EP0171076B1 - Composition conductrice à film épais - Google Patents

Composition conductrice à film épais Download PDF

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Publication number
EP0171076B1
EP0171076B1 EP85109932A EP85109932A EP0171076B1 EP 0171076 B1 EP0171076 B1 EP 0171076B1 EP 85109932 A EP85109932 A EP 85109932A EP 85109932 A EP85109932 A EP 85109932A EP 0171076 B1 EP0171076 B1 EP 0171076B1
Authority
EP
European Patent Office
Prior art keywords
glass
pph
pbo
parts
basis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP85109932A
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German (de)
English (en)
Other versions
EP0171076A3 (en
EP0171076A2 (fr
Inventor
Barry Edward Taylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of EP0171076A2 publication Critical patent/EP0171076A2/fr
Publication of EP0171076A3 publication Critical patent/EP0171076A3/en
Application granted granted Critical
Publication of EP0171076B1 publication Critical patent/EP0171076B1/fr
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/253—Silica-free oxide glass compositions containing germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys

Definitions

  • the invention relates to a glass composition to build up thick film conductor compositions and especially to such compositions having good solderability and adhesion to the substrates on which they are employed.
  • thick film conductors in hybrid microelectronic components is well known in the electronic field.
  • Such materials are usually comprised of a dispersion of finely divided particles of a noble metal, noble metal alloy or mixtures thereof and a minor amount of inorganic binder, both dispersed in an organic medium to form a pastelike product.
  • Such pastes are usually applied to an inert substrate such as Al 2 O 3 by screen printing to form a patterned layer.
  • the patterned thick film conductor layer is then fired to volatilize the organic medium and sinter the inorganic binder, which is usually glass or a glass-forming material.
  • solderability is, of course, essential because of the necessity of connecting the conductive pattern with other components of the electronic system in which it is used, e.g., resistor and capacitor networks, resistors, trim potentiometers, chip resistors, chip capacitors, chip carriers and the like.
  • the invention is directed to a novel glass composition corresponding to the formula Bi 4 Si 3-x Ge x O 12 , wherein x is 0.1-2.9.
  • the invention is directed to ceramic substrates having printed thereon a patterned layer of the above described thick film conductor composition which has been fired to effect volatilization of the organic medium and sintering of the glass.
  • the invention is directed in its fourth aspect to a printable thick film conductor composition
  • a printable thick film conductor composition comprising an admixture of:
  • the invention is directed to an inorganic binder composition consisting essentially of an admixture of finely divided particles of:
  • U.S. 4,255,291 to Needes discloses a class of lead bismuthate glass frits comprising by weight 10-85% PbO, Bi 2 0 3 or mixtures thereof, 1-20% CdO, Si0 2 , B 2 0 3 or mixtures thereof, and 0-10% of Na 2 0, K 2 0, AI 2 0 3 , CaO, Ti0 2 , Li 2 O, ZnO or mixtures thereof.
  • the frits actually disclosed contain 12.5% B 2 0 3 in addition to other oxides such as AI 2 0 3 , CdO and Na 2 0.
  • the glass frits are for use as binders for aluminum-containing metal conductors which are fired in air.
  • U.S. 4,235,644 to Needes discloses a class of lead bismuthate glass frit comprising by weight at least 60% Bi 2 O 3 which optionally may also contain PbO, Si0 2 and B 2 0 3 .
  • a preferred composition is disclosed to contain 3-30% PbO and 1-10% each of Si0 2 and B 2 0 3 .
  • the frits actually disclosed contain 3.5-10% B 2 O 3 in addition to other oxides such as AI203, CdO, Na 2 0, Ti0 2 , TiO, Zr0 2 and ZnO.
  • noble metals any of the noble metals, their alloys or mixtures thereof may be used as the conductive phase for the composition of the invention.
  • noble metals such as Ag, Pt and Pd can be used as can their alloys such as Pt/Au, Pd/Ag, Pd/Au and Ag/Pt/Pd.
  • the noble metal particles, as well as the other solids of the composition of the invention preferably have a size within the range of 0.5-10 ⁇ m and a surface area of 1-12 m 2 /g. Though these ranges are preferred, it should be recognized that these limits are not narrowly critical to the effectiveness of the compositions in use.
  • the amount of noble metal in the composition relative to total solids will fall within the range of 60-99% wt. of the composition, excluding the organic medium. Most compositions will, however, contain on the order of 75-98% wt. noble metal and complementally 25-2% wt. inorganic binder.
  • the inorganic binder phase of the compositions of the invention contains as a principal component a glass corresponding to the formula Bi 4 Si- 3-x Ge x O 12 , wherein x is 0-3, having dissolved therein 0-100 pph, basis 100 parts of glass, of PbO. It is preferred that the amount of germanium in the glass correspond to x values of 0.1-2.9 and stlil more preferably 0.5-1.5.
  • the glass contains no boron.
  • the glass component of the inorganic binder is prepared by conventional glassmaking techniques by mixing the desired components in the desired proportions and heating the mixture to form a melt. As is well known in the art, heating is conducted to a peak temperature and for a time such that the melt becomes entirely liquid and homogeneous.
