EP0121467A1 - Kleinstverbinder mit hoher Kontaktdichtheit - Google Patents

Kleinstverbinder mit hoher Kontaktdichtheit Download PDF

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Publication number
EP0121467A1
EP0121467A1 EP84400572A EP84400572A EP0121467A1 EP 0121467 A1 EP0121467 A1 EP 0121467A1 EP 84400572 A EP84400572 A EP 84400572A EP 84400572 A EP84400572 A EP 84400572A EP 0121467 A1 EP0121467 A1 EP 0121467A1
Authority
EP
European Patent Office
Prior art keywords
electrodes
wires
support
microconnector
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP84400572A
Other languages
English (en)
French (fr)
Other versions
EP0121467B1 (de
Inventor
Claude Massit
Gérard Nicolas
Gérard Turc
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of EP0121467A1 publication Critical patent/EP0121467A1/de
Application granted granted Critical
Publication of EP0121467B1 publication Critical patent/EP0121467B1/de
Expired legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts

Definitions

  • the present invention relates to a high contact density microconnector. It applies in particular to the connection between the electrodes of a flat screen, a liquid crystal display for example, and an electronic control device, by means of an electric circuit, the latter being obtainable, so known in the state of the art, by etching, depositing or screen printing, on a support which can be flexible or rigid.
  • Connectors which make it possible to produce aligned contacts and which consist of a plurality of male plugs associated with female plugs.
  • Such connectors in their application to the connection of the electrodes of a flat screen envisaged above, have the drawback of allowing only a low density of contacts, that is to say at best a few tens of contacts separated from each other by a distance of about 1.3 mm.
  • the object of the present invention is to remedy this drawback.
  • the electrodes can for example form a row of parallel electrodes, arranged in relation to each other in a certain pattern and the wires are then fixed on said movable part so as to form a row of parallel wires arranged in relation to others following the same pattern.
  • the spacings P 1 , P 2 , ..., P N-1 can be different from each other.
  • the spacings P 1 , P 2 , ..., P N-1 are equal: in this case, the electrodes are equidistant from each other at a given pitch and the wires are then equidistant from each other following said step.
  • the microconnector which is the subject of the invention thus makes it possible to simultaneously produce a number N of contacts, of the order of 300 to 400, or even more, using flexible and elastic metallic wires of the order of 50 ⁇ m to 200 ⁇ m in diameter. , spaced from each other in a step of the order of 100 to 700 ⁇ m, for example of the order of 300 ⁇ m, which is very advantageous as regards for example liquid crystal displays.
  • the wires are made of an alloy of copper and beryllium.
  • Such wires are commercially available and are used as is, with possible curvature near one of their ends. This therefore eliminates any intermediate contact part, preformed and prefabricated, the wires themselves serving to make the contacts and improving them, due to their flexibility and elasticity.
  • the electrodes are arranged in several parallel rows and stepped on electrically insulating substrates and the wires are also fixed to the part in as many parallel and superimposed rows.
  • the electrodes are arranged parallel to one another on the same electrically insulating substrate and form a periodic series of electrodes longitudinally offset with respect to each other and the wires are also fixed on the part so as to forming a periodic series of parallel conductors, stepped, transversely and longitudinally offset from each other.
  • said support is hollow and said electrical conductors are other electrodes arranged on an electrically insulating plate carrying at least one electronic microcomponent and housed in the hollow support, said other electrodes being connected to the electronic microcomponent.
  • said wires are directly connected to said other electrodes.
  • the means for moving the part consist of an eccentric mounted to rotate on the support and designed to press on the part so as to make the contacts between the electrodes and the wires.
  • the microconnector which is the subject of the invention further comprises elastic means capable of exerting on the part a force tending to separate the wires from the electrodes.
  • the part is also movable perpendicular to the electrodes when the latter are in place in said support, so as to be able to adjust the position of the wires with respect to the electrodes.
  • the microconnector further comprises a stop fixed to the part and capable of preventing any contact between the wires and the substrate when the wires are in the connection position and the substrate strikes the stop.
