EP0258295A1 - Ignition switching device - Google Patents

Ignition switching device

Info

Publication number
EP0258295A1
EP0258295A1 EP87901024A EP87901024A EP0258295A1 EP 0258295 A1 EP0258295 A1 EP 0258295A1 EP 87901024 A EP87901024 A EP 87901024A EP 87901024 A EP87901024 A EP 87901024A EP 0258295 A1 EP0258295 A1 EP 0258295A1
Authority
EP
European Patent Office
Prior art keywords
aluminum nitride
base body
ignition switch
base
ignition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP87901024A
Other languages
German (de)
French (fr)
Inventor
Dieter Seipler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP0258295A1 publication Critical patent/EP0258295A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
    • F02P3/00—Other installations
    • F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
    • F02P3/04—Layout of circuits
    • F02P3/0407—Opening or closing the primary coil circuit with electronic switching means
    • F02P3/0435—Opening or closing the primary coil circuit with electronic switching means with semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Definitions

  • the invention relates to an ignition switch for ignition systems of motor vehicles according to the preamble of the main claim.
  • Ignition switching devices such as those used today in particular for transistor ignitions, require a structure which, owing to the presence of a power Darlington, enables good dissipation of the heat loss. Therefore, today a nickel-plated aluminum plate is generally used as the base body, which carries a layer of beryllium oxide and to which the power Darlington is soldered.
  • a decisive disadvantage of this structure is the use of the toxic beryllium oxide and the necessity to use an insulating intermediate layer.
  • the ignition switch device according to the invention with the characterizing features of the main claim has the advantage that the intermediate layer of the toxic beryllium oxide can be omitted, that the heat dissipation is comparable to that of the conventional structure and that the ignition switch device can be produced in a relatively simple manner.
  • the measures listed in the subclaims permit advantageous developments and improvements of the ignition switching device specified in the main claim. It is particularly advantageous if the aluminum nitride base body carries a metal layer. This metal layer can simultaneously serve as a circuit which is constructed using thin or thick-film technology. In addition, the power Darlington can be soldered directly onto this metal layer. A plastic covering, which is necessary to protect the electrical components of the ignition switching device, can be applied to the ceramic base body without difficulty.
  • the ceramic base plate can also be provided with bores in a simple manner, so that it is easily possible to fasten the ignition switch device by means of screws.
  • FIG. 1 shows a sectional, perspective view of an ignition switching device.
  • the ignition switch consists of a base body 1 in the form of an approximately 4 mm thick ceramic plate made of aluminum nitride. Located on the aluminum nitride base body. tracks 2, components 3 and a performance darlington in chip form h.
  • a base body 1 In the base body 1 is a little deepened an art fabric frame 5 glued, which has connections 6 in the rear part, the zen by means of wires 7 with corresponding Landenlät 3 of the electri see circuit are connected.
  • the plastic frame 5 carries a plastic cover 9 glued into a corresponding fold.
  • bores 10 are provided in the plastic frame 5 and in the base body 1.
  • the plug connections for the connections 6th In the rear part 11 of the plastic frame 5 and the plastic cover 9 existing plastic housing, the plug connections for the connections 6th
  • the base body 1 made of aluminum nitride is first provided with a thick layer or galvanically with a metal layer, for example made of copper or nickel.
  • a metal layer for example made of copper or nickel.
  • This metal layer is structured using appropriate printing and etching processes for the circuit 2 provided, the components 3 and the power darlington 4 are soldered on, and the necessary connections between the connections o and the landing sites 8 are made by means of the wires 7.
  • the plastic frame 5 is glued into the corresponding recess and glued into a fold of the plastic frame 5 of the plastic cover 9.
  • the finished ignition switch device is then screwed by means of screws through the bores 10 to a fastening surface provided for this purpose and the connections are made on the rear part 11 of the plastic housing.
  • the aluminum nitride, from which the base body 1 is made is characterized by a high thermal conductivity, moreover the power Darlington 4, which produces the most heat, is in good thermal connection with the base body 3 by soldering onto the applied metal layer, the heat loss is sufficient dissipated quickly.
  • the thermal expansion of aluminum nitride is well matched to that of silicon, so that thermal stress does not lead to mechanical stresses and consequently lead to defects.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)

Abstract

Un appareil interrupteur d'allumage pour l'allumeur d'un véhicule comprend des composants en forme de microplaquettes ou de couches épaisses imprimées reliées par des pistes conductrices, une base (1) dissipant la chaleur et un logement (11) en matière plastique. Au contraire des bases actuellement utilisées, formées d'une plaque métallique, la base (1) se compose de nitrure d'aluminium. De préférence, la base en nitrure d'aluminium porte une couche métallique qui sert en même temps d'élément connecteur. Le logement (11) en matière plastique est collé à la base (1) en nitrure d'aluminium.An ignition switch device for the igniter of a vehicle comprises components in the form of microchips or thick printed layers connected by conductive tracks, a base (1) dissipating heat and a housing (11) made of plastic. Unlike the bases currently used, formed from a metal plate, the base (1) consists of aluminum nitride. Preferably, the aluminum nitride base carries a metallic layer which at the same time serves as a connector element. The plastic housing (11) is bonded to the base (1) of aluminum nitride.

