EP0314012A2 - Verfahren und Einrichtung zur kontrollierten Auftragung von Klebepunkten - Google Patents

Verfahren und Einrichtung zur kontrollierten Auftragung von Klebepunkten Download PDF

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Publication number
EP0314012A2
EP0314012A2 EP88117573A EP88117573A EP0314012A2 EP 0314012 A2 EP0314012 A2 EP 0314012A2 EP 88117573 A EP88117573 A EP 88117573A EP 88117573 A EP88117573 A EP 88117573A EP 0314012 A2 EP0314012 A2 EP 0314012A2
Authority
EP
European Patent Office
Prior art keywords
adhesive
intensity value
light beam
detected
optical device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP88117573A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0314012B1 (de
EP0314012A3 (en
Inventor
Bernhard Dipl.-Ing. Martin
Franz Rampp
Erwin Strigl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
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Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0314012A2 publication Critical patent/EP0314012A2/de
Publication of EP0314012A3 publication Critical patent/EP0314012A3/de
Application granted granted Critical
Publication of EP0314012B1 publication Critical patent/EP0314012B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern

Definitions

  • the invention relates to a method for the controlled application of adhesive dots according to the preamble of patent claim 1 and a device for carrying out this method according to patent claim 6.
  • a metering device for contactless application of adhesive in which the adhesive located in a chamber of the metering device can be selectively dispensed in a metered amount by pressurizing it.
  • a metering device can be used in SMD ( S urface M ounted D evice) technology, in which circuit boards are automatically populated by first applying adhesive drops to the circuit boards by means of the metering device arranged in a positioning unit, to which then SMD modules are placed. The adhesive then hardens through exposure to temperature or UV radiation. The SMD modules are then fixed in the correct position so firmly on the circuit board that the electrical connections can be made in the wave pool, by reflow soldering or by soldering in the vapor phase.
  • a problem with such assembly of printed circuit boards according to the SMD technology is that previously incorrect assemblies have had to be accepted if errors occur when setting the adhesive dots in such a way that individual adhesive dots are incorrectly set undetected. In this case, the defective printed circuit boards must be separated out in the prior art, which leads to the fact that the manufacturing costs are increased due to the relatively high failure rates.
  • the object of the present invention is to provide a method and a device for the controlled application of adhesive dots, by means of which errors in setting the adhesive dots can be recognized immediately and can therefore also be corrected.
  • the main advantage of the invention is that after the setting operation it is immediately and automatically recognized whether or not an adhesive point has been set at a predetermined position on a circuit board or the like. Errors in setting the adhesive dots therefore do not have to be accepted. If it is found, for example, that a glue point was incorrectly set at a desired location on a printed circuit board during a setting operation, the positioning device of the dosing device for setting the glue point can be stopped automatically at this point and the dosing device for setting the missing glue point e.g. be operated manually.
  • Another advantage of the invention is that the outlet opening of the metering device for setting the adhesive dots can be automatically brought into the correct position relative to the printed circuit board only by an additional control step without complex additional devices. In other words, the desired distance between the outlet opening of the metering needle of the metering device and the surface of the PCB are adhered to exactly.
  • Another important advantage of the invention is that it automatically detects when the adhesive supply in the chamber of the device for applying the adhesive points has run out.
  • the level measuring devices used in the prior art which are complex and expensive, can therefore advantageously be omitted.
  • the distance between the exit opening of the device for applying the adhesive points and the printed circuit board is maintained, for example, in that, in addition to the elongated axis of the exit opening, along which the adhesive to be applied is expelled, a spacer connected to the device is applied when the adhesive points are set the surface of the circuit board is brought to a stop before the setting operation is triggered.
  • a disadvantage of such a construction is, however, that setting operations can no longer be carried out in edge regions of the circuit board if the spacer can no longer be brought to a stop on the surface of the edge region of the circuit board.
  • a major advantage of the invention is that it is possible to set adhesive dots up to all edge edges of the circuit board.
  • the state of the art described is generally limited in terms of the possible layout because of the locations at which the spacer has to touch down. Such a limitation does not apply to the invention.
  • it can be avoided by the invention that, as can be the case when using a mechanical spacer, it attaches to adhesive spots that have already been set and thereby destroys them.
  • Another advantage is that when the invention is used, the required distances between the dispensing needle and the printed circuit board surface are always automatically maintained, even if there are any curvatures in the printed circuit boards.
  • a printed circuit board to which adhesive drops in the form of adhesive dots are to be applied by the metering device 1 is designated by 11.
  • the metering device 1 has in its interior an adhesive chamber, not shown, which contains the adhesive to be processed, which is supplied with compressed air via the hose or the line 4.
  • the individual drops of adhesive are dispensed Via the dosing needle 2 facing the printed circuit board 11.
  • the dosing device 1 is moved in a grid pattern over the printed circuit board 11 with the aid of a positioning device (not shown). Adhesive points are set at predetermined coordinates of the printed circuit board 11.
  • the metering device 1 can be approximated in the direction of the arrow 14 to the printed circuit board 11 until the positioning needle 2 is at a predetermined distance from the printed circuit board 11, which in the prior art occurs by striking a spacer (not shown) attached to the positioning device the surface of the circuit board 11 is reached.
  • This predetermined distance is approximately 0.1 mm.
  • an adhesive point can be set, for example, selectively by pressurizing the adhesive in the metering device 1. The desired amount of adhesive is applied to a predetermined location on the surface of the printed circuit board 11.