  • FIG 1 there is shown schematically a particular embodiment of the microconnector object of the invention, used for example to connect a liquid crystal display 2, to an electronic control device 3, via a circuit flexible 4 known in the prior art and provided with parallel electrical conductors 5.
  • the liquid crystal display 2 comprises, in known manner, a lower glass plate 6 and an upper glass plate 7 between which the crystals are found liquids.
  • One of the ends 6a of the lower glass plate 6 is offset relative to the upper plate 7 so as to protrude from the latter, and carries on its upper surface a row of parallel electrodes 8, equidistant from each other following a given step.
  • These electrodes are for example made of indium oxide.
  • the number of electrical conductors 5 of the flexible circuit 4 is equal to the number of electrodes 8.
  • the microconnector according to the invention essentially comprises a set of electrically conductive wires 9, flexible and elastic, a part 10 electrically insulating to make them integral with each other, and means 11 making it possible to press on the part 10 so as to produce a contact between the electrodes 8 of the display 2 and the son 9 flexible and elastic.
  • the latter are for example constituted by commercially available stripped wires, made of an alloy of copper and beryllium and whose diameter is of the order of 125 ⁇ m for example.
  • the number of wires 9 is equal to the number of electrodes 8 and these wires 9 are respectively welded to the electrical conductors 5 of the flexible circuit 4, for example in Sn / Pb reflow. (In FIG. 4, a weld 5a is seen between one of the wires 9 and the associated conductor 5).
  • the part 10 is provided to make the wires 9 rigidly integral with each other so that they form a row of conductors of the same length (of the order of 4 mm for example), parallel and equidistant from each other according to the not even the electrodes 8.
  • the part 10 is for example constituted by a plastic bar, provided with transverse grooves 10a, equidistant from each other along said pitch, in which the wires 9 are respectively immobilized, by gluing for example.
  • the part 10 can also be produced by molding a plastic material directly around the wires 9 without then having to produce transverse grooves.
  • the bar 10 and the wires 9 thus form a sort of comb, the teeth of which consist of the wires 9.
  • the edges 6b of the end 6a of the bottom plate 6, which frame the row of electrodes 8, are respectively embedded in two walls 12 of a hollow support or housing 13, these two walls being opposite one another. (In Figure 1, only one of these walls 12 is shown).
  • the electrical conductors 5 are of course electrically isolated from each other and stored side by side in the flexible circuit 4 which can thus have a flat shape.
  • the flexible circuit 4 has, in known manner, an electrically insulating face 4a.
  • the support 13 has an edge l4 which is located between the two walls 12, which dominates the lower plate 6 embedded in the walls 12 and which faces this lower plate 6.
  • the end 15 of the circuit flexible 4, which is extended by the wires 9, is placed on the edge 14, so that the electrically insulating face 4a of the flexible circuit 4 rests against this edge 14 and the strip 10 is located in the space 16 inside the support hollow 13 and between the two walls 12, and is parallel to the row of electrodes 8. (The space between the two walls 12 is of course adapted to the size of the bar 10).
  • Each wire 9 is then opposite an electrode 8 and without contact with this electrode.
  • the means 11 for pressing on the bar 10 are constituted by an eccentric in the form of a cylindrical bar, comprising in a known manner a flat lla and resting at its ends in two bearings 17 of which only one is shown in FIG. 1 and which are respectively practiced facing each other in the walls 12 of the support 13 so that the axis of the eccentric 11 is parallel to the row of electrodes 8.
  • the operation of the eccentric makes it possible to lower this bar 10, each wire 9 then coming into contact with the electrode 8 which is associated with it and opposite which it is located.
  • the support 13 is closed by a cover 18 which comes to bear, by means of a part 19 made of rubber or another electrical insulator, on the end 15 of the flexible circuit 4, at the welds 5a (FIG. 4).
  • Screws 20 make it possible to fix the cover 18 to the walls 12 of the support 13.
  • Other screws 21 pass through the cover 18, are respectively screwed into the walls 12 of the support 13 and pass through these walls so as to press against the end 6a of the lower plate 6 which is offset with respect to the upper plate 7, to keep the lower plate 6 in position in the support 13.
  • These other screws 21 are advantageously made of a plastic material such as that which is known by the name of TEFLON , so as not to damage the lower glass plate 6.
