EP0083418A2 - Cellule RAM dynamique non-volatile - Google Patents

Cellule RAM dynamique non-volatile Download PDF

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Publication number
EP0083418A2
EP0083418A2 EP82111116A EP82111116A EP0083418A2 EP 0083418 A2 EP0083418 A2 EP 0083418A2 EP 82111116 A EP82111116 A EP 82111116A EP 82111116 A EP82111116 A EP 82111116A EP 0083418 A2 EP0083418 A2 EP 0083418A2
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EP
European Patent Office
Prior art keywords
capacitor
floating gate
voltage
volatile
memory cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP82111116A
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German (de)
English (en)
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EP0083418B1 (fr
EP0083418A3 (en
Inventor
Donald Paul Gaffney
Gary Douglas Grise
Chung Hon Lam
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International Business Machines Corp
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International Business Machines Corp
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Publication of EP0083418A2 publication Critical patent/EP0083418A2/fr
Publication of EP0083418A3 publication Critical patent/EP0083418A3/en
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Publication of EP0083418B1 publication Critical patent/EP0083418B1/fr
Expired legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C14/00—Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down

Definitions

  • This invention relates to non-volatile semiconductor memory cells and more particularly to cells which utilize a device having a floating gate and an enhanced conduction insulator.
  • a number of circuits have evolved which take advantage of the ability of field effect transistors to store charge and thus serve as memory cells.
  • Such cells may be either dynamic or static in nature.
  • the dynamic cells may employ only a single field effect transistor and the static cells may be arranged in a flip-flop configuration, as is well known.
  • Each of these types of cells may be referred to as volatile cells since information stored in these cells is lost when the power supply voltage applied to the memory is lost or turned off.
  • an alternate power supply such as a battery system, must be coupled to the memory for use in the event of failure of the main power supply.
  • CMOS complementary metal-nitride-oxide-silicon
  • CMOS complementary metal-nitride-oxide-silicon
  • CMOS complementary metal-nitride-oxide-silicon
  • CMOS complementary metal-nitride-oxide-silicon
  • floating gate field effect transistors having a floating gate
  • non-volatile memory cells which use non-volatile MNOS transistors or devices are capable of retaining for long periods of time information stored volatilely in a cell but these devices require high voltage pulses for writing and erasing the information they are slow and they require rather complex processes for their fabrication.
  • An example of a non-volatile semiconductor memory cell is taught in U. S. Patent 3 676 717, filed November 2, 1970.
  • Non-volatile memory cells which use convention ally arranged floating gate devices are also capable of preserving for long periods of time information stored volatilely in a cell but these devices likewise have required high voltage pulses for writing and erasing the information, they have been slow and required high currents, approximately one milliampere per device, to write.
  • An example of a known non-volatile semiconductor memory cell having incorporated therein a floating gate is taught in U. S. Patent 4 207 615, filed November 17, 1978.
  • non-volatile static memories which include a volatile circuit coupled to a non-volatile device having a floating gate and first and second control gates capacitively coupled to the floating gate with a charge injector structure including enhanced conduction insulators disposed between the floating gate and one of the two control gates.
  • a detailed discussion of enhanced conduction insulators may be found in an article entitled "High Current Injection Into Sio 2 from Si rich Sio 2 Films and Experimental Applications” by D. J. DiMaria and D . W. Dong, Journal of Applied Physics 51(5), May 1980, pp.
  • RAM cells having only a single storage capacitor and a single switch or transistor are disclosed in commonly assigned U. S. Patents 3 387 286, filed on July 14, 1967, and 3 811 076, filed on January 2, 1973.
  • One device dynamic volatile memory cells having the capability of storing data non-volatilely are known.
  • U. S. Patent 3 916 390 filed December 31, 1974 discloses the use of a dual insulator made of silicon dioxide and silicon nitride for storing information non-volatilely during power failure.
  • Other examples of dynamic cells capable of storing non-volatilely by using MNOS structures include U. S. Patent 4 055 837, filed October 22., 1975, and 4 175 291, filed October 31, 1977.
  • These dynamic cells having non-volatile capability can operate satisfactorily, however, they generally require both negative and positive voltages to switch between volatile and non-volatile modes, larger cell areas, larger voltages for the volatile operating mode or backup memory.
  • the invention as claimed is intended to remedy these drawbacks. It solves the problem of how to design a non-volatile dynamic semiconductor memory which is dense, more versatile and faster than such known memories and which is fabricated by a simple process.
  • the advantages offered by the invention are mainly that it operates at low voltages in the volatile mode and requires less time and low power during data transfer between volatile and non-volatile modes that using an enhanced conduction or silicon-rich insulator, it operates faster than known non-volatile memories, that it can store non-volatilely the previously stored data and also can store any new data in a volatile mode, thereby effectively yielding a double dense memory system, that all volatile data from all cells are preferably transferred to a non-volatile mode in a parallel operation or in one cycle of operation, and that both erasure of non-volatile memory and restoration of volatile data occurs simultaneously for all cells of the system and wherein data is transferred directly from the non-volatile mode to the volatile mode in its true or non-inverted form.