  • the component oxides are mixed in any of several ways familiar to those in the art and then melted in a Kyanite@ crucible at 1350°C for 10-30 minutes.
  • the homogeneous molten glass is then poured into cold water in order to quench the amorphous glass structure.
  • the coarse glass is then placed in a ceramic jar mill with an appropriate amount of water and ceramic media to give efficient size reduction. Milling times of 20-70 hours were generally found to give adequate size reduction.
  • the excess water is removed by decantation and the frit powder is oven dried at a temperature of 150°C.
  • the dried powder is then screened through a 45 11m (325-mesh) stainless steel screen to remove any large particles.
  • the inorganic component In addition to the glass, which may have PbO dissolved therein, the inorganic component must also contain ZnO and optionally may contain additional Bi 2 0 3 . However, these two components, unlike the PbO, must not be dissolved in the glass. To the contrary, they must be added as separate particulate solids.
  • the inorganic binder consists essentially of an admixture of (1) particles of glass in which PbO is dissolved if it is used at all, (2) ZnO particles and optionally (3) Bi 2 0 3 particles if they are used at all.
  • the inorganic binder portion of the invention may comprise as little as 1% wt. of the total solids and as much as 40% wt. However, more frequently the amount of inorganic binder will be 2-25% wt. of the total solids and especially 5-15% wt.
  • a further important component of the compositions in accordance with the invention is the organic medium.
  • the main purpose of the organic medium is to serve as a vehicle for dispersion of the finely divided solids of the composition in such form that it can readily be applied to ceramic or other substrates.
  • the organic medium must first of all be one in which the solids are dispersible with an adequate degree of stability.
  • the rheological properties of the organic medium must be such that they lend good application properties the dispersion.
  • the organic medium is preferably formulated also to give appropriate wettability of the solids and the substrate, good drying rate, dried film strength sufficient to withstand rough handling, and good firing properties. Satisfactory appearance of the fired composition is also important.
  • organic medium for most thick film compositions is typically a solution of resin in a solvent frequently also containing thixotropic agents and wetting agents.
  • the solvent usually boils within the range of 130-350°C.
  • resins such as ethylhydroxyethyl cellulose, wood rosin, mixtures of ethyl cellulose and phenolic resins, polymethacrylates of lower alcohols, and monobutyl ether of ethylene glycol monoacetate can also be used.
  • Suitable solvents include kerosene, mineral spirits, dibutylphthalate, butyl carbitol, butyl carbitol acetate, hexylene glycol and high-boiling alcohols and alcohol esters. Various combinations of these and other solvents are formulated to obtain the desired viscosity, volatility and compatibility with dielectric tape. Water-soluble solvent systems can also be used.
  • thixotropic agents which are commonly used are hydrogenated castor oil and derivatives thereof and ethyl cellulose. It is, of course, not always necessary to incorporate a thixotropic agent since the solvent/resin properties coupled with the shear thinning inherent in any suspension may alone be suitable in this regard.
  • Suitable wetting agents include phosphate esters and soya lecithin.
  • the ratio of organic medium to solids in the paste dispersions can vary considerably and depends upon the manner in which the dispersion is to be applied and the kind of organic medium used. Normally, to achieve good coverage, the dispersions will contain complementally by weight 40-90% solids and 60-10% organic medium.
  • the pastes are conveniently prepared on a three-roll mill.
  • the viscosity of the pastes is typically 2-50 Pa . s when mesaured at room temperature on Brookfield viscometers at low, moderate and high shear rates.
  • the amount and type of organic medium (vehicle) utilized is determined mainly by the final desired formulation viscosity and print thickness.
  • the organic medium does not play an important role in the functional properties of the microcircuit conductor.
  • the composition of the invention it has been found that the organic medium can have a significant role in determining conductor performance.
  • the wrong choice of organic vehicle can result in high resistivity and poor aged adhesion of the fired conductor film.
  • the organic vehicle must give excellent dispersion and must burn out cleanly at a low temperature (400-450°C) in the firing cycle.
  • a preferred vehicle system for the present invention consists of ethyl cellulose polymers dissolved in a mixture of ⁇ -terpineol, dibutyl carbitol, and dibutylphthalate solvents.
  • a thixotropic agent is generally added to give improved line resolution with screen printing.
  • compositions of the present patent are pastes composed of inorganic oxides and glass powders, precious metal powders such as silver, palladium, platinum and gold, and an organic vehicle which is used to disperse the oxides, glass and metal powders.
  • the resultant material should be easily screen printable by techniques commonly used in the electronics industry.