  • the edge of the cover 18, which is located above the wires 9, has a recess 22 which makes it possible to observe at least one of the two ends of the row of wires 9.
  • the mounting of the microconnector according to the invention is then carried out as follows (FIG. 2): the lower plate 6 of the liquid crystal display is embedded in the support 13; the insulating face 4a of the end 15 of the flexible circuit 4, the end which is extended by the wires 9 made rigidly secured to each other by the bar 10, is placed on the edge 14 of the support 13, so that the bar 10 receives over the eccentric 11 and that each wire 9 is located substantially above the electrode 8 which is associated with it; the cover 18 is put in place and screwed onto the support 13 using the screws 20.
  • the eccentric 11 is maneuvered so that the latter presses on the bar 10 and therefore this bar 10 is lowered.
  • the first wire 9a FIG.
  • the operation of the eccentric 11 is carried out using handles 24 with which it is provided at its ends.
  • the ends of the eccentric 11 could also be provided with hexagonal housings in which a hexagonal key would be introduced.
  • the ends 25 of the wires 9 intended to come into contact with these electrodes 8 can be bent upwards.
  • the wires 9 can undergo a surface treatment such as the gilding of their ends intended to be in contact with the electrodes, to reduce the contact resistance.
  • the microconnector according to the invention can also be provided with elastic means 26 capable of exerting on the strip 10 a force tending to separate the wires 9 from the electrodes 8 when the eccentric 11 is operated to cut the contact between the wires 9 and the electrodes 8.
  • the elastic means 26 are for example constituted by a slightly curved planar spring, for example made of an alloy of copper and beryllium.
  • the convex part of the spring 26 faces the cover 18.
  • One of the ends of the said spring is fixed to the edge 14 of the support 13, below the flexible circuit 4, the insulating face 4a of the latter resting against the spring. 26.
  • the other end of this spring 26 is fixed under the bar 10.
  • FIG 3 there is shown schematically another particular embodiment of the microconnector object of the invention.
  • This other particular embodiment is identical to that which has just been described, except as regards the bar 10 and the spring 26.
  • the bar 10 and the spring 26 are connected so as to constitute a single piece which can be produced by molding a plastic material for example, and the spring 26 is provided with recesses 27 aligned parallel to the bar 10.
  • These recesses 27 give the spring 26, the possibility of a slight deformation parallel to the row of electrodes 8, that is to say perpendicular to these electro of.
  • the bar 10 thus acquires the possibility of - moving slightly parallel to this row of electrodes 8.
  • This movement is controlled by two screws 28 which abut respectively against the two ends of the bar 10 and which are movable in two threaded holes 29 formed in the walls 12 of the support 13, parallel to the axis of the eccentric 11.
  • the microconnector shown in FIG. 3 can then be mounted, by blocking the screws 20 and 21 (FIG. 1) after having positioned each one as best as possible. wire 9 opposite the corresponding electrode 8.
  • the final adjustment of the position of the wires 9 relative to the electrodes 8 is carried out by acting on the screws 28 (that is to say by screwing one and unscrewing the other or vice versa, as many times as that is necessary) until a perfect coincidence between the electrodes 8 and the wires 9 is obtained, the adjustment being controlled using the telescope 23 (FIG. 2) which makes it possible to observe the sighting zone 30 constituted by one ends of the row of wires 9.
  • FIG. 4 there is shown schematically a particular embodiment of a safety stop 31 which avoids the deterioration of the wires 9 when the latter are in the connection position (the eccentric 11 then pressing on the bar 10) and that the end 6a of the bottom plate 6 not positioned in the support 13 is suddenly embedded in the latter.
  • the stop 31 is for example constituted by a plastic plate which is fixed on the bar 10 so as to be between the latter and the eccentric 11 and one end of which projects beyond the bar 10 to cover the wires 9.
  • the material plastic of which the plate 31 is made is transparent so as to be able to observe the wires 9 through this plate 31.
  • the bar 10 is associated with the spring 26 (FIG. 2 or 3).
  • the end 32 of the plate 31, which covers the wires 9, is bevelled so that the plate 31 is lowered when the end 6a of the lower plate 6 abuts against this end 32 of the plate 31.
  • a stop auxiliary 33 is mounted in the support 13 so as to be in the vicinity of the other end 34 of the plate 31, this other end 34 being slightly convex and the stop 33 moreover conforming to the shape of said end 34 of the plate 31
