EP0101703A1 - Printed electric circuit - Google Patents

Printed electric circuit

Info

Publication number
EP0101703A1
EP0101703A1 EP19830900717 EP83900717A EP0101703A1 EP 0101703 A1 EP0101703 A1 EP 0101703A1 EP 19830900717 EP19830900717 EP 19830900717 EP 83900717 A EP83900717 A EP 83900717A EP 0101703 A1 EP0101703 A1 EP 0101703A1
Authority
EP
European Patent Office
Prior art keywords
support
hole
networks
printed circuit
circuit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19830900717
Other languages
German (de)
French (fr)
Inventor
Edouard Serras-Paulet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0101703A1 publication Critical patent/EP0101703A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Definitions

  • the invention relates to printed electrical circuits comprising a dielectric support, in particular a sheet or film of flexible plastic, on both sides of which electrically conductive networks are formed.
  • a dielectric support in particular a sheet or film of flexible plastic
  • connection means When the support is a rigid dié ⁇ electric plate or resin epoxy for example glass, is usually drilled holes at desired locations in the support and a film is formed graphic- * conductor on the walls of these holes by electroplating, which is a long and costly operation, greatly increasing the cost price of the printed circuit.
  • the support is a flexible plastic sheet or film
  • an electrically conductive elastomer which is then vulcanized or polymerized by heating and which provides an electrical connection between the tracks of the two networks passing at the ends of the hole.
  • the vulcanization or polymerization of the elastomer is accompanied by a shrinkage phenomenon, causing cracks and micro-cracks at the ends of the hole, hence the risk of breaking the electrical connections, which get worse when the flexible circuit is
  • the object of the invention is to provide a printed electrical circuit, in particular of the type comprising a flexible support such as a film of dielectric plastic material, in which the problems of connection between the electrically conductive networks formed on the two faces of the support are solved by simple, economical and particularly reliable.
  • the invention provides a printed circuit comprising a dielectric support, in particular a sheet of flexible plastic material, and electrically conductive networks formed on the two faces of the support and interconnected by connecting means, at least some of which are made up by a hole in the support through which pass at least two different connections formed by thin strips of electrically conductive material extending at a distance from each other on the wall (s) of the hole in the support, characterized in that said strips are formed by deposition or printing by screen printing of an electroconductive ink on the wall or walls of the hole of the support.
  • a hole in the support makes it easy to establish several different connections between different tracks of the two printed networks formed on the two faces of the support;
  • connections are thin strips of conductive material formed by screen printing on one part of the wall of the support hole, these thin strips being, due to their small thickness, free from the risks of cracks or micro-cracks which would occur if a large thickness of material were used to establish the connections between the two networks.
  • these connections are formed, along the walls of the holes of the support at the same time as the: ' networks printed on the two faces of the support, which reduces the number of manufacturing operations and avoids resumption of printed circuits after formation of electroconductive networks.
  • the invention also relates to a multi-layer printed circuit comprising a printed circuit of the type described above, at least one of the faces of which is covered with a second dielectric support, such as a sheet or a film of flexible plastic material. , the outer face of which has an electrically conductive network, connected to at least one of the networks printed on the first support by at least one hole in the second support through which pass one or more electrical connections formed by depositing or printing by screen printing ink strips conductive on part of the wall (s) of the hole.
  • a second dielectric support such as a sheet or a film of flexible plastic material.
  • a printed circuit comprising a flexible support of dielectric material, provided with electrically conductive networks on its two faces and connections between the two networks passing through holes in the support, then to fix , for example by bonding, a film of dielectric plastic on one face of this printed circuit, this film comprising connection holes at the desired locations, and to form by printing by serial printing a conductive network on the external face of this film flexible, the connections between this network and the network or networks of the first circuit being established by the holes in the film with which one or more parts of the walls are provided a thin layer of electroconductive ink.
  • FIG. 1 is a partial schematic perspective view of a printed circuit according to the invention?
  • FIG. 2 is a schematic sectional view of a multi-layer printed circuit according to the invention.
  • the printed circuit board shown in Figure 1 comprises a dielectric support 10, for example a polyester film having a thickness of about 0.1 mm, the upper face 11 is provided with the electrically conductive network comprising tracks ment notam ⁇ 12 and whose lower face 13 also has a conductive network comprising tracks 14.
