EP0413567B1 - Semiconductor lasers - Google Patents
Semiconductor lasers Download PDFInfo
- Publication number
- EP0413567B1 EP0413567B1 EP90308948A EP90308948A EP0413567B1 EP 0413567 B1 EP0413567 B1 EP 0413567B1 EP 90308948 A EP90308948 A EP 90308948A EP 90308948 A EP90308948 A EP 90308948A EP 0413567 B1 EP0413567 B1 EP 0413567B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- strip
- semiconductor layer
- layer
- semiconductor
- mesa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/065—Mode locking; Mode suppression; Mode selection ; Self pulsating
- H01S5/0658—Self-pulsating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1053—Comprising an active region having a varying composition or cross-section in a specific direction
- H01S5/1064—Comprising an active region having a varying composition or cross-section in a specific direction varying width along the optical axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
Definitions
- This invention relates to semiconductor lasers.
- Semiconductor lasers have been widely employed as light sources for the optical read/write operation with recording media like optical discs and magneto-optic discs.
- recording information on or reading information from an optical recording medium such as an optical disc or a magneto-optic disc
- a semiconductor laser an inevitable small quantity of reflected light returned from the optical recording medium or the optical system produces reflected light noise, due to interference with the laser beam, and this may cause significant problems.
- Such problems attributable to reflected light noise may be solved by employing a multimode semiconductor laser or a pulsation semiconductor laser, or by the fast modulation of the semiconductor laser.
- a gain guide semiconductor laser incorporating a gain waveguide is capable of multimode oscillation.
- the threshold current I th of the gain guide semiconductor laser is very high, and such a very high threshold current I th is an impediment to increasing the output of the semiconductor laser for satisfactory operation in writing signals in and reading recorded signals from a magneto-optic recording medium or an optical disc by using the semiconductor laser as a light source.
- the fast modulation of the semiconductor laser requires a circuit of a complicated configuration.
- the use of a self-pulsation (self-oscillation) laser is desirable to reduce the reflected light noise.
- the pulsation of the self-pulsation laser can be achieved by a first means that employs an intermediate construction between an index guide and a gain guide, a second means that employs a saturable (supersaturation) absorber or a third means that increases light expansion beyond current expansion.
- the first and second means encounter problems in controlling the pulsation, and increase the threshold current I th .
- the semiconductor laser is formed by sequentially forming a first conduction type, for example, n type, AlGaAs cladding layer 3, a low-impurity or undoped GaAs active layer 4, a first, second conduction type, for example p type, AlGaAs current layer 5, a first conduction type, for example n type, AlGaAs current blocking cladding layer 6, and a second, second conduction type cap layer 8, on the major surface la of a substrate 1, such as a GaAs compound semiconductor substrate, having a crystal face (100) and provided with a strip mesa 2 extending along the ⁇ 011> crystallographic axis by a metal organic chemical vapour deposition (MOCVD) process.
- MOCVD metal organic chemical vapour deposition
- a first electrode 9 and a second electrode 10 are formed respectively over the cap layer 8 and the rear of the substrate 1 in ohmic contact.
- the n type cladding layer 3, the first p type cladding layer 5, the second p type cladding 7 and the n type current blocking layer 6 are formed of materials having a large band-gap, that is, a small refractive index, as compared with that of a material forming the active layer 4.
- portions of the lower layers formed over the strip mesa 2 are superimposed in a laminated structure having a triangular cross section, because, once the (111)B crystal face is formed by epitaxial growth on the strip mesa 2, the epitaxial growth rate of crystals on the (111)B crystal face drops below a few tenths of the epitaxial growth rate of crystals on other crystal faces, for example the (100) crystal face, the epitaxial growth of crystals on the (111)B crystal face barely continues and the (111)B crystal face forms a fault or break in continuity which results in divided regions as shown.
- the shape and size of the strip mesa 2 are determined selectively to form a strip of the active layer 4 between the cladding layers 3 and 5 formed on the strip mesa 2 between inclined side surfaces 11 of the (111)B crystal face inclined at about 55°, so that the strip of the active layer 4 is separated from other portions of the active layer 4, and the current blocking layer 6 is formed contiguously with the side surfaces 11, in mesa grooves 12.
- a semiconductor laser having a low threshold current I th can be fabricated by a single cycle of a continuous epitaxial growth process.
- the semiconductor laser thus formed by the aluminium mixed crystals grown by epitaxial growth using the MOCVD process has problems that depressions or irregularities are formed at some position in a portion of the electrode 9 corresponding to the strip mesa 2 and that the laser beam does not oscillate, the oscillating efficiency is low and the characteristic is unstable when such depressions or irregularities are formed in the electrode 9.
- the epitaxial growth rate increases sharply with increase in the aluminium content of the aluminium mixed crystals.
- an aluminium oxide is deposited across the strip of the epitaxial semiconductor layer formed separately from other portions of the same epitaxial semiconductor layer on the strip mesa 2 forming depressions or irregularities in the electrode 9 and impeding current concentration on the active layer 4 or intercepting current. Such depressions or irregularities make the semiconductor laser unacceptable and cause problems such as the deterioration or fluctuation of the characteristics.
- a self-pulsating semiconductor laser comprising: a semiconductor substrate provided in its major surface with a strip mesa of a desired width having an expanded portion; and a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer serving as a light absorbing layer; wherein: breaks in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa; the second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer forms a strip active layer between the breaks in a portion of the laminated structure extending on the strip mesa; the fourth semiconductor layer of the laminated structure is split by the breaks so that the fourth semiconductor layer is not included in a portion of the laminated structure corresponding to a portion of the desired width of the
- a self-pulsating semiconductor laser comprising: a semiconductor substrate provided in its major surface with a strip mesa of a desired width having a contracted portion; and a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer serving as a first conduction type current blocking layer; wherein: breaks in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa; the second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer forms a strip active layer between the breaks in a portion of the laminated structure extending on the strip mesa; the fourth semiconductor layer is split by the breaks so that the fourth semiconductor layer is not included in a portion of the laminated structure corresponding to a portion of the desired width of the
- a self-pulsating semiconductor laser comprising: a semiconductor substrate provided in its major surface with a strip mesa of a desired width having an expanded portion; and a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer serving as a first conduction type current blocking layer; wherein: breaks in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa; the second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer forms a strip active layer between the breaks in a portion of the laminated structure extending on the strip mesa; the fourth semiconductor layer is split by the breaks so that the edges of portions of the fourth semiconductor layer are contiguous with the side edges or the vicinities of the side edges of the
- a self-pulsating semiconductor laser comprising: a semiconductor substrate provided in its major surface with a strip mesa and auxiliary strip mesa having a height lower than that of the strip mesa and extended respectively on the opposite sides of a portion of the strip mesa; and a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer serving as a light absorbing or current blocking layer; wherein: breaks in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa; the second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer forms a strip active layer between the breaks in a portion of the laminated structure extending on the strip mesa; the fourth semiconductor layer is split by the breaks so that the
- a semiconductor laser in accordance with the present invention is fabricated by the epitaxial deposition of at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer, on the major surface of a semiconductor substrate having a strip mesa in the major surface by utilizing the crystallographic principle and the characteristics of steps formed by the strip mesa so that breaks in continuity are formed in a laminated structures of the semiconductor layers so as to extend along the direction of extension of the opposite, longitudinal side surfaces of the strip mesa.
- the second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer between the breaks in a portion of the laminated structure extending on the strip mesa forms a strip active layer.
- a portion of the strip mesa is expanded widthwise to form an expanded portion, and the fourth semiconductor layer is used as a light absorbing layer.
- the fourth semiconductor layer is split by the breaks in continuity so that a portion of the fourth semiconductor layer in the epitaxial layers corresponding to a portion of the strip mesa having a desired width is omitted and the fourth semiconductor layer, that is, the light absorbing layer is formed on the active layer on the opposite sides of the epitaxial layers on the expanded portion of the strip mesa to form a local, low-excitation region, namely, a saturable or supersaturating absorbing portion, for pulsation, that is, self-oscillation.
- a portion of the strip mesa is contracted widthwise to form a contracted portion and the fourth semiconductor layer is used as a current blocking layer.
- the fourth semiconductor layer is split by the breaks in continuity so that a portion of the fourth semiconductor layer formed on the active layer corresponding to a portion of the strip mesa having a desired width is omitted and the fourth semiconductor layer serving as a current blocking layer is formed across the epitaxial layers on the contracted portion of the strip mesa to form a portion which barely allows carrier injection into the active layer, that is, a saturable or supersaturating absorbing portion, for pulsation.
