EP0296521B1 - Wall or floor covering composed of separate ceramic panels - Google Patents
Wall or floor covering composed of separate ceramic panels Download PDFInfo
- Publication number
- EP0296521B1 EP0296521B1 EP88109787A EP88109787A EP0296521B1 EP 0296521 B1 EP0296521 B1 EP 0296521B1 EP 88109787 A EP88109787 A EP 88109787A EP 88109787 A EP88109787 A EP 88109787A EP 0296521 B1 EP0296521 B1 EP 0296521B1
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- EP
- European Patent Office
- Prior art keywords
- electrically conductive
- conductive
- ceramic
- covering
- covering according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000919 ceramic Substances 0.000 title claims description 35
- 239000000463 material Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 13
- 239000013013 elastic material Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 5
- 239000004570 mortar (masonry) Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000009795 derivation Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000012799 electrically-conductive coating Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- 244000052616 bacterial pathogen Species 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000006063 cullet Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 229910052572 stoneware Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
Definitions
- the invention relates to a ceramic wall or floor covering and an electrically conductive device therefor.
- Plate-shaped, electrically conductive ceramic bodies can be put together to form a covering for wall and floor coverings and are then connected in an electrically conductive manner to an electrically conductive substructure to be provided under the covering.
- Such wall and / or floor constructions are suitable, for example, for operating theaters, laboratories, fire-risk industrial rooms, such as paint shops, paint factories, warehouses for highly flammable chemicals, such as solvents or the like, etc.
- highly flammable chemicals such as solvents or the like, etc.
- Floor coverings in operating theaters are required to ensure that static electricity is constantly dissipated, but at the same time prevent dangerous amounts of electricity from flowing out through the human body when poorly insulated, live parts are touched.
- plate-shaped, electrically conductive ceramic elements are used as components of floor coverings. If the requirement is to be met, such coverings must have an electrical resistance of the order of 104 to 106 ohms.
- Such coverings made of ceramic plate-shaped elements have advantages over PVC and other plastic coverings because they have an insufficient resistance to organic solvents and other chemicals used for cleaning and disinfection.
- electrically conductive organic adhesives whose conductivity values are not stable over longer periods of time must be used for such floor coverings in order to connect them to the electrically conductive substructure.
- EP-A-0 211 284 which goes back to the applicant. From it a plate-like ceramic element is known, which is provided on one visible side with an electrically conductive surface glaze, which when laying the plate-like ceramic element with several such elements to form a covering for wall or floor coverings with an electrically conductive substructure to be provided under the covering communicates.
- a joint material can be selected which, in terms of its abrasion resistance, its elasticity, in particular permanent elasticity, and its hygienic properties, fully meets all requirements to be placed on such a material is and enables that at least a portion of the side of the plate-like ceramic element facing away from the visible side can be coated with an electrically highly conductive material which is electrically conductive with the surface glaze communicates.
- floor tiles In order to become independent of the drainage via the joint material, floor tiles have already been made which are produced by firing shaped mixtures of stoneware or pottery clay and iron oxide in an atmosphere customary when firing floor tiles.
- DE-B-17 71 361 describes a method for producing such electrically semiconducting ceramic floor tiles. However, by adding iron oxide to the ceramic material, dark-colored unglazed ceramic surfaces are obtained.
- mixtures are used for the production of electrically semiconducting ceramic floor tiles, which by adding other oxides such as ZnO, CuO, CoO, PbO, Sb2O3, BaO, CaO, MgO and others. individually or mixed and in amounts of 0.5 to 7%, based on the fired cullet, should cause a further decrease in the specific resistance and allow changes in the firing color from red to black.
- These tiles are pressed from the starting material and therefore their size dimensions are e.g. 5 x 5 cm limited, as can be seen from a note from DE-B-12 13 336.
- FR-A-2 204 097 describes a ceramic wall or floor covering made of ceramic plate-shaped individual elements and joint material arranged in the joints between the individual elements.
- For the discharge of electrostatic charges reference is made to the use of copper strips, which are to be arranged between two adjacent plates of the ceramic wall or floor covering.
- the discharge for the electrostatic charge from the visible side of the ceramic plates into the joint takes place via the covering applied to the visible side and pulled over the flanks, the joint area of the ceramic covering being made with electrically conductive joint mortar or Joint adhesive is filled.
- copper strips are laid on the subfloor for producing the floor covering, after which the plates of the covering are applied to the subfloor and the joint is filled with electrically conductive joint material.
- a copper mesh can be integrated into the joint material to increase the conductivity.
- the known plate covering therefore requires special preparation of a joint material in order to ensure electrical discharge. Since the number of plates required for a given area and thus the amount of joint material varies depending on the size of the plate, the discharge of the electrostatic charges is largely determined by the type and amount of the joint material, which results in different conditions for the covering depending on the plate sizes.
- the invention comes in, by proposing to dispense with the electrical discharge with the aid of an electrically conductive substructure, but instead via the flanks of electrically conductive ceramic individual elements and conductor tracks embedded in the joint pattern, which are themselves grounded and with the flanks of the ceramic Individual elements have been electrically connected to ensure. Because the conductor tracks are in the plane of the panel covering, the panel elements can be laid conventionally in a mortar bed on the existing screed, whereby the mechanical liability defects, which are based on the use of organic glue and the associated unreliability of the electrical discharge are avoided.
- a prerequisite for the desired solution is that the electrical voltage applied to the plate surface as a result of professionally designed body conduction or pulling of the electrically conductive surface glaze over the Flanks of the ceramic plate elements is made available on these flanks.
- these can be electrically conductively connected to the flanks of the adjacent plate elements. All available joints, preferably one main direction, or at least every second joint in a main direction can be selected to capture all panel elements.
- the electrically conductive devices in the form of conductor tracks can be designed in different forms, but permanent contact between the conductor track and the flank of the plate element must be ensured.
- a preferred embodiment consists of a conductor track, which is formed from an elastic core such as rubber, and a sheathing made of a highly conductive material, for example a braid-like fabric made of Cu bronze or galvanized steel.