  • the connections between these two conductive networks that is to say between the various tracks 12 of the first network and the tracks 14 of the second network, are established 1 by the through holes 15 of the support, which may be square or rectangular as shown in the drawing, a polygonal shape, • circular, oval, etc.
  • the hole 15 is of square section and has four plane faces 16 of two to two perpendicular, the height of which is equal to the thickness of the film 10 of plastic.
  • the conductive tracks 12, 14 of the electroconductive networks arrive at the edges of the flat faces 16 of the hole 15, as shown in the drawing.
  • Each track 12 of the conductive network formed on the upper face 11 of the support 10, leading to a flat face 16 of the hole 15 ,. is connected to a track 14 of the conductive network formed on the underside 13 of the support, by a strip 17 of electroconductive material, arranged on a part of. said flat face 16 and joining the end of track 12 to the end of track 14.
  • the conductive networks comprising the tracks 12 and 14 are formed on the support 10 by deposition by screen printing of an electroconductive ink of a type available on the market.
  • the conductive networks of the two faces of the support 10 can be printed at the same time, or else one after the other, according to the various methods of printing by screen printing.
  • the connection strips 17 are formed at the same time as the electrically conductive networks, this operation presenting no difficulty.
  • the support 10 is then subjected to heating, for example at a temperature of the order of 150 ° C. for a period of 5 to 10 minutes depending on the ink used, to polymerize the ink and harden it.
  • connection strips 17 formed on the walls 16 of the hole 15 thus have the same nature and the same thickness as the tracks 12 and 14 of the electrically conductive networks formed on the: two faces of the support 10 and undergo polymerization heating at the same time as these networks.
  • Such a treatment makes it possible to avoid all the risks of withdrawal of the electroconductive ink during its polymerization, hence a total absence of cracks and micro-cracks at the ends of the strips 17.
  • the connections thus obtained are particu ⁇ completely homogeneous and free from defects.
  • FIG. 2 diagrammatically represents, in section, a printed circuit with multi-ply layers according to the invention.
  • This circuit 20 comprises for example a first circuit 21, of the type described in FIG. 1, comprising a dielectric support 22 formed for example from a plastic film flexible, the two faces of which have an electroconductive network comprising tracks 23 and 24 respectively, interconnected via holes 25 of * . support 22, the walls of which have connection strips 26 similar to the connection strips 17 in FIG. 1.
  • a dielectric support 28 for example a flexible plastic film identical to the film constituting the support 22 of the first circuit, which is provided with holes 29 at the appropriate locations.
  • This film 28 is fixed for example by gluing to the upper face of the circuit 21.
  • the film 28 has on its upper face an electrically conductive network comprising tracks 30 connected to tracks 23 and / or tracks 24 of the first circuit by connection strips 31, identical to the connection strips 17, formed on part of the holes 29 of the support 28.
  • the tracks 30 and the connection strips 31 can be formed by deposition by screen printing of an electroconductive ink and polymerization of this ink, after the film 28 has been fixed to the printed circuit 21.
  • the assembly thus obtained can be further coated with a film 32 of dielectric flexible material, similar to films 28 and 22, having connection holes 33 at desired locations, and an electroconductive network comprising tracks 34 on its upper face and connection strips 35 formed on a part of the walls of the holes 33, in the same way as above.
  • a track 34 of the upper face of the film 32 can be connected to a track 30 of the upper face of the film 28, to a track 23 of the upper face of the circuit 21 and / or to a track 24 of the lower face of said film. circuit 21.
  • the holes 33 of the upper film 32 may have the same dimension as the holes 29 of the intermediate film 28, or a greater dimension.
  • the holes 29 of the intermediate film 28 may have a dimension equal to, or greater than, that of the holes 25 of the first support 22.
  • the invention allows all the possibilities of connections between various tracks of the various conductive networks thus superimposed.
  • a track on the lower face of the first circuit 21 can therefore be connected to a track on the " upper face of the film 32, and / or to any other track of the intermediate conducting networks.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Le circuit imprimé comprend un support diélectrique en particulier souple (10) comprenant sur ses deux faces un réseau électroconducteur (12, 14), et des moyens de connexion entre ces deux réseaux formés par des trous (15) du support, dont les parois (16) présentent des bandes (17) de connexion entre les diverses pistes des réseaux (12, 14) réalisées par dépôt ou impression sérigraphique d'une encre électroconductrice sur la ou les parois (16) du trou (15).The printed circuit comprises a particularly flexible dielectric support (10) comprising on its two faces an electrically conductive network (12, 14), and connection means between these two networks formed by holes (15) in the support, the walls of which ( 16) have bands (17) for connection between the various tracks of the networks (12, 14) produced by deposition or screen printing of an electroconductive ink on the wall or walls (16) of the hole (15).

