EP0374429A1 - Process for reproducing a planar structured body - Google Patents
Process for reproducing a planar structured body Download PDFInfo
- Publication number
- EP0374429A1 EP0374429A1 EP89119817A EP89119817A EP0374429A1 EP 0374429 A1 EP0374429 A1 EP 0374429A1 EP 89119817 A EP89119817 A EP 89119817A EP 89119817 A EP89119817 A EP 89119817A EP 0374429 A1 EP0374429 A1 EP 0374429A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- electrically conductive
- impression material
- electrically insulating
- structured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000002604 ultrasonography Methods 0.000 claims abstract description 7
- 239000002131 composite material Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229920001169 thermoplastic Polymers 0.000 claims description 11
- 239000004416 thermosoftening plastic Substances 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 229930182556 Polyacetal Natural products 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920006324 polyoxymethylene Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 229910052759 nickel Inorganic materials 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010327 methods by industry Methods 0.000 description 1
- 230000027272 reproductive process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
Definitions
- the invention relates to a method for reproducing a structured, plate-shaped body, in particular a microstructured body, according to the preamble of the main claim.
- DE-PS 35 37 483 discloses a method for producing a multiplicity of plate-shaped microstructure bodies made of metal, in which negative molds of the microstructures are produced by repeated molding of a tool having the microstructures with an electrically insulating impression material and are galvanically filled with a metal, after which the negative forms are removed.
- the electrically insulating impression compound is connected to a further layer of electrically conductive impression compound, the thickness of the electrically insulating impression compound corresponding to the height of the microstructures in such a way that the electrically conductive impression compound contacts the end faces of the microstructures of the tool during the molding process.
- the tool is pressed into the layer of electrically insulating impression material until the end face of the microstructures of the tool touch the layer of electrically conductive impression material.
- FIG. 13 shows that the microstructures are pressed into the composite layer at 110 ° C. and the tool is only removed after the microstructures or the tool have cooled.
- the described method is particularly uneconomical for mass production, since the temperature cycle for pressing in the microstructures means additional process engineering and time expenditure.
- the layer height of the impression material must be exactly matched to the height of the microstructures of the tool.
- the pressing-in can only take place in the liquid or viscous state of the electrically insulating layer with a relatively large force development, since otherwise the risk of damage to the microstructures of the tool increases.
- Demoulding after the polymer solidifies requires a similarly high level of force. Therefore, release agents are usually added to the polymer. Since the polymer is in the solidified state during demolding, an extremely precise movement of the tool is necessary in order to enable the demolding without damaging the tool and the negative mold and to reduce the demolding forces.
- the object of the invention is to avoid the disadvantages mentioned.
- the pressing process of the tool into the impression material and the retraction of the tool should be simplified in such a way that the expenditure of force is significantly reduced and that heating and cooling steps can be dispensed with.
- the condition that the layer thickness of the electrically insulating impression material corresponds to the height of the structures to be molded should be eliminated.
- the object is achieved by the measures described in the characterizing part of the main claim.
- the composite layer is expediently produced in such a way that an electrically conductive layer is applied to a metal plate and is covered by a layer of an electrically insulating thermoplastic.
- the electrically conductive layer can consist of an electrically conductive particles such as. B. graphite-offset thermoplastics or consist of an electrically conductive thermoplastic or of a low-melting metal or a low-melting metal alloy.
- the materials polymethyl methacrylate, polycarbonate, polystyrene, PVC, ABS, polyacetal or polyamide can be used as the thermoplastic.
- thermoplastics can be used in the solidified state. A heating and cooling step is not necessary. The force required to press in and demold the structured body is significantly reduced. This reduces the risk of damage to the structured body and the body can be used for a higher number of reproductive processes. The precision effort for inserting the structured body right up to the interface between the electrically insulating and electrically conductive layer is eliminated; rather, the body is inserted into the composite layer until the end faces of the structure protrude into the electrically conductive layer.
- release agents can be dispensed with in many cases.
- the method according to the invention can thus be carried out considerably faster, less complex and thus more cost-effectively.
- honeycomb network 4 made of nickel, the z. B. was produced by the LIGA process (X-ray depths li thographie micro ga lvanoformung), reproduced many times.
- the honeycomb network has a honeycomb-like structure, the height of the honeycomb being 400 ⁇ m, the wall thickness 10 ⁇ m and the honeycomb width 100 ⁇ m.
- the honeycomb network forms a structured body with the outer dimensions 10 cm x 10 cm.