- a further embodiment consists of a conductor track made of a wire which is provided with clasp-like bridge elements which clamp themselves on the flanks of the plate elements at predetermined intervals.
- the conductor tracks are brought together in the edge region of such a floor covering, if necessary with the aid of crimp contacts, and grounded in a suitable manner.
- the solution according to the invention offers the possibility of forming the joints with a joint material which, in terms of abrasion resistance, permanent elasticity and hygienic properties, fully meets all requirements to be placed on such a material without the joint itself being electrically conductive to have to.
- the proposed solution has the possibility of determining the leakage resistance by selecting the number and length of the contact points for each plate-like element. This is particularly evident for boards with the same electrical conductivity, i.e. same resistance value that can be increased by the aforementioned measures, i.e. can optionally take effect with a value between 106 to 108 ohms.
- the solution according to the invention also avoids the obvious disadvantage of having to accept an inconsistency or noticeable change in the discharge resistance, as is caused by the inevitable aging of the electrically conductive organic adhesive, the use of which is absolutely necessary for the electrical discharge into the substructure.
- the risk of weak spots occurring, caused by not fully filling the plate-shaped ceramic element and the associated instability of the electrical working properties, is also avoided.
- the invention is particularly suitable for ensuring the electrical discharge of large-sized plate-shaped ceramic elements, e.g. 60/60 cm, so that there are distances in the order of at least twice the edge length of a plate for the grounding line.
- Fig. 1 shows a plan view of a plate-shaped, consisting of electrically conductive individual elements 1 covering, in which electrically conductive devices run joint-compliant, represented by the track 2 of these devices.
- Fig. 2 shows this covering in section.
- This shows the inventive design of the electrically conductive individual elements 1, which are connected in an electrically conductive manner to an electrically conductive device 4 via their flanks 3. It can be seen that the electrically conductive device 4 is laid in the plate plane.
- the individual elements 1 are permanently laid on a substrate 6 with the aid of a conventional non-electrically conductive laying mortar.
- the joints are provided with an electrically non-conductive joint material 7.
- two pairs of plates 1 are assigned to an electrically conductive device, represented by track 2.
- FIG. 3 shows an enlargement of a possible embodiment of an electrically conductive device 4, which is connected to the electrically conductive flanks 3 of an electrically conductive single element 1 and its laying on electrically non-conductive mortar 5 and a supporting base 6, as well as the associated grouting 7 as a cut.
- Fig. 4 shows a representation similar to Fig. 3, but with the difference that here the electrically conductive device 4 is a self-locking between the flanks 3 of the plate element 1 contact element.
- FIG. 5 shows a possible embodiment of the strip-shaped, electrically conductive device 4, which consists of a core 8 and a strand-like sheath 9.
- FIG. 6 shows a further embodiment of the ladder-shaped electrically conductive device 4, which consists of a self-clamping contact element 10 and the associated conductor wire 11.
- connection to the electrically conductive device is expediently made by pulling the glaze over the flanks and thus contacting the device.
- body conduction that is to say when conductive particles are embedded in the ceramic mass itself, the conductive connection takes place directly via the free flank surface of the individual element.
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Floor Finish (AREA)
- Finishing Walls (AREA)
Description
Die Erfindung betrifft einen keramischen Wand- oder Bodenbelag sowie eine elektrisch leitende Vorrichtung hierfür.The invention relates to a ceramic wall or floor covering and an electrically conductive device therefor.
Plattenförmige, elektrisch leitende keramische Körper lassen sich zu mehreren zu einem Belag für Wand- und Fußbodenbekleidungen zusammenstellen und stehen dann mit einer unter dem Belag vorzusehenden elektrisch ableitenden Unterkonstruktion elektrisch leitend in Verbindung. Solche Wand- und /oder Fußbodenkonstruktionen eignen sich beispielsweise für Operationssäle, Laboratorien, feuergefährdete Industrieräume, wie Lackierereien, Lackfabriken, Lagerhallen für leicht entzündbare Chemikalien, wie Lösungsmittel od. dgl., usw.. In neuerer Zeit besteht ein Bedarf an solchen keramischen Platten auch für Bereiche, in denen eine spürbare elektrische Entladung bei Personen vermieden werden soll, wie beispielsweise in Büroräumen, in denen Computer und ähnliche elektrische und elektronische Geräte aufgestellt sind oder in denen elektronische Bauteile, wie Chips, hergestellt werden. An Fußbodenbeläge in Operationssälen wird die Forderung gestellt, daß eine ständige Ableitung von statischer Elektrizität gewährleistet ist, zugleich aber verhindert wird, daß ein Abfluß von Strom in gefährlicher Stärke beim Berühren mangelhaft isolierter, stromführender Teile durch den menschlichen Körper erfolgt. Auch hier finden solche plattenförmige elektrisch leitende keramische Elemente als Bestandteile von Bodenbelägen Verwendung. Soll die gestellte Forderung erfüllt sein, dann müssen solche Beläge einen elektrischen Widerstand in der Größenordnung von 10⁴ bs 10⁶ Ohm aufweisen.Plate-shaped, electrically conductive ceramic bodies can be put together to form a covering for wall and floor coverings and are then connected in an electrically conductive manner to an electrically conductive substructure to be provided under the covering. Such wall and / or floor constructions are suitable, for example, for operating theaters, laboratories, fire-risk industrial rooms, such as paint shops, paint factories, warehouses for highly flammable chemicals, such as solvents or the like, etc. In recent times there has also been a need for such ceramic plates for areas in which a noticeable electrical discharge is to be avoided in people, such as in offices where computers and similar electrical and electronic devices are installed or in which electronic components such as chips are manufactured. Floor coverings in operating theaters are required to ensure that static electricity is constantly dissipated, but at the same time prevent dangerous amounts of electricity from flowing out through the human body when poorly insulated, live parts are touched. Here too, such plate-shaped, electrically conductive ceramic elements are used as components of floor coverings. If the requirement is to be met, such coverings must have an electrical resistance of the order of 10⁴ to 10⁶ ohms.