Description

Circuit électrique imprimé . Domaine technique : Printed electrical circuit. Technical area :
L'invention concerne les circuits électriques imprimés com¬ prenant un support diélectrique, notamment une feuille ou un film de matière plastique souple, sur les deux faces du¬ quel sont formés des réseaux électriquement conducteurs. Technique antérieure :The invention relates to printed electrical circuits comprising a dielectric support, in particular a sheet or film of flexible plastic, on both sides of which electrically conductive networks are formed. Prior art:
Ces deux réseaux doivent' être reliés entre eux en certains points par des moyens de connexion. Lorsque le support dié¬ lectrique est une plaque rigide de résine ou de verre époxy par exemple, on perce habituellement des trous aux endroits voulus dans le support et l'on forme un film métallique-* conducteur sur les parois de ces trous par galvanoplastie, qui est une opération longue et coûteuse augmentant de façon très importante le prix de revient du circuit imprimé.These two networks must be linked together at certain points by connection means. When the support is a rigid dié¬ electric plate or resin epoxy for example glass, is usually drilled holes at desired locations in the support and a film is formed métallique- * conductor on the walls of these holes by electroplating, which is a long and costly operation, greatly increasing the cost price of the printed circuit.
Lorsque le support est une feuille ou un film souple de matière plastique, on a déjà proposé de former des trous aux endroits voulus dans le support et de remplir ces trous d'un élasto ère électro-conducteur qui est ensuite vulcanisé ou polymérisé par chauffage et qui assure une liaison élec- trique entre les pistes des deux réseaux passant aux extré¬ mités du trou. Toutefois, la vulcanisation ou polymérisation de l'élastomère s'accompagne d'un phénomène de retrait, pro¬ voquant des criques et des micro-fissures au niveau des ex¬ trémités du trou, d'où des risques de rupture des liaisons électriques, qui s'aggravent lorsque le circuit souple estWhen the support is a flexible plastic sheet or film, it has already been proposed to form holes at the desired locations in the support and to fill these holes with an electrically conductive elastomer which is then vulcanized or polymerized by heating and which provides an electrical connection between the tracks of the two networks passing at the ends of the hole. However, the vulcanization or polymerization of the elastomer is accompanied by a shrinkage phenomenon, causing cracks and micro-cracks at the ends of the hole, hence the risk of breaking the electrical connections, which get worse when the flexible circuit is
O plié ou manipulé..O folded or manipulated.
En outre, le remplissage d'un trou par l'élastomère électro- conducteur se fait après la formation des -réseaux électro- conducteurs sur les deux faces du support, ce qui allonge et complique la fabrication. Exposé de 1' invention :In addition, the filling of a hole with the electroconductive elastomer is done after the formation of the electroconductive networks on the two faces of the support, which lengthens and complicates the manufacture. Disclosure of the invention:
L'invention a pour but un circuit électrique imprimé, notam¬ ment du type comprenant un support souple tel qu'un film de matière plastique diélectrique, dans lequel les problèmes de connexion entre les réseaux électroconducteurs formés sur les deux faces du support sont résolus de façon simple, économique et particulièrement fiable.The object of the invention is to provide a printed electrical circuit, in particular of the type comprising a flexible support such as a film of dielectric plastic material, in which the problems of connection between the electrically conductive networks formed on the two faces of the support are solved by simple, economical and particularly reliable.
L'invention propose un circuit imprimé comprenant un support diélectrique, en particulier une feuille de matière plasti¬ que souple, et des réseaux électriquement conducteurs formés sur les deux faces du support et reliés entre eux par des moyens de liaison dont certains au moins sont constitués par un trou du support dans lequel passent au moins deux connexions différentes formées par des bandes minces de matière électroconductrice s'étendant à distance les unes • des autres sur la ou les parois du trou du support, caracté¬ risé en ce que lesdites bandes sont formées par dépôt ou impression par sérigraphie d'une encre electroconductrice sur la ou les parois du trou du support.The invention provides a printed circuit comprising a dielectric support, in particular a sheet of flexible plastic material, and electrically conductive networks formed on the two faces of the support and interconnected by connecting means, at least some of which are made up by a hole in the support through which pass at least two different connections formed by thin strips of electrically conductive material extending at a distance from each other on the wall (s) of the hole in the support, characterized in that said strips are formed by deposition or printing by screen printing of an electroconductive ink on the wall or walls of the hole of the support.
Le circuit imprimé selon l'invention présente donc un double avantage :The printed circuit according to the invention therefore has a double advantage:
