EP0055316B1 - Galvanisiervorrichtung - Google Patents

Galvanisiervorrichtung Download PDF

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Publication number
EP0055316B1
EP0055316B1 EP80304774A EP80304774A EP0055316B1 EP 0055316 B1 EP0055316 B1 EP 0055316B1 EP 80304774 A EP80304774 A EP 80304774A EP 80304774 A EP80304774 A EP 80304774A EP 0055316 B1 EP0055316 B1 EP 0055316B1
Authority
EP
European Patent Office
Prior art keywords
mask
air
plating
plating solution
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP80304774A
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English (en)
French (fr)
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EP0055316A1 (de
Inventor
Kouichi Shimamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sonix Co Ltd
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Sonix Co Ltd
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Filing date
Publication date
Application filed by Sonix Co Ltd filed Critical Sonix Co Ltd
Priority to EP80304774A priority Critical patent/EP0055316B1/de
Priority to DE8080304774T priority patent/DE3070493D1/de
Publication of EP0055316A1 publication Critical patent/EP0055316A1/de
Application granted granted Critical
Publication of EP0055316B1 publication Critical patent/EP0055316B1/de
Expired legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Definitions

  • This invention relates to electroplating apparatus wherein an accurate plating can be carried out on a partitive work surface.
  • any one of the above three Patents C, D and E has no mask.
  • jetting of the plating solution is such as to be accumulated locally on a work surface by means of a suction air flow, velocity of the plating solution itself and its condensation respectively. Therefore, a high speed jetting of the solution is basically impossible. And a larger current density is not obtained. Since either one of the above three Patents has no special means (e.g. a mask) for forming a clear profile of the plated part, a certain blur of the plating solution is produced and the thickness of the plated part is not formed uniformly.
  • This invention as claimed is intended to remove the above disadvantages.
  • This invention provides an electroplating apparatus wherein an accurate plating can be carried out on a localized work surface.
  • the plating apparatus comprises a mask having an opening at its center, a nozzle for jetting a plating solution which is mounted so as to be directed to the opening of the mask, and a casing for covering a closed space enclosed by the mask and the nozzle, characterized in that the mask is closely contacted with a work surface so that the opening of the mask is identical with a profile of a partitive spot on the work surface, the case is provided with fluid discharge means to maintain a negative air pressure within the closed space and the mask is provided with outer air induction means to introduce the outer air into the closed space, and the solution is prevented by the introduced air flow from permeating between the work surface and the mask surface respectively.
  • the electroplating apparatus of this invention is to save greatly an increasing consumption of the plating solution by reproducing the used plating solution by a recycling system.
  • a flow Ni of metal ion in a plating solution i is the sum of the ion movement by electric field, diffusion due to variation of the metal ion concentration in the proximity of an electrode and the ion convection in proportion to the flow velocity of the plating solution.
  • the variation of the metal ion concentration in the proximity of metal ion restrains a reaction speed makes worse the current efficiency.
  • a task of this invention is to eliminate the inconvenience of diffusion of the plating solution and to treat a smaller work surface with an immediate plating. According to a remarkable aspect of this invention, the plating solution is high-speedily collided with a work surface, but the used plating solution is immediately discharged together with a suctioned air.
  • an accurate plating can be carried out on a partitive work surface by contacting closely the mask therewith. Then, a profile of a plated part becomes very clear.
  • This plating process may make it possible to carry out a stripping operation due to inversion of voltage applied to an electrode.
  • the current density of several thousand Ampers/dm 2 has been obtained by using a plating solution of a few Ampers/dm 2 whereby the quality of the plated part was satisfactory.
  • Numeral 1 is a work surface and numeral 2 is a nozzle for jetting a plating solution.
  • Numeral 3 is a mask having an opening at its center. The mask 3 contacts closely the work surface 1 and is positioned between the work surface 1 and the nozzle 2. The nozzle 2 is mounted so as to be directed to the opening of the mask 3. The nozzle 2 and the mask 3 are covered by a casing 4. Thus, a closed space 5 is formed by the work surface 1, the nozzle 2, the mask 3 and the casing 4 respectively.