  • the metering device 1 is preferably moved in the direction of arrow 14 or in the opposite direction by a cam disk 8 shown schematically in FIG. 1, which is set in rotation by a stepping motor 10 or another suitable drive and at one point of the metering device 1 or the Haltein explained later direction 3 attacks.
  • the metering device 1 and the parts connected to it are moved downward in the direction of the arrow 14 as a result of the eccentric mounting of the cam disk 8, preferably against the force of an energy store, not shown, which is expediently a coil spring or the like.
  • the upward movement is then achieved by the spring force of the energy store mentioned.
  • Exact distances between the metering needle 2 and the surface of the circuit board 11 can be approached by an angle decoder, not shown, which actuates the stepping motor 10 in such a way that it rotates the cam disk 8 into the position required for predetermined distances.
  • a DC motor can preferably also be used at the location of the stepper motor.
  • a spindle drive actuated by the motor 10 can also be used to move the metering device 1 and the parts connected to it.
  • an optical device 5 is connected via a holding device 3, which comprises a light source for emitting a light beam 12 against the surface of the circuit board 11 and a detector device which receives the intensity of the light 12 'reflected back from the surface of the circuit board 11 and generates an electrical signal corresponding to this intensity.
  • a holding device 3 which comprises a light source for emitting a light beam 12 against the surface of the circuit board 11 and a detector device which receives the intensity of the light 12 'reflected back from the surface of the circuit board 11 and generates an electrical signal corresponding to this intensity.
  • the optical device 5 is arranged so that the plane in which the light beam 12 generated by it and the light beam 12 'reflected back to it lie at an angle to the surface of the printed circuit board 11.
  • the light beam 12 emitted in this way by the optical device 5 cuts the extension of the axial extension of the metering needle 2 at a point P, the amount of adhesive to
  • the distance between the light exit point and the surface of the circuit board 11, which runs in the direction of the normal to the surface of the circuit board 11, is referred to below as the reference distance 13.
  • This reference distance 13 is preferably selected such that the point P lies in the surface of the printed circuit board 11.
  • the distance between the outlet opening of the metering needle 2 and the surface of the printed circuit board 11 is then approximately 1.5 mm.
  • This relatively large distance is chosen in this order of magnitude because it ensures that the light beam 12 emitted by the optical device 5 and the light beam 12 reflected back to the optical device 'are not obstructed by the metering needle 2, as is the case with a distance to the adhesive dispenser about 0.1 mm would be the case.
  • the large distance of, for example, approximately 1.5 mm is therefore first approached in the manner explained in more detail later in connection with FIG. 3, and is then e.g. by simply turning the cam disc further by a predetermined angular amount, the distance to the adhesive delivery is set.
  • FIG. 3 shows the intensity of the light detected by the metering device of the optical device 5 during the approach of the metering device 1 to the surface of the printed circuit board 11 as a function of the movement of the metering device 1 (path s).
  • the detected intensity I has a dependence on the path s, which corresponds approximately to a Gaussian distribution curve.
  • the metering device 1 and the optical device 5 are driven from above onto the circuit board surface by the drive, preferably by the cam disk 8, after actuating a position desired for setting an adhesive point approximated.
  • a measuring device which is expediently a differentiator 41, continuously determines the distance from the surface of the printed circuit board 11 from the intensity values of the retroreflected light beam 12 that have just been measured. If the reference distance 13 is displayed, that is to say if two successive intensity values are determined is that the point 15 of the curve of Fig.
  • the value of the intensity A15 is stored in a memory 40, while the drive, the metering device 1 and the optical device 5 now around predetermined distance moves so that automatically the position favorable for setting the adhesive point 18 is approached, in which the outlet opening of the metering needle 2 is about 0.1 mm away from the circuit board surface.
  • This further movement corresponds to the distance ⁇ S shown in FIG. 5.
  • this further movement is automatically achieved by a predetermined further actuation of the drive, preferably by a further rotation of the cam disk 8 by a predetermined angular amount. Since there is no need to stop at reference point 13 and no time is lost, it is possible to work in an optimal time.
  • the intensity of the light reflected from the surface of the printed circuit board 11 is again measured by the metering device of the optical device 5 and stored in the memory 40.
  • the stored intensity value A 15 ⁇ is compared with the intensity value A15 previously stored during the approach of the optical device 5 to the printed circuit board 11 when the reference distance 13 is reached in a comparator 42.
  • a metering device can be brought into the position required for setting adhesive points without a spacer by first approaching a predetermined distance between the adhesive outlet opening of the metering device and the surface of the printed circuit board, whereby this distance is such that a light beam with the optical device onto the projection point of the outlet opening onto the surface of the circuit board can be directed at an angle and that the radiation reflected from this projection point can be detected by the detector device of the optical device, the light beam 12 radiated onto the projection point 8 and the light beam 12 radiated back from the projection point P 'lying in a plane which is at a predetermined angle to the surface the circuit board can be inclined.
  • cam disk 8 any other drive elements can be used instead of the cam disk 8 and that the determination of the first position after setting an adhesive point can be carried out in the same way as before setting the adhesive point.
EP88117573A 1987-10-29 1988-10-21 Verfahren und Einrichtung zur kontrollierten Auftragung von Klebepunkten Expired - Lifetime EP0314012B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3736725 1987-10-29
DE19873736725 DE3736725A1 (de) 1987-10-29 1987-10-29 Verfahren und einrichtung zur kontrollierten auftragung von klebepunkten

