EP0218832A1 - Surface-mounted component and method of affixing a surface-mounted component - Google Patents
Surface-mounted component and method of affixing a surface-mounted component Download PDFInfo
- Publication number
- EP0218832A1 EP0218832A1 EP86110874A EP86110874A EP0218832A1 EP 0218832 A1 EP0218832 A1 EP 0218832A1 EP 86110874 A EP86110874 A EP 86110874A EP 86110874 A EP86110874 A EP 86110874A EP 0218832 A1 EP0218832 A1 EP 0218832A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- component
- adhesive
- fixed
- smd
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/039—Spraying with other step
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Definitions
- the invention relates to a component for surface mounting according to the preamble of claim 1 and a method for fastening a component for surface mounting according to the preamble of claim 8.
- SMD Surface mounted Device
- Components for surface mounting are usually made from a transport belt, i.e. H. taken out of a plastic cavity and glued in a positioned manner to the surface of another body, for example a printed circuit board. The other body is then turned over and immersed in a tin bath or in a solder bath for soldering the component connections.
- a transport belt i.e. H. taken out of a plastic cavity and glued in a positioned manner to the surface of another body, for example a printed circuit board.
- the other body is then turned over and immersed in a tin bath or in a solder bath for soldering the component connections.
- the distance of the housing 1 of the SMD component from the surface of the other body 4, on which the SMD component is to be attached must not become too large due to the manufacturing tolerances which inevitably occur when the connecting legs 2 of the SMD component bend .
- the distance of the housing 1 of the SMD component from the surface of the other body 4 on which the SMD component is to be attached is 0.05 + 0.05 mm.
- the entire method for attaching an SMD component according to the prior art is very complex overall, so that even with a component and with a method according to the prior art, secure bonding of an SMD component can be achieved.
- the positioning of the adhesive 3 under the housing 1 of the SMD component according to the prior art requires a relatively large amount of effort. According to the prior art the adhesive 3 are sprayed on and must also be metered in relatively narrow tolerances. The manufacturing tolerances that are unavoidable when the connecting legs of the SMD component bend influence the distance of the housing 1 from the surface of the other body 4 on which the SMD component is to be attached.
- the distance of the housing 1 of the SMD component from the surface of the other body 4 on which the SMD component is to be fixed can only be made up to these manufacturing tolerances of the connection legs of the SMD Component can be specified exactly. Because of this tolerance in the distance of the housing 1 from the surface of the other body 4, the metering of the adhesive 3 is also subject to a tolerance. This dosage of the adhesive 3 depends on the distance of the housing 1 from the surface of the other body 4 on which the SMD component is to be attached.
- the distance of the housing 1 from the surface of the other body 4 on which the SMD component is to be fixed turns out to be particularly large, it may be that the dosage of the adhesive 3 is no longer sufficient to adequately cover the housing 1 and the surface of the other body 4 and thus to ensure the necessary adhesive strength of the SMD component on the other body 4.
- the distance of the housing 1 from the surface of the other body 4 is dimensioned very small from the start, it can happen that with a given dosage of the adhesive 3 in some SMD components, in which the bend of the connection legs 2 during manufacture has turned out so that the distance of the housing 1 from the surface of the other body 4 has not been increased, the soldering surfaces of these connecting legs are covered with adhesive 3 and so that perfect solder joints are no longer possible.
- the present invention has for its object to avoid the disadvantages mentioned in the prior art.
- the surface of the housing SMD component to be fixed is structured according to the invention in order to improve the adhesive strength so that the housing of the SMD
- the component on the one hand can lie snugly on the surface of the other body, and on the other hand a sufficient amount of the adhesive still remains between the housing of the SMD component and the surface of the other body.
- This structuring of the surface of the SMD component to be fixed can take place, for example, by forming grooves or by roughening or by forming cavities, in particular flat cavities.
- the formation of these structures on the surface of an SMD component to be fixed has the advantage that the demolding of this housing is not made difficult when the housing of the SMD component is manufactured. This advantage plays a special role if the housing of the SMD component consists of plastic, ceramic or some other material that takes its shape in a casting or injection mold and that must finally be removed from this mold.
- the application of the invention is particularly advantageous when the structure is produced on the surface of the SMD component to be fixed in such a way that excess adhesive is not pressed out at those locations of the SMD component where electrical connections of the SMD component are located, and when that location on the surface of the other body, on which the SMD component is positioned, is arranged in such a way that excess glue is pressed out at those locations which also have no adverse effects on the function of the other body with respect to the surface of the other body.
- a printed circuit board on which an SMD component is attached can be considered as another body.
- the invention advantageously makes it possible to provide the surface of the SMD component to be fixed with an adhesive even before the SMD component is attached to the surface of the other body.
- An agent can be used as an adhesive which, for example under low contact pressure and / or at elevated temperature and / or when using a solvent, provides a firmly bonded connection between the housing of the SMD component and the surface of another body on which the SMD component is fixed should be manufactured.