Solche aus keramischen plattenförmigen Elementen erstellte Beläge haben gegenüber PVC- und anderen Kunststoffbelägen Vorteile, weil jene eine nur unzureichende Beständigkeit gegen organische Lösungsmittel und andere zur Reinigung und Desinfektion verwendete Chemikalien aufweisen. Außerdem müssen für solche Bodenbeläge zu ihrer Verbindung mit der elektrisch ableitenden Unterkonstruktion elektrisch leitende organische Kleber verwendet werden, deren Leitfähigkeitswerte nicht über längere Zeiträume hinweg stabil sind.Such coverings made of ceramic plate-shaped elements have advantages over PVC and other plastic coverings because they have an insufficient resistance to organic solvents and other chemicals used for cleaning and disinfection. In addition, electrically conductive organic adhesives whose conductivity values are not stable over longer periods of time must be used for such floor coverings in order to connect them to the electrically conductive substructure.
Bei Teppichbelägen aus Kunststofffasern kommt es darüber hinaus zu der bekannten Selbstaufladung mit statischer Elektrizität, die man durch Einweben oder sonstigen Einbau von elektrisch leitenden Fäden oder Drahtgeweben zu vermeiden versucht, ein Vorgehen, das teuer ist und auch nicht zu befriedigenden Ergebnissen führt.In the case of carpet coverings made of plastic fibers, there is also the known self-charging with static electricity, which one tries to avoid by weaving in or otherwise installing electrically conductive threads or wire mesh, a procedure which is expensive and also does not lead to satisfactory results.
Zuerst hat man versucht, auf plattenförmigen keramischen Elementen zur Herstellung solcher ableitender Beläge auf der Sichtseite der Platten einen elektrisch leitenden Überzug vorzusehen. In "Baukeramik" 8/84, Seite 96, ist eine grau-blaue Leitfliese im Format 15 x 15 cm beschrieben, die aus keramischem Material besteht und einen über die Seitenkanten hinweggezogenen elektrisch leitenden Überzug aufweist, so daß die Ableitung von Elektrizität nur über das an die Kanten solcher Platten anstoßende Fugenmaterial erfolgen kann, das dann aus elektrisch leitend gemachten Grundstoffen bestehen muß. Da solche Fugenmaterial dazu neigt nachzuschwinden, besteht die Gefahr, daß der elektrische Kontakt mit den Fliesenkanten wenigstens teilweise verloren geht. Außerdem wäscht sich solches Fugenmaterial bei häufiger Reinigung rasch aus, was ebenfalls zur Verringerung der Kontaktflächen führen kann. Damit ändert sich nicht nur der Ableitwiderstand, sondern es leidet auch die mechanische Belastbarkeit des Plattenbelages. Außerdem entstehen beim Schwinden bzw. beim Abgetragenwerden des Fugenmaterials zwischen den Plattenkanten und dem Fugenmaterial kleinste Zwischenräume, die sich mit Keimen zusetzen können, was z.B. für Operationsräume absolut untragbar ist. Schließlich sind die bekannten Platten vergleichsweise kleinformatig, so daß sie der in der Prüfnorm verlangten Standortübergangswiderstandsnorm (VDE-Bestimmung 0100/5.73 §24) nicht genügen.First, attempts have been made to provide an electrically conductive coating on the visible side of the plates on plate-shaped ceramic elements for producing such conductive coverings. In "Baukeramik" 8/84, page 96, a gray-blue guide tile in the format 15 x 15 cm is described, which is made of ceramic material and has an electrically conductive coating pulled over the side edges, so that the dissipation of electricity only via the Joint material abutting the edges of such panels can then be made, which must then consist of basic materials made electrically conductive. Since such jointing material tends to recede, there is a risk that electrical contact with the tile edges is at least partially lost. In addition, such joint material washes out quickly with frequent cleaning, which can also lead to a reduction in the contact areas. This not only changes the leakage resistance, but also the mechanical strength of the plate covering suffers. In addition, when the joint material shrinks or is removed, the smallest gaps between the board edges and the joint material arise, which can become clogged with germs, which is absolutely unacceptable for operating rooms, for example. Finally, the known plates are comparatively small, so that they do not meet the site transition resistance standard required in the test standard (VDE regulation 0100 / 5.73 §24).
Eine Verbesserung beschreibt die EP-A-0 211 284, die auf die Anmelderin zurückgeht. Aus ihr ist ein plattenartiges keramisches Element bekannt, das auf einer Sichtseite mit einer elektrisch leitenden Oberflächenglasur versehen ist, die bei Verlegung des plattenartigen keramischen Elementes mit mehreren solcher Elemente zu einem Belag für Wand- oder Fußbodenbekleidungen mit einer unter dem Belag vorzusehenden, elektrisch ableitenden Unterkonstruktion leitend in Verbindung steht. Die Verlegung solcher Platten z.B. zu einem Fußbodenbelag ist somit völlig unabhängig vom Fugenmaterial, so daß ein Fugenmaterial gewählt werden kann, das hinsichtlich seiner Abriebfestigkeit, seiner Elastizität, insbesondere Dauerelastizität, und seiner hygienischen Eigenschaften allen an ein solches Material zu stellenden Forderungen in vollem Umfang gerecht wird und ermöglicht, daß wenigstens ein Teil der der Sichtseite abgewendeten Seite des plattenartigen keramischen Elementes mit einem elektrisch gut leitenden Material beschichtet werden kann, das mit der Oberflächenglasur elektrisch leitend in Verbindung steht.One improvement describes EP-A-0 211 284, which goes back to the applicant. From it a plate-like ceramic element is known, which is provided on one visible side with an electrically conductive surface glaze, which when laying the plate-like ceramic element with several such elements to form a covering for wall or floor coverings with an electrically conductive substructure to be provided under the covering communicates. The laying of such panels, for example to a floor covering, is thus completely independent of the joint material, so that a joint material can be selected which, in terms of its abrasion resistance, its elasticity, in particular permanent elasticity, and its hygienic properties, fully meets all requirements to be placed on such a material is and enables that at least a portion of the side of the plate-like ceramic element facing away from the visible side can be coated with an electrically highly conductive material which is electrically conductive with the surface glaze communicates.
