EP0221434A1 - Verbesserung der Leitfähigkeit von metallische Füllstoffe enthaltenden Kunststoffen - Google Patents
Verbesserung der Leitfähigkeit von metallische Füllstoffe enthaltenden Kunststoffen Download PDFInfo
- Publication number
- EP0221434A1 EP0221434A1 EP86114549A EP86114549A EP0221434A1 EP 0221434 A1 EP0221434 A1 EP 0221434A1 EP 86114549 A EP86114549 A EP 86114549A EP 86114549 A EP86114549 A EP 86114549A EP 0221434 A1 EP0221434 A1 EP 0221434A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- composite
- insulating material
- group
- adder
- thermoplastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000945 filler Substances 0.000 title claims description 4
- 239000004033 plastic Substances 0.000 title abstract description 32
- 229920003023 plastic Polymers 0.000 title abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 50
- 239000002131 composite material Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 14
- 239000000835 fiber Substances 0.000 claims description 12
- 229920001169 thermoplastic Polymers 0.000 claims description 10
- 239000004416 thermosoftening plastic Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- QIMMUPPBPVKWKM-UHFFFAOYSA-N 2-methylnaphthalene Chemical compound C1=CC=CC2=CC(C)=CC=C21 QIMMUPPBPVKWKM-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- FHCPAXDKURNIOZ-UHFFFAOYSA-N tetrathiafulvalene Chemical compound S1C=CSC1=C1SC=CS1 FHCPAXDKURNIOZ-UHFFFAOYSA-N 0.000 claims description 5
- CJAOGUFAAWZWNI-UHFFFAOYSA-N 1-n,1-n,4-n,4-n-tetramethylbenzene-1,4-diamine Chemical compound CN(C)C1=CC=C(N(C)C)C=C1 CJAOGUFAAWZWNI-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 3
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229920006397 acrylic thermoplastic Polymers 0.000 claims description 3
- 239000010962 carbon steel Substances 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 150000002430 hydrocarbons Chemical class 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- GUAWMXYQZKVRCW-UHFFFAOYSA-N n,2-dimethylaniline Chemical compound CNC1=CC=CC=C1C GUAWMXYQZKVRCW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000012260 resinous material Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 10
- 239000012815 thermoplastic material Substances 0.000 claims 4
- 239000012777 electrically insulating material Substances 0.000 claims 2
- 239000011231 conductive filler Substances 0.000 abstract description 8
- 239000006185 dispersion Substances 0.000 abstract description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229920004142 LEXAN™ Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000004418 Lexan Substances 0.000 description 2
- 239000004727 Noryl Substances 0.000 description 2
- 229920001207 Noryl Polymers 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 101001047746 Homo sapiens Lamina-associated polypeptide 2, isoform alpha Proteins 0.000 description 1
- 101001047731 Homo sapiens Lamina-associated polypeptide 2, isoforms beta/gamma Proteins 0.000 description 1
- 102100023981 Lamina-associated polypeptide 2, isoform alpha Human genes 0.000 description 1
- 229920000914 Metallic fiber Polymers 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Definitions
- the present invention relates to electrically conductive plastic composite materials and particularly to methods for making such materials. More particularly, this invention relates to a method for increasing the electrical conductivity of such composite materials and to the products of such a method. While the invention relates primarily to solid or foamed resinous composites, it is believed that the principles of the invention may be applicable to materials other than resinous materials including various other high resistivity composite materials such as ceramics, wood composites, and concrete, for example.
- the improved electrical conductivity of these materials is based on the fact that the metal fibers or filaments, which are of relatively short length are either in direct contact with each other at enumerable points throughout the volume of the plastic or are so closely adjacent each other that despite the small separation by the plastic, improved conductivity nevertheless results.
- thermoplastics the short lengths of metal coated fibers or conductive filaments are combined with fluid polymerizable material.
- the many individual lengths of conductive filaments develop a thin film of the insulating plastic thereon.
- This thin insulating film may increase the distance between adjacent conductive fibers in the finished material to the extent that the desired electrical conductivity is not achieved.
- the metallic or conductive fibers are interspersed throughout the volume of the plastic in a three dimensional random network, the overall conductivity of the plastic is the cumulative effect of the conductivity of the many various individual current paths between adjacent metallic elements.
- One obvious way to increase conductivity in such composites is to increase the ratio of metallized particles or fibers carried in the material.
- a yet further object of the invention is to produce a conductive plastic composite having a given electrical conductivity with a lower weight percentage of conductive material therein.
- the product of the above-noted process is highly useful for various applications such as enclosures for electronic equipment where conductivity, shielding, and grounding are important including, for example, cabinetry for electronic equipment such as communications equipment, instruments and computers.
- the intended improvement in the electrostatic shielding capability of plastic composite materials may be sufficiently great to allow their use as a low cost alternative to metallic enclosures.
- the method of the present invention relates primarily to a wide variety of conductive resinous composite materials, such as conductive plastic composite materials where the plastics include both thermoplastics and thermosets.