- an adhesive or an adhesive film can already be applied by the component manufacturer to the surface of the SMD component to be fixed.
- adhesive can be applied to the surface of the component to be fixed before the SMD component is taped.
- the invention enables the adhesive to be sheet-like on the surface of another body on which the SMD component to be fixed to apply.
- an adhesive can be applied to the surface of the other body, for example, by spraying on with the aid of one or more masks and / or by means of a printing process and / or in the form of adhesive films.
- the adhesive can be applied to the surface of the other body immediately before the assembly of the components or during the manufacture of the other body.
- the adhesive on the surface of the other body on which the SMD component is to be fixed can be activated, for example, by contact pressure and / or by temperature and / or by solvent in the adhesive effect.
- the invention can be used with all SMD components.
- the invention is particularly advantageous in the case of SOT components, for example in the types SOT-23 and SOT-143.
- Figures 2 and 3 each show a component for surface mounting with a housing 1 and with leg 2, which is fixed by means of an adhesive 3 on a circuit board 4.
- the side of the housing 1 of the SMD component with which the SMD component is fastened on the printed circuit board 4 has a special structure in each case.
- this side of the SMD component has grooves. Grooves. These grooves or grooves are shaped so that the housing 1 on the one hand can rest snugly on the circuit board 4, on the other hand that a sufficient amount of the adhesive 3 remains between the housing 1 and the circuit board 4 and that superfluous adhesive at such points is squeezed out at which there is no danger that a connecting leg 2 or a point to be soldered on the circuit board 4 will be covered with adhesive.
- the housing 1 of Figure 3 has a flat cavity, which also enables the housing 1 in Figure 3 on the one hand to lie snugly, and on the other hand that an adequate amount of the adhesive remains between the housing 1 and the circuit board 4 and that in turn superfluous adhesive is pressed out in such places where there is no risk that a connecting leg 2 or a solder joint on the printed circuit board 4 will be covered with adhesive.
- the surface mounting technology enables low costs. This advantage is reinforced by the invention.
- the invention enables greater independence in the attachment of an SMD component to the surface of another body from manufacturing tolerances in the bending of connecting legs.
- the invention enables greater flexibility in the use of SMD components.
- the invention enables adhesive to be applied to the side of the SMD component to be fixed and / or to the surface of the other body on which the SMD component is to be fixed, even before the component is assembled. Tolerances in the metering of the adhesive have to be taken into account far less than in the prior art. This enables advantages even with the dimensions of the SMD component.
- SMD components are advantageously supplied in webbing +.
- Automatic placement machines to which SMD components are fed in belt straps, work particularly cost-effectively.
- the invention enables a more flexible, reliable, faster and cheaper surface mounting than was possible according to the prior art.
- the invention can be used for hybrid circuits, for visual circuit structures, for printed circuit boards, etc.
- Multi-component adhesives are also possible as adhesives.
- the adhesive components can be distributed on the side of the SMD component to be fixed and on the surface of the other body on which the component is to be attached, also in the form of adhesive films.
- SMD components When SMD components are applied to a substrate, for example on a circuit board, these SMD components can fall down again if the adhesive which has to be applied to the substrate had been applied to the substrate a relatively long time ago and is therefore light has dried out or hardened and therefore no longer has a lot of adhesive power.
- the SMD component has a cavity 3
- an adhesive or an adhesive component can be attached in good time so that the adhesive as a whole develops sufficient adhesive force when the SMD component is applied to the substrate, the adhesive or the adhesive component can also be applied spatially precisely at those locations where adhesive force has to be developed for the reliable fastening of the SMD component without the applied adhesive or the applied adhesive brought glue component slipped or flowed or dripped and would ultimately be in places where adhesive is undesirable.
- the cavity 3 is a well-suited form to reliably hold a sufficient amount of adhesive at such a time that the SMD component can finally be reliably attached to the substrate.
- the shape of the cavity 3 is particularly favorable when a two-component adhesive is used, an adhesive component being able to be accommodated in the cavity 3, so that the adhesive as a whole can then be accommodated in its own and separate space in sufficient quantity as a result of the cavity to achieve a good adhesive effect, with a suitable distance between the connection legs 2 and the substrate (circuit board) being defined by the base point of the housing 1 at the edge of the cavity 3, so that an optimal electrical contacting of the SMD component with optimum adhesive force of the Glue can be achieved at the same time.