Publications (3)

Publication Number Publication Date
EP0314012A2 true EP0314012A2 (de) 1989-05-03
EP0314012A3 EP0314012A3 (en) 1989-12-20
EP0314012B1 EP0314012B1 (de) 1992-03-11

Family

ID=6339375

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88117573A Expired - Lifetime EP0314012B1 (de) 1987-10-29 1988-10-21 Verfahren und Einrichtung zur kontrollierten Auftragung von Klebepunkten

Country Status (2)

Country Link
EP (1) EP0314012B1 (zh-TW)
DE (2) DE3736725A1 (zh-TW)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0427362A2 (de) * 1989-11-07 1991-05-15 Helmuth Dipl.-Ing. Klatt Verfahren und Vorrichtung zum Dosieren und Auftragen von pastösen Medien
US5232736A (en) * 1989-07-24 1993-08-03 Motorola, Inc. Method for controlling solder printer
EP0611608A1 (de) * 1993-02-16 1994-08-24 SYSTEM KURANDT GmbH Verfahren und Vorrichtung zum Abtasten und Überprüfen von Spurauftragungen auf einer Unterlage
DE102010002249A1 (de) 2010-02-23 2011-08-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 Verfahren und Vorrichtung zur Kontrolle des Auftrags einer eine flüchtige Verbindung enthaltenden Flüssigkeit auf eine Oberfläche

