EP0391628A2 - Verbesserungen an und in Verbindung mit Bodenplatten - Google Patents

Verbesserungen an und in Verbindung mit Bodenplatten Download PDF

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Publication number
EP0391628A2
EP0391628A2 EP90303449A EP90303449A EP0391628A2 EP 0391628 A2 EP0391628 A2 EP 0391628A2 EP 90303449 A EP90303449 A EP 90303449A EP 90303449 A EP90303449 A EP 90303449A EP 0391628 A2 EP0391628 A2 EP 0391628A2
Authority
EP
European Patent Office
Prior art keywords
panel
edging strip
edge
strip
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP90303449A
Other languages
English (en)
French (fr)
Other versions
EP0391628A3 (de
Inventor
Robert Stevens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thorsman and Co UK Ltd
Original Assignee
Thorsman and Co UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thorsman and Co UK Ltd filed Critical Thorsman and Co UK Ltd
Publication of EP0391628A2 publication Critical patent/EP0391628A2/de
Publication of EP0391628A3 publication Critical patent/EP0391628A3/de
Withdrawn legal-status Critical Current

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/024—Sectional false floors, e.g. computer floors
    • E04F15/02405—Floor panels
    • E04F15/02435—Sealing joints

Definitions

  • This invention concerns floor panels and, in particular, floor panels of the type used in access flooring systems, wherein the panels, usually rectangular, are supported on pedestals from a base or sub-floor usually at corners of the panels.
  • each panel has a tray of conductive plastics material laid thereon, which tray is filled with the vinyl flooring material.
  • the conductive plastics tray therefor provides a conductive surround for each panel and the earthing pathway continues from the conductive plastics material through the metal panel members and its supporting pedestals.
  • an edging strip suitable for floor panels which edging strip provides a conductive path way from the upper surface of the flooring panel and/or a seal between adjacent floor panels.
  • the edge strip of the invention will be made of conductive material, preferably conductive plastics material and will have a first face that abuts the panel edge and a second face generally parallel to the first face, the first and second faces defining therebetween an upper part that will extend upwards at least to the upper surface of the flooring panel and a second resiliently deformable depending part which is shaped to provide a lateral protrusion whereby that part will be deformed by contact with a corresponding protrusion of an adjacent edge strip or another surface.
  • the resiliently deformable depending part of the edging strip is preferably of thinner section than the upper part thereof.
  • the edge strip need only extend to the upper surface of the flooring panel but for flooring panels to be covered with vinyl flooring material, such as for computer room applications, the edge strip will preferably extend above the upper surface of the flooring panel to the height of the vinyl flooring material.
  • the edging strip of the invention will provide a conductive material frame for each panel.
  • the floor panels to be used with the edging strip of the invention preferably comprise a metal tray and a metal lid adhered on opposite faces of an infill material leaving an upper part of an edge of the infill material exposed so that the edging strip of the invention can be attached thereto.
  • the preferred edging strips of the invention have their resiliently deformable part of thinner section than the upper part, so that the preferred panels for use therewith have their tray edges extending beyond the boundary of their lids, so that both the lids and trays can make edge contact with the edging strips to provide a continuous conductive pathway from the panel surface through the edging strips and the trays to the floor system pedestals either directly or via conductive material panel corner supports on the pedestals, which supports are the subject of our copending application No. 8907414
  • the panels edging strips 24 have a first face 26 and a second face 28 which are generally parallel except where the strip thins at around its mid height 30. Just above the mid height of the strip and extending from the first face 26 is a continuous strip 32 of fir tree section which is retained in the panel edge groove 22 to retain the panel edge strip in position.
  • the upper parts 33 of panel edging strips around a panel provide a surround for each panel or flooring material on the panel as is mentioned below.
  • the panel edge strip thins to form a resiliently deformable depending part 34 that is curved at its end to provide a protrusion 36 relative to the second face 28 thereof, so that when second faces of adjacent strips abut their lower parts are deformed but due to their resilience press against each other to provide a seal therebetween.
  • the panel tray edge extends beyond the edge of the panel lid to take account of the thinning of the panel edge strip from its upper part to its lower part in order to provide metal to conductive plastics contact for a conductive path between the metal lid of the panel through the conductive plastics edging strip and the metal tray of the panel.
  • Figure 1 that is not necessarily important since the flooring panels are covered with carpet tiles 40 and the edge strip does not extend beyond the floor panel lids.
  • Figure 2 which shows a flooring system suitable for computer room applications, the edging strips extend above the floor panel lids to provide conductive material surrounds 42 for vinyl flooring tiles 44 or other vinyl flooring material laid within those surrounds.