- the base point of the housing 1 on the edge of the housing 1 can also be achieved if the edge of the cavity 3 does not lie on the substrate (circuit board) in each of its points.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Die Bonding (AREA)
Abstract
Ein Bauelement für die Oberflächenmontage mit beliebigen Abmessungen und mit einer beliebigen Zahl von Anschlußbeinchen (2), mit einer Oberfläche, die mittels eines Klebers auf einer Oberfläche eines anderen Körpers (4) fixiert werden soll, soll sicher und rasch auf dem anderen Körper (4) befestigt werden können. Die zu fixierende Oberfläche des Bauelements weist zur Verbesserung der Haftfestigkeit eine Struktur auf, die es ermöglicht, daß diese zu fixierende Oberfläche auf der Oberfläche des anderen Körpers (4) einerseits satt aufliegen kann, andererseits jedoch eine zur Fixierung außreichende Klebermenge (3) zwischen der zu fixierenden Oberfläche des Bauelements und der Oberfläche des anderen Körpers (4) verbleibt. A component for surface mounting with any dimensions and with any number of connecting legs (2), with a surface that is to be fixed by means of an adhesive on a surface of another body (4), should be safely and quickly on the other body (4 ) can be attached. The surface of the component to be fixed has a structure to improve the adhesive strength, which makes it possible that this surface to be fixed can lie snugly on the surface of the other body (4) on the one hand, but on the other hand a sufficient amount of adhesive (3) for fixing between the surface of the component to be fixed and the surface of the other body (4) remains.
Description
Die Erfindung betrifft ein Bauelement für die Oberflächenmontage nach dem Oberbegriff des Anspruchs 1 und ein Verfahren zur Befestigung eines Bauelements für die Oberflächenmontage nach dem Oberbegriff des Anspruchs 8.The invention relates to a component for surface mounting according to the preamble of
Seit mehreren Jahren werden Bauelemente für die Oberflächenmontage, bekannt unter der Bezeichnung SMD (Surface mounted Device), zur Hybridisierung von Schichtschaltungen verwendet. Der Masseneinsatz von SMD-Bauelementen bringt zusammen mit dem Übergang von Handbestückung auf automatische Bestückung einen wesentlichen Anstieg der Rentabilität. Nachdem nun ein umfangreiches Programm an Bauteilen und Bestückungsautomaten vorhanden ist, gehen immer mehr Anwender dazu über, diese Aufbautechnologie auch für Leiterplatten einzuführen.Components for surface mounting, known under the name SMD (Surface mounted Device), have been used for the hybridization of layer circuits for several years. The mass use of SMD components together with the transition from manual assembly to automatic assembly brings a significant increase in profitability. Now that an extensive range of components and automatic assembly machines is available, more and more users are beginning to introduce this assembly technology for printed circuit boards.
Bauelemente für die Oberflächenmontage werden üblicherweise aus einem Transportgurt, d. h. aus einer Plastikkavität genommen und in positionierter Weise auf die Oberfläche eines anderen Körpers, beispielsweise einer Leiterplatte, geklebt. Anschließend wird der andere Körper gewendet und zur Lötung der Bauelemente-Anschlüsse durch ein Zinnbad bzw. in ein Lötbad getaucht.Components for surface mounting are usually made from a transport belt, i.e. H. taken out of a plastic cavity and glued in a positioned manner to the surface of another body, for example a printed circuit board. The other body is then turned over and immersed in a tin bath or in a solder bath for soldering the component connections.
Von besonderer Bedeutung dabei ist die schnelle und sichere Befestigung der Bauelemente auf dem anderen Körper vom Zeitpunkt der Positionierung der Bauelemente an bis zum Ende des Lötvorganges, d. h. bis zum Erstarren der Lötstellen.Of particular importance here is the fast and secure fastening of the components on the other body from the time the components are positioned to the end of the soldering process, ie until the solder joints solidify.
Fig. 1 zeigt, wie das dabei auftretende technische Problem bisher gelöst worden ist. Nach dem Stand der Technik müssen zur sicheren Klebung eines Bauelements für die Oberflächenmontage folgende Bedingungen eingehalten werden:
- 1. Die
Klebemasse 3 muß unter demGehäuse 1 des SMD-Bauelements positioniert werden. - 2. Die nach dem Stand der Technik aufgespritze Menge des
Klebers 3 muß nach dem Stand der Technik so dosiert sein, daß einerseits dasGehäuse 1 des SMD-Bauelements und die Oberfläche einesanderen Körpers 4, auf dem das SMD-Bauelement befestigt werden soll, ausreichend bedeckt werden, um die notwendige Haftfestigkeit des SMD-Bauelements zu erreichen, und daß andererseits dieKlebemasse 3 nicht die Lötflächen der Bauelement-Anschlüsse bedeckt.
- 1. The
adhesive 3 must be positioned under thehousing 1 of the SMD component. - 2. The amount of adhesive 3 sprayed on according to the prior art must be metered according to the prior art so that on the one hand the
housing 1 of the SMD component and the surface of anotherbody 4 on which the SMD component is to be attached, covered sufficiently to achieve the necessary adhesive strength of the SMD component, and that on the other hand, theadhesive 3 does not cover the soldering surfaces of the component connections.