  • the casing 4 is provided, at one end thereof, with fluid discharge means 6 for discharging an outer air and a used plating solution by driving means (not illustrated in Fig. 1).
  • the mask 3 is made of a rigid material having a mechanical strength, a wear resistance and an insulation property. So that the localized plating may be carried out due to a close contact of the mask 3 with the work surface, a profile of the mask 3 must be worked accurately.
  • the mask is made of a ceramic material, a glass or the like.
  • the mask which is disclosed in other examples of this invention is also made of such a material.
  • the maximum rate of the flow velocity in the nozzle 2 is on its center axis whereas the minimum rate thereof is on a wall of the nozzle tube.
  • the flow velocity distribution forms a parabola.
  • the flow velocity is dependent upon the electric current density of plating. So as to satisfy the rate of it is possible to set the flow velocity distribution within a predictable given rate. That is to say, the distribution of the electric current is to be set within a given rate.
  • the nozzle 2 may be of a positive electrode. Then, the Ohm loss of the flow becomes minimum along the wall of the nozzle 2 tube, while it becomes maximum on a center axis of the nozzle 2. Forthis reason, the current density is distributed uniformly.
  • the function of the mask 3 brings about a uniform plating thickness. Further, owing to the function of the outer air induction means 7 of the mask 3, the plating solution is prevented from permeating into the works surface 1 and the mask 3 surface, thereby a clear profile of the plated part being obtained.
  • Fig. 1 Since an example of Fig. 1 is based on a jetting type plating, a diffusion layer arising between a solid phase and a liquid phase becomes extremely thin. However, as soon as the plating solution collides with the work surface 1, the used plating solution is discharged from the discharge opening 6 and it is considered that the boundary between the solid phase and the liquid phase is of a fresh liquid phase. For this reason, the diffusion layer of the plating solution is almost all suctioned and the ion density becomes uniform.
  • an electrolytic column is formed, so that a constant current value is obtained due to the Ohms's Law. This causes to stabilize the metal deposition rate and brings about a high-quality plating.
  • productivity of a single nozzle is rather low, so that it is much more advantageous to mount a plurality of nozzles.
  • a layout technique of a plurality of nozzles will be described in detail hereinafter.
  • the plating quality, plating time, current density, plate thickness, etc are seriously affected because of any flow unbalance of the plating solution, any defect of the plating solution and air discharge, or any unbalance between the two electrodes. It is necessary to adjust a distance between the two electrodes.
  • nozzle 2 is fixed with the casing 4 by a screw 8 and two fixing members 9, 10.
  • the casing 4 is provided with threads 11 so as to engage with the screw 8.
  • a distance A is from a front end of the nozzle 2 to a back end of the screw 8 and a distance B is from the work surface 1 to a back end of the casing 4, a distance I is between the nozzle 2 end and the work surface 1, i.e. the two electrodes.
  • the distance C becomes an adjusting value by adjusting the screw 8.
  • the value C is readable by calipers.
  • a back end of the nozzle 2 in Fig. 1 is connected with a plating solution tank (not illustrated in Fig. 1
  • both the mask 3 and the casing 4 are treated with thread cutting.
  • a preferred shape of mask can be selected at one's option so as to comply with respective profiles.
  • a work surface 20 is curved.
  • a curved work surface 20 shows for example a surface of an electric contact member.
  • Numeral 21 is a first mask.
  • the outer air induction means forms a gap 22 between the first mask 21 side and a member 20 to be plated, and the member 20 is inserted into the mask 21 opening.
  • Numeral 23 is a second mask of which opening area is nearly equivalent to the opening area of a nozzle 24.
  • a front end of the nozzle 24 has such a curved shape as to be similar to the curved work surface 20, whereby any distance between the two electrodes is to be approximately equal in any direction.
  • the plating solution jetted from the nozzle 24 collides with the member 20. After collision, the plating solution is discharged immediately from a discharge opening (not illustrated) just as shown in the example of Fig. 1.
  • a certain outer air is introduced from the gap 22 into the mask inside. Thus, a certain air flow is formed, whereby the plating solution is prevented from permeating into the mask surface as well as into the outer air.