- the honeycomb network is connected to a stable metal plate 3 made of nickel. This can be done by overgrowing the structure during electroplating of the honeycomb network and covering it with a stable nickel layer.
- the stable metal plate is machined flat on the free side facing away from the honeycomb network.
- the plane-machined side of the stable metal plate is glued or soldered onto the sonotrode 1 of an ultrasonic welding machine, which is usually used for welding thermoplastics.
- the solder or adhesive connection 2 of the metal plate and sonotrode is indicated in FIG. 1.
- a composite body is produced.
- This electrically conductive layer is covered with an electrically insulating layer 5 made of non-cross-linked PMMA. The last two layers 5 and 6 form the composite layer.
- PMMA thermoplastic polymethyl methacrylate
- the composite body is placed with its aluminum layer 7 on the anvil 8 of the ultrasonic welding machine.
- the anvil is provided with vacuum suction openings 9.
- the honeycomb network 4 is introduced with ultrasound support through the sonotrode 1 into the composite layers 5 and 6 and then also pulled out of the composite layer again with ultrasound support.
- FIG. 2 shows the impression 10 of the honeycomb network in the composite layer.
- the honeycomb network has penetrated the electrically insulating layer 5 and has penetrated into the electrically conductive layer 6.
- the imprint 10 of the honeycomb network is then galvanically and nickel filled up, the composite body with the imprint 10 being connected as the cathode.
- the composite layer is then removed. This can be done, for example, with dichloromethane as the solvent, the graphite particles embedded in the electrically conductive layer 6 being rinsed away.
- the composite layer can also be removed by melting.
- the aluminum layer 7 comes off.
- the method can be modified.
- the composite body is also connected as a cathode.
- copper is first electroplated and only then is nickel.
- the reproduced honeycomb network thus obtained is treated with a means for the selective dissolution of copper, such as. B. a CuCl2 solution treated, the copper is selectively removed with embedded graphite particles.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
Die Erfindung betrifft ein Verfahren zur Reproduktion eines strukturierten, plattenförmigen Körpers, insbesondere eines Mikrostrukturkörpers, gemäß dem Oberbegriff des Hauptanspruchs.The invention relates to a method for reproducing a structured, plate-shaped body, in particular a microstructured body, according to the preamble of the main claim.
Aus der DE-PS 35 37 483 ist ein Verfahren zum Herstellen einer Vielzahl plattenförmiger Mikrostrukturkörper aus Metall bekannt, bei dem durch wiederholtes Abformen eines die Mikrostrukturen aufweisenden Werkzeugs mit einer elektrisch isolierenden Abformmasse Negativformen der Mikrostrukturen erzeugt werden, die galvanisch mit einem Metall aufgefüllt werden, wonach die Negativformen entfernt werden.DE-PS 35 37 483 discloses a method for producing a multiplicity of plate-shaped microstructure bodies made of metal, in which negative molds of the microstructures are produced by repeated molding of a tool having the microstructures with an electrically insulating impression material and are galvanically filled with a metal, after which the negative forms are removed.
Damit die auf diese Weise erzeugten Negativformen der Mikrostrukturen mit einem Metall aufgefüllt werden können, wird in der DE-PS 35 37 483 alternativ die folgende Methode vorgeschlagen:In order that the negative forms of the microstructures produced in this way can be filled with a metal, the following method is alternatively proposed in DE-PS 35 37 483:
Die elektrisch isolierende Abformmasse wird mit einer weiteren Schicht aus elektrisch leitender Abformmasse verbunden, wobei die Dicke der elektrisch isolierenden Abformmasse der Höhe der Mikrostrukturen entspricht in der Weise, daß die elektrisch leitende Abformmasse im Zuge des Abformens die Stirnflächen der Mikrostrukturen des Werkzeugs berührt.The electrically insulating impression compound is connected to a further layer of electrically conductive impression compound, the thickness of the electrically insulating impression compound corresponding to the height of the microstructures in such a way that the electrically conductive impression compound contacts the end faces of the microstructures of the tool during the molding process.
Das Werkzeug wird so weit in die Schicht aus elektrisch isolierender Abformmasse eingedrückt, bis die Stirnfläche der Mikrostrukturen des Werkzeugs die Schicht aus elektrisch leitender Abformmasse berühren.The tool is pressed into the layer of electrically insulating impression material until the end face of the microstructures of the tool touch the layer of electrically conductive impression material.