Der Abstand des Gehäuses 1 des SMD-Bauelements von der Oberfläche des anderen Körpers 4, auf dem das SMD-Bauelement befestigt werden soll, darf nicht infolge der Fertigungstoleranzen, die bei der Biegung der Anschlußbeinchen 2 des SMD-Bauelements unvermeidlich auftreten, zu groß werden. Beispielsweise beträgt der Abstand des Gehäuses 1 des SMD-Bauelements von der Oberfläche des anderen Körpers 4, auf dem das SMD-Bauelement befestigt werden soll, 0,05 + 0,05 mm.The distance of the
Das gesamte Verfahren zur Befestigung eines SMD-Bauelements nach dem Stand der Technik ist insgesamt sehr aufwendig, damit auch bei einem Bauelement und bei einem Verfahren nach den Stand der Technik eine sichere Klebung eines SMD-Bauelements erreicht werden kann. Die Positinierung der Klebemasse 3 unter dem Gehäuse 1 des SMD-Bauelements nach dem Stand der Technik erfordert einen relativ großen Aufwand. Nach dem Stand der Technik muß die Klebemasse 3 aufgespritzt werden und muß dabei außerdem noch in relativ engen Toleranzen dosiert werden. Die bei der Biegung der Anschlußbeinchen des SMD-Bauelements unvermeidlichen Fertigungstoleranzen beeinflussen den Abstand des Gehäuses 1 von der Oberfläche des anderen Körpers 4, auf dem das SMD-Bauelements befestigt werden soll. Bei einem Bauelement und bei einem Verfahren nach dem Stand der Technik kann der Abstand des Gehäuses 1 des SMD-Bauelements von der Oberfläche des anderen Körpers 4, auf dem das SMD-Bauelement fixiert werden soll, nur bis auf diese Fertigungstoleranzen der Anschlußbeinchen des SMD-Bauelements genau angegeben werden. Aufgrund dieser Toleranz beim Abstand des Gehäuses 1 von der Oberfläche des anderen Körper 4 ist auch die Dosierung der Klebemasse 3 mit einer Toleranz behaftet. Diese Dosierung der Klebemasse 3 hängt nämlich vom Abstand des Gehäuses 1 von der Oberfläche des anderen Körper 4, auf dem das SMD-Bauelement befestigt werden soll, ab. Wenn nun infolge von Fertigungstoleranzen bei der Biegung der Anschlußbeinchen des SMD-Bauelements der Abstand des Gehäuses 1 von der Oberfläche des anderen Körpers 4, auf dem das SMD-Bauelement fixiert werden soll, besonders groß ausfällt, kann es sein, daß die Dosierung der Klebemasse 3 nicht mehr ausreicht, um das Gehäuse 1 und die Oberfläche des anderen Körpers 4 ausreichend zu bedecken und um damit die notwendige Haftfestigkeit des SMD-Bauelements auf dem anderen Körper 4 zu gewährleisten. Wird andererseits der Abstand des Gehäuses 1 von der Oberfläche des anderen Körpers 4 von Anfang an sehr klein dimensioniert, so kann es vorkommen, daß bei einer vorgegebenen Dosiermenge der Klebemasse 3 bei manchen SMD-Bauelementen, bei denen die Biegung der Anschlußbeinchen 2 bei der Fertigung so ausgefallen ist, daß der Abstand des Gehäuses 1 von der Oberfläche des anderen Körpers 4 nicht vergrößert worden ist, die Lötflächen dieser Anschlußbeinchen von Klebemasse 3 bedeckt werden und daß damit einwandfreie Lötstellen nicht mehr möglich sind.The entire method for attaching an SMD component according to the prior art is very complex overall, so that even with a component and with a method according to the prior art, secure bonding of an SMD component can be achieved. The positioning of the
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, die beim Stand der Technik genannten Nachteile zu vermeiden.The present invention has for its object to avoid the disadvantages mentioned in the prior art.
Diese Aufgabe wird erfindungsgemäß durch ein Bauelement für die Oberflächenmontage nach dem Anspruch 1 und durch ein Verfahren zur Befestigung eines Bauelements für die Oberflächenmontage nach dem Anspruch 8 gelöst.This object is achieved according to the invention by a component for surface mounting according to
Zur Befestigung des Gehäuses des SMD-Bauelements mit beliebigen Abmessungen auf der Oberfläche eines anderen Körpers und mit einer beliebigen Zahl von Anschlußbeinchen wird nach der Erfindung zur Verbesserung der Haftfestigkeit die zu fixierende Oberfläche des Gehäuses SMD-Bauelements so strukturiert, daß das Gehäuse des SMD-Bauelements einerseits auf der Oberfläche des anderen Körpers satt aufliegen kann, und daß andererseits noch eine ausreichende Menge des Klebestoffes zwischen dem Gehäuse des SMD-Bauelements und der Oberfläche des anderen Körpers verbleibt. Diese Stukturierung der zu fixierenden Oberfläche des SMD-Bauelements kann beispielsweise durch Bildung von Riefen oder durch Aufrauhen oder durch Bildung von Kavitäten, insbesondere von flachen Kavitäten, erfolgen. Die Bildung dieser Strukturen auf der zu fixierenden Oberfläche eines SMD-Bauelements hat den Vorteil, daß bei der Herstellung des Gehäuses des SMD-Bauelements die Entformbarkeit dieses Gehäuses nicht erschwert wird. Dieser Vorteil spielt eine besondere Rolle dann, wenn das Gehäuse des SMD-Bauelements aus Plastik, aus Keramik oder aus einem sonstigen Material besteht, das in einer Guß-oder Spritzform seine Gestalt erhält und das schließlich dieser Form entnommen werden muß.For fastening the housing of the SMD component with any dimensions on the surface of another body and with any number of connecting legs, the surface of the housing SMD component to be fixed is structured according to the invention in order to improve the adhesive strength so that the housing of the SMD The component on the one hand can lie snugly on the surface of the other body, and on the other hand a sufficient amount of the adhesive still remains between the housing of the SMD component and the surface of the other body. This structuring of the surface of the SMD component to be fixed can take place, for example, by forming grooves or by roughening or by forming cavities, in particular flat cavities. The formation of these structures on the surface of an SMD component to be fixed has the advantage that the demolding of this housing is not made difficult when the housing of the SMD component is manufactured. This advantage plays a special role if the housing of the SMD component consists of plastic, ceramic or some other material that takes its shape in a casting or injection mold and that must finally be removed from this mold.