Um von der Ableitung über das Fugenmaterial unabhängig zu werden, wurde auch bereits zu Fußbodenfliesen übergegangen, die durch Brennen von geformten Mischungen aus Steinzeug- oder Töpferton und Eisenoxid in einer beim Brennen von Bodenfliesen üblichen Atmosphäre hergestellt sind. Die DE-B-17 71 361 beschreibt ein Verfahren zur Herstellung solcher elektrisch halbleitender keramischer Bodenfliesen. Allerdings erhält man durch die Beimengung von Eisenoxid zum keramischen Material dunkel gefärbte unglasierte keramische Oberflächen.In order to become independent of the drainage via the joint material, floor tiles have already been made which are produced by firing shaped mixtures of stoneware or pottery clay and iron oxide in an atmosphere customary when firing floor tiles. DE-B-17 71 361 describes a method for producing such electrically semiconducting ceramic floor tiles. However, by adding iron oxide to the ceramic material, dark-colored unglazed ceramic surfaces are obtained.
Nach der DE-B- 12 78 321 werden zur Herstellung elektrisch halbleitender keramischer Bodenfliesen Mischungen verwendet, die durch Zugabe von weiteren Oxiden, wie ZnO, CuO, CoO, PbO, Sb₂O₃,BaO, CaO, MgO u.a. einzeln oder gemischt und in Mengen von 0,5 bis 7 %, bezogen auf den gebrannten Scherben, ein weiteres Absinken des spezifischen Widerstandes bewirken sollen und Veränderungen der Brennfarbe von rot bis schwarz erlauben. Diese Fliesen werden aus dem Ausgangsmaterial gepreßt und daher sind sie in ihren Größenabmessungen auf z.B. 5 x 5 cm beschränkt, wie sich aus einem Hinweis aus der DE-B-12 13 336 ergibt.According to DE-B-12 78 321, mixtures are used for the production of electrically semiconducting ceramic floor tiles, which by adding other oxides such as ZnO, CuO, CoO, PbO, Sb₂O₃, BaO, CaO, MgO and others. individually or mixed and in amounts of 0.5 to 7%, based on the fired cullet, should cause a further decrease in the specific resistance and allow changes in the firing color from red to black. These tiles are pressed from the starting material and therefore their size dimensions are e.g. 5 x 5 cm limited, as can be seen from a note from DE-B-12 13 336.
Aus dieser DE-B- 12 13 336 entnimmt der Fachmann ferner ein Verfahren zur Herstellung elektrisch halbleitender Fliesen, gemäß dem gekörnte keramische Bodenfliesenmasse herkömmlicher Art im Gewichtsverhältnis 4:1 bis 12:1 mit einer Fe₂O₃ und andere Metalloxide, vorzugsweise ZnO enthaltenden keramischen Masse, die im gebrannten zustand einen elektrisch leitenden Scherben ergibt, gemischt, zu Fliesen verpreßt und bei 1200 bis 1250°C im normalen Indusstrieofen bei oxidierender Atmosphäre gebrannt wird.From this DE-B-12 13 336 the person skilled in the art also takes a process for the production of electrically semiconducting tiles, according to the granular ceramic floor tile mass of conventional type in a weight ratio of 4: 1 to 12: 1 with an Fe₂O₃ and other metal oxides, preferably ZnO-containing ceramic mass, which results in an electrically conductive body in the fired state, mixed, pressed into tiles and fired at 1200 to 1250 ° C in a normal industrial furnace in an oxidizing atmosphere.
Die FR-A-2 204 097 beschreibt einen keramischen Wand- oder Bodenbelag aus keramischen plattenförmigen Einzelelementen und in den Fugen zwischen den einzelnen Elementen angeordnetem Fugenmaterial. Zur Ableitung elektrostatischer Ladungen wird auf den Einsatz von Kupferbändern verwiesen, die zwischen zwei benachbarten Platten des keramischen Wand- oder Bodenbelags angeordnet sein sollen. Nach den in dieser Druckschrift beschriebenen Ausführungsbeispielen erfolgt die Ableitung für die elektrostatische Ladung von der Sichtseite der keramischen Platten in die Fuge über den sichtseitig auf die Platten aufgebrachten und über die Flanken gezogenen Belag, wobei der Fugenbereich des keramischen Belags mit elektrisch leitfähig gemachten Fugenmörtel bzw. Fugenkleber gefüllt ist. Nach den in dieser Druckschrift beschriebenen Ausführungsbeispielen werden zur Herstellung des Bodenbelags Kupferbänder auf den Unterboden verlegt, wonach die Platten des Belags auf den Unterboden aufgebracht und die Fuge mit elektrisch leitendem Fugenmaterial gefüllt wird. Gegebenenfalls kann zur Erhöhung der Leitfähigkeit in das Fugenmaterial ein Kupfernetz integriert werden. Der bekannte Plattenbelag bedarf somit einer speziellen Aufbereitung eines Fugenmaterials, um eine elektrische Ableitung zu gewährleisten. Da je nach Plattengröße die Zahl der für eine vorgegebene Fläche benötigten Platten und damit die Menge des Fugenmaterials variiert, wird die Ableitung der elektrostatischen Ladungen maßgeblich von Art und Menge des Fugenmaterials bestimmt, wodurch sich abhängig von den Plattengrößen unterschiedliche Verhältnisse für den Belag ergeben.FR-A-2 204 097 describes a ceramic wall or floor covering made of ceramic plate-shaped individual elements and joint material arranged in the joints between the individual elements. For the discharge of electrostatic charges, reference is made to the use of copper strips, which are to be arranged between two adjacent plates of the ceramic wall or floor covering. According to the exemplary embodiments described in this document, the discharge for the electrostatic charge from the visible side of the ceramic plates into the joint takes place via the covering applied to the visible side and pulled over the flanks, the joint area of the ceramic covering being made with electrically conductive joint mortar or Joint adhesive is filled. According to the exemplary embodiments described in this document, copper strips are laid on the subfloor for producing the floor covering, after which the plates of the covering are applied to the subfloor and the joint is filled with electrically conductive joint material. If necessary, a copper mesh can be integrated into the joint material to increase the conductivity. The known plate covering therefore requires special preparation of a joint material in order to ensure electrical discharge. Since the number of plates required for a given area and thus the amount of joint material varies depending on the size of the plate, the discharge of the electrostatic charges is largely determined by the type and amount of the joint material, which results in different conditions for the covering depending on the plate sizes.
