EP0403781A3 - Appareil pour la régulation de la température de dispositifs électroniques - Google Patents

Appareil pour la régulation de la température de dispositifs électroniques Download PDF

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Publication number
EP0403781A3
EP0403781A3 EP19900109002 EP90109002A EP0403781A3 EP 0403781 A3 EP0403781 A3 EP 0403781A3 EP 19900109002 EP19900109002 EP 19900109002 EP 90109002 A EP90109002 A EP 90109002A EP 0403781 A3 EP0403781 A3 EP 0403781A3
Authority
EP
European Patent Office
Prior art keywords
electronic devices
temperature control
thermal transfer
service
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19900109002
Other languages
German (de)
English (en)
Other versions
EP0403781A2 (fr
Inventor
Kurt R. Grebe
Robert E. Schwall
Ho-Ming Tong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0403781A2 publication Critical patent/EP0403781A2/fr
Publication of EP0403781A3 publication Critical patent/EP0403781A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP19900109002 1989-06-23 1990-05-12 Appareil pour la régulation de la température de dispositifs électroniques Withdrawn EP0403781A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US370437 1989-06-23
US07/370,437 US4970868A (en) 1989-06-23 1989-06-23 Apparatus for temperature control of electronic devices

Publications (2)

Publication Number Publication Date
EP0403781A2 EP0403781A2 (fr) 1990-12-27
EP0403781A3 true EP0403781A3 (fr) 1991-11-13

Family

ID=23459670

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900109002 Withdrawn EP0403781A3 (fr) 1989-06-23 1990-05-12 Appareil pour la régulation de la température de dispositifs électroniques

Country Status (3)

Country Link
US (1) US4970868A (fr)
EP (1) EP0403781A3 (fr)
JP (1) JPH073847B2 (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5251095A (en) * 1992-07-31 1993-10-05 International Business Machines Corporation Low temperature conduction module for a cryogenically-cooled processor
US5861574A (en) * 1993-04-14 1999-01-19 Fujitsu Limited Apparatus for mounting a superconducting element
JP3094780B2 (ja) * 1994-04-05 2000-10-03 株式会社日立製作所 電子装置
US5471844A (en) * 1994-11-18 1995-12-05 The United States Of America As Represented By The Secretary Of The Air Force High dissipation packaging for cryogenic integrated circuits
US5818097A (en) * 1995-01-05 1998-10-06 Superconductor Technologies, Inc. Temperature controlling cryogenic package system
US5757243A (en) * 1995-05-25 1998-05-26 Matsushita Electric Industrial Co., Ltd. High frequency system including a superconductive device and temperature controlling apparatus
TW327672B (en) * 1995-10-05 1998-03-01 Babcock & Wilcox Co Field serviceable fill tube for use on heat pipes
US5787713A (en) * 1996-06-28 1998-08-04 American Superconductor Corporation Methods and apparatus for liquid cryogen gasification utilizing cryoelectronics
US6023934A (en) * 1996-08-16 2000-02-15 American Superconductor Corp. Methods and apparatus for cooling systems for cryogenic power conversion electronics
US6173577B1 (en) 1996-08-16 2001-01-16 American Superconductor Corporation Methods and apparatus for cooling systems for cryogenic power conversion electronics
US5806318A (en) * 1996-12-30 1998-09-15 Biomagnetic Technologies, Inc. Cooling using a cryogenic liquid and a contacting gas
US5857342A (en) * 1998-02-10 1999-01-12 Superconductor Technologies, Inc. Temperature controlling cryogenic package system
US6237682B1 (en) * 1999-04-30 2001-05-29 Motorola, Inc. Cooling module including a pressure relief mechanism
EP1217708A1 (fr) * 2000-12-21 2002-06-26 Abb Research Ltd. Dispositif supraconducteur
US6988531B2 (en) * 2002-01-11 2006-01-24 Intel Corporation Micro-chimney and thermosiphon die-level cooling
US20040118144A1 (en) * 2002-12-20 2004-06-24 Hsu John S. Hermetic inverter/converter chamber with multiple pressure and cooling zones
DE04752947T1 (de) * 2003-05-23 2006-11-16 Bio-Rad Laboratories, Inc., Hercules Lokalisierte temperaturregelung für raumanordnungen von reaktionsmedien
US20050155354A1 (en) * 2004-01-21 2005-07-21 Hsieh Hsin-Mao Heat radiator
US20060187639A1 (en) * 2005-02-23 2006-08-24 Lytron, Inc. Electronic component cooling and interface system
FR2926629B1 (fr) * 2008-01-21 2010-04-02 Bruker Biospin Sa Dispositif d'echangeur thermique et installation rmn comprenant un tel dispositif
US11156235B2 (en) * 2012-07-05 2021-10-26 Tai-Her Yang Thermal transferring method and structural device utilizing thermal energy body performing vibration displacement (relative) to fluid
US8947873B2 (en) 2012-11-26 2015-02-03 International Business Machines Corporation Immersion-cooled and conduction-cooled electronic system
US9332674B2 (en) 2013-10-21 2016-05-03 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components
US9282678B2 (en) 2013-10-21 2016-03-08 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
US9927152B2 (en) * 2014-11-04 2018-03-27 Goodrich Corporation Multi-dewar cooling system
JP2018088433A (ja) * 2016-11-28 2018-06-07 富士通株式会社 冷却システム及び電子機器の冷却方法
JP6939034B2 (ja) * 2017-04-05 2021-09-22 富士通株式会社 冷却システム、冷却装置、及び電子システム
US10785891B1 (en) * 2019-06-17 2020-09-22 Microsoft Technology Licensing, Llc Superconducting computing system in a liquid hydrogen environment
TWI756618B (zh) * 2020-01-15 2022-03-01 緯穎科技服務股份有限公司 浸沒式冷卻設備