Besonders vorteilhaft ist die Anwendung der Erfindung dann, wenn die Struktur auf der zu fixierenden Oberfläche des SMD-Bauelements so erzeugt wird, daß überflüssiger Klebstoff nicht an solchen Stellen des SMD-Bauelements ausgepreßt wird, an denen sich elektrische Anschlüsse des SMD-Bauelements befinden, und wenn diejenige Stelle auf der Oberfläche des anderen Körpers, auf der das SMD-Bauelement positioniert wird, so angeordnet wird, daß überflüssiger Klebstoff an solchen Stellen ausgepreßt wird, die auch bezüglich der Oberfläche des anderen Körpers keine für die Funktion des anderen Körpers nachteilhaften Auswirkungen haben.The application of the invention is particularly advantageous when the structure is produced on the surface of the SMD component to be fixed in such a way that excess adhesive is not pressed out at those locations of the SMD component where electrical connections of the SMD component are located, and when that location on the surface of the other body, on which the SMD component is positioned, is arranged in such a way that excess glue is pressed out at those locations which also have no adverse effects on the function of the other body with respect to the surface of the other body.
Als anderer Körper kommt insbesondere eine Leiterplatte in Frage, auf der ein SMD-Bauelement befestigt wird.In particular, a printed circuit board on which an SMD component is attached can be considered as another body.
Die Erfindung ermöglicht es in vorteilhafter Weise, schon vor der Befestigung des SMD-Bauelements auf der Oberfläche des anderen Körpers die zu fixierende Oberfläche des SMD-Bauelements mit einem Klebstoff zu versehen. Als Klebstoff kann ein Mittel verwendet werden, das beispielsweise unter geringem Auflagedruck und/oder bei erhöhter Temperatur und/oder bei Anwendung eines Lösungsmittels eine festhaftende Verbindung zwischen dem Gehäuse des SMD-Bauelements und der Oberfläche eines anderen Körpers, auf dem das SMD-Bauelement fixiert werden soll, herstellt. Vorteilhafterweise kann dabei ein Klebstoff oder eine Klebefolie bereits vom Bauelementehersteller auf die zu fixierende Oberfläche des SMD-Bauelements aufgebracht werden.The invention advantageously makes it possible to provide the surface of the SMD component to be fixed with an adhesive even before the SMD component is attached to the surface of the other body. An agent can be used as an adhesive which, for example under low contact pressure and / or at elevated temperature and / or when using a solvent, provides a firmly bonded connection between the housing of the SMD component and the surface of another body on which the SMD component is fixed should be manufactured. Advantageously, an adhesive or an adhesive film can already be applied by the component manufacturer to the surface of the SMD component to be fixed.
Vorteilhafterweise kann Klebstoff bereits vor einer Gurtung des SMD-Bauelements auf die zu fixierende Oberfläche des Bauelements aufgebracht werden.Advantageously, adhesive can be applied to the surface of the component to be fixed before the SMD component is taped.
Die Erfindung ermöglicht es, den Klebstoff flächenförmig auf der Oberfläche eines anderen Körpers, auf dem das SMD-Bauelement fixiert werden soll, aufzutragen. Ein solcher Klebstoff kann beispielsweise durch Aufsprühen mit Hilfe einer oder mehrerer Masken und/oder mittels eines Druckverfahrens und/oder in Form von Klebefolien auf die Oberfläche des anderen Körpers aufgebracht werden. Das Aufbringen des Klebstoffes kann dabei unmittelbar vor der Bauelemente-Montage auf die Oberfläche des anderen Körpers oder schon bei der Herstellung des anderen Körpers erfolgen. Der Klebstoff auf der Oberfläche des anderen Körpers, auf dem das SMD-Bauelement fixiert werden soll, kann beispielsweise durch Auflagedruck und/oder durch Temperatur und/oder durch Lösungsmittel in der Klebewirkung aktiviert werden.The invention enables the adhesive to be sheet-like on the surface of another body on which the SMD component to be fixed to apply. Such an adhesive can be applied to the surface of the other body, for example, by spraying on with the aid of one or more masks and / or by means of a printing process and / or in the form of adhesive films. The adhesive can be applied to the surface of the other body immediately before the assembly of the components or during the manufacture of the other body. The adhesive on the surface of the other body on which the SMD component is to be fixed can be activated, for example, by contact pressure and / or by temperature and / or by solvent in the adhesive effect.