- a portion of the strip mesa is expanded to form an expanded portion, and the fourth semiconductor layer is split by the breaks in continuity so that the edges of the split fourth semiconductor layer are contiguous with the opposite end surfaces of a portion of the active layer on the strip mesa, a portion of the fourth semiconductor layer corresponding to a portion of the strip mesa having a desired width is omitted and a portion of the fourth semiconductor layer serving as a current blocking layer is formed on the third semiconductor layer formed on the active layer in the epitaxial layers on the expanded portion of the strip mesa to form a saturable or supersaturating portion for pulsation, that is, self-oscillation.
- auxiliary ridges having a height smaller than the strip mesa are formed on the opposite sides of a portion of the strip mesa and the fourth semiconductor layer is used as a light absorbing or current blocking layer.
- the fourth semiconductor layer is split by the breaks in continuity so that a portion of the fourth semiconductor layer in the layers formed by epitaxial growth on a portion of the strip mesa having a desired width is omitted and portions of the fourth semiconductor layer extending from portions of the epitaxial layers corresponding to the auxiliary ridges over a portion of the epitaxial layers between the auxiliary ridges are formed opposite to each other on the active layer to form a saturable or supersaturating portion for pulsation by forming a local area for suppressing carrier injection into the light absorbing or active layer.
- the first embodiment of semiconductor laser employs a semiconductor substrate 2 provided with a strip mesa 1 of a desired width W1 having an expanded portion 1a of a width W p1 on its major surface.
- Sequentially formed by epitaxial growth on the major surface of the substrate 2 are epitaxial layers including at least a first semiconductor layer 11 (first conduction type cladding layer), a second semiconductor layer 12 (active layer), a third semiconductor layer 13 (second conduction type cladding layer) and a fourth semiconductor layer 14 (first or second conduction type light absorbing layer).
- Faults that is breaks 3 in continuity as shown, are formed in the epitaxial layers along the longitudinal, opposite sides of the strip mesa 1.
- the second semiconductor layer 12 is split by the breaks 3 to form a strip active layer 4
- the fourth semiconductor layer 14 is split by the breaks 3 to omit the fourth semiconductor layer 14 from a laminated structure of the epitaxial layers formed on the expanded portion 1a of the strip mesa 1 as shown in Figure 2, and a portion of the semiconductor layer 14 serving as a strip light absorbing layer 5 is formed over the strip active layer 4.
- the second embodiment of semiconductor laser employs a semiconductor substrate 2 provided with a strip mesa 1 of a desired width W2 having a contracted portion 1b of a width W p2 on its major surface.
- Sequentially formed by epitaxial growth on the major surface of the semiconductor substrate 2 are epitaxial layers including at least a first semiconductor layer 11 (first conduction type cladding layer), a second semiconductor layer 12 (active layer), a third semiconductor layer 13 (second conduction type cladding layer), and a fourth semiconductor layer 14 (first conduction type current blocking layer).
- Faults that is breaks 3 in continuity as shown, are formed in the epitaxial layers along the longitudinal, opposite sides of the strip mesa 1.
- the second semiconductor layer 12 is split by the breaks 3 to form a strip active layer 4, and a portion of the fourth semiconductor layer 14 in the epitaxial layers corresponding to the portion of the desired width W2 of the strip mesa 1 is split so that the fourth semiconductor layer 14 is not formed over the strip active layer 4 in a portion of the laminated structure of the epitaxial layers formed on the portion of the desired width W2 of the strip mesa 1 as shown in Figure 5, and a portion of the second semiconductor layer 14 in a portion of the laminated structure of the epitaxial layers formed on the contracted portion 1b of the strip mesa 1 extend across the contracted portion 1b of the strip mesa 1 to form a current blocking layer 6 over the strip active layer 4 as shown in Figure 6.
- the third embodiment of semiconductor laser employs a semiconductor substrate 2 provided with a strip mesa 1 of a desired width W3 having an expanded portion 1c of a width W p3 on its major surface.
- sequentially formed by epitaxial growth on the major surface of the semiconductor substrate 2 are epitaxial layers including at least a first semiconductor layer 11 (first conduction type cladding layer), a second semiconductor layer 12 (active layer), a third semiconductor layer 13 (second conduction type cladding layer) and a fourth semiconductor layer 14 (first conduction type current blocking layer).
- Faults that is breaks 3 in continuity as shown, are formed in the epitaxial layers along the longitudinal, opposite sides of the strip mesa 1.
- the second semiconductor layer 12 among the epitaxial layers is split by the breaks 3 to form a strip active layer 4
- the fourth semiconductor layer 14 is split by the breaks 3 so that the edges 14a and 14b of the fourth semiconductor layer 14 are contiguous with the opposite side edges 4a and 4b or the vicinities of the opposite side edges 4a and 4b of the strip active layer 4 formed over the strip mesa 1, a portion of the fourth semiconductor layer 14 in a portion of the laminated structure of the epitaxial layers formed on the portion of the desired width W3 of the strip mesa 1 is omitted as shown in Figure 8, and a portion of the fourth semiconductor layer 14 in a portion of the laminated structure of the epitaxial layers formed on the expanded portion 1c of the width W p3 of the strip mesa 1 is formed locally on the third semiconductor layer 13 formed on the strip active layer 4 to form a strip current blocking layer 6 as shown in Figure 9.
- the fourth embodiment of semiconductor laser employs a semiconductor substrate 2 provided in its major surface with a strip mesa of a desired width W4, and auxiliary strip mesas 7a and 7b of a desired height lower than that of the strip mesa 1, extending respectively on the opposite sides of a portion of the strip mesa 1.
- Sequentially formed by epitaxial growth on the major surface of the semiconductor substrate 2 are a first semiconductor layer 11 (first conduction type cladding layer), a second semiconductor layer 12 (active layer), a third semiconductor layer 13 (second conduction type cladding layer) and a fourth semiconductor layer 14 (light absorbing or current blocking layer).
- Faults that is breaks 3 in continuity, are formed in the epitaxial layers along the longitudinal, opposite sides of the strip mesa 1.
- the second semiconductor layer 12 is split by the breaks 3 to form a strip active layer 4 on the strip mesa 1
- the fourth semiconductor layer 14 is split by the breaks 3 so that a portion of the fourth semiconductor layer 14 corresponding to a portion of the strip mesas 7a and 7b to form a current blocking layer 56 over the strip active layer 4 as shown in Figure 12.
- the epitaxial layers are formed by a continuous epitaxial process so that the breaks 3 are formed along the opposite, longitudinal sides of the strip mesa 1 by a MOCVD method disclosed previously in Japanese patent laid-open specification 86/183987, which utilizes the dependence of epitaxial growth rate on the orientation of the crystal face, and the effect of the strip mesa 1.
- the semiconductor laser in the first embodiment has the light absorbing layer strip 5 formed over a portion of the strip active layer 4 included in the epitaxial layers formed on the expanded portion 1a of the strip mesa 1. Accordingly, a local, low-excitation region, namely, a saturable (supersaturation) region, is formed in the strip active layer 4 for pulsation.
- a local, low-excitation region namely, a saturable (supersaturation) region
- the semiconductor laser in the second embodiment has the light blocking layer strip 6 formed over a portion of the strip active layer 4 included in the epitaxial layers formed on the contracted portion 1b of the strip mesa 1. Accordingly, the flow of current through a portion of the strip active layer 4 is intercepted to suppress the injection of carriers into a portion of the strip active layer 4 to form a saturable (supersaturation) absorbing portion in the strip active layer 4 due to the reduction of gain.
- the semiconductor laser in the third embodiment has the current blocking layer 6 formed contiguously with the opposite side edges 4a and 4b of the strip active layer 4, and a portion of the current blocking layer 6 is included in the epitaxial layers formed on the expanded portion 1c of the strip mesa 1. Accordingly , a current flows through restricted gaps in the current blocking layer 6 as indicated by arrows a in the epitaxial layers on the expanded portion 1c of the strip mesa 1 to suppress the injection of carriers in a region for pulsation.
- the semiconductor laser in the fourth embodiment according to the present invention is provided with the auxiliary strip mesas 7a and 7b having a height lower than that of the strip mesa 1 and extended on the opposite sides of a portion of the strip mesa 1. Accordingly, the light absorbing or current blocking layer extends across a portion of the active layer strip in the portion of the strip mesa between the auxiliary strip mesas 7a and 7b to form a saturable (supersaturation) absorbing region in part of the strip active layer 4 for pulsation.
- semiconductor lasers in accordance with the present invention may be manufactured by any one of methods disclosed in our Japanese patent laid-open specification 86/183987, 88/217829 and 88/330136.