Alle aufgrund von elektrischer Körperleitung oder aufgrund elektrisch leitender Oberflächenglasuren elektrisch leitenden keramischen Boden- oder Wandbeläge setzen nach dem heutigen Stand der Technik eine elektrisch leitende Unterkonstruktion voraus, um eine elektrische Ableitung zu gewährleisten. Diese Unterkonstruktionen bestehen zum Beispiel darin, daß geerdete Kupferbänder auf dem Estrich verlegt sind und diese entweder direkt oder über elektrisch leitende Kleber mit den elektrisch ableitenden keramischen Teilen in Verbindung stehen. Diese Art der Ableitung über eine Unterkonstruktion setzt eine sehr exakte und aufwendige Verlegung der ableitenden Teile voraus und ist wegen der Kosten, die mit dieser Verwendung und Applizierung eines elektrisch leitenden Klebers verbunden sind, vergleichsweise teuer und aufwendig. Die Alterungsbeständigkeit solcher Kleber läßt zudem ebenfalls zu wünschen übrig, da sie sich nicht nur auf die mechanische Festigkeit, sondern auch auf die Zuverlässigkeit der elektrischen Ableiteigenschaften auswirkt. Die Haftungsfähigkeit solcher elektrisch leitender Kleber ist weiterhin eingeschränkt wegen der notwendigen Beimengung elektrisch leitender Partikel, die die Klebeeigenschaften mindern.According to the current state of the art, all ceramic floor or wall coverings that are electrically conductive due to electrical body conduction or due to electrically conductive surface glazes require an electrically conductive substructure in order to ensure electrical discharge. These substructures consist, for example, in that grounded copper strips are laid on the screed and that these are connected either directly or via electrically conductive adhesives to the electrically conductive ceramic parts. This type of derivation via a substructure requires a very precise and complex laying of the dissipative parts and is comparatively expensive and complex because of the costs associated with this use and application of an electrically conductive adhesive. The aging resistance of such adhesives also leaves something to be desired, since it affects not only the mechanical strength, but also the reliability of the electrical dissipation properties. The adhesiveness of such electrically conductive adhesives is further restricted because of the necessary admixture of electrically conductive particles, which reduce the adhesive properties.
Hier setzt die Erfindung an, indem sie vorschlägt, auf die elektrische Ableitung mit Hilfe einer elektrisch leitenden Unterkonstruktion zu verzichten, sondern diese über die Flanken elektrisch leitender keramischer Einzelelemente und in das Fugenraster eingebetteter Leiterbahnen, die selbst geerdet sind und die mit den Flanken der keramischen Einzelelemente elektrisch leitend in Verbindung gebracht worden sind, zu gewährleisten. Dadurch, daß sich die Leiterbahnen in der Ebene des Plattenbelages befinden, können die Plattenelemente konventionell in ein Mörtelbett auf den vorhandenen Estrich verlegt werden, wodurch die mechanischen Haftungsmängel, die auf dem Einsatz organischer Kleber beruhen und die damit verbundene Unzuverlässigkeit der elektrischen Ableitung vermieden werden.Voraussetzung für die angestrebte Lösung ist, daß die an der Plattenoberfläche anliegende elektrische Spannung infolge fachgerecht ausgelegter Körperleitung oder Herumziehen der elektrisch leitenden Oberflächenglasur über die Flanken der keramischen Plattenelemente an diesen Flanken zur Verfügung gestellt wird. Unter Ausnutzung der beim Verlegen von plattenförmigen keramischen Körpern zu einem Belag entstehenden Fugen als vorgegebene Verlegerichtung und Aufnahmeort von elektrisch leitenden Vorrichtungen können diese mit den Flanken der benachbarten Plattenelemente elektrisch leitend in Verbindung gebracht werden. Es können hierbei alle zur Verfügung stehenden Fugen, vorzugsweise einer Hauptrichtung ausgewählt werden oder auch mindestens jede zweite Fuge einer Hauptrichtung, um alle Plattenelemente zu erfassen.This is where the invention comes in, by proposing to dispense with the electrical discharge with the aid of an electrically conductive substructure, but instead via the flanks of electrically conductive ceramic individual elements and conductor tracks embedded in the joint pattern, which are themselves grounded and with the flanks of the ceramic Individual elements have been electrically connected to ensure. Because the conductor tracks are in the plane of the panel covering, the panel elements can be laid conventionally in a mortar bed on the existing screed, whereby the mechanical liability defects, which are based on the use of organic glue and the associated unreliability of the electrical discharge are avoided. A prerequisite for the desired solution is that the electrical voltage applied to the plate surface as a result of professionally designed body conduction or pulling of the electrically conductive surface glaze over the Flanks of the ceramic plate elements is made available on these flanks. Utilizing the joints that result when laying plate-shaped ceramic bodies to form a covering as the predetermined laying direction and location of the electrically conductive devices, these can be electrically conductively connected to the flanks of the adjacent plate elements. All available joints, preferably one main direction, or at least every second joint in a main direction can be selected to capture all panel elements.