- d'une part, un trou du support permet d'établir facilement plusieurs connexions différentes entre différentes pistes des deux réseaux imprimés formés sur les deux faces du support;- On the one hand, a hole in the support makes it easy to establish several different connections between different tracks of the two printed networks formed on the two faces of the support;
- d'autre part, les connexions sont des bandes minces de matière conductrice formées par sérigraphie sur une partie de la paroi du trou du support, ces bandes minces étant, en raison de leur faible épaisseur, exemptes des risques de formation de criques ou de micro-fissures qui se produiraient si l'on utilisait une épaisseur importante de matière pour établir les connexions entre les deux réseaux.- on the other hand, the connections are thin strips of conductive material formed by screen printing on one part of the wall of the support hole, these thin strips being, due to their small thickness, free from the risks of cracks or micro-cracks which would occur if a large thickness of material were used to establish the connections between the two networks.
Selon une autre caractéristique de l'invention, ces connexion sont formées, le long des parois des trous du support en même temps que les:' réseaux imprimés sur les deux faces du support, ce qui réduit le nombre d'opérations de fabrication et évite une reprise des circuits imprimés après formation des réseaux électroconducteurs.According to another characteristic of the invention, these connections are formed, along the walls of the holes of the support at the same time as the: ' networks printed on the two faces of the support, which reduces the number of manufacturing operations and avoids resumption of printed circuits after formation of electroconductive networks.
L'invention concerne également un circuit imprimé à couches multiples, comprenant un circuit imprimé du type décrit ci-dessus, dont au moins une des faces est recouverte d'un second support diélectrique, tel qu'une feuille ou un film de matière plastique souple, dont la face extérieure présente un réseau électroconducteur, relié à au moins un des réseaux imprimés sur le premier support par au moins un trou du second support dans lequel passent une ou plusieurs connexions électriques formées par dépôt ou impression par sérigraphie de bandes d'encre conductrice sur une partie de la ou des parois du trou.The invention also relates to a multi-layer printed circuit comprising a printed circuit of the type described above, at least one of the faces of which is covered with a second dielectric support, such as a sheet or a film of flexible plastic material. , the outer face of which has an electrically conductive network, connected to at least one of the networks printed on the first support by at least one hole in the second support through which pass one or more electrical connections formed by depositing or printing by screen printing ink strips conductive on part of the wall (s) of the hole.
Pour cela, il suffit de former un circuit imprimé selon l'invention, comprenant un support souple de matière diélec¬ trique, pourvu de réseaux électroconducteurs sur ses deux faces et de connexions entre les deux réseaux passant par des trous du support, puis de fixer, par exemple par collage, un film de matière plastique diélectrique sur une face de ce circuit imprimé, ce film comprenant des trous de connexion aux endroits voulus, et de former par impression par séri¬ graphie un réseau conducteur sur la face extérieure de ce film souple, les connexions entre ce réseau et le ou les réseaux du premier circuit étant établies par les trous du film dont une ou plusieurs parties des parois sont pourvues d'une couche mince d'encre électroconductrice. Meilleure manière de réaliser l'invention : Dans la description qui suit, faite à titre d'exemple, on se réfère aux dessins annexés, dans lesquels :For this, it suffices to form a printed circuit according to the invention, comprising a flexible support of dielectric material, provided with electrically conductive networks on its two faces and connections between the two networks passing through holes in the support, then to fix , for example by bonding, a film of dielectric plastic on one face of this printed circuit, this film comprising connection holes at the desired locations, and to form by printing by serial printing a conductive network on the external face of this film flexible, the connections between this network and the network or networks of the first circuit being established by the holes in the film with which one or more parts of the walls are provided a thin layer of electroconductive ink. Best way to carry out the invention: In the description which follows, given by way of example, reference is made to the appended drawings, in which:
- la figure 1 est une vue schématique partielle en perspec¬ tive d'un circuit cimprimé selon l'invention? et- Figure 1 is a partial schematic perspective view of a printed circuit according to the invention? and
- la figure 2 est une vue schématique en coupe d'un circuit imprimé à couches multiples selon l'invention.- Figure 2 is a schematic sectional view of a multi-layer printed circuit according to the invention.