- a semiconductor laser of Example 1 is the same in construction as the semiconductor laser in the first embodiment shown in Figures 1 to 3, and is a semiconductor compound laser employing epitaxial layers formed of compounds of elements of the III and V groups, that is, AlGaAs compounds.
- the semiconductor laser employs a semiconductor substrate 2 of an n type GaAs compound having a major surface 2a of the (100) crystal face.
- a strip mesa 1 having one or a plurality of expanded portions la as shown in Figure 1 is formed on the major surface 2a of the semiconductor substrate 1 along the ⁇ 011> crystallographic axis by a crystallographic etching process.
- a strip etching mask of an etching resist is formed optically on the major surface 2a of the semiconductor substrate 2 along the (011) crystallographic axis, and the major surface 2a is etched crystallographically by using the strip etching mask and a sulphuric acid etchant prepared by mixing 3 parts H2SO4, 1 part H2O2 and 1 part H2O. Then, functional semiconductor layers are formed sequentially over the major surface 2a of the semiconductor substrate 2 by a continuous MOCVD process.
- the functional semiconductor layers include an n type first semiconductor layer 15 (an n type buffer layer of GaAs), an n type first semiconductor layer 11 ( a first cladding layer of Al x Gal 1-x As), a second semiconductor layer 12 (an active layer of undoped Al y Gal 1-y As), a p type semiconductor layer 13 (a lower second p type cladding layer), a fourth semiconductor layer 14 (a p or n type light absorbing layer of GaAs having a band-gap smaller than that of the second semiconductor layer 12 and a thickness not less than 0.1 »m), a p type sixth semiconductor layer 16 (an upper second cladding layer of p type Al x Gal 1-x As), and a p type seventh semiconductor layer 17 (a p type cap layer having a small specific resistance.
- n type first semiconductor layer 15 an n type buffer layer of GaAs
- an n type first semiconductor layer 11 a first cladding layer of Al x Gal 1-x As
- a second semiconductor layer 12 an active layer of undo
- a laminated structure of the epitaxial layers having a triangular cross section is formed between the breaks 3 on the strip mesa 1.
- the widths W1 and W p1 and the height of the strip mesa 1 are determined selectively so that a portion of the laminated structure of a triangular cross section formed between the inclined breaks 3 on the portion of the width W1 of the strip mesa 1 comprises only a strip buffer layer 9, that is, a portion of the fifth semiconductor layer 15, a first strip cladding layer 21, that is, a portion of the first semiconductor layer 11, a strip active layer 4, that is, a portion of the second semiconductor layer 12, and a strip cladding layer 22, that is, a portion of the third semiconductor layer 13, and the edges of portions of the fourth semiconductor layers 14 corresponding to the recesses 8 are contiguous respectively with the opposite side surfaces of the second strip cladding layer 22, and so that a portion of the laminated structure of the epitaxial layers formed between the inclined breaks 3 on the expanded portion 1a of the width W p1 of the strip
- a seventh semiconductor layer 17 serving as a cap layer is formed across the strip mesa 11 over the entire surface of the laminated structure of the epitaxial layers formed on the semiconductor substrate 2.
- An electrode is formed in ohmic contact over the entire surface of the seventh semiconductor layer 17 or over an area of the surface of the seventh semiconductor layer 17 corresponding to an elongate electrode window formed so as to correspond to the strip mesa 1 in an insulating layer formed over the seventh semiconductor layer 17.
- the fourth semiconductor layer 14 forming the strip light absorbing layer 5 is formed of a semiconductor having a bandgap smaller than that of a semiconductor forming the second semiconductor layer 12 forming the strip active layer 4.
- the first semiconductor layer 11, the third semiconductor layer 13 and the sixth semiconductor layer 16 are formed of semiconductors each having a band gap greater than that of the semiconductor forming the second semiconductor layer 12. That is, in the AlGaAs compounds, y ⁇ x.
- a semiconductor laser of Example 2 is the same in construction as that shown in Figures 4, 5 and 6.
- the semiconductor laser of Example 2 can be fabricated by the same process as that applied to fabricating the semiconductor laser of Example 1.
- the semiconductor laser of Example 2 employs a semiconductor substrate 2 having a strip mesa 1 of a desired width W2 including a contracted portion 1b of a width W p2 smaller than the width W2.
- the strip mesa 1 may be provided with one contracted portion 1b as shown in Figure 4 or a plurality of such contracted portions 1b.
- the fourth semiconductor layer 14 serving as a current blocking layer 6 is formed of an n type (first conduction type) AlGaAs.
- the height and widths W2 and W p2 of the strip mesa 1 are determined selectively so that a strip buffer layer 9, that is, a portion of the fifth semiconductor layer 15, a first strip cladding layer 21, that is, a portion of the first semiconductor layer 11, and a strip active layer 4, that is, a portion of the second semiconductor layer 12 are formed over the entire length of the strip mesa 1 between the breaks 3 in continuity, a portion of the laminated structure of the epitaxial layers formed over the portion of the desired width W2 of the strip mesa 1 includes a second strip cladding layer 22, that is, a portion of the third semiconductor layer 13 formed on the strip active layer 4 as shown in Figure 5, a portion of the laminated structure of the epitaxial layers formed over the contracted portion 1b of the width W p2 of the strip mesa 1 does not include the second strip cladding layer 22, that is, a portion of the third semiconductor layer 13 as shown in Figure 6, the edges 14a and 14b of portions of the fourth semiconductor layer 14 corresponding to the recesses 8
- a semiconductor laser of Example 3 is the same in construction as that shown in Figures 7, 8 and 9.
- the semiconductor laser of Example 3 may be fabricated by the same method as that applied to fabricating the semiconductor laser of Example 1.
- the semiconductor laser of Example 3 employs a semiconductor substrate having a strip mesa 1 of a desired width W3 provided with an expanded portion 1c of a width W p3 as shown in Figure 7 or a plurality of such expanded portions 1c.
- the fourth semiconductor layer 14 forming the strip current blocking layer similarly to that of the Example 2, is formed of an n type (first conduction type) AlGaAs.
- the height and widths W3 and W p3 of the strip mesa 1 are determined selectively so that a laminated structure of the epitaxial layers comprising the strip buffer layer 9, that is, a portion of the fifth semiconductor layer 15, the first strip cladding layer 21, that is, a portion of the first semiconductor layer 11, the strip active layer 4, that is, a portion of the semiconductor layer 12, and the second strip cladding layer 22, that is, a portion of the third semiconductor layer 13 are formed over the entire length of the strip mesa 1 between the breaks 3 in continuity, a portion of the laminated structure of the epitaxial layers corresponding to the expanded portion 1c of the width W p3 includes, in addition to the strip buffer layer 9, the first strip cladding layer 21, the strip active layer 4 and the second strip cladding layer 22, the strip current blocking layer 6, that is, a portion of the fourth semiconductor layer 14 as shown in Figure 9, and the edges 14a and 14b of portions of the fourth semiconductor layer 14 corresponding to the recesses 8 are contiguous respectively with the opposite side surfaces 4a and 4
- a semiconductor laser of Example 4 is the same in construction as that shown in Figures 10 to 13.
- the semiconductor laser of Example 4 may be fabricated by the same method as that applied to fabricating the semiconductor laser of Example 1.
- the semiconductor laser of Example 4 employs a semiconductor substrate having a strip mesa 1 of a desired width W4, and a pair of auxiliary strip mesas 7a and 7b having a height lower than that of the strip mesa 1 and extending respectively on the opposite sides of a substantially middle portion of the strip mesas 7a and 7b.
- the fourth semiconductor 14 serving as a light absorbing layer or a current absorbing layer 56 is formed of n type (first conduction type) AlGaAs.
- the height and widths W4 and W p4 of the strip mesa 1 and the auxiliary strip mesas 7a and 7b are determined selectively so that a laminated structure of the epitaxial layers defined by the breaks 3 in continuity and comprising the strip buffer layer 9, that is, a portion of the fifth semiconductor layer 15, the first strip cladding layer 21, that is, a portion of the first semiconductor layer 11, a strip active layer 4, that is, a portion of the second semiconductor layer 12 and the second strip cladding layer 22, that is, a portion of the third semiconductor layer 13, is formed over the entire length of the strip mesa 1, and the edges 14a and 14b of portions of the fourth semiconductor layer 14 corresponding to the recesses 8 are contiguous respectively with the opposite side surfaces 4a and 4b of the strip active layer 4 in the portion of the laminated structure of the epitaxial layers defined by the breaks 3 on a portion of the strip mesa 1 other than a portion of the same between the auxiliary strip mesas 7a and 7b as shown in Figure 11.