Aus der Beschreibung zu Fig. 13 geht hervor, daß die Mikrostrukturen bei 110° C in die Verbundschicht eingepreßt und erst nach dem Abkühlen der Mikrostrukturen bzw. des Werkzeugs das Werkzeug entfernt wird.The description of FIG. 13 shows that the microstructures are pressed into the composite layer at 110 ° C. and the tool is only removed after the microstructures or the tool have cooled.
Die beschriebene Methode ist insbesondere für eine Massenfertigung unwirtschaftlich, denn der Temperaturzyklus zum Einpressen der Mikrostrukturen bedeutet einen zusätzlichen verfahrenstechnischen und zeitlichen Aufwand. Die Schichthöhe der Abformmasse muß exakt auf die Höhe der Mikrostrukturen des Werkzeugs abgestimmt sein. Außerdem kann die Einpressung nur im flüssigen oder zähflüssigen Zustand der elektrisch isolierenden Schicht unter relativ großer Kraftentfaltung erfolgen, da sich sonst die Gefahr einer Beschädigung der Mikrostrukturen des Werkzeugs erhöht. Die Entformung nach dem Erstarren des Polymers erfordert eine ähnlich hohe Kraftanwendung. Deshalb werden dem Polymer üblicherweise Trennmittel beigemischt. Da das Polymer bei der Entformung im erstarrten Zustand vorliegt, ist eine äußerst präzise Bewegung des Werkzeugs notwendig, um die Entformung ohne Beschädigung des Werkzeugs und der Negativform zu ermöglichen und die Entformungskräfte zu reduzieren.The described method is particularly uneconomical for mass production, since the temperature cycle for pressing in the microstructures means additional process engineering and time expenditure. The layer height of the impression material must be exactly matched to the height of the microstructures of the tool. In addition, the pressing-in can only take place in the liquid or viscous state of the electrically insulating layer with a relatively large force development, since otherwise the risk of damage to the microstructures of the tool increases. Demoulding after the polymer solidifies requires a similarly high level of force. Therefore, release agents are usually added to the polymer. Since the polymer is in the solidified state during demolding, an extremely precise movement of the tool is necessary in order to enable the demolding without damaging the tool and the negative mold and to reduce the demolding forces.
Aufgabe der Erfindung ist, die genannten Nachteile zu vermeiden. Der Einpreßvorgang des Werkzeugs in die Abformmasse und das Zurückziehen des Werkzeugs soll in der Weise vereinfacht werden, daß der Kraftaufwand wesentlich reduziert wird und daß auf Aufheiz- und Kühlschritte verzichtet werden kann.The object of the invention is to avoid the disadvantages mentioned. The pressing process of the tool into the impression material and the retraction of the tool should be simplified in such a way that the expenditure of force is significantly reduced and that heating and cooling steps can be dispensed with.
Die Bedingung, daß die Schichtdicke der elektrisch isolierenden Abformmasse der Höhe der abzuformenden Strukturen entspricht, soll entfallen.The condition that the layer thickness of the electrically insulating impression material corresponds to the height of the structures to be molded should be eliminated.
Die Aufgabe wird durch die im kennzeichnenden Teil des Hauptanspruchs beschriebenen Maßnahmen gelöst.The object is achieved by the measures described in the characterizing part of the main claim.
Die Unteransprüche geben vorteilhafte Ausgestaltungen der Erfindung an.The subclaims indicate advantageous embodiments of the invention.
Es hat sich gezeigt, daß die Erzeugung einer Negativform wesentlich vereinfacht wird, wenn der strukturierte Körper mit Ultraschallunterstützung so weit in die Schicht aus elektrisch isolierender Abformmasse eingedrückt wird, bis die Stirnflächen seiner Stukturen in die elektrisch leitende Abformmasse hineinragen und wenn anschließend der strukturierte Körper mit Ultraschallunterstützung aus der Verbundschicht herausgezogen wird.It has been shown that the generation of a negative mold is considerably simplified if the structured body is pressed into the layer of electrically insulating impression material with ultrasound support until the end faces of its structures protrude into the electrically conductive impression material and if the structured body then also Ultrasound support is pulled out of the composite layer.
