EP0364361A1 - Thermischer Verteiler mit Wärmerohren - Google Patents

Thermischer Verteiler mit Wärmerohren Download PDF

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Publication number
EP0364361A1
EP0364361A1 EP89402810A EP89402810A EP0364361A1 EP 0364361 A1 EP0364361 A1 EP 0364361A1 EP 89402810 A EP89402810 A EP 89402810A EP 89402810 A EP89402810 A EP 89402810A EP 0364361 A1 EP0364361 A1 EP 0364361A1
Authority
EP
European Patent Office
Prior art keywords
heat
forming
thermal
distributor according
thermal distributor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89402810A
Other languages
English (en)
French (fr)
Other versions
EP0364361B1 (de
Inventor
Denis Clodic
Robert Dehausse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Association pour la Recherche et le Developpement des Methodes et Processus Industriels
Original Assignee
Association pour la Recherche et le Developpement des Methodes et Processus Industriels
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Filing date
Publication date
Application filed by Association pour la Recherche et le Developpement des Methodes et Processus Industriels filed Critical Association pour la Recherche et le Developpement des Methodes et Processus Industriels
Priority to AT89402810T priority Critical patent/ATE75027T1/de
Publication of EP0364361A1 publication Critical patent/EP0364361A1/de
Application granted granted Critical
Publication of EP0364361B1 publication Critical patent/EP0364361B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B33/00Boilers; Analysers; Rectifiers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06Control arrangements therefor