  • the aim of this invention is accomplished.
  • Figs. 3 and 4 show other examples of the mask.
  • the mask 30 has a first air channel 31 and a second air channel 34. Between the two channels 31 and 34 is formed an air retaining recess 33 into which a highly pressurized air or inert gas may be supplied and retained.
  • the first air channel 31 is, at its inlet, provided with a pipe (not illustrated) to feed such inert gas into the mask side. Further, it comprises an air cleaner and a turbo charger, both of which are illustrated in Fig. 3.
  • the mask 30 may float upon the work' surface 35 due to the introduced inert gas or the like. And the mask and the nozzle as well may move freely on the work surface 35. Therefore, for example, a continuous band-type plating (a so- called stripe plating) or a plating for describing writing letters can be achieved.
  • the inert gas is very effective in case the plating solution acutely reacts to carbonic acid gas or oxygen contained in the air.
  • annular recess 42 is formed in the vicinity of a mask 40 opening and associated with an air passage 41 mounted in the mask 40.
  • a closed space inside the mask 40 is maintained with a negative pressure as shown in Fig. 1.
  • the air quantity to be supplied is determined by a diameter of the passage 41 and the negative pressure. And, the flow velocity of the plating solution to be jetted from the nozzle 44 is stabilized more. Further, when mounting an 0- ring or the like on the outer side of the annular recess 42, the contact of the recess 42 with the work surface 43 is becoming closer.
  • Figs. 5a and 5b are plan views of the example of Fig. 4 wherein there are shown a plurality of channels for introducing the outer air.
  • Fig. 5a there is shown a hole 50 provided at a center of the mask 40, wherein a plurality of channels 51 are formed radially.
  • Fig. 5b is another example, wherein a plurality of channels 53 are formed along a circumference of the hole 52.
  • the outer air flows easily into the hole 52 along its circumference.
  • the turbulent effect of the plating solution collided with the work surface is more effective than that in the example of Fig. 5a.
  • Fig. 6 shows an example of a plating apparatus - having a single system of one nozzle and one mask, although a plurality of nozzles and masks can be arranged.
  • Mask-nozzle means 61 is linked with a plating solution tank 62 by way of a pipe 62'.
  • the pipe 62' comprises an electromagnetic valve 63 for ON/OFF jetting of the plating solution, an adjusting valve 64 for adjusting flow of the plating solution, a purifying water tank 65 and a switching valve 66 to be switched to the plating solution tank 62.
  • a suction means 67 is linked with air-liquid separating means 68 which is connected to the mask-nozzle means 61 by way of a pipe 68'.
  • the pipe 68' comprises an adjusting valve 69 for adjusting a negative pressure of the mask-nozzle means 61 and a release valve 70 for releasing a negative pressure of the mask-nozzle means 61.
  • the air-liquid separating means 68 is connected to a tank 71 for storing a plating solution. Further, between the air-liquid separating means 68 and the plating solution tank 71 are mounted a valve 72 interlocked with the release valve 70, a waste water tank 73 and a switching valve 74 to be switched to the plating solution tank 71.
  • the plating solution recovered by the tank 71 is returned to the upper tank 62 by actuating a feeding pump 75.
  • Numeral 77 is an air compressor, numeral 78 a tank for reserving a highly pressurized air and numeral 79 a valve for adjusting pressure.
  • the highly pressurized air is introduced to the plating solution tank 62.
  • Numeral 80 is a pressure adjusting valve of the plating solution tank 62.
  • the plating solution tank 62 is kept under a high pressure.
  • the switching valve 76 is released and the plating solution is supplied to the tank 62.
  • the valve 76 is closed, the plating solution is such that it is returned to the tank 71.
  • Numeral 82 is a heater for keeping the plating solution at a desired temperature.
  • Numeral 83 is a power source circuit for supplying electric power of a mutually opposing polarity to a partitive spot upon the work surface and to the nozzle.
  • Numeral 84 is a timer for controlling the plating time.
  • Numeral 85 is a control section of the electromagnetic valve 63 or the like.