  • improved non-volatile semiconductor memories comprise a one device dynamic volatile memory circuit including a storage capacitor with a plate and a storage node coupled to a non-volatile device including a voltage divider having first and second serially-connected capacitors, with a floating gate being disposed at the common point between the first and second capacitors.
  • the plate of the storage capacitor is connected to a reference voltage source.
  • a control gate is capacitively coupled to the floating gate through the first capacitor which includes a dual charge or electron injector structure.
  • the floating gate is coupled to the storage node through the second capacitor.
  • the capacitance of the first capacitor has a value substantially less than that of the second capacitor.
  • the storage node is formed as an inversion layer.
  • FIG. 1 of the drawings there is shown the circuit diagram of the non-volatile dynamic memory cell of the present invention.
  • This cell includes a storage capacitor C having a storage node 10 in the form of an inversion layer and a plate 12 and an input/output line I/O which may be interconnected by a switching device 14, preferably a field effect transistor.
  • a voltage Vp e.g., +5 volts, is applied to terminal P connected to capacitor plate 12.
  • Voltage divider circuit 16 having serially-connected first and second capacitors C1 and C2, respectively, is connected between the storage node 10 and a terminal C having control voltage V C , e.g., +5 volts, applied thereto, with capacitor C2 having a substantially larger capacitance value than that of capacitor C1.
  • a floating gate identified by terminal FG, is disposed between the first and second capacitors C1 and C2.
  • a parasitic capacitor Cp which is generally present is indicated as being located between the storage node 10 and a semiconductor substrate indicated at S.
  • the first capacitor C1 includes a dual charge or electron injector structure of the type described in the hereinabove cited IEEE Electron Device Letters article.
  • the storage capacitor C s In the normal operation of the circuit or cell of Fig. 1 of the drawings, the storage capacitor C s , the input/output line I/O and the switching device 14 function as a volatile dynamic one device memory cell.
  • the storage capacitor plate 12 When power failure is detected, the storage capacitor plate 12 is ramped to ground while simultaneously the voltage V c at terminal C is pulsed to an appropriate positive voltage, such as +20 volts. As a result of this pulse, a large voltage is developed across the first capacitor C1. If the voltage on the storage node 10 is at 0 volts representing a binary digit "0", the voltage across the capacitor C1 is of sufficient value to charge the floating gate FG in a positive direction.
  • the control terminal C has applied thereto a 0 volt bias, plate 12 has a +5 volt bias and the input/output line I/O is at zero volts with the switch 14 closed. If the floating gate FG is positively charged, then there is sufficient voltage across the second capacitor C2 to transfer electrons into the potential well under the floating gate FG and under the plate 12. As a result, the voltage on the storage node 10 assumes a lower value, e.g., +0.0 volts due to charge storage. If no charge resides on the floating gate FG, no significant charge transfer takes place and hence the voltage on the storage node 10 remains at about +5 volts. The cell is next refreshed as a normal volatile cell, and is now available for normal volatile operation with data now at the same state as that which existed prior to power failure.
  • a P type silicon substrate 18 has an N+ diffusion region 20 forming the input/output or bit/sense line connected to terminal BL, a first potential well PW1 located under floating gate FG and a second potential well PW2 located under the storage capacitor plate 12.
  • the potential wells PW1 and P W2 form the storage node 10.
  • the floating gate FG is separated from the storage node 10 by a thin insulating layer 22 preferably made of silicon dioxide forming the second capacitor C2.
  • the capacitor Cl is formed by the floating gate FG and a first capacitor electrode 24, connected to control terminal C, along with a dual electron injector structure 26 which includes first and second silicon-rich silicon dioxide layers 28 and 30, respectively, separated by a silicon dioxide layer 32.
  • the storage inversion capacitor C s is formed by the capacitor plate 12, an end of which overlaps the floating gate FG, the floating gate FG and the silicon dioxide layer 22.
  • the switching device or transistor 14 is formed by a gate electrode 34, having an end overlapping the floating gate FG, disposed between the bit/sense line diffusion region 20 and the storage node 10 ' and separated from the surface of the silicon substrate 18 by the silicon dioxide layer 22.
  • the gate electrode 34 is connected to a word line terminal WL.
  • Fig. 3 illustrates a 2 x 2 array of non-volatile memory cells of the type shown in Figs. 1 and 2 of the drawings wherein similar elements in the two figures are identified by the same reference characters.
  • the array includes a first word line WL1 to which first and second cells Al and A2 are connected and a second word line WL2 to which a third cell Bl and fourth cell B2 are connected.
  • First and third cells Al and B1 are connected to a first bit line BL1 and the second and fourth cells A2 and B2 are connected to a second bit line BL2.
  • the first and second word lines WL1 and WL2 are connected to word line decoder and driver circuit 36 which may employ conventional circuitry and the first second bit lines BL1 and BL2 are connected to bit line decoder, precharge and sense amplifier circuits 38 which may also utilize conventional circuitry.
  • the control terminal or line C and the capacitor plate terminal or line P are connected to non-volatile write and erase circuits 40, which may be of any known type.
  • a non-volatile memory cell e.g., cell A1
