EP0132719B1 - Method and device of conducting a closed cycle of the bath for plating of coatings - Google Patents

Method and device of conducting a closed cycle of the bath for plating of coatings Download PDF

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Publication number
EP0132719B1
EP0132719B1 EP19840108238 EP84108238A EP0132719B1 EP 0132719 B1 EP0132719 B1 EP 0132719B1 EP 19840108238 EP19840108238 EP 19840108238 EP 84108238 A EP84108238 A EP 84108238A EP 0132719 B1 EP0132719 B1 EP 0132719B1
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EP
European Patent Office
Prior art keywords
electrolyte
electroplating
evaporation device
air
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP19840108238
Other languages
German (de)
French (fr)
Other versions
EP0132719A1 (en
Inventor
Ryszard Wasiak
Marek Kieszkowski
Dariusz Cichowski
Pawel Ciecko
Maciej Zubr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Instytut Mechaniki Precyzyjnej
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Instytut Mechaniki Precyzyjnej
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PL24323083A external-priority patent/PL139479B1/en
Priority claimed from PL24440083A external-priority patent/PL139478B1/en
Application filed by Instytut Mechaniki Precyzyjnej filed Critical Instytut Mechaniki Precyzyjnej
Publication of EP0132719A1 publication Critical patent/EP0132719A1/en
Application granted granted Critical
Publication of EP0132719B1 publication Critical patent/EP0132719B1/en
Expired legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/02Heating or cooling
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003Electroplating using gases, e.g. pressure influence