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • General Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Floor Finish (AREA)
EP19900303449 1989-04-01 1990-03-30 Verbesserungen an und in Verbindung mit Bodenplatten Withdrawn EP0391628A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8907415 1989-04-01
GB898907415A GB8907415D0 (en) 1989-04-01 1989-04-01 Improvements in and relating to floor panels

Publications (2)

Publication Number Publication Date
EP0391628A2 true EP0391628A2 (de) 1990-10-10
EP0391628A3 EP0391628A3 (de) 1991-04-10

Family

ID=10654348

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900303449 Withdrawn EP0391628A3 (de) 1989-04-01 1990-03-30 Verbesserungen an und in Verbindung mit Bodenplatten

Country Status (2)

Country Link
EP (1) EP0391628A3 (de)
GB (2) GB8907415D0 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202007017238U1 (de) 2007-12-10 2009-04-16 Lindner Ag Elementensatz und Bodenplatte für einen Bodenaufbau
DE202007017236U1 (de) 2007-12-10 2009-04-16 Lindner Ag Elementensatz und Bodenplatte für einen Bodenaufbau
DE202007017235U1 (de) 2007-12-10 2009-04-16 Lindner Ag Elementensatz und Bodenplatte für einen Bodenaufbau

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2330592B (en) * 1997-10-16 2001-07-18 Coseley Panel Products Ltd A cladding panel system
EP1606473A1 (de) * 2003-03-24 2005-12-21 Kingspan Holdings (IRL) Limited Bodenplatte mit dichtlippe

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1915552A1 (de) * 1968-04-04 1970-04-16 Central Flooring Stoke Ltd Fussboden
US4085557A (en) * 1976-06-01 1978-04-25 James A. Tharp Raised access floor system
DE3012470A1 (de) * 1980-03-31 1981-10-08 Schmidt Reuter Ingenieurgesellschaft mbH & Co KG, 5000 Köln Verfahren und vorrichtung zur herstellung einer aus einzelnen montageplatten gebildeten boden-, wand- oder deckenflaeche mit einem belag

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1915552A1 (de) * 1968-04-04 1970-04-16 Central Flooring Stoke Ltd Fussboden
US4085557A (en) * 1976-06-01 1978-04-25 James A. Tharp Raised access floor system
DE3012470A1 (de) * 1980-03-31 1981-10-08 Schmidt Reuter Ingenieurgesellschaft mbH & Co KG, 5000 Köln Verfahren und vorrichtung zur herstellung einer aus einzelnen montageplatten gebildeten boden-, wand- oder deckenflaeche mit einem belag

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202007017238U1 (de) 2007-12-10 2009-04-16 Lindner Ag Elementensatz und Bodenplatte für einen Bodenaufbau
DE202007017236U1 (de) 2007-12-10 2009-04-16 Lindner Ag Elementensatz und Bodenplatte für einen Bodenaufbau
DE202007017235U1 (de) 2007-12-10 2009-04-16 Lindner Ag Elementensatz und Bodenplatte für einen Bodenaufbau

Also Published As

Publication number Publication date
EP0391628A3 (de) 1991-04-10
GB2230285B (en) 1993-06-23
GB9007233D0 (en) 1990-05-30
GB2230285A (en) 1990-10-17
GB8907415D0 (en) 1989-05-17

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