EP0237728A2 - Werkzeug und Verfahren zum Zusammenbau einer gedruckten Leiterplatte - Google Patents

Werkzeug und Verfahren zum Zusammenbau einer gedruckten Leiterplatte Download PDF

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Publication number
EP0237728A2
EP0237728A2 EP87100926A EP87100926A EP0237728A2 EP 0237728 A2 EP0237728 A2 EP 0237728A2 EP 87100926 A EP87100926 A EP 87100926A EP 87100926 A EP87100926 A EP 87100926A EP 0237728 A2 EP0237728 A2 EP 0237728A2
Authority
EP
European Patent Office
Prior art keywords
connector
springs
tool
housing
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP87100926A
Other languages
English (en)
French (fr)
Other versions
EP0237728B1 (de
EP0237728A3 (en
Inventor
Joseph Lawrence De Marco
Charles Howard Enkling
James Warren Zimmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0237728A2 publication Critical patent/EP0237728A2/de
Publication of EP0237728A3 publication Critical patent/EP0237728A3/en
Application granted granted Critical
Publication of EP0237728B1 publication Critical patent/EP0237728B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board

Definitions

  • the present invention relates to a tool and a method for assembling a printed circuit card having a plurality of connector spings, and a housing adapted to hold said connector springs, each of said connector springs having an arm that is adapted to be soldered to a tab on the edge of said printed circuit card, and two contacts that form a slot for insertion of a male connector.
  • CARD ON BOARD technology A widely used technology for packaging electronic circuitry is generally termed CARD ON BOARD technology. This technology utilizes relatively large boards which have pins protruding therefrom. Card which have connec­tors soldered to at least one end thereof are plugged into the board. Electronic components are located on the cards and these components are interconnected by conduc­tive paths on the cards and board.
  • MST Monolithic System Technology
  • IBM 370 System IBM 370 System
  • a description of this MST packaging technology is given in IBM Maintenance Library Manual SY22-6739-5, Copyright 1969.
  • MST technology relatively rigid spring contacts are soldered to the edge of cards. These contacts are next inserted into a plastic contact housing. The spring contacts are protected by the housing and the card can be shipped and handled in this condition. When desired, the card can be plugged into the pins on the board. It is noted that in MST technology the spring contacts are relatively rigid so they can be soldered to the card before they are inserted into the plastic contact housing.
  • the present invention is directed to the assembly of a package such as that shown in the above referenced article by Chirino et. al. where the connector springs are soldered to the printed circuit card.
  • the Chirino article shows and describes an assembly technique for such springs which has several disadvantages. First, using the tool and technique shown in the Chirino artic­le, the gold contacts on the connector springs are abraded during the assembly operation. Second, the connector springs are not uniformly seated in the housing and as a result there is residual stress on the solder connection between the connector spring and the printed circuit card. Third, the rotation of the springs is not controlled, resulting in additional residual stress on the solder joint. Because of these problems the system shown in the Chirino reference does not provide a consi­stent, accurate and reliable method and apparatus for assembling the units shown.
  • the object of the present invention is to provide an improved method and apparatus to facilitate the assembly of contact springs on printed circuit card units.
  • Another object of the present invention is to provide an improved method and apparatus which will reliably assemble delicate contact springs on the edge of printed circuit cards.
  • Yet another object is to provide a method and apparatus for reliable, inexpensive and efficient assemb­ly of printed circuit cards which have contact assemblies attached thereto.
  • a still further object of the present invention is to provide a method and apparatus for consistently and accurately locating connector springs while they are being soldered to a printed circuit card so that there is no residual stress in the solder joint.
  • the advantage offered by the invention is mainly that there is no stress on the solder connections between the spring contacts and the printed circuit card when plugging the card assembly into e.g. a circuit board.
  • the present invention relates to a tool and a method for assembling a printed circuit card unit which has a large number of individual connector springs soldered to one edge thereof.
  • Each of these connector springs fits in a hole in a plastic housing.
  • the protruding end of each connector spring has two gold plated contacts.
  • the end of each connector spring is free to move in three linear directions and to rotate.
  • the amount of linear movement and the amount of rotation allowed is small (a few hundredth of a mm); however, it is sufficient to insure that the connector springs can be easily inserted into the hole in the housing.
  • This invention provides a tool and method for properly positioning the connector springs in the housing and then holding them firmly in place while a tail or arm that extends from each contact spring is soldered to a tab or pad on the edge of the printed circuit card.