Definitions

  • the invention is related to a method and an apparatus for electroplating with a closed electrolyte cycle.
  • the known methods and devices for electroplating having a closed electrolyte cycle employ usually an evaporation process. Most often the water used for rinsing is evaporated and a concentrated solution of the components of the electrolyte is obtained.
  • the evaporation process includes usually the application of vacuum for lowering the temperature of the process and increasing the intensity thereof.
  • the known vacuum evaporators have generally an external heating chamber (indirect evaporators, as for example such from the companies Pfaudler, Corning and Cosmos).
  • evaporators are direct evaporators, in which evaporation takes place at atmospheric pressure (Lancy Company). Therein, the feeded electrolyte is heated in a heat exchanger and supplied from top of a column, wherein it flows down in a counter-current relation to incoming air and evaporates.
  • the solution to be evaporated is heated in the evaporation device, and the heating chamber is an integral part of the evaporator.
  • the expense and the costs for hitherto known methods and devices are considerable, especially in the case of chemically aggressive electrolytes, as for example for chromium pfating.
  • the heating elements had to be of special boro-silicate glass or materials of titanium or tantalum.
  • Auxiliary equipment (pumps etc.) must be of special design.
  • the object of the invention to provide a method and an apparatus for electroplating with a closed electrolyte cycle so that evaporation of water from the system is achieved at minimum expense.
  • This object is solved according to the invention by providing a method of electroplating in which electrolyte is fed into a circuit from an electroplating bath to an evaporation device, and from the evaporation device after concentration of the electrolyte in the evaporation device back to the electroplating bath, wherein the electroplating bath is heated and the electrolyte fed from the bath into the evaporation device is caused to flow horizontally in a thin film, air being blown, optionally after being heated, upwardly through the horizontally flowing electrolyte film in the whole evaporation device or only a part thereof, wet air having passed through the electrolyte being taken off from the circuit after previous separation of entrained particles, and the concentrated electrolyte from the evaporation device is introduced back to the electroplating bath, the electroplating bath further being made up continuously with washings from a water washer for washing workpieces after treatment in said electroplating bath.
  • At least 25% of the heat necessary for evaporation in the evaporation device is supplied to the electroplating bath wherein the electrolyte is heated.
  • the air taken off from the circuit may be used for mixing after treatment in said electroplating bath.
  • the air taken off from the circuit may, after adding water vapour thereto, also be used for washing the workpieces after treatment in said electroplating bath.
  • an apparatus for electroplating comprising an electroplating tank and an evaporation device connected with the electroplating tank through means, preferably an air lift pump, for supplying, in use, concentrated electrolyte from the evaporation device to the electroplating tank, wherein the electroplating tank comprises heating means and the evaporation device comprises an evaporating chamber which is horizontally elongated and comprises an upstanding weir whose height establishes the thickness of a horizontal layer of electrolyte flowing, in use, through the chamber, the chamber being provided with an inlet for electrolyte from the electroplating tank at its end remote from the weir, and further comprising a perforated conduit or conduits and/or a conduit or conduits having porous walls, through which, in use, air is fed, optionally after heating, into the chamber, the conduit or conduits extending below the level of the weir, and the chamber being connected at its end adjacent the weir with a separator, an
  • the evaporation device is of polyvinyl chloride.
  • the drop catcher is of the labyrinth type and comprises air-flow guide vanes.
  • the heat necessary therefore is supplied, in principle, to the electrolyte in the electroplating tank or in the vicinity thereof, using the heating element which is a standard equipment of the tank.
  • the air introduced into the evaporation device is also heated.
  • the heating element already existing in the electroplating tank is used.
  • doubling the heating elements is avoided.
  • the number of devices necessary for control of working parameters of the electrolyte are reduced. If necessary for power reasons, additional heating may be provided, this additional heating being only the complement between the heat power of the already existing equipment and the heat power necessary to achieve evaporation in the required amount.
  • evaporation is effected directly by the air passing through the electrolyte to be evaporated which flows in a closed channel and is in the phase of dynamic foam.
  • the evaporation module or device of Fig. 1 is designated with reference numeral 10.
  • the feeded electrolyte is supplied by an inlet 1, flows through an evaporation pipe or chamber 2 and over a weir 3 and is finally taken off from a. separator 4 by an outlet 5.
  • a conduit 6 for air is immersed parallel to the axis of the pipe 2. The air, passing through the solution, causes mixing by the bubble flow, foam build-up and evaporation of the solution.
  • a drop catcher 7 arrests particles of the solution entrained by the air.
  • polyvinyl chloride pipes are usually used for the construction of the evaporation device.
  • the apparatus and the method have a great design simplicity, are easy to realize, simple in operation and failure-free in use.
  • the standard module as shown in the example of Fig. 2 it is possible to build multi-module evaporators of a required capacity, usually about 100 I/hr of evaporated liquid. Such evaporators require little space and can be easily combined with already operating electroplating lines.
  • washings from washers 8 are directed as a whole by a pipe 20 to an electroplating tank 9.
  • the flow rate of the electrolyte through the evaporation device 10 is controlled by a valve 11.
  • the apparatus has emergency overflow means with an overflow conduit 18.
  • the electrolyte is supplied by a pump 12 to a feeding tank 13 wherefrom it flows to the electroplating tank 9.
  • the temperature in the electroplating tank is controlled by a temperature-control system comprising elements 14, 15, 16 and 17.
  • An air outlet 19 is provided at the evaporation module or device 10.
  • Total evaporation from two modules connected in parallel was 10 I/hr. This enables material circulation in the electroplating plant in a closed cycle.
  • Fig. 1 does not show ion-exchange columns through which washings flow usually in order to eliminate impurities, for example Cr 3+ and Fe 3+ ions.