Die Verbundschicht wird zweckmäßigerweise so hergestellt, daß auf eine Metallplatte eine elektrisch leitende Schicht aufgebracht wird, die von einer Schicht eines elektrisch isolierenden Thermoplasts überdeckt wird. Die elektrisch leitende Schicht kann aus einem mit elektrisch leitenden Partikeln wie z. B. Graphit versetzten Thermoplasten oder aus einem an sich elektrisch leitenden Thermoplasten oder aus einem niedrig schmelzenden Metall oder einer niedrig schmelzenden Metall-Legierung bestehen. Als Thermoplast können die Materialien Polymethylmethacrylat, Polycarbonat, Polystyrol, PVC, ABS, Polyacetal oder Polyamid verwendet werden.The composite layer is expediently produced in such a way that an electrically conductive layer is applied to a metal plate and is covered by a layer of an electrically insulating thermoplastic. The electrically conductive layer can consist of an electrically conductive particles such as. B. graphite-offset thermoplastics or consist of an electrically conductive thermoplastic or of a low-melting metal or a low-melting metal alloy. The materials polymethyl methacrylate, polycarbonate, polystyrene, PVC, ABS, polyacetal or polyamide can be used as the thermoplastic.
Das erfindungsgemäße Verfahren weist gegenüber dem Stand der Technik folgende wesentliche Vorzüge auf:The method according to the invention has the following essential advantages over the prior art:
Die Thermoplaste können in erstarrtem Zustand angewendet werden. Ein Aufheiz- und Abkühlschritt ist nicht notwendig. Die Kraft, die zum Einpressen und zum Entformen des strukturierten Körpers notwendig ist, wird wesentlich reduziert. Dadurch verringert sich die Gefahr einer Beschädigung des strukturierten Körpers und der Körper kann für eine höhere Anzahl von Reproduktionsvorgängen verwendet werden. Der Präzisionsaufwand zum Einführen des strukturierten Körpers bis genau an die Grenzfläche zwischen elektrisch isolierender und elektrisch leitender Schicht entfällt; vielmehr wird der Körper soweit in die Verbundschicht eingeführt, bis die Stirnflächen der Struktur in die elektrisch leitfähige Schicht hineinragen.The thermoplastics can be used in the solidified state. A heating and cooling step is not necessary. The force required to press in and demold the structured body is significantly reduced. This reduces the risk of damage to the structured body and the body can be used for a higher number of reproductive processes. The precision effort for inserting the structured body right up to the interface between the electrically insulating and electrically conductive layer is eliminated; rather, the body is inserted into the composite layer until the end faces of the structure protrude into the electrically conductive layer.
Auf die Verwendung von Trennmitteln kann in vielen Fällen verzichtet werden.The use of release agents can be dispensed with in many cases.
Damit kann das erfindungsgemäße Verfahren wesentlich schneller, weniger aufwendig und somit kostengünstiger durchgeführt werden.The method according to the invention can thus be carried out considerably faster, less complex and thus more cost-effectively.
Das erfindungsgemäße Verfahren wird im folgenden anhand eines Durchführungsbeispiels und den Fig. 1 und 2 näher erläutert.The method according to the invention is explained in more detail below with the aid of an exemplary embodiment and FIGS. 1 and 2.
Es soll ein Wabennetz 4 aus Nickel, das z. B. nach dem LIGA-Verfahren (Röntgentiefenlithographie-Mikrogalvanoformung) hergestellt wurde, vielfach reproduziert werden. Das Wabennetz weist eine honigwabenartige Struktur auf, wobei die Höhe der Waben 400 µm, die Wandstärke 10 µm und die Wabenweite 100 µm betragen.It is a
Das Wabennetz bildet einen strukturierten Körper mit den äußeren Abmessungen 10 cm x 10 cm.The honeycomb network forms a structured body with the
Zuerst wird das Wabennetz mit einer stabilen Metallplatte 3 aus Nickel verbunden. Dies kann dadurch erfolgen, daß beim Galvanoformen des Wabennetzes die Struktur überwachsen und mit einer stabilen Nickelschicht überdeckt wird.First, the honeycomb network is connected to a
Die stabile Metallplatte wird auf der freien, dem Wabennetz abgewandten Seite mechanisch plan bearbeitet.The stable metal plate is machined flat on the free side facing away from the honeycomb network.