  • the underside of the plate 31 can also be provided with a slot 35 located in the vicinity of the beveled end 32, this slot being perpendicular to the wires 9.
  • a slot 35 located in the vicinity of the beveled end 32, this slot being perpendicular to the wires 9.
  • FIG 5 there is shown schematically another particular embodiment of the microconnector object of the invention. It includes, as before, the hollow support or housing 13 inside of which is the flat spring 26, one end of which is fixed to the upper part of the support 13 and the other end of which carries the bar rette 10.
  • the eccentric 11 makes it possible to press on the spring 26 so that the wires 9, carried by the bar 10, come into contact with the electrodes 8 which are located on the glass slide 6.
  • the wires 9 make it possible to connect the electrodes 8 at the main part of their electronic control device, part which is constituted by several electronic microcomponents 44 such as integrated circuits, mounted on an electrically insulating plate 43. This carries a row of other parallel electrodes 45 to which the microcomponents 44 are suitably connected.
  • the plate 43 is fixed vertically in the hollow support 13, at the end of the spring 26 which is fixed to the upper part of the support 13 and so that said other electrodes 45 are then at the top of the plate thus positioned.
  • the free ends of the wires 9, that is to say those which are not intended for contact with the electrodes 8, are respectively ' welded to the other electrodes 45.
  • the spring 26 has an opening 47 through which one can reach the other electrodes 45 and make the various welds.
  • wires 46 for connecting microcomponents 44 with earth and with the rest of the electronic control device (power supply, clocks, etc.) which is not shown.
  • FIG 6 there is shown schematically a microconnector similar to that which has just been described with reference to Figure 5.
  • FIG. 7 there is schematically shown another particular embodiment of the microconnector object of the invention. It allows several series of connections to be made simultaneously at different levels.
  • This other particular embodiment makes it possible in particular to make connections between a plurality of rows of electrodes, for example three rows 37a, 37b, 37c, respectively arranged on glass plates 36a, 36b, 36c, offset with respect to the others so as to form a series of steps, and an electronic control device 38, by means of electrical conductors carried by flexible circuits 39a, 39b, 39c, which can moreover be combined so as to constitute a single circuit .
  • the microconnector according to the invention represented in FIG.
  • the microconnector according to the invention shown in Figure 7 includes a support not shown in which one can nest the plates 36a, 36b, 36c and in which can rotate the eccentric, as explained in the description of Figure 1, and the circuits 39a, 39b, 39c are immobilized between an edge not shown of said support and the cover of the latter (not shown).
  • FIG. 8 schematically shows another particular embodiment of the microconnector object of the invention adapted to electrodes 8 which are arranged parallel to one another on the same glass plate 42 (homologous to plate 6 of the Figure 1) and which form a periodic series of electrodes longitudinally offset from each other.
  • Each pattern 48 has a number M of electrodes, each of these electrodes extending further than the previous one.
  • the wires 9 are then fixed to the insulating piece 10 so as to form a periodic series of parallel wires, stepped, transversely and longitudinally offset with respect to each other.
  • Each pattern 49 has a number M of threads 9, each thread 9 extending further than the previous one and being offset relative to the latter not only in height but also laterally, so that by lowering the piece 10, each wire 9 comes into contact with an electrode 8 and only one.
  • the microconnector which is the subject of the invention therefore allows several hundred electrical contacts to be made simultaneously. In addition, obtaining or the removal of the connections between the wires and the electrodes is very fast. Finally, the force required to make said connections is practically zero since the microconnector according to the invention does not require any insertion of plugs into other plugs. In addition, the above description shows that the microconnector according to the invention can serve as an electrical switch with quick opening and closing.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Multi-Conductor Connections (AREA)
EP84400572A 1983-03-28 1984-03-21 Kleinstverbinder mit hoher Kontaktdichtheit Expired EP0121467B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8305062A FR2543746B1 (fr) 1983-03-28 1983-03-28 Microconnecteur a haute densite de contacts
FR8305062 1983-03-28