Definitions

  • the present invention relates to a heat distributor with heat pipes intended to ensure a predetermined distribution of heat between a single heat source and several heat sinks at different temperatures and absorbed powers.
  • a particular embodiment of a thermal distributor with heat pipes is used in a heat pipe boiler of an absorption-diffusion machine described in patent FR-A-2 602 317.
  • This boiler comprises two heat pipes, the end portions of which form evaporators are close to a heat source and the two opposite end parts, forming condensers, are in intimate contact with two heat sinks constituted respectively by the reboiler and a bubble pump tube located outside the reboiler.
  • Such a device makes it possible to obtain different temperature levels in the two extreme parts forming condensers of the two heat pipes and therefore different heat transfers.
  • the present invention relates to improvements made to a thermal distributor of the aforementioned type allowing the temperatures and powers absorbed by the various heat sinks to be fixed with precision beforehand so that they operate under optimal conditions.
  • this heat pipe heat distributor intended to ensure a predetermined distribution of heat between at least one heat source and several heat sinks at different temperatures and absorbed powers, comprising at least one heat pipe per heat sink, the extreme part of which forms an evaporator. placed in the vicinity of the heat source and the opposite end part forming the condenser is placed in intimate contact with the heat sink, is characterized in that the lower end parts forming the heat pipe evaporators are integral with an envelope of heat conductive material surrounding the heat source, by being in intimate contact with this envelope, or they constitute by themselves such an envelope.
  • the heat pipe distributor shown in Figures 1 and 2 has two parallel heat pipes 1,2 extending vertically.
  • This embodiment of the invention is in no way limiting and the thermal distributor could include more than two heat pipes, which may or may not be parallel to each other.
  • Each of the heat pipes 1, 2 has a tubular envelope closed at its two ends, in which a vacuum has been created and which has then been partially filled with a fluid such as water, ammonia, sodium, etc. ..
  • the heat pipe fluid is under its vapor pressure and any heat supply at a point where there is liquid causes this liquid to boil, the vapor thus formed condensing at the place where the heat pipe is in contact with a heat sink.
  • the boiling zone must be situated at a lower level or at the same level as the condensation zone.
  • the heat pipes 1,2 respectively have lower end portions 1a, 2a forming evaporators and upper end portions 1b, 2b forming condensers.
  • the lower end portions 1a, 2a forming evaporators of the heat pipes 1, 2 are engaged and held firmly in a block 3 of heat-conducting material, constituting the thermal distributor proper.
  • the block 3 constituting the thermal distributor is advantageously produced in two parts assembled together, namely a relatively thick main body 3a on which is pressed and immobilized, by means of screws 4, a cover front plate 3b.
  • the lower end parts 1a, 2a forming evaporators of the heat pipes 1,2 are engaged in respective vertical housings 5,5a which are formed in the joint plane between the body 3a and the front plate 3b.
  • Each of the housings 5,5a has a circular cross section and it is constituted by two semi-circular grooves facing each other, which are hollowed respectively in the two faces in contact with the body 3a and the plate 3b.
  • the thermal distributor 3 could consist of a single piece block in which would be drilled the housings 5,5a receiving the lower end portions 1a, 2a forming evaporators with or without a conductor station.
  • the body 3a of the thermal distributor 3 is also formed a vertical housing 6 intended to receive a heat source 7 or constituting this heat source.
  • the heat source can be constituted by an electric heating resistor engaged in the housing 6 or even by a gas or oil burner whose combustion gases pass through the housing 6. It is also possible to use, to heat the housing 6, thermal discharges such as exhaust gases from an engine, any exchanger, a solar absorber, etc.
  • the body 3a could comprise several housings 6 for several different heat sources but only one of which would be put into operation at a time, according to the needs.
  • the housings 5,5a receiving the lower end parts 1a, 2a forming evaporators and the housing 6 for the heat source may consist of vertical holes passing right through the block of the thermal distributor 3, as shown in FIGS. 1 and 2, or alternatively they may be formed by blind holes.
  • the upper end portions 1b, 2b forming condensers of the heat pipes 1,2 are respectively related to two heat sinks 8,9 at respective temperatures T1, T2. Thereby the respective temperature levels T1, T2 of the heat sinks 8, 9 determine the different temperature levels of the upper end portions 1b, 2b forming condensers.
  • This characteristic results from the fact that the fluid of the heat pipes 1,2 is substantially under its vapor pressure and at a given temperature level a determined pressure level is established.
  • the dew curve of the fluid adapts to the temperature level of the heat sink 8, 9 as long as it is below the critical pressure.
  • the heat source which is at a temperature T3 naturally higher than those T1, T2 of all the thermal wells 8, 9 emits heat which is transmitted through the block 3 of the thermal distributor to the lower end parts 1a, 2a forming evaporators by causing the liquid fluid in these parts of the heat pipes to boil.
  • the vapor of the fluid then condenses in the upper end portions 1b, 2b forming condensers, by giving up its heat to the heat sinks 8, 9.
  • the operating characteristics of each heat sink lead to a defined relationship between the temperature and the power received.
  • the thermal distributor 3 has the function of achieving heat transmission conditions such that all of the heat sinks 8, 9 operate under conditions suited to the desired objectives.
  • the working fluid of the two heat pipes 1,2 is the same, for example water, and that it is necessary to deliver heat to the heat sink 8 at a temperature level T1 of 200 ° C and to the heat sink 9 at a temperature level T2 of 150 ° C.
  • the power P1 to be delivered to the heat sink 8 at the temperature of 200 ° C is twice as large as the power P2 to be delivered to the heat sink 9 at 150 ° C.
  • the thermal distributor 3 makes it possible to easily and simply adjust the levels of the respective powers P1, P2 supplied to the heat sinks 8, 9.
  • the first power adjustment parameter is constituted by the distance between the lower end part 1a, 2a forming the heat pipe evaporator 1,2 and the single heat source represented by the housing 6. It can be seen in FIG. 2 that this housing 6 is closer to the housing 5 containing the heat pipe 1 whose upper end part 1b, 2b forming a condenser must be brought to the highest temperature of 200 ° C., than it is from the other housing 5a containing the another heat pipe 2 whose upper end part 1b, 2b forming a condenser must be brought to 150 ° C.
  • the second parameter on which we can play is the ratio between the evaporating surfaces, that is to say the surfaces of the lower end portions 1a, 2a forming evaporators which are in intimate contact with block 3 of the thermal distributor. It is possible to choose at will, for this purpose, different diameters for the heat pipes 1,2 and different lengths for the lower end parts 1a, 2a forming evaporators.
  • FIG. 1 it has been assumed that the lower end portion 2a forming the heat pipe evaporator 2 has a length 11 shorter than the length 12 of the lower end portion forming the heat pipe evaporator 1.
  • the third parameter on which we can play is constituted by the contact resistance between the envelopes of the heat pipes 1,2 and the walls of the housings 5,5a provided in the thermal distributor block 3.
  • a fourth parameter relates to the upper end portions 1b, 2b forming condensers.
  • the respective powers supplied to the thermal wells 8,9 can be adjusted by varying the contact surfaces between each heat pipe 1,2 and the thermal well 8,9 where it delivers heat.
  • the upper end part 1b forming the heat pipe condenser 1 has a length 13 which is greater than the length 14 of the upper extreme part 2b forming the heat pipe condenser 2.
  • FIGS. 3 and 4 illustrate an application of the thermal distributor 3 according to the invention to a heat pipe boiler of an absorption-diffusion machine as described in patent FR-A-2 602 317.
  • This device comprises a vertical reboiler 11 to which an external bubble pump tube 12 is connected, the reboiler 11 and the bubble pump tube 12 being in intimate contact with the upper end portions 1b, 2b forming condensers of the two heat pipes 1,2.
  • the thermal distributor block 3 consists of the body 3a in which is formed the vertical housing 6 which constitutes a combustion chamber traversed vertically by the combustion gases emitted for example by a gas burner 13 mounted below the thermal distributor block 3.
  • On the body 3a is fixed another body 3c, relatively thick, in which is formed a vertical housing 14 intended to receive another source of heat such as an electrical resistance.
  • the assembly of these bodies 3a, 3c is achieved by means of flanges through which locking screws 4 pass.
  • the thermal distributor 3 makes it possible to adjust the ratio between the powers supplied to the two heat sinks which constitute the reboiler 11 and the pump tube 12, from the single source of heat constituted either by the burner 13 and the combustion chamber 6 or by the electrical resistance in the housing 14. In this case it is important to limit the power delivered to the pump tube 12 within a well defined range and in particular not to exceed the maximum flux limit.
  • the thermal distributor 3 makes it possible to use approximately 40% of the total power on the pump tube 12 and 60% of this power on the reboiler, the temperature level of the pump tube 12 being maintained at around 155 ° C. while that of the reboiler 11 being about 185 ° C.
  • the heat pipes 1,2 have been shown as being pinched inside the block 3 forming a thermal distributor, between the body 3 and the front plate 3b or the body 3c, the thermal contact could be made differently.
  • the 1,2 heat pipes could be crimped, welded or else they could form by themselves the outer envelope of the heat source, the main thing being that the 1,2 heat pipes have a part in intimate contact with the source. heat, this part ensuring the evaporation of the fluid contained in the heat pipes.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Buildings Adapted To Withstand Abnormal External Influences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
EP89402810A 1988-10-11 1989-10-11 Thermischer Verteiler mit Wärmerohren Expired - Lifetime EP0364361B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT89402810T ATE75027T1 (de) 1988-10-11 1989-10-11 Thermischer verteiler mit waermerohren.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8813363 1988-10-11
FR8813363A FR2637678B1 (fr) 1988-10-11 1988-10-11 Repartiteur thermique a caloducs