  • the various powders and organic vehicle are first blended by using commercial blending equipment such as a Hobart° mixer, and then sufficiently dispersed on a three-roll mill.
  • the resultant paste is often screened through a 45-38 pm (325 ⁇ 400 mesh) stainless steel screen to remove any metal flakes which might have resulted from the roll milling operation.
  • Aged adhesion The adhesion after thermal aging is determined as follows. Parts are printed on 96% alumina substrates such as Alsimag O 614 (tradename of 3M Company, Minneapolis, Minnesota for aluminum magnesium silicon oxides).
  • the screen used generally is a 75 ⁇ m (200-mesh) screen with 40.6-53.5 pm) (1.6-2.1 mil) diameter stainless steel mesh.
  • the wire is mounted so that the mesh wires run parallel to the frame of the screen.
  • the pattern is defined by a pattern photoimaged on an emulsion applied to the mesh and developed chemically to form a stencil through which the thick film paste is applied to the substrate.
  • the pattern for the adhesion test has nine pads, each 0.20 mm (80 mils) square, arranged to form a 3x3 grid of pads on a 2.54x2.54 cm (1"x1") substrate.
  • the photographic emulsion generally extends 12.7­25.4 um (0.5-1.0 mil) below the wire mesh on the bottom of the screen to allow a thicker print and to seal off the pattern at the substrate surface to provide better resolution.
  • the screen printer is generally set to have a 635 pm (25 mil) gap between the screen and the substrate to be printed upon.
  • the squeegee that forces paste through the stencil is made of hard rubber or a synthetic material such as Viton @ fluoroelastomer of 50-90 durometer hardness rating. (Viton @ is a registered trademark of E. I. du Pont de Nemours and Company, Inc., Wilmington, Delaware). Downward pressure, typically about 0.18 kg per cm (1 pound per inch) of squeegee length, is exerted on the squeegee. The squeegee sweeps ink across the pattern at 7.62-25.4 cm/second (3-10 inches/second) typically.
  • the printed parts are dried 5-15 minutes at 80-150 0 C. They are then fired five times in a belt furnace which has a 10 minute peak temperature cycle at 850°C, plus a 20 minute ramp of increasing temperature from room temperature to the maximum of 850°C and a 30 minute descending temperature ramp back down from 850°C to ambient.
  • the parts After firing five times, the parts have wires attached as follows. Wires are clipped onto the substrate so that they each run down the center of three pads. Then the wires/fired parts are dipped into Alpha 611 solder flux. The parts are then prewarmed on the solder bath and dipped for 10 seconds and allowed to cool. Residual solder flux is cleaned from the soldered wired parts with a CH 2 CI 2 /methanol mixture. Parts are placed in an oven at 150° for 48 hours, then removed and cooled.
  • the aged parts are placed in an apparatus for measuring the force necessary to separate the wire from the substrate.
  • the force necessary is recorded.
  • the type of separation is noted, i.e., whether separation involves the wire pulling out of the solder pulls off the substrate. Over 15 newtons indicates good adhesion and over 20 newtons is excellent adhesion. Adhesion values of 12-14 newtons are marginal and below 12 is unacceptable.
  • solderability Using a paste formulated in the manner described above, a 7/8 inchx7/8 inch (2.2x2.2 cm) pattern is printed upon a 96% alumina substrate (Alsimag® 614) and then dried and fired in the manner described above for the aged adhesion test.
  • the printed and fired substrate is dipped into solder flux (Alpha 611) to coat the substrate.
  • the fluxed substrate is then heated briefly (ca. 2 seconds) over a solder pot which contains 62/36/2 Sn/Pb/Ag solder heated to 220°C. After heating, the substrate is immersed into the solder for 5 seconds, removed and rinsed with a solution of methanol and methylene chloride.
  • the solderability of the substrate is then evaluated by visual examination using the following criteria:
  • Bi 2 O 3 ⁇ Si0 2 - Ge0 2 glasses have also been found to be very useful in microcircuit conductor compositions. Several such glasses have been used in conjunction with added Bi 2 0 3 and ZnO in the manner described above. Table 8 lists compositions using these glasses and gives their relevant properties. Example 21, Table 8, exhibits the highest aged adhesion values and uses Glass C, Table 2. A repeat experiment using a different lot of silver to demonstrate possible performance variations gave essentially the same adhesion values.
  • Example 23 which contains Glass E, Table 2, exhibited excellent solderability, but aged adhesion was lower (13 newtons). A repeat experiment gave significantly higher adhesion (23 newtons). It appears that this composition is more sensitive to raw material variations than Example 21, Table 8.
  • Table 9 lists conductor compositions which used various glasses in the Bi 2 O 3 ⁇ SiO 2 ⁇ GeO 2 ⁇ PbO system (see Table 3).
  • Examples 27-29 of Table 9 gave significantly higher aged adhesion values Examples 30-32. This demonstrates that 7:1:4 (weight ratio of glass:ZnO:Bi 2 0 3 ) binder ratios give more reliable adhesion values than 3:1:3 (glass:ZnO:Bi203) ratios.
  • Examples 27-29 of Table 9 also showed a trend of decreasing solderability which may be due to higher Ge0 2 content or to higher PbO/Bi 2 O 3 ratio in the glasses. Under the conditions of this experiment, Example 27 of Table 9 gave better performance than the rest.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Claims (5)