Description

ZundschaltgerätIgnition switch
Stand der TechnikState of the art
Die Erfindung geht aus von einem Zundschaltgerät für Zündanlagen von Kraftfahrzeugen nach der Gattung des Hauptanspruchs. Zündschaltgeräte, wie sie heute insbesondere bei Transistor-Zündungen eingesetzt werden, benötigen einen Aufbau, der infolge des Vorhandenseins eines Leistungsdarlingtons eine gute Abführung der Verlustwärme ermöglicht. Daher wird heute als Grundkörper im allgemeinen eine vernickelte Aluminiumplatte verwendet, die eine Schicht aus Berylliumoxid trägt und auf die der Leistungsdarlington aufgelötet ist. Ein entscheidender Nachteil dieses Aufb aus ist die Verwendung des giftigen BeryIliumoxids sowie überhaupt die Notwendigkeit der Verwendung einer isolierenden Zwischenschicht.The invention relates to an ignition switch for ignition systems of motor vehicles according to the preamble of the main claim. Ignition switching devices, such as those used today in particular for transistor ignitions, require a structure which, owing to the presence of a power Darlington, enables good dissipation of the heat loss. Therefore, today a nickel-plated aluminum plate is generally used as the base body, which carries a layer of beryllium oxide and to which the power Darlington is soldered. A decisive disadvantage of this structure is the use of the toxic beryllium oxide and the necessity to use an insulating intermediate layer.
Vorteile der ErfindungAdvantages of the invention
Das erfindungsgemäße Zundschaltgerät mit den kennzeichnenden Merkmalen des Hauptanspruchs hat demgegenüber den Vorteil, daß die Zwischenschicht aus dem giftigen Berylliumoxid entfallen kann, daß die Wärmeabführung mit derjenigen des herkömmlichen Aufbaus vergleichbar ist und daß das Zundschaltgerät in verhältnismäßig einfacher Weise herstellbar ist. Durch die in den Unteransprüchen aufgeführten Maßnahmen sind vorteilhafte Weiterbildungen und Verbesserungen des im Hauptanspruch angegebenen Zündschaltgerätes möglich. Besonders vorteilhaft ist es, wenn der Aluminiumnitrid-Grundkörper eine Metallschicht trägt. Diese Metallschicht kann gleichzeitig als Schaltung dienen, die in Dünn- oder Dickschichttechnik aufgebaut ist. Darüber hinaus läßt sich der Leistungsdarlington direkt auf diese Metallschicht auflöten. Auf den Keramik-Grundkörper läßt sich ohne Schwierigkeiten eine Kunststoffumhüllung aufbringen, die zum Schutz der elektrischen Bauelemente des Zündschaltgerätes notwendig ist. Auch läßt sich in einfacher Weise die keramische Grundplatte mit Bohrungen versehen, so daß es ohne weiteres möglich ist, das Zundschaltgerät durch Schrauben zu befestigen.The ignition switch device according to the invention with the characterizing features of the main claim has the advantage that the intermediate layer of the toxic beryllium oxide can be omitted, that the heat dissipation is comparable to that of the conventional structure and that the ignition switch device can be produced in a relatively simple manner. The measures listed in the subclaims permit advantageous developments and improvements of the ignition switching device specified in the main claim. It is particularly advantageous if the aluminum nitride base body carries a metal layer. This metal layer can simultaneously serve as a circuit which is constructed using thin or thick-film technology. In addition, the power Darlington can be soldered directly onto this metal layer. A plastic covering, which is necessary to protect the electrical components of the ignition switching device, can be applied to the ceramic base body without difficulty. The ceramic base plate can also be provided with bores in a simple manner, so that it is easily possible to fasten the ignition switch device by means of screws.
Zeichnungdrawing
Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Die Figur zeigt eine geschnittene, perspektivische Darstellung eines Zündschaltgerätes.An embodiment of the invention is shown in the drawing and explained in more detail in the following description. The figure shows a sectional, perspective view of an ignition switching device.
Beschreibung des AusführungsbeispielsDescription of the embodiment