Die Erfindung kann bei allen SMD-Bauelementen verwendet werden. Besonders vorteilhaft ist die Erfindung bei SOT-Bauelementen, beispielsweise bei den Bauformen SOT- 23 und SOT- 143.The invention can be used with all SMD components. The invention is particularly advantageous in the case of SOT components, for example in the types SOT-23 and SOT-143.
Ausführungsbeispiele der Erfindung sind in der Zeichnung dargestellt und werden im folgenden näher erläutert.
- Fig. 1 zeigt ein Bauelement für die Oberflächenmontage nach dem Stand der Technik.
Figuren 2 und 3 zeigen Bauelemente für die Oberflächenmontage nach der Erfindung.
- Fig. 1 shows a component for surface mounting according to the prior art.
- Figures 2 and 3 show components for surface mounting according to the invention.
Die Figuren 2 und 3 zeigen jeweils ein Bauelement für die Oberflächenmontage mit einem Gehäuse 1 und mit Anschlußbeinchen 2, das mittels einer Klebemasse 3 auf einer Leiterplatte 4 befestigt ist. Diejenige Seite des Gehäuses 1 des SMD-Bauelements, mit der das SMD-Bauelements auf der Leiterplatte 4 befestigt ist, weist dabei jeweils eine besondere Struktur auf. In Figur 2 besitzt diese Seite des SMD-Bauelements Riefen bzw. Rillen bzw. Nuten. Diese Riefen bzw. Rillen bzw. Nuten sind so geformt, daß das Gehäuse 1 einerseits auf der Leiterplatte 4 satt aufliegen kann, daß andererseits noch eine ausreichende Menge des Klebstoffes 3 zwischen dem Gehäuse 1 und der Leiterplatte 4 verbleibt und daß überflüssiger Klebstoff an solchen Stellen ausgepreßt wird, an denen keine Gefahr besteht, daß ein Anschlußbeinchen 2 oder eine zu verlötende Stelle auf der Leiterplatte 4 mit Klebemasse bedeckt werden. Das Gehäuse 1 von Figur 3 weist eine flache Kavität auf, die ebenfalls ermöglicht, daß das Gehäuse 1 in Figur 3 einerseits satt aufliegen kann, und daß andererseits noch eine außreichende Menge des Klebstoffes zwischen Gehäuse 1 und Leiterplatte 4 verbleibt und daß wiederum überflüssiger Klebstoff an solchen Stellen ausgepreßt wird, wo keine Gefahr besteht, daß ein Anschlußbeinchen 2 oder eine Lötstelle auf der Leiterplatte 4 mit Klebmasse bedeckt wird.Figures 2 and 3 each show a component for surface mounting with a
Die Oberflächenmontagetechnik ermöglicht günstige Kosten. Dieser Vorteil wird durch die Erfindung verstärkt. Die Erfindung ermöglicht eine stärkere Unabhängigkeit bei der Befestigung eines SMD-Bauelements auf der Oberfläche eines anderen Körpers von Fertigungstoleranzen bei der Biegung von Anschlußbeinchen.The surface mounting technology enables low costs. This advantage is reinforced by the invention. The invention enables greater independence in the attachment of an SMD component to the surface of another body from manufacturing tolerances in the bending of connecting legs.
Die Erfindung ermöglicht eine größere Flexibilität bei der Anwendung von SMD-Bauelementen. Die Erfindung ermöglicht das Aufbringen von Klebmasse auf die zu fixierende Seite des SMD-Bauelements und/oder auf die Oberfläche des anderen Körpers, auf die das SMD-Bauelement fixiert werden soll, bereits vor der Bauelemente-Montage. Auf Toleranzen bei der Dosierung der Klebmasse muß wesentlich weniger Rücksicht genommen werden als beim Stand der Technik. Dies ermöglicht Vorteile auch bei den Abmessungen des SMD-Bauelements.The invention enables greater flexibility in the use of SMD components. The invention enables adhesive to be applied to the side of the SMD component to be fixed and / or to the surface of the other body on which the SMD component is to be fixed, even before the component is assembled. Tolerances in the metering of the adhesive have to be taken into account far less than in the prior art. This enables advantages even with the dimensions of the SMD component.