Le circuit imprimé représenté en figure 1 comprend un support diélectrique 10, par exemple un film de polyester ayant une épaisseur de l'ordre de 0,1 mm, dont la face supérieure 11 est pourvue dlun réseau électroconducteur comprenant notam¬ ment des pistes 12 et dont la face inférieure 13 présente également un réseau conducteur comprenant des pistes 14. Les connexions entre ces deux réseaux conducteurs, c'est-à-dire entre les diverses pistes 12 du premier réseau et les pistes 14 du second réseau, sont établies par 1 lintermédiaire de trous 15 du support, qui peuvent être de forme carrée ou rectangulaire comme représenté au dessin, de forme polygonale, • circulaire, ovale, etc.The printed circuit board shown in Figure 1 comprises a dielectric support 10, for example a polyester film having a thickness of about 0.1 mm, the upper face 11 is provided with the electrically conductive network comprising tracks ment notam¬ 12 and whose lower face 13 also has a conductive network comprising tracks 14. The connections between these two conductive networks, that is to say between the various tracks 12 of the first network and the tracks 14 of the second network, are established 1 by the through holes 15 of the support, which may be square or rectangular as shown in the drawing, a polygonal shape, • circular, oval, etc.
Dans l'exemple représenté, le trou 15 est à section carrée et présente quatre faces planes 16 de deux à deux perpendi¬ culaires, dont la hauteur est égale à llépaisseur du film 10 de matière plastique.In the example shown, the hole 15 is of square section and has four plane faces 16 of two to two perpendicular, the height of which is equal to the thickness of the film 10 of plastic.
Les pistes conductrices 12, 14 des réseaux électroconduc¬ teurs arrivent aux bords des faces planes 16 du trou 15, comme représenté au dessin.The conductive tracks 12, 14 of the electroconductive networks arrive at the edges of the flat faces 16 of the hole 15, as shown in the drawing.
Chaque piste 12 du réseau conducteur formé sur la face supé- rieure 11 du support 10, aboutissant à une face plane 16 du trou 15,. est reliée à une piste 14 du réseau conducteur formé sur la face inférieure 13 du support, par une bande 17 de matière électroconductrice, disposée sur une partie de . ladite face plane 16 et réunissant l'extrémité de la piste 12 à l'extrémité de la piste- 14.Each track 12 of the conductive network formed on the upper face 11 of the support 10, leading to a flat face 16 of the hole 15 ,. is connected to a track 14 of the conductive network formed on the underside 13 of the support, by a strip 17 of electroconductive material, arranged on a part of. said flat face 16 and joining the end of track 12 to the end of track 14.
Avantageusement, les réseaux conducteurs comprenant les pistes 12 et 14 sont formés sur le support 10 par dépôt par sérigraphie d'une encre électroconductrice d'un type disponible dans le commerce. Les réseaux conducteurs des deux faces du support 10 peuvent être imprimés en même temps, ou bien l'un après l'autre, selon les divers procédés d'im¬ pression par sérigraphié. Avantageusement, les bandes de connexion 17 sont formées en même temps que les réseaux électroconducteurs, cette opération ne présentant aucune difficulté. Le support 10 est ensuite soumis à un chauffage, par exemple à une température de l'ordre de 150°C pendant une durée de 5 à 10 minutes en fonction de l'encre utilisée, pour polymériser l'encre et la durcir.Advantageously, the conductive networks comprising the tracks 12 and 14 are formed on the support 10 by deposition by screen printing of an electroconductive ink of a type available on the market. The conductive networks of the two faces of the support 10 can be printed at the same time, or else one after the other, according to the various methods of printing by screen printing. Advantageously, the connection strips 17 are formed at the same time as the electrically conductive networks, this operation presenting no difficulty. The support 10 is then subjected to heating, for example at a temperature of the order of 150 ° C. for a period of 5 to 10 minutes depending on the ink used, to polymerize the ink and harden it.
Les bandes de connexion 17 formées sur les parois 16 du trou 15 ont ainsi la même nature et la même épaisseur que les pistes 12 et 14 des réseaux électroconducteurs formés sur les : deux faces du support 10 et subissent un chauffage de polymérisation en même temps que ces réseaux. Un tel traite¬ ment permet d'éviter tous les risques de retrait de l'encre électroconductrice au cours de sa polymérisation, d'où une absence totale de criques et de micro-fissures aux extrémités des bandes 17. Les connexions ainsi obtenues sont particu¬ lièrement homogènes et libres de défaut.The connection strips 17 formed on the walls 16 of the hole 15 thus have the same nature and the same thickness as the tracks 12 and 14 of the electrically conductive networks formed on the: two faces of the support 10 and undergo polymerization heating at the same time as these networks. Such a treatment makes it possible to avoid all the risks of withdrawal of the electroconductive ink during its polymerization, hence a total absence of cracks and micro-cracks at the ends of the strips 17. The connections thus obtained are particu ¬ completely homogeneous and free from defects.