- portions of the fourth semiconductor layer 14 corresponding to the auxiliary strip mesas 7a and 7b are raised accordingly as shown in Figures 12 and 13, and, consequently, the light absorbing or current blocking layer 56, that is, a portion of the fourth semiconductor layer 14, corresponding to the auxiliary strip mesas 7a and 7b extends across the portion of the strip mesa 1 between the auxiliary strip mesas 7a and 7b.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Description
- This invention relates to semiconductor lasers.
- Semiconductor lasers have been widely employed as light sources for the optical read/write operation with recording media like optical discs and magneto-optic discs. In recording information on or reading information from an optical recording medium, such as an optical disc or a magneto-optic disc, with a semiconductor laser, an inevitable small quantity of reflected light returned from the optical recording medium or the optical system produces reflected light noise, due to interference with the laser beam, and this may cause significant problems.
- Such problems attributable to reflected light noise may be solved by employing a multimode semiconductor laser or a pulsation semiconductor laser, or by the fast modulation of the semiconductor laser.
- As is generally known, a gain guide semiconductor laser incorporating a gain waveguide is capable of multimode oscillation. However, the threshold current Ith of the gain guide semiconductor laser is very high, and such a very high threshold current Ith is an impediment to increasing the output of the semiconductor laser for satisfactory operation in writing signals in and reading recorded signals from a magneto-optic recording medium or an optical disc by using the semiconductor laser as a light source. The fast modulation of the semiconductor laser requires a circuit of a complicated configuration.
- Accordingly, the use of a self-pulsation (self-oscillation) laser is desirable to reduce the reflected light noise. The pulsation of the self-pulsation laser can be achieved by a first means that employs an intermediate construction between an index guide and a gain guide, a second means that employs a saturable (supersaturation) absorber or a third means that increases light expansion beyond current expansion. The first and second means encounter problems in controlling the pulsation, and increase the threshold current Ith.
- To solve such problems, we have proposed a method of forming a buried heterostructure semiconductor laser in Japanese patent laid-open specification 86/183987. This method utilizes the dependence of epitaxial growth rate on the orientation of the crystal face in forming a semiconductor laser by a single, continuous process. This method forms semiconductor layers continuously and sequentially over the surface of a semiconductor substrate provided with a strip mesa by epitaxial growth to form a buried heterostructure semiconductor laser having a comparatively low threshold current Ith.
- We have further proposed semiconductor lasers formed by utilizing the dependence of epitaxial growth rate on the orientation of the crystal face in Japanese patent laid-open specifications 87/217829 and 88/330136. These semiconductor lasers incorporate improvements for simplifying the manufacturing process and further stabilizing the characteristics. Figure 14 shows one of these previously proposed semiconductor lasers. As shown, the semiconductor laser is formed by sequentially forming a first conduction type, for example, n type,
AlGaAs cladding layer 3, a low-impurity or undoped GaAsactive layer 4, a first, second conduction type, for example p type, AlGaAscurrent layer 5, a first conduction type, for example n type, AlGaAs current blockingcladding layer 6, and a second, second conductiontype cap layer 8, on the major surface la of asubstrate 1, such as a GaAs compound semiconductor substrate, having a crystal face (100) and provided with astrip mesa 2 extending along the <011> crystallographic axis by a metal organic chemical vapour deposition (MOCVD) process. - A
first electrode 9 and asecond electrode 10 are formed respectively over thecap layer 8 and the rear of thesubstrate 1 in ohmic contact. The ntype cladding layer 3, the first ptype cladding layer 5, the secondp type cladding 7 and the n typecurrent blocking layer 6 are formed of materials having a large band-gap, that is, a small refractive index, as compared with that of a material forming theactive layer 4. - In depositing the materials in crystals by the epitaxial growth method, portions of the lower layers formed over the
strip mesa 2 are superimposed in a laminated structure having a triangular cross section, because, once the (111)B crystal face is formed by epitaxial growth on thestrip mesa 2, the epitaxial growth rate of crystals on the (111)B crystal face drops below a few tenths of the epitaxial growth rate of crystals on other crystal faces, for example the (100) crystal face, the epitaxial growth of crystals on the (111)B crystal face barely continues and the (111)B crystal face forms a fault or break in continuity which results in divided regions as shown. Thus, the relation with the orientation of the crystal face of thestrip mesa 2 of thesubstrate 1 is specified, the shape and size of thestrip mesa 2 are determined selectively to form a strip of theactive layer 4 between thecladding layers strip mesa 2 betweeninclined side surfaces 11 of the (111)B crystal face inclined at about 55°, so that the strip of theactive layer 4 is separated from other portions of theactive layer 4, and thecurrent blocking layer 6 is formed contiguously with theside surfaces 11, inmesa grooves 12. - Since the strip of the
active layer 4 formed on thestrip mesa 2 is surrounded by thecurrent blocking layer 6, a semiconductor laser having a low threshold current Ith can be fabricated by a single cycle of a continuous epitaxial growth process. - The semiconductor laser thus formed by the aluminium mixed crystals grown by epitaxial growth using the MOCVD process, however, has problems that depressions or irregularities are formed at some position in a portion of the
electrode 9 corresponding to thestrip mesa 2 and that the laser beam does not oscillate, the oscillating efficiency is low and the characteristic is unstable when such depressions or irregularities are formed in theelectrode 9. - It is known that the epitaxial growth rate increases sharply with increase in the aluminium content of the aluminium mixed crystals. We have found through studies that the deterioration of the characteristics of the semiconductor laser is more or less attributable to the epitaxial growth rate. For example, an aluminium oxide is deposited across the strip of the epitaxial semiconductor layer formed separately from other portions of the same epitaxial semiconductor layer on the
strip mesa 2 forming depressions or irregularities in theelectrode 9 and impeding current concentration on theactive layer 4 or intercepting current. Such depressions or irregularities make the semiconductor laser unacceptable and cause problems such as the deterioration or fluctuation of the characteristics. - According to the present invention there is provided a self-pulsating semiconductor laser comprising:
a semiconductor substrate provided in its major surface with a strip mesa of a desired width having an expanded portion; and
a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer serving as a light absorbing layer;
wherein:
breaks in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa;
the second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer forms a strip active layer between the breaks in a portion of the laminated structure extending on the strip mesa;
the fourth semiconductor layer of the laminated structure is split by the breaks so that the fourth semiconductor layer is not included in a portion of the laminated structure corresponding to a portion of the desired width of the strip mesa; and
a portion of the fourth semiconductor layer serving as a light absorbing layer is formed over the strip active layer in a portion of the laminated structure corresponding to the expanded portion of the strip mesa. - According to the present invention there is also provided a self-pulsating semiconductor laser comprising:
a semiconductor substrate provided in its major surface with a strip mesa of a desired width having a contracted portion; and
a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer serving as a first conduction type current blocking layer;
wherein:
breaks in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa;
the second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer forms a strip active layer between the breaks in a portion of the laminated structure extending on the strip mesa;
the fourth semiconductor layer is split by the breaks so that the fourth semiconductor layer is not included in a portion of the laminated structure corresponding to a portion of the desired width of the strip mesa; and
the fourth semiconductor layer extends, as a current blocking layer over and across the strip active layer of a portion of the laminated structure corresponding to the contracted portion of the strip mesa. - According to the present invention there is also provided a self-pulsating semiconductor laser comprising:
a semiconductor substrate provided in its major surface with a strip mesa of a desired width having an expanded portion; and
a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer serving as a first conduction type current blocking layer;
wherein:
breaks in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa;
the second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer forms a strip active layer between the breaks in a portion of the laminated structure extending on the strip mesa;
the fourth semiconductor layer is split by the breaks so that the edges of portions of the fourth semiconductor layer are contiguous with the side edges or the vicinities of the side edges of the strip active layer in the portion of the laminated structure extending on the strip mesa between the breaks;
the fourth semiconductor layer is not included in a portion of the laminated structure corresponding to a portion of the desired width of the strip mesa; and
a portion of the fourth semiconductor layer is formed locally on a portion of the third semiconductor layer formed over the strip active layer included in a portion of the laminated structure corresponding to the expanded portion of the strip mesa. - According to the present invention there is also provided a self-pulsating semiconductor laser comprising:
a semiconductor substrate provided in its major surface with a strip mesa and auxiliary strip mesa having a height lower than that of the strip mesa and extended respectively on the opposite sides of a portion of the strip mesa; and
a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer serving as a light absorbing or current blocking layer;
wherein:
breaks in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa;
the second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer forms a strip active layer between the breaks in a portion of the laminated structure extending on the strip mesa;
the fourth semiconductor layer is split by the breaks so that the fourth semiconductor layer is not included in a portion of the laminated structure other than the portion thereof formed on the portion between the auxiliary strip mesas; and
a portion of the fourth semiconductor layer included in a portion of the laminated structure formed on the portion of the strip mesa between the auxiliary strip mesas extends across the portion of the strip mesa between the auxiliary strip mesas and opposite to the strip active layer. - A semiconductor laser in accordance with the present invention is fabricated by the epitaxial deposition of at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer, on the major surface of a semiconductor substrate having a strip mesa in the major surface by utilizing the crystallographic principle and the characteristics of steps formed by the strip mesa so that breaks in continuity are formed in a laminated structures of the semiconductor layers so as to extend along the direction of extension of the opposite, longitudinal side surfaces of the strip mesa. The second semiconductor layer is split by the breaks so that a portion of the second semiconductor layer between the breaks in a portion of the laminated structure extending on the strip mesa forms a strip active layer.