1. Une composition de verre correspondant à la formule Bi4Si3-xGexO12, où x=0 à 3, dans laquelle sont dissoutes 0 à 100 parties pour cent en poids de PbO, sur la base de 100 parties de verre, et, dans le cas où x=0, 1 à 20 parties pour cent de PbO, sur la base de 100 parties de verre.
2. Une composition de verre selon la revendication 1, correspondant à la formule Bi4Si3-xGexO12 où x=0,1 à 2,9.
3. Le verre de la revendication 1, dans lequel x vaut 0,2 à 2, contenant, à l'état dissous, 10 à 50 parties pour cent en poids de PbO.
4. Une composition pour conducteurs en couche épaisse applicable par impression, comprenant un mélange de
A. 60 à 99% en poids de particules finement divisées d'un métal noble, d'un alliage de métaux nobles, ou d'un mélange d'entre eux, et
B. 40 à 1% en poids d'un liant minéral constitué de particules finement divisées de (1) un verre correspondant à la formule Bi4Si3-xGexO12, où x=0 à 3, dans lequel sont dissoutes 0 à 100 parties pour cent de PbO, sur la base de 100 parties de verre, et, dans le cas où x=0, 1 à 20 parties pour cent de PbO, sur la base de 100 parties de verre, (2) 0 à 100 parties pour cent de Bi03, sur la base de 100 parties de verre, et (3) 4 à 100 parties pour cent de ZnO, sur la base de 100 parties de verre, dispersés dans
C. un milieu organique.
5. Une composition de liant minéral essentiellement constituée d'un mélange de particules finement divisées de:
A. un verre correspondant à la formule Bi4Si3-xGexO12, où x=0 à 3, dans lequel sont dissoutes 0 à 100 parties pour cent de PbO, sur la base de 100 parties de verre, et, dans le cas où x=0, 1 à 20 parties pour cent de PbO, sur la base de 100 parties de verre,
B. 0 à 100 parties pour cent en poids de Bi3O3, et
C. 4 à 100 parties pour cent en poids de ZnO, sur la base de 100 parties de verre.
EP85109932A 1984-08-10 1985-08-07 Composition conductrice à film épais Expired EP0171076B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US639384 1984-08-10
US06/639,384 US4532075A (en) 1984-08-10 1984-08-10 Thick film conductor composition