- suitable thermoplastics include, but are not limited to polycarbonates, polyesters, oxide polymers, polyurethanes, polyamides, acrylics, polyvinylchlorides and hydrocarbon polymers.
- suitable thermosets include, but are not limited to polyesters, epoxies, ureas and silicones.
- Suitable conductive materials useful for incorporation into the plastic composites include various types of metal fibers and ribbons and metal particles of various shapes, metallized glass, metallized graphite or other conductive or nonconductive fibers, and carbon fiber and carbon particles of various shapes.
- the choice metal is wide; however, for practical reasons the choice is usually narrowed to inexpensive metals that have good conductivity and are easily formed.
- Aluminum is the most preferred as fitting the above criteria. However, the processes are equally applicable to composites having other metals such as stainless steel, silver, copper, zinc, iron, nickel, carbon steel, etc. and mixtures thereof.
- metallized glass fibers are preferably coated with aluminum due to the above criteria and due to its low melting point, which facilitates its manufacture.
- test samples were cut from molded plaques of the designated matrix or base material.
- the samples were typically 6 cm long, 0.5 cm wide and 0.33 cm thick.
- the small sides of each sample (0.5X0.33) were painted with Dupont conducting paint 4817 and the resistance between them measured before and after treatment, using a Beckman RMS3030 multimeter. From the measured resistance the resistivity was then calculated and is reported in the Tables.
- a plurality of samples cut from molded plaques of a polymer that is sold under the trademark NORYL and which are designated as SE90-960 and containing 6% by weight stainless steel fibers were exposed in a bell jar at atmospheric pressure to a vapor of N, N' dimethylaniline (DMA).
- DMA N, N' dimethylaniline
- the table below relates the resistivity of each sample before exposure to the DMA with the resistivity after absorption of the listed % by weight of DMA.
- Noryl® resin designated as SE90-GH100, also containing 6% by weight of stainless steel fibers were tested as in Example 1 above and TABLE II reflects the results of such tests.
- Example 3 Same as Example 3 except that the test samples were exposed to vapors of tetrathia fulvalene (TTF) under a vacuum at 130°C. Measurements were taken as in the previous examples with Table IV below reflecting the values measured.
- TTF tetrathia fulvalene
- Example 4 Same as Example 4 except that the test samples were exposed to vapors of N, N, N', N' tetramethyl p-phenylene diamine (TMPD) under vacuum at 60°C. Measurements were taken as in the previous examples and are reflected in Table V below.
- TMPD N, N, N', N' tetramethyl p-phenylene diamine
- Example 5 Again a procedure similar to Example 5 was performed with the exception that Lexan polycarbonate samples were exposed to vapors of 2-methyl naphthalene (2 MN) in air at atmospheric pressure at 50°C. Table VI shows the values of resistivity measured before and after addition of 2MN to the test samples at stated concentrations of 2MN.
- Example 5 Again a procedure similar to Example 5 was performed with the exception that the Lexan polycarbonate contained 26% by weight aluminum flakes and was exposed to DMA in air in a bell jar at atmospheric pressure. Table VII shows the values of resistivity measured before and after the treatment.
- the low ionization materials used in the examples above are but a few of those which could be used to achieve a similar result.
- the ionization potential of a material refers to the energy required to remove an electron from the highest filled orbital (most loosely bound electron) of a neutral molecule of such material in its ground state.
- a low ionization potential material is, therefore, generally characterized by the fact that, when added to the base plastic/metallic composites, it operates to supply electrons upon the application of a relatively small electrical potential, and thereby increases the overall conductivity of the composite.
- These materials must, of course, be selected, in part, based on their compatability with the matrix or base plastic material employed.
- the gas phase ionization potentials for the materials used in the examples discussed above are as follows: N N' DMA, 7.14 eV; 2MN, 7.96 eV; TMPO 6.33 eV and TTF, 7.0 eV.
- the base or matrix polymer materials have gas phase ionization potentials which range between 8.3 eV and 9.3 eV.
- materials having an ionization potential in the range between approximately 15%-30% lower than the matrix plastic material have been shown to produce significant reductions in resistivity. It is believed that a broader range of matrix/low ionization potential materials may be utilized to produce similar effects.
- Some low ionization materials may exhibit instability when combined with specific base plastics, however, it is believed that suitable stable compositions may be selected or, alternatively, known stabilizing techniques employed to improve the characteristics of the final composite.
- the low ionization potential materials were added to a previously prepared base composite plastic/metal filler material
- the thermoplastic composition may be heated within an extruder to a temperature sufficiently high to provide a viscosity that allows the thermoplastic polymer to flow and be blended with other constituents.
- temperatures will, of course, depend on the thermoplastic selected.
- the low ionization potential adder material and metallic filler are injected into the extruder at a point where the thermoplastic composition is molten.
- conventional techniques are utilized to obtain a uniform dispersion of the constituents within the composite material.