Description

  • The invention is related to a method and an apparatus for electroplating with a closed electrolyte cycle.
  • The known methods and devices for electroplating having a closed electrolyte cycle employ usually an evaporation process. Most often the water used for rinsing is evaporated and a concentrated solution of the components of the electrolyte is obtained. The evaporation process includes usually the application of vacuum for lowering the temperature of the process and increasing the intensity thereof. The known vacuum evaporators have generally an external heating chamber (indirect evaporators, as for example such from the companies Pfaudler, Corning and Cosmos). Known are also vacuum circulating evaporators (Simax Company).
  • Another group of evaporators are direct evaporators, in which evaporation takes place at atmospheric pressure (Lancy Company). Therein, the feeded electrolyte is heated in a heat exchanger and supplied from top of a column, wherein it flows down in a counter-current relation to incoming air and evaporates.
  • In all present methods and devices for evaporation the solution to be evaporated is heated in the evaporation device, and the heating chamber is an integral part of the evaporator.
  • The expense and the costs for hitherto known methods and devices are considerable, especially in the case of chemically aggressive electrolytes, as for example for chromium pfating. The heating elements had to be of special boro-silicate glass or materials of titanium or tantalum. Auxiliary equipment (pumps etc.) must be of special design.
  • For example, the costs for an evaporator of Corning Company with a capacity of Q = 67 of evaporated liquid/hr are in the order of US-$ 20,000 (1977).
  • Such costs sets back the technique of recycling of wastes despite of obvious effects on environmental protection.
  • It is, therefore, the object of the invention to provide a method and an apparatus for electroplating with a closed electrolyte cycle so that evaporation of water from the system is achieved at minimum expense.
  • This object is solved according to the invention by providing a method of electroplating in which electrolyte is fed into a circuit from an electroplating bath to an evaporation device, and from the evaporation device after concentration of the electrolyte in the evaporation device back to the electroplating bath, wherein the electroplating bath is heated and the electrolyte fed from the bath into the evaporation device is caused to flow horizontally in a thin film, air being blown, optionally after being heated, upwardly through the horizontally flowing electrolyte film in the whole evaporation device or only a part thereof, wet air having passed through the electrolyte being taken off from the circuit after previous separation of entrained particles, and the concentrated electrolyte from the evaporation device is introduced back to the electroplating bath, the electroplating bath further being made up continuously with washings from a water washer for washing workpieces after treatment in said electroplating bath.
  • Preferably, at least 25% of the heat necessary for evaporation in the evaporation device is supplied to the electroplating bath wherein the electrolyte is heated.
  • The air taken off from the circuit may be used for mixing after treatment in said electroplating bath.
  • The air taken off from the circuit may, after adding water vapour thereto, also be used for washing the workpieces after treatment in said electroplating bath.
  • It is also preferable that from the wet air which has passed through the electrolyte and which is taken off from the circuit water is condensed off, and that the condensed water is used as washing water in washers.
  • Further, the above object is solved according to the invention by providing an apparatus for electroplating, comprising an electroplating tank and an evaporation device connected with the electroplating tank through means, preferably an air lift pump, for supplying, in use, concentrated electrolyte from the evaporation device to the electroplating tank, wherein the electroplating tank comprises heating means and the evaporation device comprises an evaporating chamber which is horizontally elongated and comprises an upstanding weir whose height establishes the thickness of a horizontal layer of electrolyte flowing, in use, through the chamber, the chamber being provided with an inlet for electrolyte from the electroplating tank at its end remote from the weir, and further comprising a perforated conduit or conduits and/or a conduit or conduits having porous walls, through which, in use, air is fed, optionally after heating, into the chamber, the conduit or conduits extending below the level of the weir, and the chamber being connected at its end adjacent the weir with a separator, an upper part of the separator comprising a drop catcher through which, in use, wet air is taken off, and a lower part of the separator comprising an outlet for taking off the concentrated electrolyte and returning it to the tank, the heating means being connected to a temperature control system for controlling the temperature in the tank.