Das Zundschaltgerät gemäß der Figur besteht aus einem Grundkörper 1 in Form einer ca. 4 mm dicken Keramikplatte aus Aluminiumnitrid. Auf dem Aluminiumnitrid-Grundkörper befinden. sich Leiterbahnen 2, Bauelemente 3 sowie ein Leistungsdarlington in Chip-Form h . In dem Grundkörper 1 ist etwas vertieft ein Kunst Stoffrahmen 5 eingeklebt, der im rückwärtigen Teil Anschlüsse 6 aufweist, die mittels Drähten 7 mit ent sυrechenden Landenlät zen 3 der elektri sehen Schaltung verbunden sind. Der Kunststoffrahmen 5 trägt einen in einen entsprechenden Falz eingeklebten Kunststoffdeckel 9. Zur Befestigung des Zündschaltgerätes im Kraftfahrzeug, sind in den Kunst stoffrahmen 5 und im Grundkörper 1 Bohrungen 10 vorgesehen. Im rückwärtigen Teil 11 des aus dem Kunst stoffrahmen 5 und dem Kunststoffdeckel 9 bestehenden Kunststoffgehauses liegen die Steckverbindungen für die Anschlüsse 6.The ignition switch according to the figure consists of a base body 1 in the form of an approximately 4 mm thick ceramic plate made of aluminum nitride. Located on the aluminum nitride base body. tracks 2, components 3 and a performance darlington in chip form h. In the base body 1 is a little deepened an art fabric frame 5 glued, which has connections 6 in the rear part, the zen by means of wires 7 with corresponding Landenlät 3 of the electri see circuit are connected. The plastic frame 5 carries a plastic cover 9 glued into a corresponding fold. For fastening the ignition switching device in the motor vehicle, bores 10 are provided in the plastic frame 5 and in the base body 1. In the rear part 11 of the plastic frame 5 and the plastic cover 9 existing plastic housing, the plug connections for the connections 6th
Zur Herstellung des Zündschaltgerätes wird der Grundkörper 1 aus Aluminiumnitrid zunächst mittels Dickschicht oder galvanisch mit einer Metallschicht, beispielsweise aus Kupfer oder Nickel, versehen. Diese Metailschicht wird über entsprechende Druck- und Ätzverfahren zur vorgesehenen Schaltung 2 strukturiert, die Bauelemente 3 sowie der Leistungsdarlington 4 aufgelötet und mittels der Drähte 7 die notwendigen Verbindungen zwischen den Anschlüssen o und den Landeplätzen 8 hergestellt. Dann wird der Kunst stoffrahmen 5 in die entsprechende Vertiefung eingeklebt und in einen Falz des Kunststoffrahmens 5 der Kunst stoffdeckel 9 geklebt. Das fertige Zundschaltgerät wird dann mittels Schrauben durch die Bohrungen 10 hindurch an einer dafür vorgesehenen Befestigungsfläche festgeschraubt und am rückwärtigen Teil 11 des Kunststoffgehauses die Anschlüsse hergestellt.To manufacture the ignition switching device, the base body 1 made of aluminum nitride is first provided with a thick layer or galvanically with a metal layer, for example made of copper or nickel. This metal layer is structured using appropriate printing and etching processes for the circuit 2 provided, the components 3 and the power darlington 4 are soldered on, and the necessary connections between the connections o and the landing sites 8 are made by means of the wires 7. Then the plastic frame 5 is glued into the corresponding recess and glued into a fold of the plastic frame 5 of the plastic cover 9. The finished ignition switch device is then screwed by means of screws through the bores 10 to a fastening surface provided for this purpose and the connections are made on the rear part 11 of the plastic housing.
Da sich das Aluminiumnitrid, aus dem der Grundkörper 1 besteht, durch eine hohe Wärmeleitfähigkeit auszeichnet, darüber hinaus der Leistungsdarlington 4 , der die meiste Wärme produziert, durch Lötung auf die aufgebrachte Metallschicht mit dem Grundkörper 3 in guter thermischer Verbindung steht, wird die Verlustwärme ausreichend schnell abgeführt. Außerdem ist die Wärmeausdehnung des Aluminiumnitrids gut an die von Silicium angepaßt, so daß eine thermische Belastung nicht zu mechanischen Spannungen und in der Folge zu Defekten führen kennen. Since the aluminum nitride, from which the base body 1 is made, is characterized by a high thermal conductivity, moreover the power Darlington 4, which produces the most heat, is in good thermal connection with the base body 3 by soldering onto the applied metal layer, the heat loss is sufficient dissipated quickly. In addition, the thermal expansion of aluminum nitride is well matched to that of silicon, so that thermal stress does not lead to mechanical stresses and consequently lead to defects.