- In a first aspect of the present invention, a portion of the strip mesa is expanded widthwise to form an expanded portion, and the fourth semiconductor layer is used as a light absorbing layer. The fourth semiconductor layer is split by the breaks in continuity so that a portion of the fourth semiconductor layer in the epitaxial layers corresponding to a portion of the strip mesa having a desired width is omitted and the fourth semiconductor layer, that is, the light absorbing layer is formed on the active layer on the opposite sides of the epitaxial layers on the expanded portion of the strip mesa to form a local, low-excitation region, namely, a saturable or supersaturating absorbing portion, for pulsation, that is, self-oscillation.
- In a second aspect of the present invention, a portion of the strip mesa is contracted widthwise to form a contracted portion and the fourth semiconductor layer is used as a current blocking layer. The fourth semiconductor layer is split by the breaks in continuity so that a portion of the fourth semiconductor layer formed on the active layer corresponding to a portion of the strip mesa having a desired width is omitted and the fourth semiconductor layer serving as a current blocking layer is formed across the epitaxial layers on the contracted portion of the strip mesa to form a portion which barely allows carrier injection into the active layer, that is, a saturable or supersaturating absorbing portion, for pulsation.
- In a third aspect of the present invention, a portion of the strip mesa is expanded to form an expanded portion, and the fourth semiconductor layer is split by the breaks in continuity so that the edges of the split fourth semiconductor layer are contiguous with the opposite end surfaces of a portion of the active layer on the strip mesa, a portion of the fourth semiconductor layer corresponding to a portion of the strip mesa having a desired width is omitted and a portion of the fourth semiconductor layer serving as a current blocking layer is formed on the third semiconductor layer formed on the active layer in the epitaxial layers on the expanded portion of the strip mesa to form a saturable or supersaturating portion for pulsation, that is, self-oscillation.
- In a fourth aspect of the present invention, auxiliary ridges having a height smaller than the strip mesa are formed on the opposite sides of a portion of the strip mesa and the fourth semiconductor layer is used as a light absorbing or current blocking layer. The fourth semiconductor layer is split by the breaks in continuity so that a portion of the fourth semiconductor layer in the layers formed by epitaxial growth on a portion of the strip mesa having a desired width is omitted and portions of the fourth semiconductor layer extending from portions of the epitaxial layers corresponding to the auxiliary ridges over a portion of the epitaxial layers between the auxiliary ridges are formed opposite to each other on the active layer to form a saturable or supersaturating portion for pulsation by forming a local area for suppressing carrier injection into the light absorbing or active layer.
- The invention will now be described by way of example with reference to the accompanying drawings, throughout which like parts are referred to by like references, and in which:
- Figure 1 is an enlarged, schematic plan view of a first embodiment of semiconductor laser according to the present invention;
- Figure 2 is an enlarged sectional view taken on line A-A in Figure 1;
- Figure 3 is an enlarged sectional view taken on line B-B in Figure 1;
- Figure 4 is an enlarged, schematic plan view of a second embodiment of semiconductor laser according to the present invention;
- Figure 5 is an enlarged sectional view taken on line A-A in Figure 4;
- Figure 6 is an enlarged sectional view taken on line B-B in Figure 4;
- Figure 7 is an enlarged, schematic plan view of a third embodiment of semiconductor laser according to the present invention;
- Figure 8 is an enlarged sectional view taken on line A-A in Figure 7;
- Figure 9 is an enlarged sectional view taken on line B-B in Figure 7.
- Figure 10 is an enlarged, schematic plan view of a fourth embodiment of semiconductor laser according to the present invention;
- Figure 11 is an enlarged sectional view taken on line A-A in Figure 10;
- Figure 12 is an enlarged sectional view taken on line B-B in Figure 10;
- Figure 13 is an enlarged perspective view of part of Figure 10; and
- Figure 14 is an enlarged, fragmentary, schematic view of a previously proposed semiconductor laser.
- Referring to Figures 1, 2 and 3, the first embodiment of semiconductor laser employs a
semiconductor substrate 2 provided with astrip mesa 1 of a desired width W₁ having an expandedportion 1a of a width Wp1 on its major surface. Sequentially formed by epitaxial growth on the major surface of thesubstrate 2 are epitaxial layers including at least a first semiconductor layer 11 (first conduction type cladding layer), a second semiconductor layer 12 (active layer), a third semiconductor layer 13 (second conduction type cladding layer) and a fourth semiconductor layer 14 (first or second conduction type light absorbing layer). Faults, that is breaks 3 in continuity as shown, are formed in the epitaxial layers along the longitudinal, opposite sides of thestrip mesa 1. Thesecond semiconductor layer 12 is split by thebreaks 3 to form a stripactive layer 4, thefourth semiconductor layer 14 is split by thebreaks 3 to omit thefourth semiconductor layer 14 from a laminated structure of the epitaxial layers formed on the expandedportion 1a of thestrip mesa 1 as shown in Figure 2, and a portion of thesemiconductor layer 14 serving as a striplight absorbing layer 5 is formed over the stripactive layer 4. - Referring to Figures 4, 5 and 6, the second embodiment of semiconductor laser employs a
semiconductor substrate 2 provided with astrip mesa 1 of a desired width W₂ having a contractedportion 1b of a width Wp2 on its major surface. Sequentially formed by epitaxial growth on the major surface of thesemiconductor substrate 2 are epitaxial layers including at least a first semiconductor layer 11 (first conduction type cladding layer), a second semiconductor layer 12 (active layer), a third semiconductor layer 13 (second conduction type cladding layer), and a fourth semiconductor layer 14 (first conduction type current blocking layer). Faults, that is breaks 3 in continuity as shown, are formed in the epitaxial layers along the longitudinal, opposite sides of thestrip mesa 1. Thesecond semiconductor layer 12 is split by thebreaks 3 to form a stripactive layer 4, and a portion of thefourth semiconductor layer 14 in the epitaxial layers corresponding to the portion of the desired width W₂ of thestrip mesa 1 is split so that thefourth semiconductor layer 14 is not formed over the stripactive layer 4 in a portion of the laminated structure of the epitaxial layers formed on the portion of the desired width W₂ of thestrip mesa 1 as shown in Figure 5, and a portion of thesecond semiconductor layer 14 in a portion of the laminated structure of the epitaxial layers formed on the contractedportion 1b of thestrip mesa 1 extend across the contractedportion 1b of thestrip mesa 1 to form acurrent blocking layer 6 over the stripactive layer 4 as shown in Figure 6. - Referring to Figures 7, 8, and 9, the third embodiment of semiconductor laser employs a
semiconductor substrate 2 provided with astrip mesa 1 of a desired width W₃ having an expandedportion 1c of a width Wp3 on its major surface. Sequentially formed by epitaxial growth on the major surface of thesemiconductor substrate 2 are epitaxial layers including at least a first semiconductor layer 11 (first conduction type cladding layer), a second semiconductor layer 12 (active layer), a third semiconductor layer 13 (second conduction type cladding layer) and a fourth semiconductor layer 14 (first conduction type current blocking layer). Faults, that is breaks 3 in continuity as shown, are formed in the epitaxial layers along the longitudinal, opposite sides of thestrip mesa 1. Thesecond semiconductor layer 12 among the epitaxial layers is split by thebreaks 3 to form a stripactive layer 4, thefourth semiconductor layer 14 is split by thebreaks 3 so that theedges fourth semiconductor layer 14 are contiguous with theopposite side edges opposite side edges active layer 4 formed over thestrip mesa 1, a portion of thefourth semiconductor layer 14 in a portion of the laminated structure of the epitaxial layers formed on the portion of the desired width W₃ of thestrip mesa 1 is omitted as shown in Figure 8, and a portion of thefourth semiconductor layer 14 in a portion of the laminated structure of the epitaxial layers formed on the expandedportion 1c of the width Wp3 of thestrip mesa 1 is formed locally on thethird semiconductor layer 13 formed on the stripactive layer 4 to form a stripcurrent blocking layer 6 as shown in Figure 9. - Referring to Figures 10, 11, 12 and 13, the fourth embodiment of semiconductor laser employs a