  • the valves 70, 72 are closed and due to the function of a suction means 67 there arises a negative pressure within the mask-nozzle means 61.
  • the work surface 60 is thus closely contacted with the mask-nozzle means 61.
  • the plating solution is jetted high-speedily because the plating solution tank 62 is kept under a high pressure by means of the air compressor 77.
  • the plating solution collided with the work surface 60 and the outer air introduced into the mask-nozzle means 61 are separated from each other by means of the air-liquid separating means 68.
  • the plating solution remains somewhat in a form of mists in the air suctioned by the suction means 67, so that the air discharged from the suction means 67 is discharged to the plating solution tank 71, thereby the whole of the plating solution being returned thereto.
  • the valve 63 When the power source 83 is turned to "OFF" by a timer, the valve 63 is closed, subsequently the valves 70, 72 being opened and communicated to the outer air. In this case, a negative pressure within the mask-nozzle means 61 will diminish and the pressure therewithin is identical with the outer air pressure. Accordingly, a close contact of the work surface 60 with the mask-nozzle means 61 is lost whereby it becomes possible to remove easily the work surface 60 from the mask-nozzle means 61. All of the plating solution separated in the air-liquid separating means 68 are returned to the plating solution tank 71 by way of the one-way valve 74.
  • the highly-pressurized plating solution to be fed from the feeding pump 75 is supplied to the plating solution tank 62.
  • the flow velocity of each mask-nozzle means 61 is not uniform.
  • the jetting quantity from the nozzle is to be adjusted by adjusting the valve 64 and the flow velocity of the plating solution from each nozzle is to be adjusted by adjusting a negative pressure of the mask-nozzle means by means of the valve 69.
  • the pressure and flow control is carried out at section of the piping. Further, the flow velocity of the mask-nozzle means 61 can be controlled by a baffer plate (not illustrated) which is located between the mask-nozzle means 61 and the air-liquid separating means 68.
  • Any unbalanced flow velocity of the plating solution varies the current density.
  • the plating apparatus as disclosed in the example of Fig. 6 is characterized in that the plating solution is recycled prefectly. Therefore, there exists neither outside leakage of the plating solution nor adhesion thereof to the plating means.
  • Fig. 7 is an example of a plating solution tank 90 which is positioned, in view of potential energy, above a mask-nozzle means (not illustrated) in lieu of the arrangement of the plating solution tank 62, the air compressor 77 and the highly-pressurized air tank 78.
  • the plating solution tank 90 is divided into two tanks 91, 92. Like the example of Fig. 6, the tank 91 is connected to the mask-nozzle means and the tank 92 is to store temporarily the plating solution overflowing from the tank 91. The overflowing plating solution is returned to a lower plating solution tank 94 by way of a return pipe 93 connected to the bottom of the tank 92. Numeral 95 is a pump for feeding the plating solution.
  • the above description is different from the example of Fig. 6, and the operation of the device in Fig. 7 is the same as that in Fig. 6.
  • the velocity of the plating solution is decided by adjusting appropriately a distance H of the potential energy.
  • Fig. 8 has neither the tank 62 nor the tank 90.
  • the plating solution is supplied directly to the mask-nozzle means 101 by means of the feeding pump 100.
  • the plating solution is supplied to the mask-nozzle means 101 by way of a flow adjusting valve 103 by operating a switch valve 102.
  • the plating solution is returned to the tank 104 by switching the switch valve 102.
  • the flow adjusting valve 103 is provided to adjust a jetting velocity from the nozzle.
  • An excessive quantity of the plating solution is returned to the tank 104 by way of a pipe 105.
  • the other structure is the same as that in Fig. 6.
  • a power source for plating When doing a plating treatment by the mask-nozzle means in Fig. 1, a certain resistance is in series connected to the nozzle 2. And when observing the voltage decrease of both ends of the resistance with a synchroscope or the like, a certain voltage rate for time is observed. For this reason, a timing of ON-OFF switching of the power source is selected at option.
  • Figs. 9a, 9b, 9c and 9d show relationships of the jetting time of the plating solution with the plating electric current. Either one of the five examples disclosed in Fig. 9 can be selected, so that a design of the control circuit for the power source can be made as one desires.
