EP0082051B1 - Verfahren zur Herstellung einer Kühlvorrichtung - Google Patents

Verfahren zur Herstellung einer Kühlvorrichtung Download PDF

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Publication number
EP0082051B1
EP0082051B1 EP82402215A EP82402215A EP0082051B1 EP 0082051 B1 EP0082051 B1 EP 0082051B1 EP 82402215 A EP82402215 A EP 82402215A EP 82402215 A EP82402215 A EP 82402215A EP 0082051 B1 EP0082051 B1 EP 0082051B1
Authority
EP
European Patent Office
Prior art keywords
mandrels
support
windings
base support
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP82402215A
Other languages
English (en)
French (fr)
Other versions
EP0082051A2 (de
EP0082051A3 (en
Inventor
René Dassonville
Philippe Bauchet
Eugène Borget
Gildas Laudren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to AT82402215T priority Critical patent/ATE24818T1/de
Publication of EP0082051A2 publication Critical patent/EP0082051A2/de
Publication of EP0082051A3 publication Critical patent/EP0082051A3/fr
Application granted granted Critical
Publication of EP0082051B1 publication Critical patent/EP0082051B1/de
Expired legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a method for producing a cooling device comprising a base support and at least one coil with non-contiguous turns of wire of good thermal conductivity, fixed to the support by a weld metal.
  • the cooling device obtained by this process ensures good thermal coupling between a member to be cooled and the ambient medium and applies in particular to electrical components with high heat dissipation.
  • cooling devices are associated with a forced air generator which increases cooling by forced convection.
  • the cooling of a traveling wave tube is a typical example of an application using such means.
  • the known cooling devices used for such applications are generally so-called "spike" radiators and include a base support pian on which many small cylindrical elements are arranged perpendicular to this support.
  • alloys with good thermal conductivity generally have poor flowability, which leads to a reduction in the length of the pins and their distribution density, thereby limiting the contact surface with the cooling fluid.
  • the molten metal tends to cool before reaching the bottom of the mold cavities if they are deep and of small section; moreover, during the demoulding, certain pins break and remain inside the mold.
  • the need to be able to demold limits the forms that a radiator can have, the base of which is, therefore, generally planar, the pins being perpendicular to this base. To these drawbacks are added the high cost of a mold and the difficulties encountered in obtaining modifications of the characteristics of the radiator.
  • Milling in the mass introduces a significant loss of material and requires a relatively long execution time.
  • the pins tend to bend in the direction where the tool attacks the metal; to limit this deflection, the pins must be short, of large section and consequently few in number, which limits the performance of the device.
  • the milling technique is also ill-suited to mass production.
  • each spike is placed in a blind hole made in the support, the pins and the support being previously tinned. The whole is brought to the melting temperature of the tin and then cooled. The pins are thus welded to the support.
  • the assembly technique requires a long execution time and is not compatible with the requirements of mass production.
  • the invention therefore aims to provide a simple method of this type ensuring a correct and reproducible position of the windings on the support, and lending itself to automation.
  • FIG. 1 illustrates an example of a radiator with pins according to the known art, as it could be obtained by a molding or assembly technique.
  • the pins 2 secured to a flat base support 1 are, for the clarity of the figure shown with a low density of distribution.
  • the edge to edge distance between two pins and the diameter of said pins are of the same order of magnitude.
  • FIG. 2 represents a first variant of the device obtained by the method according to the invention.
  • Wire of good thermal conductivity in this example tinned copper wire, is wound with non-contiguous turns on a mandrel with rectangular section.
  • the rectangle constituting the section of the mandrel has, in this preferred variant, short sides of length substantially greater than the diameter of the wire and long sides of length equal to approximately fifteen times said diameter. For the clarity of the drawing these proportions are not exactly respected.
  • FIG. 3 represents a second variant of the device obtained by the method according to the invention.
  • the sets 5 of turns 6 are obtained by winding tinned copper wire on mandrels of triangular section.
  • Each set 5, arranged parallel to the long sides of the support 1, has its evenings 6 partly engaged between the turns of the sets 5 which are adjacent to it.
  • For each of the turns 6, one side of the triangle ensures contact over its entire length with the base support 1.
  • Each turn is situated in a plane perpendicular to the support 1 and fixed to the latter by a filler metal with a low melting point. (tin, lead-tin alloy).
  • the mandrels of triangular section must be eliminated before the positioning of the assemblies 5 on the support 1.
  • the assemblies 5 are placed, in the nested position, in the cavities 'a positioning support before being brought closer to the base support 1. The positioning support is removed after fixing the turns 6 on the support 1.
  • FIG. 4 presents a step in a method allowing two cooling devices to be produced simultaneously.
  • a first device is produced according to the method described for the first variant corresponding to FIG. 2.
  • a second base support 7 bearing on the other short side of the turns is superimposed on the first base support 1.
  • the second support 7 is subjected to a thermal cycle which makes it integral with the turns by melting a filler metal.
  • the mandrels are eliminated and FIG. 4 illustrates the device obtained at this stage.
  • the space between the supports 1 and 7 comprising the turns is filled with wax or another product which can be solidified at room temperature.
  • the assembly After hardening of the wax, the assembly is cut along a plane parallel to the supports 1 and 7, located midway between these two supports and represented in FIG. 4 by the two orthogonal 8 and 9.
  • the wax is removed by elevation temperature and the two cooling devices obtained constitute so-called "spike" coolers.
  • the invention is not limited to the three variant embodiments which have just been described. It is indeed possible to act separately or in combinations on numerous parameters such as the nature of the wire, the shape and the value of its section, the shape and the size of the turns; the turns can, after fixing, be opened and the filiform elements take any desired configuration.
  • the density of distribution of the filiform elements can be modulated by varying the pitch of the turns, the distance between the sets of turns, the dimension of the turns and the section of the wire of each of the sets of turns in order to optimize the performance in each case. of application.
  • the material, shape and dimensions of the support can also contribute to this optimization.
  • the manufacturing method of the cooling device described above has the advantages of not requiring any elaborate and expensive tooling and of making it possible to obtain more efficient radiators (longer, thinner, more numerous filiform elements) than by known techniques. .
  • this process is suitable for the installation of filiform elements on supports of any shape (not necessarily planar) and easily lends itself to the production of radiators made "on demand" (non-standardized products). Finally, it easily lends itself to mass production and makes it possible to reduce the cost of cooling devices.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • General Induction Heating (AREA)
  • Thermistors And Varistors (AREA)
  • Wire Processing (AREA)