Publications (2)

Publication Number Publication Date
EP0364361A1 true EP0364361A1 (de) 1990-04-18
EP0364361B1 EP0364361B1 (de) 1992-04-15

Family

ID=9370909

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89402810A Expired - Lifetime EP0364361B1 (de) 1988-10-11 1989-10-11 Thermischer Verteiler mit Wärmerohren

Country Status (4)

Country Link
EP (1) EP0364361B1 (de)
AT (1) ATE75027T1 (de)
DE (1) DE68901241D1 (de)
FR (1) FR2637678B1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603048A1 (de) * 1992-12-16 1994-06-22 Alcatel Telspace System zur Wärmeabführung für ein elektronisches Bauelement und ein geschlossenes Gehäuse in einem solchen System
WO2003014648A1 (fr) * 2001-08-09 2003-02-20 Sidorenko, Boris Revoldovich Chambre d'evaporation a caloduc de contour

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US261628A (en) * 1882-07-25 William g
US4136733A (en) * 1972-05-04 1979-01-30 U.S. Philips Corporation Heating device
EP0084929A2 (de) * 1982-01-22 1983-08-03 Kabushiki Kaisha Toshiba Magnetische Kühlvorrichtung
FR2602317A1 (fr) * 1986-07-31 1988-02-05 Armines Bouilleur a caloduc pour un appareil a absorption

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2616628A (en) * 1948-06-22 1952-11-04 Lloyd V Guild Temperature controlled gas analysis apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US261628A (en) * 1882-07-25 William g
US4136733A (en) * 1972-05-04 1979-01-30 U.S. Philips Corporation Heating device
EP0084929A2 (de) * 1982-01-22 1983-08-03 Kabushiki Kaisha Toshiba Magnetische Kühlvorrichtung
FR2602317A1 (fr) * 1986-07-31 1988-02-05 Armines Bouilleur a caloduc pour un appareil a absorption

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603048A1 (de) * 1992-12-16 1994-06-22 Alcatel Telspace System zur Wärmeabführung für ein elektronisches Bauelement und ein geschlossenes Gehäuse in einem solchen System
WO2003014648A1 (fr) * 2001-08-09 2003-02-20 Sidorenko, Boris Revoldovich Chambre d'evaporation a caloduc de contour
US6892799B2 (en) 2001-08-09 2005-05-17 Boris Revoldovich Sidorenko Evaporation chamber for a loop heat pipe

Also Published As

Publication number Publication date
EP0364361B1 (de) 1992-04-15
FR2637678B1 (fr) 1991-06-14
DE68901241D1 (de) 1992-05-21
FR2637678A1 (fr) 1990-04-13
ATE75027T1 (de) 1992-05-15

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