Die stabile Metallplatte wird mit ihrer plan bearbeiteten Seite auf die Sonotrode 1 einer Ultraschall-Schweißmaschine, die üblicherweise zum Schweißen von Thermoplasten verwendet wird, geklebt oder gelötet. Die Löt- oder Klebverbindung 2 von Metallplatte und Sonotrode ist in Fig. 1 angedeutet.The plane-machined side of the stable metal plate is glued or soldered onto the
In einem weiteren Verfahrensschritt wird ein Verbundkörper hergestellt. Auf die Aluminiumschicht 7 wird eine elektrisch leitfähige Schicht 6 des Thermoplasten Polymethylmethacrylat (PMMA), der mit elektrisch leitfähigen Graphitpartikeln versetzt ist, durch Aufgießen aufgebracht. Diese elektrisch leitfähige Schicht wird mit einer elektrisch isolierenden Schicht 5 aus nicht vernetztem PMMA überdeckt. Die beiden letztgenannten Schichten 5 und 6 bilden die Verbundschicht.In a further process step, a composite body is produced. An electrically
Der Verbundkörper wird mit seiner Aluminiumschicht 7 auf den Amboß 8 der Ultraschall-Schweißmaschine gelegt. Der Amboß ist mit Vakuum-Ansaugöffnungen 9 versehen.The composite body is placed with its
Das Wabennetz 4 wird mit Ultraschallunterstützung durch die Sonotrode 1 in die Verbundschicht 5 und 6 eingeführt und anschließend ebenfalls mit Ultraschallunterstützung wieder aus der Verbundschicht herausgezogen.The
Fig. 2 zeigt den Abdruck 10 des Wabennetzes in der Verbundschicht. Das Wabennetz hat die elektrisch isolierende Schicht 5 durchstoßen und ist in die elektrisch leitfähige Schicht 6 eingedrungen.2 shows the
Der Abdruck 10 des Wabennetzes wird anschließend galvanisch und Nickel aufgefüllt, wobei der Verbundkörper mit dem Abdruck 10 als Kathode geschaltet wird. Die Verbundschicht wird anschließend entfernt. Dies kann beispielsweise mit Dichlormethan als Lösungsmittel erfolgen, wobei die in der elektrisch leitenden Schicht 6 eingelagerten Graphitpartikel fortgespült werden.The
Die Verbundschicht kann jedoch auch durch Ausschmelzen entfernt werden.However, the composite layer can also be removed by melting.
Dabei löst sich die Aluminiumschicht 7 ab.The
Als Ergebnis wird ein reproduziertes Wabennetz aus Nickel enthalten.As a result, a reproduced nickel honeycomb network will be included.
Für den Fall, daß am unteren Ende des Wabennetzes noch Graphitpartikel anhaften oder teilweise in Nickel eingebettet sind, kann das Verfahren modifiziert werden.In the event that graphite particles still adhere to the lower end of the honeycomb network or are partially embedded in nickel, the method can be modified.
In diesem Fall wird der Verbundkörper ebenfalls als Kathode geschaltet. In den Abdruck 10 des Wabennetzes wird jedoch zuerst Kupfer und erst danach Nickel galvanisch abgeschieden.In this case, the composite body is also connected as a cathode. In the
Das so erhaltende reproduzierte Wabennetz wird mit einem Mittel zur selektiven Auflösung von Kupfer, wie z. B. einer CuCl₂-Lösung, behandelt, wobei das Kupfer mit etwa eingebetteten Graphitpartikeln selektiv entfernt wird.The reproduced honeycomb network thus obtained is treated with a means for the selective dissolution of copper, such as. B. a CuCl₂ solution treated, the copper is selectively removed with embedded graphite particles.