  • the cell performs as a conventional one device storage circuit coupled to the first bit line BL1 and the first word line WL1 and the voltages therein may be those indicated in Fig. 4 of the drawing between times tl and t2, with constant voltages V c and Vp being applied to terminals C and P, respectively, having a magnitude of, say, +5 volts.
  • the voltage on storage node 10 is, say, zero volts and then the voltage on the floating gate FG will be at approximately 1.0 volt.
  • the floating gate is preferably at +3 volts for illustration purposes.
  • applied voltage VB L on the bit/sense line BL and the voltage V FG produced on the floating gate FG are shown in solid lines for stored binary "1” bits and in dashed lines for stored binary "0" bits.
  • the voltage V c on the control terminal C is increased from +5.0 volts to, say, +20.0 volts while the voltage V P at the plate terminal P is reduced from +5.0 volts to, say, 0.0 volts, as indicated in Fig. 4 between times t2 and t3.
  • any charge stored in the potential well PW2 under the storage plate 12 is transferred to the potential well PW1 under the floating gate FG.
  • the storage node voltage V 10 is increased to about +10.0 volts, the floating gate voltage V FG to about +10.0 volts, and, therefore, the voltage V FG - V c across the first capacitor C1 is 10.0 volts, which is insufficient to conduct charging current from floating gate FG to the control terminal C.
  • the voltage across the first capacitor C1 is +13.0 volts which is by design sufficient to significantly alter the charge on the floating gate FG since this voltage is equal to or greater than the turn-on voltage of the dual electron injector structure 26.
  • the floating gate FG of a cell storing a binary "0" now is charged to, say, +3.0 volts after a short period of time ranging from nanoseconds to a few milliseconds and then the voltages V and Vp are removed from the terminals C and P, respectively.
  • the memory When power is again turned on or resumed, the memory can be used in a volatile mode with new data while still storing the non-volatile data in the floating gates, if desired, or the non-volatile data can be restored without erasing the stored data.
  • the voltage V c on the terminal C is increased to +5 volts as is the word line voltage V WL . If a "1" digit has been stored, the bit line voltage will remain at +5 volts, however, if a "0" digit has been stored, the voltage V BL on the bit line BL will decrease, as indicated Fig. 4 between times t6 and t7.
  • Erasure of data from the floating gate FG takes place between times t7 and t8. This is accomplished by pulsing the plate terminal P from +5.0 volts to +20.0 volts so that an effective voltage of +13.0 volts appears across the first capacitor C1 of the binary bit "0" cell and 0.0 volts appears across the first capacitor C1 of the binary bit “1” cell. Since 0.0 volts is insufficient to make the first capacitor or dual electron injector structure C1 conductive, no change occurs for the cell storing the previous binary bit "1". Since +13.0 volts is sufficient to conduct through the first capacitor Cl, the floating gate FG of the cell storing the previous binary "0" will lose the +3.0 volt charge, thereby lowering the voltage.
  • the voltage on the plate terminal P is now returned to +5.0 volts, and the cell is refreshed in its normal manner to restore voltages to the storage nodes 10 having full values representing "1" and "0" binary digits.
  • the signal levels between a binary "1" and “0" are independent of the amount of charge stored on the floating gate, as long as the floating gate. has sufficient charge to invert the underlying potential well PW1 between times t4 and t5 on the pulse program of Fig. 4.
  • the signal level at the sense amplifier is about 1 volt for 5 volts on the plate 12 and a 0.2 transfer ratio between the storage node capacitance and the total bit line capacitance.
  • control terminal C may be pulsed negatively to erase.
  • each of the cells A1, A2, Bl and B2 illustrated in the system illustrated in Fig. 3 of the drawings may be operated in accordance with the illustrative pulse program shown in Fig. 4.
  • cell Al is operated by selecting word line WL1 and bit/sense line BL1
  • cell A2 is operated by selecting word line WL1 and bit/sense line BL2
  • cell B1 is operated by selecting word line WL2 and bit/sense line BL1
  • cell B2 is operated by selecting word line WL2 and bit/sense line BL2.
  • the voltages V c and Vp are produced in non-volatile write and erase circuits 40, which may be provided on-chip or by the system using this memory, and are applied to control terminal C and storage capacitor plate terminal P which are common to all cells Al, A2, Bl and B2.
  • the cells may be fabricated by any known techniques but it is preferred that the floating gate FG be made from a first layer of doped polysilicon and that the storage capacitor plate 12, the first capacitor electrode 24 and the gate electrode 34 of Fig. 2 be made from a second layer of doped polysilicon. Also, an N type semiconductor substrate may be used instead of the P type substrate, with the polarity of the voltages being opposite to those used in the illustrated examples mentioned hereinabove.
  • An improved non-volatile dynamic semiconductor memory has been described hereinabove which does not produce data in inverted form when it is transferred from the non-volatile mode and which can operate normally at the high speeds known in random access memories, yet which will not lose its data when a power failure occurs.
  • the cells may retain their previously stored data in a non-volatile structure while new data is being handled in a volatile storage circuit.
  • Volatile circuit data from either a field effect transistor or bipolar device circuit, is retained in a non-volatile device with the use of lower voltages dissipating only a very small amount of power and with faster data transfer times between the volatile circuitry and the non-volatile device or structure.
  • the process for making the memory of the present invention is simpler than that used to make, e.g., MNOS devices and the memory of the present invention uses substantially lower writing power levels than is required in floating gate devices written by hot electrons.