  • Figs. 10 and 11 show respective relationship of the flow velocity of the plating solution with the electric current density wherein the plating solution is used in the example of Fig. 1.
  • This plating solution is an ordinary acidic gold plating solution which appears on the market, and its gold density is low, i.e. 8 gl.
  • a relationship of the flow velocity of the plating solution with the electric current density is of a completely straight line type, but the inclination of this straight line is varied by a metal concentration and temperature of the plating solution, a voltage rate of the power source, etc.
  • the efficiency of the electric current is perfectly maintained by those values. Therefore, when the current efficiency is worsened, the straight line in Fig. 10 is lost, then a non- straight line area arises and the finished plated surface shows a phenomenon of burning.
  • a jetted plating solution column has a perfect electric resistance.
  • Fig. 11 shows, on the other hand, a relationship between the electric current density and the metal deposition rate. As shown in Fig. 11, it is understood that the metal deposition of the plating device in Fig. 11 is much faster than a conventional jetting plating. The testing result of the plating process according to this invention shows that it is carried out high-speedily.
  • an electric contactor, a semiconductor lead frame, etc require an accurate partitive plating. Those products are being produced in a mass production system, so that productivity of the plating means according to this invention must be considered fully.
  • a metal deposition rate as shown in Fig. 11 is obtained.
  • the plate thickness of 211 is sufficient, so that in view of the metal deposition rate in Fig. 11 the plating time of a 0.5 secs. degree is quite sufficient. If a desirable plating solution for specified use will be selected, a preferred plate thickness can be formed in a shorter time.
  • the plating operation is applied for press molding products. Accordingly, as shown in Figs. 12 and 14, a plurality of mask-nozzle means are connected with each other, thereby productivity being enhanced furthermore.
  • the plurality of mask-nozzle means 120, 121, 122, 123 are very suitable for a continuous partitive plating work.
  • the plurality of openings for respective mask-nozzle means are mounted on the same line in which a pitch between two openings may be equal to a pitch between both work surfaces.
  • Each of the mask-nozzle means 120, 121, 122, 123 is such that it is easily separable from an exhaust pipe. So as to cope with the requirements of various plate areas as well as various plate shapes, if a certain modulated mask-nozzle means is prepared, a plating treatment can be greatly shortened.
  • each of variable resistors 140, 141 ... is connected in series to each electrode of the mask-nozzle means.
  • the mask-nozzle means requires the maximum plate area or maximum plate thickness. While maintaining the plating quality, the power source voltage E 145 is obtained so that the minimum plating time, i.e. the maximum current density of the mask-nozzle means may be obtained. After that, in order that a necessary current density of other mask-nozzle means may be obtained, each variable resistor 140, 141... is adjusted. By doing so, a different plate area, shape or thickness can be formed within the same cycle by using such mask-nozzle means. Further, each mask-nozzle means may be provided with its own power source.
  • respective mask-nozzle can be mounted in view of its plating purpose, for example, alloy gold plating solution, pure plating solution, etc can be supplied to respective mask-nozzle means, whereby various plating treatments can be carried out at the same cycle time.
  • FIG. 13 there is shown a semiconductor wire board.
  • a plurality of partitive spots are scattered.
  • Three mask-nozzle means 131, 132 and 133 are arranged in order to plate respective spots which are located upwardly, intermediately and downwardly of the semiconductor wire board. Likewise, it is available to furnish each mask-nozzle means a desired plating solution.
  • Fig. 15 shows an example of the plating apparatus according to this invention in which is mounted a rotary index table.
  • Numeral 150 is a rotary index table in which twelve processes are indicated.
  • first process (I) an object for plating is mounted on a jig 151.
  • second process (II) a degreasing treatment is carried out.
  • a degreasing agent is absorbed to a rotary made of felt or the like which is installed in a tank 52.
  • the work surface is passed on the rotary 153 wherein only a necessary area is degreased.
  • the third process (III) is water washing in which the water is jetted.
  • Numeral 154 is a water jetting nozzle.
