EP0221434A1 - Verbesserung der Leitfähigkeit von metallische Füllstoffe enthaltenden Kunststoffen - Google Patents

Verbesserung der Leitfähigkeit von metallische Füllstoffe enthaltenden Kunststoffen Download PDF

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Publication number
EP0221434A1
EP0221434A1 EP86114549A EP86114549A EP0221434A1 EP 0221434 A1 EP0221434 A1 EP 0221434A1 EP 86114549 A EP86114549 A EP 86114549A EP 86114549 A EP86114549 A EP 86114549A EP 0221434 A1 EP0221434 A1 EP 0221434A1
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EP
European Patent Office
Prior art keywords
composite
insulating material
group
adder
thermoplastic
Prior art date
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Application number
EP86114549A
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English (en)
French (fr)
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EP0221434B1 (de
Inventor
Stefan Jacek Rzad
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General Electric Co
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General Electric Co
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Publication date
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/24Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

  • the present invention relates to electrically conductive plastic composite materials and particularly to methods for making such materials. More particularly, this invention relates to a method for increasing the electrical conductivity of such composite materials and to the products of such a method. While the invention relates primarily to solid or foamed resinous composites, it is believed that the principles of the invention may be applicable to materials other than resinous materials including various other high resistivity composite materials such as ceramics, wood composites, and concrete, for example.
  • the improved electrical conductivity of these materials is based on the fact that the metal fibers or filaments, which are of relatively short length are either in direct contact with each other at enumerable points throughout the volume of the plastic or are so closely adjacent each other that despite the small separation by the plastic, improved conductivity nevertheless results.
  • thermoplastics the short lengths of metal coated fibers or conductive filaments are combined with fluid polymerizable material.
  • the many individual lengths of conductive filaments develop a thin film of the insulating plastic thereon.
  • This thin insulating film may increase the distance between adjacent conductive fibers in the finished material to the extent that the desired electrical conductivity is not achieved.
  • the metallic or conductive fibers are interspersed throughout the volume of the plastic in a three dimensional random network, the overall conductivity of the plastic is the cumulative effect of the conductivity of the many various individual current paths between adjacent metallic elements.
  • One obvious way to increase conductivity in such composites is to increase the ratio of metallized particles or fibers carried in the material.
  • a yet further object of the invention is to produce a conductive plastic composite having a given electrical conductivity with a lower weight percentage of conductive material therein.
  • the product of the above-noted process is highly useful for various applications such as enclosures for electronic equipment where conductivity, shielding, and grounding are important including, for example, cabinetry for electronic equipment such as communications equipment, instruments and computers.
  • the intended improvement in the electrostatic shielding capability of plastic composite materials may be sufficiently great to allow their use as a low cost alternative to metallic enclosures.
  • the method of the present invention relates primarily to a wide variety of conductive resinous composite materials, such as conductive plastic composite materials where the plastics include both thermoplastics and thermosets.
  • suitable thermoplastics include, but are not limited to polycarbonates, polyesters, oxide polymers, polyurethanes, polyamides, acrylics, polyvinylchlorides and hydrocarbon polymers.
  • suitable thermosets include, but are not limited to polyesters, epoxies, ureas and silicones.
  • Suitable conductive materials useful for incorporation into the plastic composites include various types of metal fibers and ribbons and metal particles of various shapes, metallized glass, metallized graphite or other conductive or nonconductive fibers, and carbon fiber and carbon particles of various shapes.
  • the choice metal is wide; however, for practical reasons the choice is usually narrowed to inexpensive metals that have good conductivity and are easily formed.
  • Aluminum is the most preferred as fitting the above criteria. However, the processes are equally applicable to composites having other metals such as stainless steel, silver, copper, zinc, iron, nickel, carbon steel, etc. and mixtures thereof.
  • metallized glass fibers are preferably coated with aluminum due to the above criteria and due to its low melting point, which facilitates its manufacture.