Publications (3)

Publication Number Publication Date
EP0171076A2 EP0171076A2 (fr) 1986-02-12
EP0171076A3 EP0171076A3 (en) 1986-04-23
EP0171076B1 true EP0171076B1 (fr) 1988-11-17

Family

ID=24563870

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85109932A Expired EP0171076B1 (fr) 1984-08-10 1985-08-07 Composition conductrice à film épais

Country Status (9)

Country Link
US (1) US4532075A (fr)
EP (1) EP0171076B1 (fr)
JP (1) JPS6177641A (fr)
KR (1) KR900002542B1 (fr)
CA (1) CA1269238A (fr)
DE (1) DE3566319D1 (fr)
DK (1) DK364385A (fr)
GR (1) GR851955B (fr)
IE (1) IE56829B1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6124101A (ja) * 1984-07-13 1986-02-01 住友金属鉱山株式会社 厚膜導電ペ−スト
DE3512158A1 (de) * 1985-04-03 1986-10-23 W.C. Heraeus Gmbh, 6450 Hanau Elektrisches bauelement sowie verfahren zum herstellen eines solchen bauelementes
US4636332A (en) * 1985-11-01 1987-01-13 E. I. Du Pont De Nemours And Company Thick film conductor composition
GB8717920D0 (en) * 1987-07-29 1987-09-03 Era Patents Ltd Thick film ink
US4881974A (en) * 1987-11-05 1989-11-21 Johnson Matthey, Inc. Silver-glass paste
JP2001297857A (ja) * 1999-11-24 2001-10-26 Ibiden Co Ltd 半導体製造・検査装置用セラミックヒータ
US6530776B1 (en) 2001-10-09 2003-03-11 Husky Injection Molding Systems, Ltd. Method and apparatus of connection to an electrical film device
US7326367B2 (en) 2005-04-25 2008-02-05 E.I. Du Pont De Nemours And Company Thick film conductor paste compositions for LTCC tape in microwave applications
US7611645B2 (en) 2005-04-25 2009-11-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions and the use thereof in LTCC circuits and devices
JP4524318B2 (ja) 2008-05-27 2010-08-18 原田工業株式会社 車載用ノイズフィルタ
JP5114325B2 (ja) 2008-07-08 2013-01-09 原田工業株式会社 車両用ルーフマウントアンテナ装置
USD726696S1 (en) 2012-09-12 2015-04-14 Harada Industry Co., Ltd. Vehicle antenna

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US4029605A (en) * 1975-12-08 1977-06-14 Hercules Incorporated Metallizing compositions
US4255291A (en) * 1979-06-21 1981-03-10 E. I. Du Pont De Nemours And Company Air-fireable conductor composition
US4463030A (en) * 1979-07-30 1984-07-31 Graham Magnetics Incorporated Process for forming novel silver powder composition
US4414143A (en) * 1981-05-06 1983-11-08 E. I. Du Pont De Nemours & Co. Conductor compositions
US4416932A (en) * 1981-08-03 1983-11-22 E. I. Du Pont De Nemours And Company Thick film conductor compositions
US4446059A (en) * 1982-04-15 1984-05-01 E. I. Du Pont De Nemours & Co. Conductor compositions
US4466830A (en) * 1982-11-19 1984-08-21 E. I. Du Pont De Nemours And Company Thick film gold metallization composition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Glaschemie W. Vogel, VEB Leipzig 1979, pp. 205,384 (Bi-oxide containing glasses) *

Also Published As

Publication number Publication date
KR860002112A (ko) 1986-03-26
KR900002542B1 (ko) 1990-04-20
JPS6177641A (ja) 1986-04-21
DK364385D0 (da) 1985-08-09
IE56829B1 (en) 1991-12-18
EP0171076A3 (en) 1986-04-23
DK364385A (da) 1986-02-11
IE851959L (en) 1986-02-10
DE3566319D1 (en) 1988-12-22
JPH0232223B2 (fr) 1990-07-19
EP0171076A2 (fr) 1986-02-12
US4532075A (en) 1985-07-30
GR851955B (fr) 1985-12-10
CA1269238A (fr) 1990-05-22

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