Die elektrisch leitenden Vorrichtungen in Form von Leiterbahnen können in unterschiedlicher Form ausgeführt sein, wobei jedoch ein dauerhafter Kontakt zwischen Leiterbahn und Flanke des Plattenelementes sichergestellt sein muß.The electrically conductive devices in the form of conductor tracks can be designed in different forms, but permanent contact between the conductor track and the flank of the plate element must be ensured.
Eine vorzugsweise Ausführung besteht aus einer Leiterbahn, die aus einer elastischen Seele wie z.B. Gummi, und einer Ummantelung aus gut leitendem Material z.B. einem litzenartigen Gewebe von Cu-Bronze oder verzinktem Stahl gebildet ist. Eine weitere Ausführung besteht aus einer Leiterbahn aus einem Draht, der mit in vorgegebenen Abständen sich selbst an den Flanken der Plattenelemente sich beklemmenden spangenartigen Brückenelemente versehen ist.A preferred embodiment consists of a conductor track, which is formed from an elastic core such as rubber, and a sheathing made of a highly conductive material, for example a braid-like fabric made of Cu bronze or galvanized steel. A further embodiment consists of a conductor track made of a wire which is provided with clasp-like bridge elements which clamp themselves on the flanks of the plate elements at predetermined intervals.
Die Leiterbahnen werden im Randbereich eines solchen Bodenbelages ggf. mit Hilfe von Krimmkontakten zusammengeführt und in geeigneter Weise geerdet.The conductor tracks are brought together in the edge region of such a floor covering, if necessary with the aid of crimp contacts, and grounded in a suitable manner.
Die erfindungsgemäße Lösung bietet neben der konventionellen Verlegung der plattenartigen Elemente die Möglichkeit, die Fugen mit einem Fugenmaterial auszubilden, das hinsichtlich Abriebfestigkeit, Dauerelastizität und hygienischer Eigenschaften allen an ein solches Material zu stellenden Forderungen in vollem Umfang gerecht wird, ohne die Fuge selbst elektrisch leitend ausbilden zu müssen.In addition to the conventional laying of the plate-like elements, the solution according to the invention offers the possibility of forming the joints with a joint material which, in terms of abrasion resistance, permanent elasticity and hygienic properties, fully meets all requirements to be placed on such a material without the joint itself being electrically conductive to have to.
Die vorgeschlagene Lösung weist gegenüber den bisher bekannten Ausführungen die Möglichkeit auf, durch Wahl der Anzahl und Länge der Kontaktstellen je plattenartigem Element den Ableitwiderstand zu bestimmen. Dies zeigt sich insbesondere für Platten gleicher elektrischer Ableitfähigkeit, d.h. gleichen Widerstandswertes, der durch die vorgenannten Maßnahmen erhöht werden kann, d.h. wahlweise mit einem Wert zwischen 10⁶ bis 10⁸ Ohm wirksam werden kann.Compared to the previously known designs, the proposed solution has the possibility of determining the leakage resistance by selecting the number and length of the contact points for each plate-like element. This is particularly evident for boards with the same electrical conductivity, i.e. same resistance value that can be increased by the aforementioned measures, i.e. can optionally take effect with a value between 10⁶ to 10⁸ ohms.
Die erfindungsgemäße Lösung vermeidet auch den offensichtlichen Nachteil,eine Unbeständigkeit oder spürbare Änderung des Ableitwiderstandes hinnehmen zu müssen, wie sie durch die unvermeidbare Alterung des elektrisch leitenden organischen Klebers, dessen Einsatz bei der elektrischen Ableitung in die Unterkonstruktion unbedingt notwendig ist, bedingt ist. Auch wird die Gefahr des Auftretens von Schwachstellen,hervorgerufen durch nicht vollsattes Verlegen des plattenförmigen keramischen Elementes und damit verbundener Unbeständigkeit der elektrischen Arbeitseigenschaften vermieden.The solution according to the invention also avoids the obvious disadvantage of having to accept an inconsistency or noticeable change in the discharge resistance, as is caused by the inevitable aging of the electrically conductive organic adhesive, the use of which is absolutely necessary for the electrical discharge into the substructure. The risk of weak spots occurring, caused by not fully filling the plate-shaped ceramic element and the associated instability of the electrical working properties, is also avoided.
Da elektrisch leitende Kleber oder Mörtel eine schlechtere spezifische elektrische Leitfähigkeit aufweisen als reines Metall, wie es erfindungsgemäß angewendet wird, und Ableitungsverluste wegen der gegebenen konzentrierten linienförmigen Ableitungsmöglichkeit in wesentlich geringerem Maße auftreten als bei flächigem Ableiten über die Unterkonstruktion zu Leiterbahnen ergibt sich auch ein geringerer Materialaufwand, was zu Kosteneinsparungen und Steigerung der Zuverlässigkeit der Ableitung führt.Because electrically conductive glue or mortar is worse Have specific electrical conductivity as pure metal, as is used according to the invention, and lead losses due to the given concentrated line-shaped lead possibility occur to a much lesser extent than with flat lead-off via the substructure to conductor tracks, there is also less material expenditure, which leads to cost savings and increased reliability the derivation leads.
Die Erfindung eignet sich in besonderem Maße zur Sicherstellung der elektrischen Ableitung von großformatigen plattenförmigen keramischen Elementen z.B. 60/60 cm, so daß sich für die Erdungsleitung Abstände in der Größenordnung von mindestens dem Doppelten der Kantenlänge einer Platte ergibt.The invention is particularly suitable for ensuring the electrical discharge of large-sized plate-shaped ceramic elements, e.g. 60/60 cm, so that there are distances in the order of at least twice the edge length of a plate for the grounding line.
