceptor
WO2009138089A1 (en) * 2008-05-13 2009-11-19 Aalborg Universitet Inductive input device

Also Published As

Publication number Publication date
EP0500367A3 (en) 1993-07-21

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