Claims (8)

1. Verfahren zur Herstellung einer Kühlvorrichtung mit einem Basisträger (1) und mindestens einer Spirale (4) aus sich nicht berührenden Windungen (3) gut wärmeleitenden Drahts, die durch ein Lötmetall am Träger befestigt ist. welches die folgenden Verfahrensschritte aufweist:
- Aufwickeln einer Schicht dieses Drahts auf Dorne,
- Befestigung der Dorne mit ihren Enden auf einem Rahmen,
- Anbringen des Rahmens und der Dorne auf dem Basisträger (1), so daß alle Windungen mit dem Träger in Verbindung stehen,
- Befestigung der Windungen (3) auf dem Basisträger (1) mittels eines Lötmetalls,
- Entfernen des Rahmens und der Dorne nach der Befestigung der Windungen.
2. Hersteilungsverfahren nach Anspruch 1, nach dem
- die Anordnung der Dorne auf dem Träger (1) und auf einem zweiten Basisträger (7) parallel zu ersten derart geschieht, daß jede Windung mit beiden Trägern in Kontakt steht,
- die Windungen auf den beiden Basisträgern mithilfe eines Lötmetalls niedrigen Schmelzpunkts befestigt wird und dir Dorne entfernt werden,
- die erhaltene Einheit gemäß einer Ebene zerschnitten wird, die parallel zu den Basisträgern liegt und sich in der Mitte zwischen diesen beiden Trägern befindet, so daß gleichzeitig zwei Kühlvorrichtungen hergestellt werden.
3. Herstellungsverfahren nach Anspruch 2, das außerdem nach der Stufe des Entfernens des Rahmens und der Dorne eine Stufe aufweist, in der der Zwischenraum zwischen den beiden Trägern, in dem sich die Windungen befinden, mit einem bei Umgebungs temperatur härtbaren Produckt gefüllt wird, um das Zerschneiden der beiden erhaltenen Kühlvorrichtungen zu erleichtern, wobei dieses Produkt durch Erhöhen der Temperatur entfernt wird.
4. Verfahren nach Anspruch 1, bei dem die Form der Dorne so gewählt wird, daß rechtwinklige Windungen erhalten werden, wobei die großen Seiten jeder rechtwinkligen Windung (3) senkrecht zum Basisträger liegen.
5. Verfahren nach Anspruch 1, bei dem die Form der Dorne so gewählt wird, daß dreieckige Windungen erhalten werden, wobei jede dreiekkige Windung sich in einer zum Basisträger senkrechten Ebene befindet und eine der Seiten der Windung mit dem Träger in Kontakt steht.
6. Verfahren nach einem der vorhergehenden Ansprüche, bei dem der Basisträger (1 aus Kupfer ist.
7. Verfahren nach einem beliebigen der vorhergehenden Ansprüche, bei dem der Draht aus Kupfer und von kreisförmigem Querschnitt ist.
8. Verfahren nach einem beliebigen der vorhergehenden Ansprüche, bei dem das Lötmetall mit niedrigem Schmelzpunkt Zinn oder eine Blei-Zinn-Legierung ist.
EP82402215A 1981-12-11 1982-12-03 Verfahren zur Herstellung einer Kühlvorrichtung Expired EP0082051B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT82402215T ATE24818T1 (de) 1981-12-11 1982-12-03 Verfahren zur herstellung einer kuehlvorrichtung.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8123212A FR2518357A1 (fr) 1981-12-11 1981-12-11 Procede de realisation d'un dispositif de refroidissement a elements filiformes pour composant electronique et dispositif de refroidissement ainsi obtenu
FR8123212 1981-12-11