Bien entendu, on peut faire passer plusieurs connexions pa¬ rallèles ou distantes les unes des autres sur une seule face 16 d'un trou 15.Of course, it is possible to pass several connections parallel or distant from one another on a single face 16 of a hole 15.
On se réfère maintenant à la figure 2, qui représente sché- matiquement, en coupe, un circuit imprimé à couches multi¬ ples selon l'invention.Reference is now made to FIG. 2, which diagrammatically represents, in section, a printed circuit with multi-ply layers according to the invention.
OMPi Ce circuit 20 comprend par exemple un premier circuit 21 , du type décrit en figure 1 , comprenant un support diélectri¬ que 22 formé par exemple d'un film de matière plastique sou¬ ple, dont les deux faces présentent un réseau électrocon- ducteur comprenant des pistes 23 et 24 respectivement, reliées entre elles par l'intermédiaire de trous 25 du *. support 22 dont les parois présentent des bandes de connexion 26 semblables aux bandes de connexion 17 de la figure 1.WIPO This circuit 20 comprises for example a first circuit 21, of the type described in FIG. 1, comprising a dielectric support 22 formed for example from a plastic film flexible, the two faces of which have an electroconductive network comprising tracks 23 and 24 respectively, interconnected via holes 25 of * . support 22, the walls of which have connection strips 26 similar to the connection strips 17 in FIG. 1.
Sur ce circuit imprimé 21 est rapporté un support diélectri¬ que 28 , par exemple un film de matière plastique souple iden¬ tique au film constituant le support 22 du premier circuit, qui est pourvu de trous 29 aux endroits appropriés. Ce film 28 est fixé par exemple par collage sur la face supérieure du circuit21. Le film 28 présente sur sa face supérieure un réseau électroconducteur comprenant des pistes 30 reliées aux pistes 23 et/ou aux pistes 24 du premier circuit par des bandes de connexion 31 , identiques aux bandes de connexion 17, formées sur une partie des trous 29 du support 28.On this printed circuit 21 is reported a dielectric support 28, for example a flexible plastic film identical to the film constituting the support 22 of the first circuit, which is provided with holes 29 at the appropriate locations. This film 28 is fixed for example by gluing to the upper face of the circuit 21. The film 28 has on its upper face an electrically conductive network comprising tracks 30 connected to tracks 23 and / or tracks 24 of the first circuit by connection strips 31, identical to the connection strips 17, formed on part of the holes 29 of the support 28.
Les pistes 30 et les bandes de connexion 31 peuvent être for¬ mées par dépôt par sérigraphie d'une encre électroconductrice et polymérisation de cette encre, après que le film 28 ait été fixé sur le circuit imprimé 21.The tracks 30 and the connection strips 31 can be formed by deposition by screen printing of an electroconductive ink and polymerization of this ink, after the film 28 has been fixed to the printed circuit 21.
Llensemble ainsi obtenu peut encore être revêtu d'un film 32 de matière souple diélectrique, analogue aux films 28 et 22, présentant des trous de connexion 33 aux endroits voulus, ainsi qu'un réseau électroconducteur comprenant des pistes 34 sur sa face supérieure et des bandes de connexion 35 for¬ mées sur une partie des parois des trous 33, de la même façon que précédemment.L the assembly thus obtained can be further coated with a film 32 of dielectric flexible material, similar to films 28 and 22, having connection holes 33 at desired locations, and an electroconductive network comprising tracks 34 on its upper face and connection strips 35 formed on a part of the walls of the holes 33, in the same way as above.
Ainsi, une piste 34 de la face supérieure du film 32 peut être reliée à une piste 30 de la face supérieure du film 28, à une piste 23 de la face supérieure du circuit 21 et/ou à une piste 24 de la face inférieure dudit circuit 21. Les trous 33 du film supérieur 32 peuvent avoir la même dimension que les trous 29 du film intermédiaire 28, ou une dimension supérieure. De même, les trous 29 du film intermé¬ diaire 28 peuvent avoir une dimension égale, ou supérieure, à celle des trous 25 du premier support 22.Thus, a track 34 of the upper face of the film 32 can be connected to a track 30 of the upper face of the film 28, to a track 23 of the upper face of the circuit 21 and / or to a track 24 of the lower face of said film. circuit 21. The holes 33 of the upper film 32 may have the same dimension as the holes 29 of the intermediate film 28, or a greater dimension. Likewise, the holes 29 of the intermediate film 28 may have a dimension equal to, or greater than, that of the holes 25 of the first support 22.
L'invention permet toutes les possibilités de liaisons entre diverses pistes des divers réseaux conducteurs ainsi superposés. Une piste de la face inférieure du premier circuit 21- peut donc être reliée à une piste de la "face supérieure du film 32, et/ou à n'importe quelle autre piste des réseaux conducteurs intermédiaires. The invention allows all the possibilities of connections between various tracks of the various conductive networks thus superimposed. A track on the lower face of the first circuit 21 can therefore be connected to a track on the " upper face of the film 32, and / or to any other track of the intermediate conducting networks.