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624381A (ja) * 1985-06-29 1987-01-10 Toshiba Corp 極低温装置
WO1988009055A1 (fr) * 1987-05-07 1988-11-17 Ncr Corporation Elements en carbone permettant la connexion a un circuit integre refroidi par immersion dans un liquide

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5375554A (en) * 1976-12-16 1978-07-05 Meidensha Electric Mfg Co Ltd Cooling system
JPS5852153B2 (ja) * 1977-02-01 1983-11-21 株式会社明電舎 冷却装置
US4223540A (en) * 1979-03-02 1980-09-23 Air Products And Chemicals, Inc. Dewar and removable refrigerator for maintaining liquefied gas inventory
US4369636A (en) * 1981-07-06 1983-01-25 General Atomic Company Methods and apparatus for reducing heat introduced into superconducting systems by electrical leads
US4766741A (en) * 1987-01-20 1988-08-30 Helix Technology Corporation Cryogenic recondenser with remote cold box
US4739622A (en) * 1987-07-27 1988-04-26 Cryogenics International, Inc. Apparatus and method for the deep cryogenic treatment of materials

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624381A (ja) * 1985-06-29 1987-01-10 Toshiba Corp 極低温装置
WO1988009055A1 (fr) * 1987-05-07 1988-11-17 Ncr Corporation Elements en carbone permettant la connexion a un circuit integre refroidi par immersion dans un liquide

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM Technical Disclosure Bulletin, Vol. 18, No. 4, September 1975, New York US, pages 1226-1229; V. RIDEOUT: "Close-cycle liquid nitrogen refrigeration system for low-temperature computer operation". *
PATENT ABSTRACTS OF JAPAN, Vol. 11, No. 171 (E-512) 02 June 1987; & JP-A-62 004 381 (TOSHIBA CORP.) 10 January 1987 *

Also Published As

Publication number Publication date
JPH0334562A (ja) 1991-02-14
JPH073847B2 (ja) 1995-01-18
EP0403781A2 (fr) 1990-12-27
US4970868A (en) 1990-11-20

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