Bei kleineren Formaten ist die Zusammenfassung mehrerer Platten zu sinnvollen Verbundelementen in elektrischer Sicht durch kleine Überbrückungselemente, die eine Ableitung von Platte zu Platte ermöglichen und die in der Ausführung den Brückenelementen gemäß Anspruch 9 entsprechen können, zweckmäßig.In the case of smaller formats, it is expedient to combine several plates into meaningful composite elements from an electrical point of view by means of small bridging elements which enable a derivation from plate to plate and which can correspond in design to the bridge elements according to
Nachfolgend werden Ausführungsbeispiele der Erfindung anhand der Zeichnung beschrieben. Darin zeigen:
- Fig. 1
- eine Draufsicht auf einen aus plattenförmigen Einzelelementen bestehenden Belag,
- Fig. 2
- eine Schnittansicht des Belags nach Fig. 1,
- Fig. 3
- eine Einzelheit des Belags und einer Fuge in vergrößerter Darstellung,
- Fig. 4
- eine Ansicht entsprechend Fig. 3 einer weiteren Ausführungsform,
- Fig. 5
- eine perspektivische Ansicht einer Ausführungsform der elektrisch leitenden Vorrichtung sowie
- Fig. 6
- eine weitere Ausführungsform einer solchen Vorrichtung.
- Fig. 1
- a plan view of a covering consisting of plate-shaped individual elements,
- Fig. 2
- 2 shows a sectional view of the covering according to FIG. 1,
- Fig. 3
- a detail of the covering and a joint in an enlarged view,
- Fig. 4
- a view corresponding to FIG. 3 of another Embodiment,
- Fig. 5
- a perspective view of an embodiment of the electrically conductive device and
- Fig. 6
- a further embodiment of such a device.
Fig. 1 zeigt in der Draufsicht einen plattenförmigen, aus elektrisch leitenden Einzelelementen 1 bestehenden Belag, bei dem elektrisch leitende Vorrichtungen fugenkonform verlaufen, dargestellt durch die Spur 2 dieser Vorrichtungen.Fig. 1 shows a plan view of a plate-shaped, consisting of electrically conductive
Fig. 2 stellt diesen Belag im Schnitt dar. Hier zeigt sich die erfindungsgemäße Ausbildung der elektrisch leitenden Einzelelemente 1, die über ihre Flanken 3 mit einer elektrisch leitenden Vorrichtung 4 elektrisch leitend in Verbindung stehen. Es ist ersichtlich, daß die elektrisch leitende Vorrichtung 4 in Plattenebene verlegt ist. Die Einzelelemente 1 sind mit Hilfe eines konventionellen nicht elektrisch leitenden Verlegemörtels auf einem Untergrund 6 dauerhaft verlegt. Die Fugen werden mit einem elektrisch nicht leitenden Fugenmaterial 7 versehen. Im dargestellten Beispiel sind jeweils 2 Plattenpaare 1 einer elektrisch ableitenden Vorrichtung, dargestellt durch die Spur 2, zugeordnet.Fig. 2 shows this covering in section. This shows the inventive design of the electrically conductive
Fig. 3 zeigt in einer Vergrößerung eine mögliche Ausgestaltung einer elektrisch leitenden Vorrichtung 4, die mit den elektrisch leitenden Flanken 3 eines elektrisch leitenden Einzelelementes 1 in Verbindung steht und dessen Verlegung auf elektrisch nicht leitendem Mörtel 5 und einem tragenden Untergrund 6 sowie die zugehörige Verfugung 7 als Schnitt.3 shows an enlargement of a possible embodiment of an electrically
Fig. 4 zeigt eine analoge Darstellung wie Fig. 3, jedoch mit der Abweichung, daß hier die elektrisch leitende Vorrichtung 4 als ein sich selbst zwischen den Flanken 3 des Plattenelementes 1 beklemmenden Kontaktelementes besteht.Fig. 4 shows a representation similar to Fig. 3, but with the difference that here the electrically
Fig. 5 zeigt eine mögliche Ausführungsform der leistenförmigen elektrisch leitenden Vorrichtung 4, die aus einer Seele 8 und einer litzenartigen Umhüllung 9 besteht.FIG. 5 shows a possible embodiment of the strip-shaped, electrically
Fig. 6 zeigt eine weitere Ausführungsform der leiterförmigen elektrisch leitenden Vorichtung 4, die aus einem sich selbst beklemmenden Kontaktelement 10 und dazugehörigem Leiterdraht 11 besteht.FIG. 6 shows a further embodiment of the ladder-shaped electrically
Im Falle eines mit einer elektrisch leitenden Oberflächenglasur versehenen Einzelelementes erfolgt die Verbindung mit der elektrisch ableitenden Vorrichtung zweckmäßigerweise dadurch, daß die Glasur über die Flanken gezogen ist und somit die Vorrichtung kontaktiert. Im Falle von Körperleitung, also bei Einlagerung von leitenden Partikeln in der keramischen Masse selbst, erfolgt die leitende Verbindung unmittelbar über die freie Flankenfläche des Einzelelements.In the case of a single element provided with an electrically conductive surface glaze, the connection to the electrically conductive device is expediently made by pulling the glaze over the flanks and thus contacting the device. In the case of body conduction, that is to say when conductive particles are embedded in the ceramic mass itself, the conductive connection takes place directly via the free flank surface of the individual element.
Claims (10)
- Ceramic wall or floor covering composed of separate ceramic panels (1) and a joint material (7) arranged in the joints between the separate panels, the separate panels of this covering being fashioned thus that they are electrically conductive, whereby the joint material is electrically non-conductive and the leakage of the voltage occurs via the flanks (3) of the plate-shaped ceramic panel (1) as well as via electrically conductive devices (4) laid in the joints in the plane of the plate and being themselves grounded.