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4305991C1 (de) * 1993-02-26 1994-06-01 Grecon Greten Gmbh & Co Kg Verfahren zur Überwachung des Leimauftrags bei der Herstellung einer verleimten Keilzinkenverbindung zweier Hölzer
DE9305877U1 (zh-TW) * 1993-04-20 1993-07-15 Hhs Leimauftrags-Systeme Gmbh, 4030 Ratingen, De
DE4419346A1 (de) * 1994-06-03 1995-12-07 Bernd Dr Ing Platz Anordnung zur Überwachung der Beschichtung von Werkstoff(stück)oberflächen
DE19945470B4 (de) * 1999-09-22 2007-06-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen einer mikrofunktionalen Verbundvorrichtung
DE10216631B4 (de) * 2002-04-15 2004-02-26 Jochen Eckardt Vorrichtung und Verfahren zum selektiven Auftragen von Öl auf Platinen
DE10252340B4 (de) * 2002-11-05 2013-09-26 Quiss Gmbh Vorrichtung zum Erkennen einer auf einem Substrat aufzubringenden Struktur sowie geeignete Verfahren hierfür
DE10356992A1 (de) * 2003-12-03 2005-06-30 Henkel Loctite Deutschland Gmbh Vorrichtung und Verfahren zur Bestimmung der Dicke von dünnen Klebstoffschichten und Dichtungen
DE102007049381A1 (de) 2007-10-15 2009-04-16 Heidelberger Druckmaschinen Ag Vorrichtung zur Kontrolle und Regelung einer aufzubringenden Klebstoffschicht bei der Herstellung von Druckerzeugnissen
CN105750163B (zh) * 2016-05-18 2019-06-14 珠海恒讯科技有限公司 全自动点胶装置和点胶方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2059502A1 (de) * 1969-12-05 1971-06-09 Anvar Verfahren und Vorrichtung zur fotoelektrischen Aufnahme von Lagekoordinaten ebener oder sphaerischer,reflektierender oder zerstreuender Oberflaechen und zur oertlichen Einstellung dieser Koordinaten
CH606987A5 (zh-TW) * 1974-12-19 1978-11-30 Gen Electric
EP0128859A1 (de) * 1983-04-29 1984-12-19 Forma-Vitrum Ag Verfahren zum Auftragen einer flüssigen oder pastösen Masse auf Glasampullen und Vorrichtung zur Durchführung des Verfahrens
DE3542903A1 (de) * 1985-12-04 1987-06-11 Henning J Claassen Vorrichtung zum intermittierenden auftragen von fluessigkeiten wie klebstoff
EP0282748A1 (de) * 1987-03-16 1988-09-21 Siemens Aktiengesellschaft Vorrichtung zur dosierbaren Klebstoff-Applikation
EP0289421A2 (en) * 1987-04-28 1988-11-02 UNIVERSAL INSTRUMENTS CORPORATION (Delaware Corp.) Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2059502A1 (de) * 1969-12-05 1971-06-09 Anvar Verfahren und Vorrichtung zur fotoelektrischen Aufnahme von Lagekoordinaten ebener oder sphaerischer,reflektierender oder zerstreuender Oberflaechen und zur oertlichen Einstellung dieser Koordinaten
CH606987A5 (zh-TW) * 1974-12-19 1978-11-30 Gen Electric
EP0128859A1 (de) * 1983-04-29 1984-12-19 Forma-Vitrum Ag Verfahren zum Auftragen einer flüssigen oder pastösen Masse auf Glasampullen und Vorrichtung zur Durchführung des Verfahrens
DE3542903A1 (de) * 1985-12-04 1987-06-11 Henning J Claassen Vorrichtung zum intermittierenden auftragen von fluessigkeiten wie klebstoff
EP0282748A1 (de) * 1987-03-16 1988-09-21 Siemens Aktiengesellschaft Vorrichtung zur dosierbaren Klebstoff-Applikation
EP0289421A2 (en) * 1987-04-28 1988-11-02 UNIVERSAL INSTRUMENTS CORPORATION (Delaware Corp.) Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232736A (en) * 1989-07-24 1993-08-03 Motorola, Inc. Method for controlling solder printer
EP0427362A2 (de) * 1989-11-07 1991-05-15 Helmuth Dipl.-Ing. Klatt Verfahren und Vorrichtung zum Dosieren und Auftragen von pastösen Medien
EP0427362A3 (en) * 1989-11-07 1992-01-02 Helmuth Dipl.-Ing. Klatt Method and device for metering and applying a pasty fluid
EP0611608A1 (de) * 1993-02-16 1994-08-24 SYSTEM KURANDT GmbH Verfahren und Vorrichtung zum Abtasten und Überprüfen von Spurauftragungen auf einer Unterlage
DE102010002249A1 (de) 2010-02-23 2011-08-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 Verfahren und Vorrichtung zur Kontrolle des Auftrags einer eine flüchtige Verbindung enthaltenden Flüssigkeit auf eine Oberfläche
WO2011104271A1 (de) 2010-02-23 2011-09-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und vorrichtung zur kontrolle des auftrags einer eine flüchtige verbindung enthaltenden flüssigkeit auf eine oberfläche

Also Published As

Publication number Publication date
EP0314012B1 (de) 1992-03-11
DE3736725A1 (de) 1989-05-11
DE3869055D1 (de) 1992-04-16
EP0314012A3 (en) 1989-12-20

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