Publications (2)

Publication Number Publication Date
EP0121467A1 true EP0121467A1 (de) 1984-10-10
EP0121467B1 EP0121467B1 (de) 1987-08-05

Family

ID=9287303

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84400572A Expired EP0121467B1 (de) 1983-03-28 1984-03-21 Kleinstverbinder mit hoher Kontaktdichtheit

Country Status (5)

Country Link
US (1) US4684181A (de)
EP (1) EP0121467B1 (de)
JP (1) JPS59184473A (de)
DE (1) DE3465226D1 (de)
FR (1) FR2543746B1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985003387A1 (fr) * 1984-01-19 1985-08-01 Battelle Memorial Institute Connecteur electrique d'un module a circuit electrique
US4723195A (en) * 1985-04-03 1988-02-02 Rdi Limited Partnership Assembly including a modular electrical circuit and connector

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US4628410A (en) * 1985-04-10 1986-12-09 Itt Corporation Surface mounting connector
AU619366B2 (en) * 1988-12-16 1992-01-23 Paul H. Hartman Radially expandable edge connector system
US4948379A (en) * 1989-03-17 1990-08-14 E. I. Du Pont De Nemours And Company Separable, surface-mating electrical connector and assembly
JPH0330378U (de) * 1989-07-21 1991-03-26
US5709555A (en) * 1995-06-22 1998-01-20 Framatome Connectors Usa Inc. High density card edge connection system with outrigger and sequentially connected contacts
US6091474A (en) * 1997-06-26 2000-07-18 Ericsson, Inc. Display assembly
JP2974214B1 (ja) * 1998-12-16 1999-11-10 株式会社双晶テック プローブユニット
FR2787641B1 (fr) * 1998-12-22 2001-03-09 Sc2N Sa Connecteur electrique a piece pivotante
TWI238513B (en) 2003-03-04 2005-08-21 Rohm & Haas Elect Mat Coaxial waveguide microstructures and methods of formation thereof
JP3755879B2 (ja) * 2003-05-13 2006-03-15 日本航空電子工業株式会社 コネクタ
TWI284628B (en) * 2005-07-01 2007-08-01 Ind Tech Res Inst Method of fabricating a microconnector and shape of a terminal of the microconnector
EP3104450A3 (de) 2007-03-20 2016-12-28 Nuvotronics, LLC Integrierte elektronische komponenten und herstellungsverfahren dafür
US7898356B2 (en) 2007-03-20 2011-03-01 Nuvotronics, Llc Coaxial transmission line microstructures and methods of formation thereof
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) * 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
US9993982B2 (en) 2011-07-13 2018-06-12 Nuvotronics, Inc. Methods of fabricating electronic and mechanical structures
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
JP6535347B2 (ja) 2014-01-17 2019-06-26 ヌボトロニクス、インク． ウエハースケールのテスト・インターフェース・ユニット：高速および高密度の混合信号インターコネクトおよびコンタクタのための低損失および高絶縁性の装置および方法
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

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DE1127416B (de) * 1960-08-16 1962-04-12 Siemens Ag Steckerleiste fuer Fernmelde-, insbesondere Fernsprechanlagen
DE1440198A1 (de) * 1961-09-13 1968-10-24 Siemens Ag Federleiste mit andrueckbaren Kontaktfedern mit Steckverbindungen,insbesondere Federleiste fuer Schaltungsplatten in Fernsprechanlagen
US3518612A (en) * 1966-08-06 1970-06-30 Ibm Connector assembly
US3905670A (en) * 1974-04-05 1975-09-16 Itt Actuated printed circuit connector

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US3805159A (en) * 1969-09-15 1974-04-16 Delta Design Inc Contactor unit for integrated circuit testing
CA1079374A (en) * 1976-04-12 1980-06-10 Sangamo Weston, Inc. Plug-in multiple conductor-connector assembly and method
FR2366714A1 (fr) * 1976-09-29 1978-04-28 Bonhomme F R Perfectionnements aux dispositifs de connexion electrique separables
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
DE1127416B (de) * 1960-08-16 1962-04-12 Siemens Ag Steckerleiste fuer Fernmelde-, insbesondere Fernsprechanlagen
DE1440198A1 (de) * 1961-09-13 1968-10-24 Siemens Ag Federleiste mit andrueckbaren Kontaktfedern mit Steckverbindungen,insbesondere Federleiste fuer Schaltungsplatten in Fernsprechanlagen
US3518612A (en) * 1966-08-06 1970-06-30 Ibm Connector assembly
US3905670A (en) * 1974-04-05 1975-09-16 Itt Actuated printed circuit connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985003387A1 (fr) * 1984-01-19 1985-08-01 Battelle Memorial Institute Connecteur electrique d'un module a circuit electrique
EP0154602A1 (de) * 1984-01-19 1985-09-11 Battelle Memorial Institute Elektrischer Verbinder für ein Modul mit einer elektronischen Schaltung
US4723195A (en) * 1985-04-03 1988-02-02 Rdi Limited Partnership Assembly including a modular electrical circuit and connector

Also Published As

Publication number Publication date
FR2543746A1 (fr) 1984-10-05
JPS59184473A (ja) 1984-10-19
DE3465226D1 (en) 1987-09-10
EP0121467B1 (de) 1987-08-05
US4684181A (en) 1987-08-04
FR2543746B1 (fr) 1985-12-27

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