Vorteilhafterweise werden SMD-Bauelemente in Gurtbändern+ geliefert. Bestückungsautomaten, denen SMD-Bauelemente in Gurtbändern zugeführt werden, arbeiten besinders kostengünstig.SMD components are advantageously supplied in webbing +. Automatic placement machines, to which SMD components are fed in belt straps, work particularly cost-effectively.
Die Erfindung ermöglicht eine flexiblere, zuverlässigere, raschere und kostengünstigere Oberflächenmontage als dies nach dem Stand der Technik möglich war.The invention enables a more flexible, reliable, faster and cheaper surface mounting than was possible according to the prior art.
Die Erfindung ist anwendbar für Hybridschaltungen, für Sichtschaltungsaufbauten, für Leiterplatten usw. Als Kleber sind auch Mehrkomponeten kleber möglich. Die Kleberkomponenten können dabei auf die zu fixierende Seite des SMD-Bauelements und auf die Oberfläche des anderen Körpers, auf der das Bauelement befestigt werden soll, auch in Form von Klebefolien, verteilt werden. The invention can be used for hybrid circuits, for visual circuit structures, for printed circuit boards, etc. Multi-component adhesives are also possible as adhesives. The adhesive components can be distributed on the side of the SMD component to be fixed and on the surface of the other body on which the component is to be attached, also in the form of adhesive films.
Beim Aufbringen von SMD-Bauelementen auf ein Substrat, beispielsweise auf eine Platine, können diese SMD-Bauelemente wieder herunterfallen, wenn der Kleber, der auf dem Substrat aufgebracht werden muß, schon vor relativ langer Zeit auf das Substrat aufgebracht worden war und daher schon leicht ausgetrocknet bzw. ausgehärtet ist und daher nicht mehr viel Klebekraft besitzt. Wenn das SMD-Bauelement jedoch eine Kavität 3 besitzt, ist ein Kleber oder eine Kleberkomponente zeitgerecht ( in good time) so anbringbar, daß der Kleber insgesamt zum Zeitpunkt des Aufbringens des SMD-Baulements auf das Substrat eine ausreichende Klebekraft entfaltet, wobei der Kleber bzw. die Kleberkomponente zugleich auch räumlich genau auf denjenigen Stellen lokal aufgebracht werden kann, an denen Klebekraft entfaltet werden muß zur zuverlässigen Befestigung des SMD-Bauelementsm ohne daß der aufgebrachte Kleber bzw. die aufge brachte Kleberkomponente verrutscht oder verfließt oder vertropft und somit sich schließlich an Stellen befinden würde, wo Klebemasse unerwünscht ist.When SMD components are applied to a substrate, for example on a circuit board, these SMD components can fall down again if the adhesive which has to be applied to the substrate had been applied to the substrate a relatively long time ago and is therefore light has dried out or hardened and therefore no longer has a lot of adhesive power. However, if the SMD component has a
Die Kavität 3 ist eine gut geeignete Form, um zuverlässig eine ausreichende Menge Kleber zu einem solchen Zeitpunkt aufzunehmen, daß das SMD-Bauelement schließlich zuverlässig auf dem Substrat befestigt werden kann. Besonders günstig ist die Form der Kavität 3 dann, wenn ein Zweikomponentenkleber verwendet wird, wobei eine Kleberkomponente in der Kavität 3 untergebracht werden kann, so daß der Kleber dann insgesamt infolge der Kavität in ausreichender Menge in einem eigenen und separaten Raum untergebracht werden kann, um eine gute Klebewirkung zu erzielen, wobei durch den Fußpunkt des Gehäuses 1 am Rand der Kavität 3 ein geeigneter Abstand zwischen den Anschlußbeinchen 2 und dem Substrat (Platine) definiert wird, so daß eine optimale elektrische Kontaktierung des SMD-Bauelemenst bei optimaler Klebe-Kraft des Klebers gleichzeitig erzielt werden kann.The
Der Fußpunkt des Gehäuses 1 am Rand des Gehäuses 1 kann auch erzielt werden, wenn der Rand der Kavität 3 nicht in jedem seiner Punkte auf dem Substrat (Platine) aufliegt.The base point of the
- 1 Gehäuse1 housing
- 2 Anschlußbeinchen2 connecting legs
- 3 Klebemasse3 adhesive
- 5 Leiterplatte5 circuit board
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3534872 | 1985-09-30 | ||
DE3534872 | 1985-09-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0218832A1 true EP0218832A1 (en) | 1987-04-22 |
EP0218832B1 EP0218832B1 (en) | 1990-11-22 |
Family
ID=6282384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP86110874A Expired - Lifetime EP0218832B1 (en) | 1985-09-30 | 1986-08-06 | Surface-mounted component and method of affixing a surface-mounted component |
Country Status (4)
Country | Link |
---|---|
US (1) | US4864471A (en) |
EP (1) | EP0218832B1 (en) |
JP (1) | JPS6281719A (en) |