- Covering according to claim 1,
characterised in that
at least one flank (3) of the ceramic panel (1) is in electrical contact with an electrically conductive device (4) laid in the plane of the panel. - Covering according to claim 2, being provided with an electrically conductive surface glaze,
characterised in that
the electrically conductive glaze extends over the flanks (3). - Covering according to one of the previous claims,
characterised in that
the electrically conductive devices (4) are arranged in at least one preferred direction, conforming to the joints, of the panel covering in the plane of the panel. - Covering according to one of the previous claims,
characterised in that
the electrical devices (4) consist of conductive paths, an electrical contact being established between these paths and the flanks (3) of ceramic panels adjacent to a conductive path in direction of its laying. - Covering according to claim 5,
characterised in that
an electrical contact is established between the conductive path and the flanks of all ceramic panels adjacent to the conductive path in direction of its laying. - Covering according to claim 5 or 6,
characterised in that
the conductive path is composed of a cable-shaped path wherein the core (8) is made of an elastic material and the sheathing (9) is made of a conductive material, in particular a metallic conductive material. - Covering according to claim 7,
characterised in that
the conducting cable is under initial radial stress and is thus laid in the joints in a self-adjusting manner. - Covering according to one of claims 5 to 8,
characterised in that
the conductive path consists of a combination of an electrically conductive wire (11) or cable with intermediary self-adjusting electrically conductive contact elements (10). - Covering according to claim 9,
characterised in that
the number of electrically conductive contact elements per panel (1) and their length is chosen such that the leakage resistance varies between values of 10⁶ and 10⁸ ohms.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3720598 | 1987-06-22 | ||
| DE19873720598 DE3720598A1 (en) | 1987-06-22 | 1987-06-22 | CERAMIC WALL OR FLOORING COMPOSED FROM PANEL-SHAPED INDIVIDUAL ELEMENTS |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0296521A2 EP0296521A2 (en) | 1988-12-28 |
| EP0296521A3 EP0296521A3 (en) | 1989-05-31 |
| EP0296521B1 true EP0296521B1 (en) | 1992-04-01 |
Family
ID=6330063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP88109787A Expired - Lifetime EP0296521B1 (en) | 1987-06-22 | 1988-06-20 | Wall or floor covering composed of separate ceramic panels |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4870795A (en) |
| EP (1) | EP0296521B1 (en) |
| JP (1) | JPS6466358A (en) |
| DE (2) | DE3720598A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2797193B2 (en) * | 1989-03-20 | 1998-09-17 | 日本電気ホームエレクトロニクス株式会社 | CSK communication device |
| US5192580A (en) * | 1992-04-16 | 1993-03-09 | E. I. Du Pont De Nemours And Company | Process for making thin polymer film by pulsed laser evaporation |
| DE19915093C2 (en) * | 1999-04-01 | 2002-08-14 | Crc Chemical Res Co Ltd | Process for producing an acid-resistant and electrically conductive building material covering |
| US6189276B1 (en) | 1999-08-06 | 2001-02-20 | Mark Z. Pinto | Decorative baseboard molding |
| ITMI20051199A1 (en) * | 2005-06-24 | 2006-12-25 | Intersider Acciai S P A | TILE FOR METAL COVERINGS METHOD FOR PRODUCTION AND RELATIVE COVERINGS |
| DE202012100911U1 (en) * | 2012-03-14 | 2013-06-17 | Rehau Ag + Co | Flooring |
| CN108086637A (en) * | 2017-12-25 | 2018-05-29 | 安徽向利机房设备工程有限公司 | Manufacturing process of ceramic anti-static floor |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US28756A (en) * | 1860-06-19 | Composition for lining safes | ||
| US3025934A (en) * | 1958-01-30 | 1962-03-20 | Joseph W Spiselman | Sectional flooring |
| DE1796428U (en) * | 1959-05-08 | 1959-09-24 | Ver Leichtmetallwerke Gmbh | PLASTIC FLOOR PLATE. |
| FR1297904A (en) * | 1961-05-26 | 1962-07-06 | Hippolyte Boulenger Et Cie | Process for the flow of static charges that accumulate in building floors |
| CH519071A (en) * | 1971-06-03 | 1972-02-15 | Keller & Co Ag | Multi-layer cladding panel and use of the same |
| DE2230578A1 (en) * | 1972-06-22 | 1974-01-17 | Dynamit Nobel Ag | ANTISTATIC AND / OR ELECTRICALLY CONDUCTIVE FLOOR COVERING AND THE PROCESS FOR ITS MANUFACTURING |
| FR2204097A1 (en) * | 1972-10-20 | 1974-05-17 | Solvay | Eliminating static electricity from surface cover - by coating with electrically conducting enamel |
| US4308568A (en) * | 1980-06-12 | 1981-12-29 | Industrial Heating Systems, Inc. | Antistatic construction |
| DE3433702A1 (en) * | 1984-09-13 | 1986-03-20 | Buchtal Gmbh, 8472 Schwarzenfeld | WALL, CEILING AND / OR FLOOR TRAINING AND METHOD FOR THEIR PRODUCTION |
| FR2577262B1 (en) * | 1985-02-08 | 1991-06-21 | Heuga France | WALL COVERING FOR SUPPLYING AN ELECTRICAL RECEIVER WITH VARIABLE POSITIONS ON THE WALL |
| EP0211284B1 (en) * | 1985-07-18 | 1990-01-03 | Buchtal Gesellschaft mit beschränkter Haftung | Plate-like ceramic element with an electrically conducting varnish on its visible side |
| DE3535632A1 (en) * | 1985-10-05 | 1987-04-23 | Huchzermeyer Herforder Teppich | FLOORING |
-
1987
- 1987-06-22 DE DE19873720598 patent/DE3720598A1/en not_active Withdrawn
-
1988
- 1988-06-20 EP EP88109787A patent/EP0296521B1/en not_active Expired - Lifetime
- 1988-06-20 DE DE8888109787T patent/DE3869671D1/en not_active Expired - Fee Related
- 1988-06-22 JP JP63154546A patent/JPS6466358A/en active Pending
- 1988-06-22 US US07/210,099 patent/US4870795A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE3720598A1 (en) | 1989-01-05 |
| DE3869671D1 (en) | 1992-05-07 |
| EP0296521A2 (en) | 1988-12-28 |
| EP0296521A3 (en) | 1989-05-31 |
| JPS6466358A (en) | 1989-03-13 |
| US4870795A (en) | 1989-10-03 |
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