Claims

Revendications de Brevet : Patent Claims:
1. Circuit imprimé comprenant un support diélectrique, en particulier une feuille de matière plastique souple, et des réseaux électriquement conducteurs formés sur les deux faces du support et reliés entre eux par des moyens de liaison dont certains au moins sont constitués par un trou du support dans lequel passent au moins deux connexions différentes formées par des bandes minces de matière élec- troconductrice s'étendant à distance les unes des autres sur la ou les parois du trou du support, caractérisé en ce que lesdites bandes (17) sont formées par dépôt ou impression par sérigraphie drune encre électroconductrice sur la ou les parois (16) du trou (15) du support (10) .1. Printed circuit comprising a dielectric support, in particular a sheet of flexible plastic material, and electrically conductive networks formed on the two faces of the support and interconnected by connection means, at least some of which consist of a hole in the support in which pass at least two different connections formed by thin strips of electrically conductive material extending at a distance from each other on the wall or walls of the hole of the support, characterized in that said strips (17) are formed by deposition or printing by screen printing of an electrically conductive ink on the wall or walls (16) of the hole (15) of the support (10).
2. Circuit imprimé selon la revendication 1 , dans lequel les réseaux électroconducteurs (12, 14) sont formés par dépôt ou impression par sérigraphie d'encre électroconduc¬ trice sur les deux faces (11, 13) du support, caractérisé en ce que lesdites bandes de connexion (17) sont formées de la même encre électroconductrice que les réseaux (12, 1 ) et ont sensiblement la même épaisseur que les pistes des réseaux auxquelles elles sont reliées.2. A printed circuit according to claim 1, in which the electroconductive networks (12, 14) are formed by deposition or printing by screen printing of electroconductive ink on the two faces (11, 13) of the support, characterized in that said Connection strips (17) are formed from the same electroconductive ink as the networks (12, 1) and have substantially the same thickness as the tracks of the networks to which they are connected.
3. Circuit imprimé selon la revendication 2, caractérisé en ce que lesdites bandes de connexion (17) sont formées en même temps que les réseaux électroconducteurs (12, 14) .3. A printed circuit according to claim 2, characterized in that said connection strips (17) are formed at the same time as the electrically conductive networks (12, 14).
4. Circuit imprimé selon l'une des revendications 1 à 3, caractérisé en ce que, par un trou (15) du support (10), passent une multiplicité de connexions (17) différentes.4. A printed circuit according to one of claims 1 to 3, characterized in that, through a hole (15) of the support (10), pass a multiplicity of different connections (17).
5. Circuit imprimé selon l'une des revendications précé¬ dentes, caractérisé en ce qu'au moins une de ses faces est recouverte d'un second support diélectrique (28) , tel en particulier qu'une feuille ou un film de matière plastique souple, dont la face extérieure présente un réseau électro- conducteur (30) relié à au moins un des réseaux (23, 24) imprimés sur le premier support (22) par au moins un trou (29) du second support (28) dans lequel passent une ou plusieurs connexions électriques (31) formées par dépôt ou impression par sérigraphie de bandes de matière conduc¬ trice s'étendant sur une partie de la ou des parois du trou (29) .5. A printed circuit according to one of the preceding claims, characterized in that at least one of its faces is covered with a second dielectric support (28), such as in particular a sheet or a film of plastic material. flexible, the outside of which has an electro- conductor (30) connected to at least one of the networks (23, 24) printed on the first support (22) by at least one hole (29) of the second support (28) through which pass one or more electrical connections (31) formed by depositing or printing by screen printing strips of conductive material extending over part of the wall or walls of the hole (29).
6. Circuit imprimé selon la revendication 5, caractérisé en ce que le trou (29) du second support (28) est aligné avec un trou (25) du premier support (22) dans lequel passe au moins une connexion électrique (26) .6. A printed circuit according to claim 5, characterized in that the hole (29) of the second support (28) is aligned with a hole (25) of the first support (22) through which at least one electrical connection (26) passes.
7. Circuit imprimé selon la revendication 5 ou 6, caractérisé en ce que le trou (29) du second support a une dimension supérieure à celle du ou des trous (25) du premier support (22) .7. A printed circuit according to claim 5 or 6, characterized in that the hole (29) of the second support has a dimension greater than that of the hole or holes (25) of the first support (22).
8. Circuit imprimé selon l'une des revendications 5 à 7, caractérisé en ce que le second support (28) est recouvert d'un troisième support (32) dont la face extérieure comprend un réseau électriquement conducteur (34) relié au réseau (30) du second support et/ou à au moins l'un des réseaux (23, 24) du premier support (22) par au moins un trou (33) du troisiè- me support dans lequel passent une ou plusieurs connexions électriques (35) formées par dépôt ou impression par séri¬ graphie d'une encre électroconductrice sur les parois du trou (33) du troisième support.8. A printed circuit according to one of claims 5 to 7, characterized in that the second support (28) is covered with a third support (32) whose outer face comprises an electrically conductive network (34) connected to the network ( 30) of the second support and / or at least one of the networks (23, 24) of the first support (22) by at least one hole (33) of the third support through which one or more electrical connections (35 ) formed by deposition or printing by serial printing of an electroconductive ink on the walls of the hole (33) of the third support.
OMPI WIPO
EP19830900717 1982-02-26 1983-02-22 Printed electric circuit Withdrawn EP0101703A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8203301 1982-02-26
FR8203301A FR2522459A1 (en) 1982-02-26 1982-02-26 PRINTED ELECTRICAL CIRCUIT