  • Preferably, the evaporation device is of polyvinyl chloride.
  • It is also to prefer that the drop catcher is of the labyrinth type and comprises air-flow guide vanes.
  • According to the invention, only the electrolyte is evaporated, and the heat necessary therefore is supplied, in principle, to the electrolyte in the electroplating tank or in the vicinity thereof, using the heating element which is a standard equipment of the tank. Optionally, the air introduced into the evaporation device is also heated. When the evaporator used according to the invention is assembled with an already operating electroplating equipment, the heating element already existing in the electroplating tank is used. Thus, doubling the heating elements is avoided. Additionally, the number of devices necessary for control of working parameters of the electrolyte are reduced. If necessary for power reasons, additional heating may be provided, this additional heating being only the complement between the heat power of the already existing equipment and the heat power necessary to achieve evaporation in the required amount.
  • According to the invention, evaporation is effected directly by the air passing through the electrolyte to be evaporated which flows in a closed channel and is in the phase of dynamic foam.
  • An example of realization of the solution according to the invention is now described with reference to the drawings.
    • Fig. 1 shows schematically an apparatus for electroplating together with a washer and a feeding tank, and
    • Fig. 2 shows schematically a single evaporation module.
  • In Fig. 1, the evaporation module or device of Fig. 1 is designated with reference numeral 10. With reference to Fig. 2, the feeded electrolyte is supplied by an inlet 1, flows through an evaporation pipe or chamber 2 and over a weir 3 and is finally taken off from a. separator 4 by an outlet 5. In the solution to be evaporated, a conduit 6 for air is immersed parallel to the axis of the pipe 2. The air, passing through the solution, causes mixing by the bubble flow, foam build-up and evaporation of the solution. A drop catcher 7 arrests particles of the solution entrained by the air. For the construction of the evaporation device polyvinyl chloride pipes are usually used.
  • Such a solution has a number of advantages in relation to the existing devices.
  • The apparatus and the method have a great design simplicity, are easy to realize, simple in operation and failure-free in use. On the basis of the standard module as shown in the example of Fig. 2 it is possible to build multi-module evaporators of a required capacity, usually about 100 I/hr of evaporated liquid. Such evaporators require little space and can be easily combined with already operating electroplating lines.
  • For laboratory purposes, the diameter of the pipe or chamber 2 was of D = 70 mm and the length of the evaporation zone 1 = 500 mm (Fig. 2).
  • Working on a semi-technical scale, two modules were used in a small electroplating plant for chromium plating. The sizes of a single module were D = 110 mm and 1 = 1200 mm.
  • As shown in Fig. 1, washings from washers 8 are directed as a whole by a pipe 20 to an electroplating tank 9. The flow rate of the electrolyte through the evaporation device 10 is controlled by a valve 11. The apparatus has emergency overflow means with an overflow conduit 18. After evaporation, the electrolyte is supplied by a pump 12 to a feeding tank 13 wherefrom it flows to the electroplating tank 9. The temperature in the electroplating tank is controlled by a temperature-control system comprising elements 14, 15, 16 and 17. An air outlet 19 is provided at the evaporation module or device 10.
  • Total evaporation from two modules connected in parallel was 10 I/hr. This enables material circulation in the electroplating plant in a closed cycle.
  • Fig. 1 does not show ion-exchange columns through which washings flow usually in order to eliminate impurities, for example Cr3+ and Fe3+ ions.