Publications (3)

Publication Number Publication Date
EP0082051A2 EP0082051A2 (de) 1983-06-22
EP0082051A3 EP0082051A3 (en) 1984-01-11
EP0082051B1 true EP0082051B1 (de) 1987-01-07

Family

ID=9264935

Family Applications (1)

Application Number Title Priority Date Filing Date
EP82402215A Expired EP0082051B1 (de) 1981-12-11 1982-12-03 Verfahren zur Herstellung einer Kühlvorrichtung

Country Status (4)

Country Link
EP (1) EP0082051B1 (de)
AT (1) ATE24818T1 (de)
DE (1) DE3275053D1 (de)
FR (1) FR2518357A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19623677A1 (de) * 1996-06-14 1997-12-18 Univ Dresden Tech Geräteschrank für elektrische und elektronische Systeme
DE10140328A1 (de) * 2001-08-16 2003-04-03 Siemens Ag Kühleinrichtung zur Kühlung elektronischer Bauelemente, Kühlkörper für eine solche Kühleinrichtung und Anwendung einer solchen Kühleinrichtung

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5158136A (en) * 1991-11-12 1992-10-27 At&T Laboratories Pin fin heat sink including flow enhancement
FR2913765B1 (fr) * 2007-03-16 2012-08-10 Pierre Vironneau Nappe de circulation de fluide, procede pour realiser une telle nappe et utilisation de telles nappes pour la realisation d'un echangeur thermique
NL2019792B1 (en) * 2017-10-24 2019-04-29 Micro Turbine Tech B V Heat exchanger comprising a stack of cells and method of manufacturing such a heat exchanger
SE1730353A1 (sv) * 2017-12-28 2019-06-29 Andersson Inge Kylanordning

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB692885A (en) * 1949-12-28 1953-06-17 Brown Fintube Co Improvements in the manufacture of heat exchangers
US2879041A (en) * 1956-10-15 1959-03-24 Rca Corp Heat radiator
DE1132883B (de) * 1957-01-30 1962-07-12 Franciscus Roffelsen Verfahren zum Herstellung von Waermeaustauschelementen
FR1511618A (fr) * 1966-12-19 1968-02-02 Chausson Usines Sa Procédé pour la fabrication de dissipateurs de chaleur du type à fils et dissipateur en résultant

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19623677A1 (de) * 1996-06-14 1997-12-18 Univ Dresden Tech Geräteschrank für elektrische und elektronische Systeme
DE19623677C2 (de) * 1996-06-14 1999-09-16 Knuerr Mechanik Ag Geräteschrank für elektrische und elektronische Systeme
DE10140328A1 (de) * 2001-08-16 2003-04-03 Siemens Ag Kühleinrichtung zur Kühlung elektronischer Bauelemente, Kühlkörper für eine solche Kühleinrichtung und Anwendung einer solchen Kühleinrichtung
DE10140328B4 (de) * 2001-08-16 2006-02-02 Siemens Ag Kühlanordnung zur Kühlung elektronischer Bauelemente

Also Published As

Publication number Publication date
DE3275053D1 (en) 1987-02-12
ATE24818T1 (de) 1987-01-15
EP0082051A2 (de) 1983-06-22
EP0082051A3 (en) 1984-01-11
FR2518357B3 (de) 1984-12-14
FR2518357A1 (fr) 1983-06-17

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