  • test samples were cut from molded plaques of the designated matrix or base material.
  • the samples were typically 6 cm long, 0.5 cm wide and 0.33 cm thick.
  • the small sides of each sample (0.5X0.33) were painted with Dupont conducting paint 4817 and the resistance between them measured before and after treatment, using a Beckman RMS3030 multimeter. From the measured resistance the resistivity was then calculated and is reported in the Tables.
  • a plurality of samples cut from molded plaques of a polymer that is sold under the trademark NORYL and which are designated as SE90-960 and containing 6% by weight stainless steel fibers were exposed in a bell jar at atmospheric pressure to a vapor of N, N' dimethylaniline (DMA).
  • DMA N, N' dimethylaniline
  • the table below relates the resistivity of each sample before exposure to the DMA with the resistivity after absorption of the listed % by weight of DMA.
  • Noryl® resin designated as SE90-GH100, also containing 6% by weight of stainless steel fibers were tested as in Example 1 above and TABLE II reflects the results of such tests.
  • Example 3 Same as Example 3 except that the test samples were exposed to vapors of tetrathia fulvalene (TTF) under a vacuum at 130°C. Measurements were taken as in the previous examples with Table IV below reflecting the values measured.
  • TTF tetrathia fulvalene
  • Example 4 Same as Example 4 except that the test samples were exposed to vapors of N, N, N', N' tetramethyl p-phenylene diamine (TMPD) under vacuum at 60°C. Measurements were taken as in the previous examples and are reflected in Table V below.
  • TMPD N, N, N', N' tetramethyl p-phenylene diamine
  • Example 5 Again a procedure similar to Example 5 was performed with the exception that Lexan polycarbonate samples were exposed to vapors of 2-methyl naphthalene (2 MN) in air at atmospheric pressure at 50°C. Table VI shows the values of resistivity measured before and after addition of 2MN to the test samples at stated concentrations of 2MN.
  • Example 5 Again a procedure similar to Example 5 was performed with the exception that the Lexan polycarbonate contained 26% by weight aluminum flakes and was exposed to DMA in air in a bell jar at atmospheric pressure. Table VII shows the values of resistivity measured before and after the treatment.
  • the low ionization materials used in the examples above are but a few of those which could be used to achieve a similar result.
  • the ionization potential of a material refers to the energy required to remove an electron from the highest filled orbital (most loosely bound electron) of a neutral molecule of such material in its ground state.
  • a low ionization potential material is, therefore, generally characterized by the fact that, when added to the base plastic/metallic composites, it operates to supply electrons upon the application of a relatively small electrical potential, and thereby increases the overall conductivity of the composite.
  • These materials must, of course, be selected, in part, based on their compatability with the matrix or base plastic material employed.
  • the gas phase ionization potentials for the materials used in the examples discussed above are as follows: N N' DMA, 7.14 eV; 2MN, 7.96 eV; TMPO 6.33 eV and TTF, 7.0 eV.
  • the base or matrix polymer materials have gas phase ionization potentials which range between 8.3 eV and 9.3 eV.
  • materials having an ionization potential in the range between approximately 15%-30% lower than the matrix plastic material have been shown to produce significant reductions in resistivity. It is believed that a broader range of matrix/low ionization potential materials may be utilized to produce similar effects.
  • Some low ionization materials may exhibit instability when combined with specific base plastics, however, it is believed that suitable stable compositions may be selected or, alternatively, known stabilizing techniques employed to improve the characteristics of the final composite.
  • the low ionization potential materials were added to a previously prepared base composite plastic/metal filler material
  • the thermoplastic composition may be heated within an extruder to a temperature sufficiently high to provide a viscosity that allows the thermoplastic polymer to flow and be blended with other constituents.
  • temperatures will, of course, depend on the thermoplastic selected.
  • the low ionization potential adder material and metallic filler are injected into the extruder at a point where the thermoplastic composition is molten.
  • conventional techniques are utilized to obtain a uniform dispersion of the constituents within the composite material.
  • the resulting blended composition may then be passed through a die at the end of the extruder and pellitized. These pellets may be subsequently utilized in extrusion processes, injection molding processes, etc. to obtain finished products, suitable for a particular high conductivity application.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP86114549A 1985-11-04 1986-10-21 Verbesserung der Leitfähigkeit von metallische Füllstoffe enthaltenden Kunststoffen Expired - Lifetime EP0221434B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79499585A 1985-11-04 1985-11-04
US794995 1985-11-04