semiconductor substrate 2 provided in its major surface with a strip mesa of a desired width W₄, andauxiliary strip mesas 7a and 7b of a desired height lower than that of thestrip mesa 1, extending respectively on the opposite sides of a portion of thestrip mesa 1. Sequentially formed by epitaxial growth on the major surface of thesemiconductor substrate 2 are a first semiconductor layer 11 (first conduction type cladding layer), a second semiconductor layer 12 (active layer), a third semiconductor layer 13 (second conduction type cladding layer) and a fourth semiconductor layer 14 (light absorbing or current blocking layer). Faults, that is breaks 3 in continuity, are formed in the epitaxial layers along the longitudinal, opposite sides of thestrip mesa 1. Thesecond semiconductor layer 12 is split by thebreaks 3 to form a stripactive layer 4 on thestrip mesa 1, thefourth semiconductor layer 14 is split by thebreaks 3 so that a portion of thefourth semiconductor layer 14 corresponding to a portion of thestrip mesas 7a and 7b to form acurrent blocking layer 56 over the stripactive layer 4 as shown in Figure 12. - The epitaxial layers are formed by a continuous epitaxial process so that the
breaks 3 are formed along the opposite, longitudinal sides of thestrip mesa 1 by a MOCVD method disclosed previously in Japanese patent laid-open specification 86/183987, which utilizes the dependence of epitaxial growth rate on the orientation of the crystal face, and the effect of thestrip mesa 1. - As shown in Figure 3, the semiconductor laser in the first embodiment has the light absorbing
layer strip 5 formed over a portion of the stripactive layer 4 included in the epitaxial layers formed on the expandedportion 1a of thestrip mesa 1. Accordingly, a local, low-excitation region, namely, a saturable (supersaturation) region, is formed in the stripactive layer 4 for pulsation. - As shown in Figure 6, the semiconductor laser in the second embodiment has the light
blocking layer strip 6 formed over a portion of the stripactive layer 4 included in the epitaxial layers formed on the contractedportion 1b of thestrip mesa 1. Accordingly, the flow of current through a portion of the stripactive layer 4 is intercepted to suppress the injection of carriers into a portion of the stripactive layer 4 to form a saturable (supersaturation) absorbing portion in the stripactive layer 4 due to the reduction of gain. - As shown in Figure 9, the semiconductor laser in the third embodiment has the
current blocking layer 6 formed contiguously with theopposite side edges active layer 4, and a portion of thecurrent blocking layer 6 is included in the epitaxial layers formed on the expandedportion 1c of thestrip mesa 1. Accordingly , a current flows through restricted gaps in thecurrent blocking layer 6 as indicated by arrows a in the epitaxial layers on the expandedportion 1c of thestrip mesa 1 to suppress the injection of carriers in a region for pulsation. - As shown in Figures 10 to 13, the semiconductor laser in the fourth embodiment according to the present invention is provided with the
auxiliary strip mesas 7a and 7b having a height lower than that of thestrip mesa 1 and extended on the opposite sides of a portion of thestrip mesa 1. Accordingly, the light absorbing or current blocking layer extends across a portion of the active layer strip in the portion of the strip mesa between theauxiliary strip mesas 7a and 7b to form a saturable (supersaturation) absorbing region in part of the stripactive layer 4 for pulsation. - Concrete examples of semiconductor lasers in accordance with the present invention will be described below. The semiconductor lasers in accordance with the present invention may be manufactured by any one of methods disclosed in our Japanese patent laid-open specification 86/183987, 88/217829 and 88/330136.
- A semiconductor laser of Example 1 is the same in construction as the semiconductor laser in the first embodiment shown in Figures 1 to 3, and is a semiconductor compound laser employing epitaxial layers formed of compounds of elements of the III and V groups, that is, AlGaAs compounds.
- The semiconductor laser employs a
semiconductor substrate 2 of an n type GaAs compound having amajor surface 2a of the (100) crystal face. Astrip mesa 1 having one or a plurality of expanded portions la as shown in Figure 1 is formed on themajor surface 2a of thesemiconductor substrate 1 along the <011> crystallographic axis by a crystallographic etching process. In forming thestrip mesa 1 a strip etching mask of an etching resist is formed optically on themajor surface 2a of thesemiconductor substrate 2 along the (011) crystallographic axis, and themajor surface 2a is etched crystallographically by using the strip etching mask and a sulphuric acid etchant prepared by mixing 3 parts H₂SO₄, 1 part H₂O₂ and 1 part H₂O. Then, functional semiconductor layers are formed sequentially over themajor surface 2a of thesemiconductor substrate 2 by a continuous MOCVD process. The functional semiconductor layers include an n type first semiconductor layer 15 (an n type buffer layer of GaAs), an n type first semiconductor layer 11 ( a first cladding layer of AlxGal1-xAs), a second semiconductor layer 12 (an active layer of undoped AlyGal1-yAs), a p type semiconductor layer 13 (a lower second p type cladding layer), a fourth semiconductor layer 14 (a p or n type light absorbing layer of GaAs having a band-gap smaller than that of thesecond semiconductor layer 12 and a thickness not less than 0.1 »m), a p type sixth semiconductor layer 16 (an upper second cladding layer of p type AlxGal1-xAs), and a p type seventh semiconductor layer 17 (a p type cap layer having a small specific resistance. - When those functional layers are thus formed by epitaxial growth over the
strip mesa 1 and recesses 8 formed on the opposite sides of thestrip mesa 1 extending along the <011> crystallographic axis, breaks 3 in continuity of the (111)B crystal face inclined at an angle ϑ of about 55° to the top surface of the (100) crystal face of thestrip mesa 1 are formed in the functional layers, because, once the (111)B crystal face is formed in the epitaxial layer grown on thestrip mesa 1, the epitaxial growth rate of crystals on the (111)B crystal faces is a few tenths or less of the crystal growth rate on other crystal faces, such as the (100) crystal face. Consequently, a laminated structure of the epitaxial layers having a triangular cross section is formed between thebreaks 3 on thestrip mesa 1. The widths W₁ and Wp1 and the height of the strip mesa 1 are determined selectively so that a portion of the laminated structure of a triangular cross section formed between the inclined breaks 3 on the portion of the width W₁ of the strip mesa 1 comprises only a strip buffer layer 9, that is, a portion of the fifth semiconductor layer 15, a first strip cladding layer 21, that is, a portion of the first semiconductor layer 11, a strip active layer 4, that is, a portion of the second semiconductor layer 12, and a strip cladding layer 22, that is, a portion of the third semiconductor layer 13, and the edges of portions of the fourth semiconductor layers 14 corresponding to the recesses 8 are contiguous respectively with the opposite side surfaces of the second strip cladding layer 22, and so that a portion of the laminated structure of the epitaxial layers formed between the inclined breaks 3 on the expanded portion 1a of the width Wp1 of the strip mesa 1 comprises, in addition to the strip buffer layer 9, the first strip cladding layer 21, the strip active layer 4 and the second strip cladding layer 22, a strip light absorbing layer 5, that is, a portion of the fourth semiconductor layer 14, and a strip upper second cladding layer 22u, that is, a portion of the sixth semiconductor layer 16. - A
seventh semiconductor layer 17 serving as a cap layer is formed across thestrip mesa 11 over the entire surface of the laminated structure of the epitaxial layers formed on thesemiconductor substrate 2. An electrode, not shown, is formed in ohmic contact over the entire surface of theseventh semiconductor layer 17 or over an area of the surface of theseventh semiconductor layer 17 corresponding to an elongate electrode window formed so as to correspond to thestrip mesa 1 in an insulating layer formed over theseventh semiconductor layer 17. - The
fourth semiconductor layer 14 forming the striplight absorbing layer 5 is formed of a semiconductor having a bandgap smaller than that of a semiconductor forming thesecond semiconductor layer 12 forming the stripactive layer 4. Thefirst semiconductor layer 11, thethird semiconductor layer 13 and thesixth semiconductor layer 16 are formed of semiconductors each having a band gap greater than that of the semiconductor forming thesecond semiconductor layer 12. That is, in the AlGaAs compounds, y < x. - A semiconductor laser of Example 2 is the same in construction as that shown in Figures 4, 5 and 6. The semiconductor laser of Example 2 can be fabricated by the same process as that applied to fabricating the semiconductor laser of Example 1.