Claims (4)
- ein Verbundkörper hergestellt wird, indem eine Schicht aus elektrisch isolierender Abformmasse mit einer Schicht aus elektrisch leitender Abformmasse überdeckt wird,
- der strukturierte Körper soweit in die Schicht aus elektrisch isolierender Abformmasse eingedrückt wird, bis die Stirnflächen der Struktur des strukturierten Körpers mit der Schicht aus elektrisch leitender Abformmasse in Kontakt stehen,
- die so erzeugte Negativform der Struktur im Verbundkörper galvanisch mit einem Metall ausgefüllt wird, wonach
- der Verbundkörper entfernt wird,
dadurch gekennzeichnet, daß
- der strukturierte Körper mit Ultraschallunterstützung so weit in die Schicht aus elektrisch isolierender Abformmasse eingedrückt wird, bis die Stirnflächen seiner Strukturen in die elektrisch leitende Abformmasse hineinragen, wonach
- der strukturierte Körper mit Ultraschallunterstützung aus dem Verbundkörper herausgezogen wird.1. Process for the reproduction of a structured, plate-shaped body, in particular a microstructured body, in which
a composite body is produced by covering a layer of electrically insulating impression material with a layer of electrically conductive impression material,
the structured body is pressed into the layer of electrically insulating impression material until the end faces of the structure of the structured body are in contact with the layer of electrically conductive impression material,
- The thus generated negative form of the structure in the composite body is galvanically filled with a metal, after which
the composite body is removed,
characterized in that
- The structured body with ultrasound support is pressed into the layer of electrically insulating impression material until the end faces of its structures protrude into the electrically conductive impression material, after which
- The structured body is pulled out of the composite body with ultrasound support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT89119817T ATE78524T1 (en) | 1988-12-17 | 1989-10-25 | METHOD OF REPRODUCTION OF A STRUCTURED PLATE-FORM BODY. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3842611 | 1988-12-17 | ||
| DE3842611A DE3842611C1 (en) | 1988-12-17 | 1988-12-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0374429A1 true EP0374429A1 (en) | 1990-06-27 |
| EP0374429B1 EP0374429B1 (en) | 1992-07-22 |
Family
ID=6369460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP89119817A Expired - Lifetime EP0374429B1 (en) | 1988-12-17 | 1989-10-25 | Process for reproducing a planar structured body |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4981558A (en) |
| EP (1) | EP0374429B1 (en) |
| JP (1) | JPH02197592A (en) |
| AT (1) | ATE78524T1 (en) |
| DE (1) | DE3842611C1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19709137B4 (en) * | 1997-03-06 | 2005-12-15 | INSTITUT FüR MIKROTECHNIK MAINZ GMBH | Method for producing and storing at least one metallic microcomponent |
| FR2793432B1 (en) * | 1999-05-10 | 2001-07-06 | Gemplus Card Int | METHOD FOR PRODUCING A CONTACT BETWEEN TWO CONDUCTIVE LAYERS SEPARATED BY AN INSULATING LAYER |
| US7090189B2 (en) * | 2001-01-17 | 2006-08-15 | Sandia National Laboratories | Compliant cantilevered micromold |
| US6422528B1 (en) * | 2001-01-17 | 2002-07-23 | Sandia National Laboratories | Sacrificial plastic mold with electroplatable base |
| DE10106135B4 (en) * | 2001-02-10 | 2005-03-10 | Micromotion Gmbh | Process for producing galvanically moldable negative forms of microstructured bodies, in particular gears |
| JP5143045B2 (en) * | 2008-07-09 | 2013-02-13 | 富士フイルム株式会社 | Fine structure and manufacturing method thereof |
| DE102012206097A1 (en) | 2012-04-13 | 2013-10-17 | Robert Bosch Gmbh | Method for manufacturing metal structure e.g. movable metallic microstructure, involves galvanizing metal structure on surface of substrate so that shaped portion and substrate are formed with structured surface formed by column matrix |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0033862A1 (en) * | 1980-01-28 | 1981-08-19 | BASF Aktiengesellschaft | Process for producing a moulded article from pulverulent to granular thermoplastic synthetics |
| US4541977A (en) * | 1982-02-26 | 1985-09-17 | Kernforschungszentrum Karlsruhe Gmbh | Method for producing separating nozzle elements |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3537483C1 (en) * | 1985-10-22 | 1986-12-04 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Process for producing a large number of plate-shaped microstructure bodies made of metal |
-
1988
- 1988-12-17 DE DE3842611A patent/DE3842611C1/de not_active Expired - Fee Related
-
1989
- 1989-10-25 EP EP89119817A patent/EP0374429B1/en not_active Expired - Lifetime
- 1989-10-25 AT AT89119817T patent/ATE78524T1/en not_active IP Right Cessation
- 1989-12-13 JP JP1321573A patent/JPH02197592A/en active Pending
- 1989-12-18 US US07/452,030 patent/US4981558A/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0033862A1 (en) * | 1980-01-28 | 1981-08-19 | BASF Aktiengesellschaft | Process for producing a moulded article from pulverulent to granular thermoplastic synthetics |
| US4541977A (en) * | 1982-02-26 | 1985-09-17 | Kernforschungszentrum Karlsruhe Gmbh | Method for producing separating nozzle elements |
Also Published As
| Publication number | Publication date |
|---|---|
| ATE78524T1 (en) | 1992-08-15 |
| DE3842611C1 (en) | 1990-02-22 |
| US4981558A (en) | 1991-01-01 |
| EP0374429B1 (en) | 1992-07-22 |
| JPH02197592A (en) | 1990-08-06 |
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