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  • Read Only Memory (AREA)
  • Dram (AREA)
  • Non-Volatile Memory (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Memories (AREA)
EP82111116A 1981-12-31 1982-12-02 Cellule RAM dynamique non-volatile Expired EP0083418B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/336,247 US4446535A (en) 1981-12-31 1981-12-31 Non-inverting non-volatile dynamic RAM cell
US336247 1994-11-07

Publications (3)

Publication Number Publication Date
EP0083418A2 true EP0083418A2 (fr) 1983-07-13
EP0083418A3 EP0083418A3 (en) 1986-04-16
EP0083418B1 EP0083418B1 (fr) 1988-10-26

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EP82111116A Expired EP0083418B1 (fr) 1981-12-31 1982-12-02 Cellule RAM dynamique non-volatile

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US (1) US4446535A (fr)
EP (1) EP0083418B1 (fr)
JP (1) JPS58118092A (fr)
DE (1) DE3279165D1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0176714A2 (fr) * 1984-09-27 1986-04-09 International Business Machines Corporation Cellule de mémoire mémorisant des données logiques sous forme volatile et non volatile
EP0259158A2 (fr) * 1986-09-05 1988-03-09 AGENCY OF INDUSTRIAL SCIENCE & TECHNOLOGY MINISTRY OF INTERNATIONAL TRADE & INDUSTRY Mémoire non-volatile à semi-conducteurs à accès aléatoire
EP0393737A2 (fr) * 1989-03-31 1990-10-24 Koninklijke Philips Electronics N.V. Mémoires à semi-conducteur électrique programmables
GB2235088A (en) * 1989-08-17 1991-02-20 Samsung Electronics Co Ltd Nonvolatile semiconductor memory device
WO1993011540A1 (fr) * 1991-11-26 1993-06-10 Purdue Research Foundation Dispositif a memoire a acces selectif remanente