- The semiconductor laser of Example 2 employs a
semiconductor substrate 2 having astrip mesa 1 of a desired width W₂ including a contractedportion 1b of a width Wp2 smaller than the width W₂. Thestrip mesa 1 may be provided with one contractedportion 1b as shown in Figure 4 or a plurality of such contractedportions 1b. Thefourth semiconductor layer 14 serving as acurrent blocking layer 6 is formed of an n type (first conduction type) AlGaAs. - The height and widths W₂ and Wp2 of the strip mesa 1 are determined selectively so that a strip buffer layer 9, that is, a portion of the fifth semiconductor layer 15, a first strip cladding layer 21, that is, a portion of the first semiconductor layer 11, and a strip active layer 4, that is, a portion of the second semiconductor layer 12 are formed over the entire length of the strip mesa 1 between the breaks 3 in continuity, a portion of the laminated structure of the epitaxial layers formed over the portion of the desired width W₂ of the strip mesa 1 includes a second strip cladding layer 22, that is, a portion of the third semiconductor layer 13 formed on the strip active layer 4 as shown in Figure 5, a portion of the laminated structure of the epitaxial layers formed over the contracted portion 1b of the width Wp2 of the strip mesa 1 does not include the second strip cladding layer 22, that is, a portion of the third semiconductor layer 13 as shown in Figure 6, the edges 14a and 14b of portions of the fourth semiconductor layer 14 corresponding to the recesses 8 are contiguous respectively with the opposite side surfaces 4a and 4b of the strip active layer 4 in the portion of the laminated structure of the epitaxial layers defined by the breaks 3 on the portion of the width W₂ of the strip mesa 1 as shown in Figure 5, and a current blocking layer 6, that is, a portion of the fourth semiconductor layer 14 is in direct contact with the strip active layer 4 in the portion of the laminated structure of the epitaxial layers on the contracted portion 1b of the strip mesa 1 as shown in Figure 6.
- A semiconductor laser of Example 3 is the same in construction as that shown in Figures 7, 8 and 9. The semiconductor laser of Example 3 may be fabricated by the same method as that applied to fabricating the semiconductor laser of Example 1.
- The semiconductor laser of Example 3 employs a semiconductor substrate having a
strip mesa 1 of a desired width W₃ provided with an expandedportion 1c of a width Wp3 as shown in Figure 7 or a plurality of such expandedportions 1c. Thefourth semiconductor layer 14 forming the strip current blocking layer, similarly to that of the Example 2, is formed of an n type (first conduction type) AlGaAs. - The height and widths W₃ and Wp3 of the strip mesa 1 are determined selectively so that a laminated structure of the epitaxial layers comprising the strip buffer layer 9, that is, a portion of the fifth semiconductor layer 15, the first strip cladding layer 21, that is, a portion of the first semiconductor layer 11, the strip active layer 4, that is, a portion of the semiconductor layer 12, and the second strip cladding layer 22, that is, a portion of the third semiconductor layer 13 are formed over the entire length of the strip mesa 1 between the breaks 3 in continuity, a portion of the laminated structure of the epitaxial layers corresponding to the expanded portion 1c of the width Wp3 includes, in addition to the strip buffer layer 9, the first strip cladding layer 21, the strip active layer 4 and the second strip cladding layer 22, the strip current blocking layer 6, that is, a portion of the fourth semiconductor layer 14 as shown in Figure 9, and the edges 14a and 14b of portions of the fourth semiconductor layer 14 corresponding to the recesses 8 are contiguous respectively with the opposite side surfaces 4a and 4b of the strip active layer 4 in the portion of the laminated structure of the epitaxial layers defined by the breaks 3 on the portion of the strip mesa 1.
- A semiconductor laser of Example 4 is the same in construction as that shown in Figures 10 to 13. The semiconductor laser of Example 4 may be fabricated by the same method as that applied to fabricating the semiconductor laser of Example 1.
- The semiconductor laser of Example 4 employs a semiconductor substrate having a
strip mesa 1 of a desired width W₄, and a pair ofauxiliary strip mesas 7a and 7b having a height lower than that of thestrip mesa 1 and extending respectively on the opposite sides of a substantially middle portion of thestrip mesas 7a and 7b. Thefourth semiconductor 14 serving as a light absorbing layer or a current absorbinglayer 56 is formed of n type (first conduction type) AlGaAs. - The height and widths W₄ and Wp4 of the
strip mesa 1 and theauxiliary strip mesas 7a and 7b are determined selectively so that a laminated structure of the epitaxial layers defined by thebreaks 3 in continuity and comprising thestrip buffer layer 9, that is, a portion of thefifth semiconductor layer 15, the firststrip cladding layer 21, that is, a portion of thefirst semiconductor layer 11, a stripactive layer 4, that is, a portion of thesecond semiconductor layer 12 and the secondstrip cladding layer 22, that is, a portion of thethird semiconductor layer 13, is formed over the entire length of thestrip mesa 1, and theedges fourth semiconductor layer 14 corresponding to therecesses 8 are contiguous respectively with theopposite side surfaces active layer 4 in the portion of the laminated structure of the epitaxial layers defined by thebreaks 3 on a portion of thestrip mesa 1 other than a portion of the same between theauxiliary strip mesas 7a and 7b as shown in Figure 11. Since the depth of therecesses 8 in areas including theauxiliary strip mesas 7a and 7b is decreased, portions of thefourth semiconductor layer 14 corresponding to theauxiliary strip mesas 7a and 7b are raised accordingly as shown in Figures 12 and 13, and, consequently, the light absorbing orcurrent blocking layer 56, that is, a portion of thefourth semiconductor layer 14, corresponding to theauxiliary strip mesas 7a and 7b extends across the portion of thestrip mesa 1 between theauxiliary strip mesas 7a and 7b.
Claims (4)
- A self-pulsating semiconductor laser comprising:
a semiconductor substrate (2) provided in its major surface with a strip mesa (1) of a desired width having an expanded portion (1a); and
a laminated structure constructed on the major surface of the semiconductor substrate (2) by sequentially forming epitaxially at least a first semiconductor layer (11) serving as a first conduction type cladding layer, a second semiconductor layer (12) serving as an active layer, a third semiconductor layer (13) serving as a second conduction type cladding layer, and a fourth semiconductor layer (14) serving as a light absorbing layer;
wherein:
breaks (3) in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa (1);
the second semiconductor layer (12) is split by the breaks (3) so that a portion of the second semiconductor layer (12) forms a strip active layer (4) between the breaks (3) in a portion of the laminated structure extending on the strip mesa (1);
the fourth semiconductor layer (14) of the laminated structure is split by the breaks (3) so that the fourth semiconductor layer (14) is not included in a portion of the laminated structure corresponding to a portion of the desired width of the strip mesa (1); and
a portion of the fourth semiconductor layer (14) serving as a light absorbing layer is formed over the strip active layer (4) in a portion of the laminated structure corresponding to the expanded portion (1a) of the strip mesa (1). - A self-pulsating semiconductor laser comprising:
a semiconductor substrate (2) provided in its major surface with a strip mesa (1) of a desired width having a contracted portion (1c); and
a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer (11) serving as a first conduction type cladding layer, a second semiconductor layer (12) serving as an active layer, a third semiconductor layer (13) serving as a second conduction type cladding layer, and a fourth semiconductor layer (14) serving as a first conduction type current blocking layer;
wherein:
breaks (3) in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa (1);
the second semiconductor layer (12) is split by the breaks (3) so that a portion of the second semiconductor layer (12) forms a strip active layer (4) between the breaks (3) in a portion of the laminated structure extending on the strip mesa (1);
the fourth semiconductor layer (14) is split by the breaks (3) so that the fourth semiconductor layer (14) is not included in a portion of the laminated structure corresponding to a portion of the desired width of the strip mesa (1); and
the fourth semiconductor layer (14) extends, as a current blocking layer over and across the strip active layer (4) of a portion of the laminated structure corresponding to the contracted portion (1c) of the strip mesa (1). - A self-pulsating semiconductor laser comprising:
a semiconductor substrate (2) provided in its major surface with a strip mesa (1) of a desired width having an expanded portion (1c); and
a laminated structure constructed on the major surface of the semiconductor substrate (2) by sequentially forming epitaxially at least a first semiconductor layer (11) serving as a first conduction type cladding layer, a second semiconductor layer (12) serving as an active layer, a third semiconductor layer (13) serving as a second conduction type cladding layer, and a fourth semiconductor layer (14) serving as a first conduction type current blocking layer;
wherein:
breaks (3) in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa (1);
the second semiconductor layer (12) is split by the breaks (3) so that a portion of the second semiconductor layer (12) forms a strip active layer (4) between the breaks (3) in a portion of the laminated structure extending on the strip mesa;
the fourth semiconductor layer (14) is split by the breaks (3) so that the edges of portions of the fourth semiconductor layer (14) are contiguous with the side edges or the vicinities of the side edges (4a, 4c) of the strip active layer (4) in the portion of the laminated structure extending on the strip mesa (1) between the breaks (3);
the fourth semiconductor layer (14) is not included in a portion of the laminated structure corresponding to a portion of the desired width of the strip mesa (1); and
a portion of the fourth semiconductor layer (14) is formed locally on a portion of the third semiconductor layer (13) formed over the strip active layer (4) included in a portion of the laminated structure corresponding to the expanded portion (1c) of the strip mesa (1). - A self-pulsating semiconducteur laser comprising:
a semiconductor substrate (2) provided in its major surface with a strip mesa (1) and auxiliary strip mesas (7a, 7b) having a height lower than that of the strip mesa (1) and extended respectively on the opposite sides of a portion of the strip mesa (1); and
a laminated structure constructed on the major surface of the semiconductor substrate by sequentially forming epitaxially at least a first semiconductor layer (11) serving as a first conduction type cladding layer, a second semiconductor layer (12) serving as an active layer, a third semiconductor layer (13) serving as a second conduction type cladding layer, and a fourth semiconductor layer (14) serving as a light absorbing or current blocking layer;
wherein:
breaks (3) in continuity are formed in the laminated structure along the direction of extension of the opposite longitudinal side surfaces of the strip mesa (1);
the second semiconductor layer (12) is split by the breaks (3) so that a portion of the second semiconductor layer (12) forms a strip active layer (4) between the breaks (3) in a portion of the laminated structure extending on the strip mesa (1);
the fourth semiconductor layer (14) is split by the breaks (3) so that the fourth semiconductor layer (14) is not included in a portion of the laminated structure other than the portion thereof formed on the portion between the auxiliary strip mesas (7a, 7b); and
a portion of the fourth semiconductor layer (14) included in a portion of the laminated structure formed on the portion of the strip mesa (1) between the auxiliary strip mesas (7a, 7b) extends across the portion of the strip mesa (1) between the auxiliary strip mesas (7a, 7b) and opposite to the strip active layer (4).