Claims

Ansprüche Expectations
1. Zundschaltgerät für Zündanlagen von Kraftfahrzeugen, bestehend aus mit Leiterbahnen verbundenen Bauelementen in Chipform bzw. in aufgedruckter Dickschicht, mit einem wärmeableitenden Grundkörper und mit einem Kunststoffgehäuse, dadurch gekennzeichnet, daß der Grundkörper (1) aus Aluminiumnitrid besteht.1. Ignition switch for ignition systems of motor vehicles, consisting of components connected to conductor tracks in chip form or in printed thick film, with a heat-dissipating base body and with a plastic housing, characterized in that the base body (1) consists of aluminum nitride.
2. Zundschaltgerät nach Anspruch 1, dadurch gekennzeichnet, daß der Aluminiumnitrid-Grundkörper ( 1) eine Metallschicht trägt, die gleichzeitig als Schaltung dient.2. Ignition switch according to claim 1, characterized in that the aluminum nitride base body (1) carries a metal layer which also serves as a circuit.
3. Zundschaltgerät nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß das Kunststoffgehäuse (5, 9) mit dem Aluminiumnitrid-Grundkörper (3) verklebt ist.3. Ignition switch according to claim 1 or 2, characterized in that the plastic housing (5, 9) with the aluminum nitride base body (3) is glued.
4. Zundschaltgerät nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß der Aluminiumnitrid-Grundkörper ( 1) Bohrungen (10) zum Aufschrauben des Gerätes aufweist. 4. Ignition switch according to one of the preceding claims, characterized in that the aluminum nitride base body (1) has bores (10) for screwing on the device.
EP87901024A 1986-02-08 1987-02-05 Ignition switching device Withdrawn EP0258295A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863604074 DE3604074A1 (en) 1986-02-08 1986-02-08 IGNITION SWITCH
DE3604074 1986-02-08

Publications (1)

Publication Number Publication Date
EP0258295A1 true EP0258295A1 (en) 1988-03-09

Family

ID=6293753

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87901024A Withdrawn EP0258295A1 (en) 1986-02-08 1987-02-05 Ignition switching device

Country Status (5)

Country Link
EP (1) EP0258295A1 (en)
AU (1) AU6937187A (en)
DE (1) DE3604074A1 (en)
ES (1) ES2004089A6 (en)
WO (1) WO1987004859A1 (en)

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DE3837975A1 (en) * 1988-11-09 1990-05-10 Telefunken Electronic Gmbh ELECTRONIC CONTROL UNIT
DE3837974A1 (en) * 1988-11-09 1990-05-10 Telefunken Electronic Gmbh ELECTRONIC CONTROL UNIT
DE3843863A1 (en) * 1988-12-24 1990-06-28 Bosch Gmbh Robert High-temperature heating element, method of producing it and use thereof
DE3910699A1 (en) * 1989-04-03 1990-10-04 Omt Oberflaechen Materialtech Printed circuit board for integrated circuits
DE3916899C2 (en) * 1989-05-24 2003-04-03 Bosch Gmbh Robert Housing for an electronic circuit
DE3937183A1 (en) * 1989-07-22 1991-01-24 Bosch Gmbh Robert METHOD FOR EMISSION RADIATION DAMPING ON CIRCUIT BOARDS
US5008492A (en) * 1989-10-20 1991-04-16 Hughes Aircraft Company High current feedthrough package
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
DE19515622C2 (en) * 1995-04-28 2000-06-08 Telefunken Microelectron Control module of motor vehicles
DE19549099C2 (en) * 1995-12-29 1999-05-20 Tele Quarz Gmbh Temperature stabilized quartz crystal of an Ostzillator circuit
DE102004040591A1 (en) * 2004-08-21 2006-02-23 Robert Bosch Gmbh Electronic module has housing with mounted heat sink in contact and secured by rivets
TWI449137B (en) * 2006-03-23 2014-08-11 Ceramtec Ag Traegerkoerper fuer bauelemente oder schaltungen
WO2008132056A1 (en) * 2007-04-26 2008-11-06 Ceramtec Ag Cooling box for components or circuits
DE102014107217A1 (en) * 2014-05-19 2015-11-19 Ceram Tec Gmbh The power semiconductor module
DE102020211078A1 (en) * 2020-09-02 2022-03-03 Robert Bosch Gesellschaft mit beschränkter Haftung Control device, in particular steering control device

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JPS5854268B2 (en) * 1977-02-09 1983-12-03 株式会社日立製作所 Non-contact ignition device
DE3247985C2 (en) * 1982-12-24 1992-04-16 W.C. Heraeus Gmbh, 6450 Hanau Ceramic carrier
JPS60178652A (en) * 1984-02-27 1985-09-12 Toshiba Corp Circuit substrate
JPS617647A (en) * 1984-06-21 1986-01-14 Toshiba Corp Circuit substrate

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Title
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Also Published As

Publication number Publication date
ES2004089A6 (en) 1988-12-01
DE3604074A1 (en) 1987-08-13
AU6937187A (en) 1987-08-25
WO1987004859A1 (en) 1987-08-13

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