EP0287118A3 - Vorrichtung zur Molekularstrahl-Epitaxie - Google Patents

Vorrichtung zur Molekularstrahl-Epitaxie Download PDF

Info

Publication number
EP0287118A3
EP0287118A3 EP88106059A EP88106059A EP0287118A3 EP 0287118 A3 EP0287118 A3 EP 0287118A3 EP 88106059 A EP88106059 A EP 88106059A EP 88106059 A EP88106059 A EP 88106059A EP 0287118 A3 EP0287118 A3 EP 0287118A3
Authority
EP
European Patent Office
Prior art keywords
disc
substrates
cam
drive system
signals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP88106059A
Other languages
English (en)
French (fr)
Other versions
EP0287118A2 (de
Inventor
Naoyuki Tamura
Norio Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of EP0287118A2 publication Critical patent/EP0287118A2/de
Publication of EP0287118A3 publication Critical patent/EP0287118A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/141Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
EP88106059A 1987-04-17 1988-04-15 Vorrichtung zur Molekularstrahl-Epitaxie Withdrawn EP0287118A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62093055A JPH0691952B2 (ja) 1987-04-17 1987-04-17 真空装置
JP93055/87 1987-04-17

Publications (2)

Publication Number Publication Date
EP0287118A2 EP0287118A2 (de) 1988-10-19
EP0287118A3 true EP0287118A3 (de) 1990-01-24

Family

ID=14071821

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88106059A Withdrawn EP0287118A3 (de) 1987-04-17 1988-04-15 Vorrichtung zur Molekularstrahl-Epitaxie

Country Status (3)

Country Link
US (1) US4932357A (de)
EP (1) EP0287118A3 (de)
JP (1) JPH0691952B2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0834187B2 (ja) * 1989-01-13 1996-03-29 東芝セラミックス株式会社 サセプタ
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US5113102A (en) * 1991-05-09 1992-05-12 Huntington Mechanical Laboratories, Inc. Rotary motion transmitter and heat treatment method for sealed chamber
JP2598353B2 (ja) * 1991-12-04 1997-04-09 アネルバ株式会社 基板処理装置、基板搬送装置及び基板交換方法
AU4652993A (en) * 1992-06-26 1994-01-24 Materials Research Corporation Transport system for wafer processing line
US5443358A (en) * 1993-04-30 1995-08-22 Burton Industries, Inc. Indexing part loader
US5958134A (en) * 1995-06-07 1999-09-28 Tokyo Electron Limited Process equipment with simultaneous or sequential deposition and etching capabilities
EP2445003A1 (de) * 2010-10-25 2012-04-25 Applied Materials, Inc. Vorrichtung zur Bereitstellung eines Drehträgermagazins und Bedienungsverfahren dafür
US20140120735A1 (en) * 2012-10-31 2014-05-01 Macronix International Co., Ltd. Semiconductor process gas flow control apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0211292A2 (de) * 1985-08-09 1987-02-25 Hitachi, Ltd. Gerät für Molekularstrahlepitaxie

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5998520A (ja) * 1982-11-27 1984-06-06 Toshiba Mach Co Ltd 半導体気相成長装置
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
US4795299A (en) * 1987-04-15 1989-01-03 Genus, Inc. Dial deposition and processing apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0211292A2 (de) * 1985-08-09 1987-02-25 Hitachi, Ltd. Gerät für Molekularstrahlepitaxie

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SOLID STATE TECHNOLOGY, vol. 26, no. 7, July 1983 F.T. TURNER et al.: "Advances in Cassette-to-Cassette Spultercoating Systems" pages 115-123 *

Also Published As

Publication number Publication date
US4932357A (en) 1990-06-12
JPH0691952B2 (ja) 1994-11-16
JPS63258632A (ja) 1988-10-26
EP0287118A2 (de) 1988-10-19

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