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP210382/89 | 1989-08-15 | ||
JP1210382A JP2822470B2 (en) | 1989-08-15 | 1989-08-15 | Semiconductor laser |
JP1212600A JP3005998B2 (en) | 1989-08-18 | 1989-08-18 | Manufacturing method of semiconductor laser |
JP212600/89 | 1989-08-18 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0413567A2 EP0413567A2 (en) | 1991-02-20 |
EP0413567A3 EP0413567A3 (en) | 1991-10-09 |
EP0413567B1 true EP0413567B1 (en) | 1995-04-19 |
Family
ID=26518019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90308948A Expired - Lifetime EP0413567B1 (en) | 1989-08-15 | 1990-08-15 | Semiconductor lasers |
Country Status (3)
Country | Link |
---|---|
US (1) | US5111469A (en) |
EP (1) | EP0413567B1 (en) |
DE (1) | DE69018732T2 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04236468A (en) * | 1991-01-18 | 1992-08-25 | Toshiba Corp | Light-emitting diode element for optical communication use |
JPH04317384A (en) * | 1991-04-16 | 1992-11-09 | Mitsubishi Electric Corp | Semiconductor light emitting device |
US5255280A (en) * | 1991-04-22 | 1993-10-19 | Sony Corporation | Semiconductor laser |
JP2823476B2 (en) * | 1992-05-14 | 1998-11-11 | 三菱電機株式会社 | Semiconductor laser and method of manufacturing the same |
GB2299708B (en) * | 1992-05-14 | 1997-01-08 | Mitsubishi Electric Corp | Semiconductor laser and method for manufacturing semiconductor laser |
JP3154198B2 (en) * | 1992-08-25 | 2001-04-09 | ソニー株式会社 | Semiconductor laser and its manufacturing method. |
JPH06132608A (en) * | 1992-10-20 | 1994-05-13 | Sony Corp | Semiconductor laser and manufacture thereof |
JPH0715082A (en) * | 1993-06-24 | 1995-01-17 | Mitsubishi Electric Corp | Semiconductor pulsation laser |
JP2982619B2 (en) * | 1994-06-29 | 1999-11-29 | 日本電気株式会社 | Semiconductor optical waveguide integrated photodetector |
JP3199158B2 (en) * | 1995-12-26 | 2001-08-13 | シャープ株式会社 | Semiconductor laser device |
JPH1075011A (en) * | 1996-08-30 | 1998-03-17 | Sony Corp | Semiconductor laser |
US5850411A (en) * | 1996-09-17 | 1998-12-15 | Sdl, Inc | Transverse electric (TE) polarization mode AlGaInP/GaAs red laser diodes, especially with self-pulsating operation |
JP2000101200A (en) * | 1998-09-25 | 2000-04-07 | Sony Corp | Semiconductor laser and multi semiconductor laser |
JP5223439B2 (en) * | 2007-05-28 | 2013-06-26 | ソニー株式会社 | Semiconductor light emitting device |
JP2009071172A (en) * | 2007-09-14 | 2009-04-02 | Sony Corp | Semiconductor light-emitting device and its manufacturing method, and method of forming base layer |
JP2017050318A (en) * | 2015-08-31 | 2017-03-09 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5826834B2 (en) * | 1979-09-28 | 1983-06-06 | 株式会社日立製作所 | semiconductor laser equipment |
GB2114808B (en) * | 1981-12-01 | 1985-10-09 | Standard Telephones Cables Ltd | Semiconductor laser manufacture |
JPS6034089A (en) * | 1983-08-04 | 1985-02-21 | Nec Corp | Optical bistable semiconductor laser |
JPS6076184A (en) * | 1983-10-03 | 1985-04-30 | Nec Corp | Semiconductor laser |
JPS60140774A (en) * | 1983-12-28 | 1985-07-25 | Toshiba Corp | Semiconductor laser |
GB8516853D0 (en) * | 1985-07-03 | 1985-08-07 | British Telecomm | Manufacture of semiconductor structures |
JPS6425590A (en) * | 1987-07-22 | 1989-01-27 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor laser |
-
1990
- 1990-08-14 US US07/566,824 patent/US5111469A/en not_active Expired - Lifetime
- 1990-08-15 EP EP90308948A patent/EP0413567B1/en not_active Expired - Lifetime
- 1990-08-15 DE DE69018732T patent/DE69018732T2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0413567A2 (en) | 1991-02-20 |
DE69018732D1 (en) | 1995-05-24 |
US5111469A (en) | 1992-05-05 |
DE69018732T2 (en) | 1995-08-31 |
EP0413567A3 (en) | 1991-10-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0413567B1 (en) | Semiconductor lasers | |
US5737474A (en) | Semiconductor optical device | |
EP0044571B1 (en) | Semiconductor laser device | |
US4841532A (en) | Semiconductor laser | |
US6865202B2 (en) | Semiconductor laser element | |
JPH0888439A (en) | Semiconductor laser and its production | |
CA1196078A (en) | Double channel planar buried heterostructure laser with periodic structure formed in guide layer | |
EP0155151B1 (en) | A semiconductor laser | |
US5255280A (en) | Semiconductor laser | |
JP2912624B2 (en) | Semiconductor laser device | |
US4758535A (en) | Method for producing semiconductor laser | |
EP0291936A2 (en) | Semiconductor Laser | |
JPH0416032B2 (en) | ||
EP0616399B1 (en) | Laser diode and process for producing the same | |
JP2990837B2 (en) | Semiconductor laser | |
JP2822470B2 (en) | Semiconductor laser | |
JPH0786676A (en) | Semiconductor laser | |
JPH0394490A (en) | Semiconductor laser element | |
JPH0578810B2 (en) | ||
JPS6234473Y2 (en) | ||
JPH0272688A (en) | Semiconductor laser element | |
JPH0587997B2 (en) | ||
JPS59125686A (en) | Semiconductor laser | |
JPH0983077A (en) | Semiconductor optical device | |
JPS62165389A (en) | Semiconductor laser |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB |
|
17P | Request for examination filed |
Effective date: 19920215 |
|
17Q | First examination report despatched |
Effective date: 19930622 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB |
|
REF | Corresponds to: |
Ref document number: 69018732 Country of ref document: DE Date of ref document: 19950524 |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19960806 Year of fee payment: 7 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19970815 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19970815 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20020808 Year of fee payment: 13 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20020821 Year of fee payment: 13 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040302 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040430 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |