EP0232920A3 - Mehrblattinnenlochsäge für das Zersägen von Kristallstäben sowie vermittels dieser Säge durchgeführte Trennverfahren - Google Patents

Mehrblattinnenlochsäge für das Zersägen von Kristallstäben sowie vermittels dieser Säge durchgeführte Trennverfahren Download PDF

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Publication number
EP0232920A3
EP0232920A3 EP87102096A EP87102096A EP0232920A3 EP 0232920 A3 EP0232920 A3 EP 0232920A3 EP 87102096 A EP87102096 A EP 87102096A EP 87102096 A EP87102096 A EP 87102096A EP 0232920 A3 EP0232920 A3 EP 0232920A3
Authority
EP
European Patent Office
Prior art keywords
saw
sawing
blades
well
internal hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP87102096A
Other languages
English (en)
French (fr)
Other versions
EP0232920A2 (de
Inventor
Walter Dipl.-Ing Frank (Fh)
Gerhard Palme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of EP0232920A2 publication Critical patent/EP0232920A2/de
Publication of EP0232920A3 publication Critical patent/EP0232920A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0524—Plural cutting steps
    • Y10T83/0538—Repetitive transverse severing from leading edge of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/768—Rotatable disc tool pair or tool and carrier
    • Y10T83/7755—Carrier for rotatable tool movable during cutting
    • Y10T83/7763—Tool carrier reciprocable rectilinearly
    • Y10T83/7776—With means to reciprocate carrier
    • Y10T83/778—And means to rotate tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Es werden eine Mehrblattinnenlochsäge für das Zersägen von Kristallstäben oder -blöcken, insbesondere Solarzellen­ grundmaterial auf Siliciumbasis, in dünne Scheiben sowie ver­ mittels dieser Säge durchgeführte Sägeverfahren angegeben. Erfindungsgemäss verfügt die Säge über bezüglich der Lager spiegelsymmetrisch zu beiden Seiten eines gemeinsamen An­ triebszylinders angeordnete Sägeblätter. Beim Sägevorgang wird von jedem der Sägeblätter synchron jeweils ein Werk­ stück zersägt.
EP87102096A 1986-02-14 1987-02-13 Mehrblattinnenlochsäge für das Zersägen von Kristallstäben sowie vermittels dieser Säge durchgeführte Trennverfahren Withdrawn EP0232920A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863604739 DE3604739A1 (de) 1986-02-14 1986-02-14 Mehrblattinnenlochsaege fuer das zersaegen von kristallstaeben sowie vermittels dieser saege durchgefuehrte trennverfahren
DE3604739 1986-02-24

Publications (2)

Publication Number Publication Date
EP0232920A2 EP0232920A2 (de) 1987-08-19
EP0232920A3 true EP0232920A3 (de) 1987-11-04

Family

ID=6294123

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87102096A Withdrawn EP0232920A3 (de) 1986-02-14 1987-02-13 Mehrblattinnenlochsäge für das Zersägen von Kristallstäben sowie vermittels dieser Säge durchgeführte Trennverfahren

Country Status (5)

Country Link
US (1) US4834062A (de)
EP (1) EP0232920A3 (de)
JP (1) JPS62193807A (de)
AU (1) AU585125B2 (de)
DE (1) DE3604739A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH078495B2 (ja) * 1990-11-29 1995-02-01 信越半導体株式会社 単結晶引上装置の単結晶絞り部自動切断装置
US5915370A (en) * 1996-03-13 1999-06-29 Micron Technology, Inc. Saw for segmenting a semiconductor wafer
DE19739965A1 (de) * 1997-09-11 1999-03-18 Wacker Siltronic Halbleitermat Sägeleiste zum Fixieren eines Kristalls und Verfahren zum Abtrennen von Scheiben
DE10145309B4 (de) * 2001-09-14 2006-11-23 Daimlerchrysler Ag Verfahren und Vorrichtung zum automatisierten Zuschneiden von Harzmatten für die Herstellung von SMC-Teilen
CN101664968B (zh) * 2009-09-03 2012-07-04 无锡机床股份有限公司 一种改进的用于单晶硅棒的夹持机构
CN117086401B (zh) * 2023-06-13 2024-04-02 重庆敏德兴模具材料科技有限公司 一种模具钢加工设备及加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0093406A1 (de) * 1982-04-30 1983-11-09 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Verfahren zum Sägen von Kristallstäben und Mehrblattinnenlochsäge zur Durchführung des Verfahrens

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3051207A (en) * 1959-10-02 1962-08-28 Hobart Mfg Co Food handling apparatus
US3154990A (en) * 1962-03-16 1964-11-03 Sylvania Electric Prod Slicing apparatus having a rotary internal peripheral faced saw blade
US3175548A (en) * 1964-05-14 1965-03-30 Shirley I Weiss Cutting wheel holders
US3261383A (en) * 1965-01-18 1966-07-19 Mutual Ice Company Ice cutting machine
US3662733A (en) * 1969-10-12 1972-05-16 Yoji Hattori Annular cutting apparatus with work removal means
US3879896A (en) * 1971-11-01 1975-04-29 E Blair Maxfield Rock cutting and polishing device
DE2524100A1 (de) * 1975-05-30 1976-12-09 Festo Maschf Stoll G Einrichtung zum aufarbeiten von werkstuecken in form von holz-laengsverschnitt kleiner laenge zu nutzholz, beispielsweise leisten, balken und/oder dgl.
US4004477A (en) * 1975-06-02 1977-01-25 Oxford Industries, Inc. Fabric cutting apparatus
JPS52138787A (en) * 1976-05-17 1977-11-19 Hiroshi Ishizuka Multiistage type stone cutting device
US4116095A (en) * 1977-08-05 1978-09-26 Cousino Walter F Metal sawing or milling machine
US4150912A (en) * 1978-01-23 1979-04-24 Monsanto Company Twin blade mounting and tensioning apparatus
US4227348A (en) * 1978-12-26 1980-10-14 Rca Corporation Method of slicing a wafer
JPS60103076A (ja) * 1983-11-02 1985-06-07 住友特殊金属株式会社 磁気ヘツド用磁器組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0093406A1 (de) * 1982-04-30 1983-11-09 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Verfahren zum Sägen von Kristallstäben und Mehrblattinnenlochsäge zur Durchführung des Verfahrens

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SOVIET INVENTIONS ILLUSTRATED, Sektion PQ, Woche E 27, 18. August 1982 DERWENT PUBLICATIONS LTD., London, P 64. *

Also Published As

Publication number Publication date
AU585125B2 (en) 1989-06-08
DE3604739A1 (de) 1987-08-20
AU6821487A (en) 1987-08-20
EP0232920A2 (de) 1987-08-19
US4834062A (en) 1989-05-30
JPS62193807A (ja) 1987-08-26

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Inventor name: FRANK, WALTER, DIPL.-ING (FH)

Inventor name: PALME, GERHARD