  • each spring is free to move and rotate in the housing; however, during the assembly operation, the connector must be held firmly in the housing so that latch surfaces on the connector springs are firmly seated on the appropriate surfaces in the housing. In this way there is no residual load or strain on the solder joint between the spring connector and the tab on the card.
  • the stress is taken by the surfaces of the spring which mate with surfaces on the housing and there is no stress or strain on the solder joint.
  • the present invention provides a tool which has a plurality of rubber protrusions, one for each spring connector in the assembly. These rubber protrusions are wedge shaped and they fit into the gold plated contacts to hold the connector springs firmly in an aligned position with the latching surfaces of the connector held firmly in place.
  • the rubber protrusions do not abrade the gold contacts; however, they provide individualized pressure on each individual contact spring thereby firmly seating each contact even though there are minor differences in the individual springs and in the holes into which the connector springs fit.
  • the spring contacts are first loosely positioned in the holes in the housing assembly.
  • the tool with the wedge shaped protrusions is used to push the connector springs into their final position and to hold them in position during the soldering operation. Once the solder has hardened, the tool is removed. Thereafter, when a pin or spade is inserted into the connector spring, the mating surfaces between the connector and the housing provide the necess­ary resistance to motion and there is no stress applied to the solder joint.
  • the unit assembled with the present invention includes a printed circuit card 5, metal spring connectors 6 (invidually desiganted 6R, 6M and 6L), and a plastic housing 7.
  • the printed circuit card 5 is positioned and held in housing 7 by fingers 7A and 7B.
  • Each connector spring 6 has an arm or tail 63 that connects to electrical circuitry (not shown) on card 5.
  • the connectors 6L on the left side of the card 5 connect to tabs 51 on the left side of card 5.
  • the connectors 6R on the right side of card 5 connect to tabs 51 on the right side of card 5.
  • the connectors 6M in the center row alternately connect to tabs 51 on the right and then on the left of the card 5.
  • connectors 6 fit into housing 7
  • Each connector spring 6 fits into a hole in housing 7.
  • Each connector spring 6 is held in the housing 7 by two latch tabs 61 and 62.
  • the latch tabs 61 and 62 respectively engage latching surfaces 71 and 72 in housing 7.
  • Each connector spring 6 has an arm or tail 63 which is attached to a tab or land 51 (see Figure 3) on card 5 by solder 52 (see Figure 2).
  • the tail 63 is held in place by tabs 61 and 62 and that there be no strain on solder connection 52.
  • tabs 61 and 62 must be firmly seated on latching surfaces 71 and 72 so that when a pin or spade in inserted between the gold contact surfaces 66 and 67 any force or stress is absorbed by tabs 61 and 62 and latching surfaces 71 and 72 and so that no stress is placed on solder joint 52.
  • FIG. 3 A perspective view of the tool used with the present invention is shown in Figure 3. It has a base plate 8 and a number of molded wedge shaped protrusions 81.
  • the protrusions 81 are made of fluoro-silicone rubber.
  • base plate 8 has a hole 82 associated with each wedge shaped protrusion 81 and the fluoro-sili­cone rubber is molded into the holes in the base plate 8.
  • the tool is fabricated by starting with a base plate 8 which has hour-glass shaped holes 82 therein and then molding fluoro-silicone rubber in the holes and extending out to form wedge shaped protrusions 81.
  • the holes in base plate 8 have an hour-glass shape so that the fluoro-­silicon rubber is firmly held to the base plate 8.
  • the only portion of the tool that is subject to substantial wear is the rubber protrusions 81. When these protrusion show wear, the rubber is removed from the base plate 8. New protrusions 81 with associated tabs 81A that extend through the base plate 8 can then be molded onto the base plate 8.
  • FIG. 3 is a perspective view of the assembly with the housing 7 shown in phantom lines.
  • This figure also shows how the wedge shaped protrusions 81 fit into the contact surfaces 66 and 67 on connector springs 6.
  • the fit between con­tacts 66 and 67 and wedge shaped member 81 is such that each connector is automatically rotated to the correct position, centered in its associated hole in housing 7, and held firmly in place with connector tabs 61 and 62 firmly engaging surfaces 71 and 72 of the housing. All of the connector springs 6 are simultaneously positioned to the correct position, even though there may be minor variations in the holes in housing 7 and in the indivi­dual connector springs 6.
  • the tool 8 can align and firmly seat each connector 6 so that tabs 61 and 62 are firmly seated on surfaces 71 and 72. This can be done without abrading the contact surfaces 66 and 67.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
EP87100926A 1986-03-17 1987-01-23 Werkzeug und Verfahren zum Zusammenbau einer gedruckten Leiterplatte Expired - Lifetime EP0237728B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84027386A 1986-03-17 1986-03-17
US840273 1986-03-17