Claims (8)

1. A method of electroplating in which electrolyte is fed in a circuit from an electroplating bath to an evaporation device, and from the evaporation device after concentration of the electrolyte in the evaporation device back to the electroplating bath, characterized in that the electroplating bath is heated and the electrolyte fed from the bath into the evaporation device is caused to flow horizontally in a thin film, air being blown, optionally after being heated, upwardly through the horizontally flowing electrolyte film in the whole evaporation device or only a part thereof, wet air having passed through the electrolyte being taken off from the circuit after previous separation of entrained particles, and the concentrated electrolyte from the evaporation device is introduced back to the electroplating bath, the electroplating bath further being made up continuously with washings from a water washer for washing workpieces after treatment in said electroplating bath.
2. The method according to claim 1, characterized in that at least 25% of the heat necessary for evaporation in the evaporation device is supplied to the electroplating bath wherein the electrolyte is heated.
3. The method according to claim 1, characterized in that the air taken off from the circuit is used for mixing of washing water in washers for washing the workpieces after treatment in said electroplating bath.
4. The method according to claim 1, characterized in that the air taken off from the circuit is, after adding water vapour thereto, used for washing the workpieces after treatment in said electroplating bath.
5. The method according to claim 1, characterized in that from the wet air which has passed through the electrolyte and which'is taken off from the circuit water is condensed off, and that the condensed water is used as washing water in washers.
6. Apparatus for electroplating, comprising an electroplating tank, and an evaporation device connected with the electroplating tank through means, preferably an air lift pump, for supplying, in use, concentrated electrolyte from the evaporation device to the electroplating tank, characterized in that the electroplating tank (9) comprises heating means (17) and the evaporation device (10) comprises an evaporating chamber (2) which is horizontally elongated and comprises an upstanding weir (3) whose height establishes the thickness of a horizontal layer of electrolyte flowing, in use, through the chamber, the chamber being provided with an inlet (1) for electrolyte from the electroplating tank (9) at its end remote from the weir (3), and further comprising a perforated conduit (6) or conduits and/or a conduit (6) or conduits having porous walls, through which, in use, air is fed, optionally after heating, into the chamber (2), the conduit (6) or conduits extending below the level of the weir (3), and the chamber (2) being connected at its end adjacent the weir with a separator (4), an upper part of the separator comprising a drop catcher (7) through which, in use, wet air is taken off, and a lower part of the separator (4) comprising an outlet (5) for taking off the concentrated electrolyte and returning it to the tank, the heating means (17) being connected to a temperature control system (14, 15, 16) for controlling the temperature in the tank (9).
7. The apparatus according to claim 6, characterized in that the evaporation device (10) is of polyvinyl chloride.
8. The apparatus according to claim 6, characterized in that the drop catcher (7) is of the labyrinth type and comprises air-flow guide vanes.
EP19840108238 1983-07-30 1984-07-12 Method and device of conducting a closed cycle of the bath for plating of coatings Expired EP0132719B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
PL24323083A PL139479B1 (en) 1983-07-30 1983-07-30 Apparatus for effecting closed cycle recirculation of a bath used in electrodeposition processes
PL243230 1983-07-30
PL24440083A PL139478B1 (en) 1983-11-02 1983-11-02 Method of effecting closed cycle recirculation of a bath used in electrodepostion processes
PL244400 1983-11-02

Publications (2)

Publication Number Publication Date
EP0132719A1 EP0132719A1 (en) 1985-02-13
EP0132719B1 true EP0132719B1 (en) 1988-03-09

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Application Number Title Priority Date Filing Date
EP19840108238 Expired EP0132719B1 (en) 1983-07-30 1984-07-12 Method and device of conducting a closed cycle of the bath for plating of coatings

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EP (1) EP0132719B1 (en)
DE (1) DE3469764D1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781806A (en) * 1985-10-11 1988-11-01 Dominic Tenace Electroplating system
DE10225203A1 (en) * 2002-06-06 2003-12-18 Goema Ag Method and device for returning rinsing water and cleaning a process bath

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3623962A (en) * 1968-07-31 1971-11-30 Nat Steel Corp Reducing electrolytic sludge formation
DE1962249B2 (en) * 1969-12-11 1978-08-17 Nordnero Ab, Kungaelv (Schweden) Process for cooling treatment baths
DE2729270B2 (en) * 1977-06-29 1980-06-12 Stolle, Hans, Ing.(Grad.), 7129 Brackenheim Method for recovering carried-over electrolyte
DE3033479A1 (en) * 1980-09-05 1982-04-15 Recon Verfahrenstechnik GmbH Fischer und Tscherwitschke, 7022 Leinfelden-Echterdingen Surface treatment plant esp. for electroplating - where heat generated in process is reclaimed together with chemicals carried over into rinsing tanks
EP0079987B1 (en) * 1981-11-20 1986-02-26 Kabushiki Kaisha Sanshin Seisakusho Method and apparatus for recycling washing liquid and heat contained in washings discharged from metal surfacing process

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DE3469764D1 (en) 1988-04-14
EP0132719A1 (en) 1985-02-13

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