DE (1) | DE3675734D1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5040868A (en) * | 1989-05-31 | 1991-08-20 | Siemens Aktiengesellschaft | Surface-mountable opto-component |
WO1995009521A1 (en) * | 1993-09-22 | 1995-04-06 | Samsung Electronics Co., Ltd. | Local hardening method of a semiconductor integrated circuit |
WO1997016913A1 (en) * | 1995-11-03 | 1997-05-09 | Telefonaktiebolaget Lm Ericsson (Publ) | A method and device to fasten a loudspeaker to a circuit board |
Families Citing this family (11)
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US4996629A (en) * | 1988-11-14 | 1991-02-26 | International Business Machines Corporation | Circuit board with self-supporting connection between sides |
US5121190A (en) * | 1990-03-14 | 1992-06-09 | International Business Machines Corp. | Solder interconnection structure on organic substrates |
US5162613A (en) * | 1991-07-01 | 1992-11-10 | At&T Bell Laboratories | Integrated circuit interconnection technique |
JP3225062B2 (en) * | 1991-08-05 | 2001-11-05 | ローム株式会社 | Thermosetting resin sheet and semiconductor element mounting method using the same |
US5237829A (en) * | 1992-07-29 | 1993-08-24 | Japan Servo Co., Ltd. | Ice-making machine having thermal relay |
DE4340594C2 (en) * | 1992-12-01 | 1998-04-09 | Murata Manufacturing Co | Method of manufacturing and adjusting the characteristics of a surface mount chip type LC filter |
US5650595A (en) * | 1995-05-25 | 1997-07-22 | International Business Machines Corporation | Electronic module with multiple solder dams in soldermask window |
EP0905700A3 (en) * | 1997-09-24 | 2000-08-02 | Siemens Aktiengesellschaft | Support for a data processing device |
US6711812B1 (en) | 1999-04-13 | 2004-03-30 | Unicap Electronics Industrial Corporation | Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages |
US6675472B1 (en) | 1999-04-29 | 2004-01-13 | Unicap Electronics Industrial Corporation | Process and structure for manufacturing plastic chip carrier |
DE102007062901B3 (en) * | 2007-12-21 | 2009-05-07 | Kleiner Gmbh | Snap disk, has fastening part with surface that is provided with adhesive, where surface provided with base element is turned away from adhesive, and part fastening spherical cap-shaped curved region |
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DE3231277A1 (en) * | 1982-08-23 | 1984-02-23 | Siemens AG, 1000 Berlin und 8000 München | Electrical layer capacitor of chip construction which can be regenerated |
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JPS599310A (en) * | 1982-07-08 | 1984-01-18 | Yanmar Diesel Engine Co Ltd | Built-up crankshaft |
US4567546A (en) * | 1982-11-08 | 1986-01-28 | All States Plastic Mfg. Co., Inc. | Anchor base mounting block |
JPS59215759A (en) * | 1983-05-24 | 1984-12-05 | Nec Corp | Semiconductor device |
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- 1986-08-06 EP EP86110874A patent/EP0218832B1/en not_active Expired - Lifetime
- 1986-08-06 DE DE8686110874T patent/DE3675734D1/en not_active Expired - Fee Related
- 1986-09-08 US US06/904,638 patent/US4864471A/en not_active Expired - Fee Related
- 1986-09-27 JP JP61229467A patent/JPS6281719A/en active Pending
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GB1335159A (en) * | 1971-07-19 | 1973-10-24 | Matsuo Electric Co | Electronic component |
FR2502387A1 (en) * | 1981-03-17 | 1982-09-24 | Siemens Ag | PROCESS FOR THE PRODUCTION OF STACKED ELECTRIC CAPACITORS OF A POLYMER OBTAINED BY ELECTRIC EFFLUVE AS DIELECTRIC |
DE3231277A1 (en) * | 1982-08-23 | 1984-02-23 | Siemens AG, 1000 Berlin und 8000 München | Electrical layer capacitor of chip construction which can be regenerated |
WO1985001634A1 (en) * | 1983-09-27 | 1985-04-11 | Dortrell Limited | Electronic circuit assembly |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5040868A (en) * | 1989-05-31 | 1991-08-20 | Siemens Aktiengesellschaft | Surface-mountable opto-component |
WO1995009521A1 (en) * | 1993-09-22 | 1995-04-06 | Samsung Electronics Co., Ltd. | Local hardening method of a semiconductor integrated circuit |
WO1997016913A1 (en) * | 1995-11-03 | 1997-05-09 | Telefonaktiebolaget Lm Ericsson (Publ) | A method and device to fasten a loudspeaker to a circuit board |
US5974655A (en) * | 1995-11-03 | 1999-11-02 | Telefonaktiebolaget Lm Ericsson | Method of mounting loudspeakers and a loudspeaker mounting |
Also Published As
Publication number | Publication date |
---|---|
US4864471A (en) | 1989-09-05 |
EP0218832B1 (en) | 1990-11-22 |
DE3675734D1 (en) | 1991-01-03 |
JPS6281719A (en) | 1987-04-15 |
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