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4665417A (en) * 1984-09-27 1987-05-12 International Business Machines Corporation Non-volatile dynamic random access memory cell
US4729115A (en) * 1984-09-27 1988-03-01 International Business Machines Corporation Non-volatile dynamic random access memory cell
KR100389130B1 (ko) * 2001-04-25 2003-06-25 삼성전자주식회사 2비트 동작의 2트랜지스터를 구비한 불휘발성 메모리소자
JP2005064427A (ja) * 2003-08-20 2005-03-10 Elpida Memory Inc 不揮発性ランダムアクセスメモリおよびその製造方法
US7816722B2 (en) * 2004-02-04 2010-10-19 Hewlett-Packard Development Company, L.P. Memory array
US8064255B2 (en) * 2007-12-31 2011-11-22 Cypress Semiconductor Corporation Architecture of a nvDRAM array and its sense regime

Citations (2)

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US4030083A (en) * 1975-04-04 1977-06-14 Bell Telephone Laboratories, Incorporated Self-refreshed capacitor memory cell
US4175291A (en) * 1976-08-16 1979-11-20 Ncr Corporation Non-volatile random access memory cell

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US3676717A (en) * 1970-11-02 1972-07-11 Ncr Co Nonvolatile flip-flop memory cell
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US4388704A (en) * 1980-09-30 1983-06-14 International Business Machines Corporation Non-volatile RAM cell with enhanced conduction insulators
US4363110A (en) * 1980-12-22 1982-12-07 International Business Machines Corp. Non-volatile dynamic RAM cell
JPS6233672A (ja) * 1985-08-07 1987-02-13 Ricoh Co Ltd ２色感熱記録材料

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US4030083A (en) * 1975-04-04 1977-06-14 Bell Telephone Laboratories, Incorporated Self-refreshed capacitor memory cell
US4175291A (en) * 1976-08-16 1979-11-20 Ncr Corporation Non-volatile random access memory cell

Non-Patent Citations (2)

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IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, vol. 24, February 1981, pages 148-149, IEEE, New York, US; J. DRORI et al.: "A single 5V supply nonvolatile static RAM" *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0176714A2 (fr) * 1984-09-27 1986-04-09 International Business Machines Corporation Cellule de mémoire mémorisant des données logiques sous forme volatile et non volatile
EP0176714A3 (en) * 1984-09-27 1987-10-14 International Business Machines Corporation Memory cell storing logic data in volatile and non-volatile forms
EP0259158A2 (fr) * 1986-09-05 1988-03-09 AGENCY OF INDUSTRIAL SCIENCE & TECHNOLOGY MINISTRY OF INTERNATIONAL TRADE & INDUSTRY Mémoire non-volatile à semi-conducteurs à accès aléatoire
EP0259158A3 (fr) * 1986-09-05 1992-01-02 AGENCY OF INDUSTRIAL SCIENCE & TECHNOLOGY MINISTRY OF INTERNATIONAL TRADE & INDUSTRY Mémoire non-volatile à semi-conducteurs à accès aléatoire
EP0393737A2 (fr) * 1989-03-31 1990-10-24 Koninklijke Philips Electronics N.V. Mémoires à semi-conducteur électrique programmables
EP0393737A3 (fr) * 1989-03-31 1991-01-30 Koninklijke Philips Electronics N.V. Mémoires à semi-conducteur électrique programmables
GB2235088A (en) * 1989-08-17 1991-02-20 Samsung Electronics Co Ltd Nonvolatile semiconductor memory device
GB2235088B (en) * 1989-08-17 1993-07-14 Samsung Electronics Co Ltd Nonvolatile semiconductor memory device and manufacturing method thereof
WO1993011540A1 (fr) * 1991-11-26 1993-06-10 Purdue Research Foundation Dispositif a memoire a acces selectif remanente
KR100304248B1 (ko) * 1991-11-26 2001-11-22 시. 에릭 헌터 비소멸성임의접근메모리(nvram)디바이스,이디바이스에데이터를저장하는방법및이디바이스를갖는메모리장치

Also Published As

Publication number Publication date
EP0083418B1 (fr) 1988-10-26
US4446535A (en) 1984-05-01
DE3279165D1 (de) 1988-12-01
JPS58118092A (ja) 1983-07-13
JPH0154796B2 (fr) 1989-11-21
EP0083418A3 (en) 1986-04-16

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