Publications (2)

Publication Number Publication Date
EP0221434A1 true EP0221434A1 (de) 1987-05-13
EP0221434B1 EP0221434B1 (de) 1990-03-14

Family

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Family Applications (1)

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EP86114549A Expired - Lifetime EP0221434B1 (de) 1985-11-04 1986-10-21 Verbesserung der Leitfähigkeit von metallische Füllstoffe enthaltenden Kunststoffen

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Country Link
EP (1) EP0221434B1 (de)
JP (1) JPS62135564A (de)
DE (1) DE3669611D1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0297677A1 (de) * 1987-06-30 1989-01-04 Akzo N.V. Leitungsmetallisierung von Substraten mittels Entwicklungsmittel
WO1989012306A1 (en) * 1988-06-08 1989-12-14 Akzo N.V. Conductive metal-filled composites via developing agents
US5252255A (en) * 1988-06-08 1993-10-12 Akzo America Inc. Conductive metal-filled substrates via developing agents
EP1184880A2 (de) * 2000-08-31 2002-03-06 Matsushita Electric Industrial Co., Ltd. Leitfähiges Bindemittel und Verpackungsstruktur daraus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0131067A1 (de) * 1983-07-11 1985-01-16 Toshiba Chemical Corporation Leitfähiges formbares Material aus synthetischem Harz
JPS6063237A (ja) * 1983-09-14 1985-04-11 Nissin Electric Co Ltd 電界緩和用高分子組成物
EP0144127A1 (de) * 1983-10-07 1985-06-12 Nippon Telegraph And Telephone Corporation Elektrisch leitfähiger Polymer und deren Herstellung
FR2561032A1 (fr) * 1984-03-07 1985-09-13 Mitsui Toatsu Chemicals Composition de resine conductrice contenant de l'iode
EP0172518A2 (de) * 1984-08-24 1986-02-26 BASF Aktiengesellschaft Verfahren zur Herstellung von Verbundstoffen aus nichtleitenden und intrinsisch leitfähigen Polymeren

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0663237A (ja) * 1992-08-25 1994-03-08 Osamu Ishitobi パチンコ台及びパチンコ台配置構造

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0131067A1 (de) * 1983-07-11 1985-01-16 Toshiba Chemical Corporation Leitfähiges formbares Material aus synthetischem Harz
JPS6063237A (ja) * 1983-09-14 1985-04-11 Nissin Electric Co Ltd 電界緩和用高分子組成物
EP0144127A1 (de) * 1983-10-07 1985-06-12 Nippon Telegraph And Telephone Corporation Elektrisch leitfähiger Polymer und deren Herstellung
FR2561032A1 (fr) * 1984-03-07 1985-09-13 Mitsui Toatsu Chemicals Composition de resine conductrice contenant de l'iode
EP0172518A2 (de) * 1984-08-24 1986-02-26 BASF Aktiengesellschaft Verfahren zur Herstellung von Verbundstoffen aus nichtleitenden und intrinsisch leitfähigen Polymeren

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0297677A1 (de) * 1987-06-30 1989-01-04 Akzo N.V. Leitungsmetallisierung von Substraten mittels Entwicklungsmittel
WO1989012306A1 (en) * 1988-06-08 1989-12-14 Akzo N.V. Conductive metal-filled composites via developing agents
US4961879A (en) * 1988-06-08 1990-10-09 Akzo America Inc. Conductive metal-filled substrates via developing agents
US5252255A (en) * 1988-06-08 1993-10-12 Akzo America Inc. Conductive metal-filled substrates via developing agents
EP1184880A2 (de) * 2000-08-31 2002-03-06 Matsushita Electric Industrial Co., Ltd. Leitfähiges Bindemittel und Verpackungsstruktur daraus
EP1184880A3 (de) * 2000-08-31 2003-12-17 Matsushita Electric Industrial Co., Ltd. Leitfähiges Bindemittel und Verpackungsstruktur daraus

Also Published As

Publication number Publication date
DE3669611D1 (de) 1990-04-19
JPS62135564A (ja) 1987-06-18
EP0221434B1 (de) 1990-03-14

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