Publications (1)

Publication Number Publication Date
EP0101703A1 true EP0101703A1 (en) 1984-03-07

Family

ID=9271416

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19830900717 Withdrawn EP0101703A1 (en) 1982-02-26 1983-02-22 Printed electric circuit

Country Status (4)

Country Link
EP (1) EP0101703A1 (en)
JP (1) JPS59500295A (en)
FR (1) FR2522459A1 (en)
WO (1) WO1983003040A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3429236A1 (en) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin FILM WITH ELECTRICAL LEADS PRINTED ON SIDE SIDE
US4802741A (en) * 1987-10-09 1989-02-07 Eastman Kodak Company In-depth electrode light valve array devices and improved fabrication method therefor
KR20010085811A (en) 1998-09-17 2001-09-07 엔도 마사루 Multilayer build-up wiring board
JP5773633B2 (en) * 2010-12-13 2015-09-02 キヤノン株式会社 Wiring board manufacturing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400210A (en) * 1966-04-26 1968-09-03 Automatic Elect Lab Interlayer connection technique for multilayer printed wiring boards
FR1493316A (en) * 1966-09-20 1967-08-25 Litton Industries Inc Multi-layer circuit board
DE2323529A1 (en) * 1973-05-10 1974-11-28 Peter Kammermeier CIRCUIT BOARD WITH PRINTED OR CLADDED TRACKS
FR2296988A1 (en) * 1974-12-31 1976-07-30 Ibm France IMPROVEMENT OF THE MANUFACTURING PROCESSES OF A CERAMIC MULTILAYER CIRCUIT MODULE

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO8303040A1 *

Also Published As

Publication number Publication date
FR2522459A1 (en) 1983-09-02
WO1983003040A1 (en) 1983-09-01
FR2522459B1 (en) 1985-04-26
JPS59500295A (en) 1984-02-23

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