Publications (3)

Publication Number Publication Date
EP0237728A2 true EP0237728A2 (de) 1987-09-23
EP0237728A3 EP0237728A3 (en) 1988-06-15
EP0237728B1 EP0237728B1 (de) 1991-04-24

Family

ID=25281918

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87100926A Expired - Lifetime EP0237728B1 (de) 1986-03-17 1987-01-23 Werkzeug und Verfahren zum Zusammenbau einer gedruckten Leiterplatte

Country Status (3)

Country Link
EP (1) EP0237728B1 (de)
JP (1) JPS62226591A (de)
DE (1) DE3769501D1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0642701A1 (de) * 1992-05-29 1995-03-15 Berg Electronics Manufacturing B.V. Positionierungswerkzeug für elektrische steckerstifte und buchsen
WO1995035585A2 (en) * 1994-06-10 1995-12-28 Xetel Corporation Surface mountable substrate edge terminal
US5509197A (en) * 1994-06-10 1996-04-23 Xetel Corporation Method of making substrate edge connector
EP0767516A2 (de) * 1995-01-27 1997-04-09 Molex Incorporated Bestückungsvorrichtung für elektrische Verbinder
DE102011103777A1 (de) * 2011-06-01 2012-12-06 Lumberg Connect Gmbh Verbindung zweier Leiterplatten

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2550664A1 (fr) * 1983-08-11 1985-02-15 Augat Inc Support de broches de connexion et son procede de fabrication

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2550664A1 (fr) * 1983-08-11 1985-02-15 Augat Inc Support de broches de connexion et son procede de fabrication

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 18, no. 8, January 1976, page 2460, New York, US; R.L. AGARD et al.: "Offset contact blade carrier" *
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 25, no. 3B, August 182, pages 1410-1411, New York, US; O.I. CHIRINO et al.: "Semi-automatic card inserton device" *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0642701A1 (de) * 1992-05-29 1995-03-15 Berg Electronics Manufacturing B.V. Positionierungswerkzeug für elektrische steckerstifte und buchsen
EP0642701A4 (de) * 1992-05-29 1996-05-22 Berg Tech Inc Positionierungswerkzeug für elektrische steckerstifte und buchsen.
WO1995035585A2 (en) * 1994-06-10 1995-12-28 Xetel Corporation Surface mountable substrate edge terminal
WO1995035585A3 (en) * 1994-06-10 1996-02-15 Xetel Corp Surface mountable substrate edge terminal
US5509197A (en) * 1994-06-10 1996-04-23 Xetel Corporation Method of making substrate edge connector
US5644839A (en) * 1994-06-10 1997-07-08 Xetel Corporation Surface mountable substrate edge terminal
EP0767516A2 (de) * 1995-01-27 1997-04-09 Molex Incorporated Bestückungsvorrichtung für elektrische Verbinder
EP0767516A3 (de) * 1995-01-27 1998-04-15 Molex Incorporated Bestückungsvorrichtung für elektrische Verbinder
US5884393A (en) * 1995-01-27 1999-03-23 Molex Incorporated Mounting jig for electrical connectors
DE102011103777A1 (de) * 2011-06-01 2012-12-06 Lumberg Connect Gmbh Verbindung zweier Leiterplatten
DE102011103777B4 (de) * 2011-06-01 2017-12-28 Lumberg Connect Gmbh Verbindung zweier Leiterplatten

Also Published As

Publication number Publication date
EP0237728B1 (de) 1991-04-24
DE3769501D1 (de) 1991-05-29
JPS62226591A (ja) 1987-10-05
JPH0377633B2 (de) 1991-12-11
EP0237728A3 (en) 1988-06-15

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