- the resulting blended composition may then be passed through a die at the end of the extruder and pellitized. These pellets may be subsequently utilized in extrusion processes, injection molding processes, etc. to obtain finished products, suitable for a particular high conductivity application.
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79499585A | 1985-11-04 | 1985-11-04 | |
US794995 | 1985-11-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0221434A1 true EP0221434A1 (de) | 1987-05-13 |
EP0221434B1 EP0221434B1 (de) | 1990-03-14 |
Family
ID=25164330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP86114549A Expired - Lifetime EP0221434B1 (de) | 1985-11-04 | 1986-10-21 | Verbesserung der Leitfähigkeit von metallische Füllstoffe enthaltenden Kunststoffen |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0221434B1 (de) |
JP (1) | JPS62135564A (de) |
DE (1) | DE3669611D1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0297677A1 (de) * | 1987-06-30 | 1989-01-04 | Akzo N.V. | Leitungsmetallisierung von Substraten mittels Entwicklungsmittel |
WO1989012306A1 (en) * | 1988-06-08 | 1989-12-14 | Akzo N.V. | Conductive metal-filled composites via developing agents |
US5252255A (en) * | 1988-06-08 | 1993-10-12 | Akzo America Inc. | Conductive metal-filled substrates via developing agents |
EP1184880A2 (de) * | 2000-08-31 | 2002-03-06 | Matsushita Electric Industrial Co., Ltd. | Leitfähiges Bindemittel und Verpackungsstruktur daraus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0131067A1 (de) * | 1983-07-11 | 1985-01-16 | Toshiba Chemical Corporation | Leitfähiges formbares Material aus synthetischem Harz |
JPS6063237A (ja) * | 1983-09-14 | 1985-04-11 | Nissin Electric Co Ltd | 電界緩和用高分子組成物 |
EP0144127A1 (de) * | 1983-10-07 | 1985-06-12 | Nippon Telegraph And Telephone Corporation | Elektrisch leitfähiger Polymer und deren Herstellung |
FR2561032A1 (fr) * | 1984-03-07 | 1985-09-13 | Mitsui Toatsu Chemicals | Composition de resine conductrice contenant de l'iode |
EP0172518A2 (de) * | 1984-08-24 | 1986-02-26 | BASF Aktiengesellschaft | Verfahren zur Herstellung von Verbundstoffen aus nichtleitenden und intrinsisch leitfähigen Polymeren |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0663237A (ja) * | 1992-08-25 | 1994-03-08 | Osamu Ishitobi | パチンコ台及びパチンコ台配置構造 |
-
1986
- 1986-10-21 DE DE8686114549T patent/DE3669611D1/de not_active Expired - Fee Related
- 1986-10-21 EP EP86114549A patent/EP0221434B1/de not_active Expired - Lifetime
- 1986-10-28 JP JP25485886A patent/JPS62135564A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0131067A1 (de) * | 1983-07-11 | 1985-01-16 | Toshiba Chemical Corporation | Leitfähiges formbares Material aus synthetischem Harz |
JPS6063237A (ja) * | 1983-09-14 | 1985-04-11 | Nissin Electric Co Ltd | 電界緩和用高分子組成物 |
EP0144127A1 (de) * | 1983-10-07 | 1985-06-12 | Nippon Telegraph And Telephone Corporation | Elektrisch leitfähiger Polymer und deren Herstellung |
FR2561032A1 (fr) * | 1984-03-07 | 1985-09-13 | Mitsui Toatsu Chemicals | Composition de resine conductrice contenant de l'iode |
EP0172518A2 (de) * | 1984-08-24 | 1986-02-26 | BASF Aktiengesellschaft | Verfahren zur Herstellung von Verbundstoffen aus nichtleitenden und intrinsisch leitfähigen Polymeren |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0297677A1 (de) * | 1987-06-30 | 1989-01-04 | Akzo N.V. | Leitungsmetallisierung von Substraten mittels Entwicklungsmittel |
WO1989012306A1 (en) * | 1988-06-08 | 1989-12-14 | Akzo N.V. | Conductive metal-filled composites via developing agents |
US4961879A (en) * | 1988-06-08 | 1990-10-09 | Akzo America Inc. | Conductive metal-filled substrates via developing agents |
US5252255A (en) * | 1988-06-08 | 1993-10-12 | Akzo America Inc. | Conductive metal-filled substrates via developing agents |
EP1184880A2 (de) * | 2000-08-31 | 2002-03-06 | Matsushita Electric Industrial Co., Ltd. | Leitfähiges Bindemittel und Verpackungsstruktur daraus |
EP1184880A3 (de) * | 2000-08-31 | 2003-12-17 | Matsushita Electric Industrial Co., Ltd. | Leitfähiges Bindemittel und Verpackungsstruktur daraus |
Also Published As
Publication number | Publication date |
---|---|
DE3669611D1 (de) | 1990-04-19 |
JPS62135564A (ja) | 1987-06-18 |
EP0221434B1 (de) | 1990-03-14 |
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