  • the fourth process (IV) is pickling.
  • the fifth process (V) is water washing by which any toxicants stuck to the work surface are removed. In view of the control of environmental pollution no particular means for discharging used washing water is mounted in this example. A partitive plating is carried out for 5 mm 2 area, so that about 1 I pickling agent is required for plating about 2,400,000 units of the electric contactors.
  • the sixth process (VI) is rewashing due to jetting flow.
  • the seventh process (VII) is a gold plating for a smaller area wherein eight units of the mask-nozzle means are used.
  • the eighth process (VIII) is again the water washing wherein a slight amount of the plating solution adhered to the plated surface (7th process) is removed and a precious metal is withdrawn.
  • the ninth process (IX) is hot water washing, the tenth process (X): drying and the eleventh process (XI): a plate thickness measuring process or a spare one.
  • the twelfth process (XII) is a process for removing the work surface from the jig 151.
  • the operation efficiency is very advantageous. Further, because of a partitive plating the use oftoxicants is little and the costfor exhausting the waste water is small. Accordingly, the production cost is reduced greatly.
  • Fig. 16 is another example of the plating apparatus, in which a partitive plating for plating a hoop-type product is carried out continuously.
  • the hoop-type product 170 is supplied from a right-hand side, and next to this the pretreatments such as degreasing, pickling, etc are carried out continuously in the pretreating process 17.
  • the partitive plating is carried out at a position 173.
  • Numeral 174 is a dryer
  • numeral 175 an indexing means for feeding intermittently a plated product
  • numeral 176 a post- washing treating device
  • numeral 177 a dryer.
  • numerals 178 and 179 are buffers for absorbing a process gap between a continuous feeding and an intermittent feeding.
  • Figs. 17a and 17b are respective plating means each of which has a single mask-nozzle means.
  • This plating means is for example applicable for a gold plating bump for bonding a Large-scale Integrated Circuit (LSI) chip on a ceramic base plate of a hybrid LSI.
  • LSI Large-scale Integrated Circuit
  • This device makes use of a X-Y table.
  • Numeral 180 is a X-Y table, numeral 181 a mask-nozzle means, numeral 182 a cartridge-type plating solution tank, numeral 183 a suction pump, numeral 184 a compressor for feeding a plating solution under an application of pressure and numeral 185 a control device.
  • the basic operation of this plating means is the same as the operation of the plating means in Fig. 1.
  • the X-Y table 180 is controlled by a numerically-controlled device (not illustrated). Two or more X-Y tables are also mountable if necessary, thus productivity being improved furthermore. Since the plating solution tank is of a cartridge type, it is very easy to replace with a new cartridge. As mentioned previously, the circulation of the plating solution is recycled perfectly.
  • two or more mask-nozzle means are mounted simultaneously in the plating apparatus. Unless the mask-nozzle means gains a fixed negative electrode current stably during the plating operation, the plate thickness becomes unbalanced.
  • the unbalance of the plating current is caused by variations of the resistance rate of the plating solution column. Mainly, the flow velocity and its sectional area are varied. The variations are derived of a close contact of the work surface with the mask. The probability is that such a phenomenon arises. It is advantageous to monitor such phenomenon by a certain means during the time when the plating apparatus is being driven automatically, or to stop the operation or to give an alarm in case it will arise.
  • numeral 190 is a power source for plating, numeral 191, 192 low resistances R,, R 2 respectively, numeral 193 a potentiometer VR, numeral 194 an electric resistance r having a jetting plate solution column and numeral 195 a voltmeter.
  • Fig. 19 is a circuit diagram of an example of a plating current monitoring device in the plating apparatus according to this invention in which a plurality of mask-nozzle means are mounted.
  • numeral 200 is a power source for plating
  • numeral 201 an ampere-hour meter
  • numeral 202 a mask-nozzle means
  • numeral 203 a timer for adjusting the plating hour
  • numerals 204, 205 respectively a low resistance
  • numeral 206 a potentiometer
  • numeral 207 a differential amplifier
  • numeral 208 a threshold rate detector which is a circuit such as a Schmidt trigger circuit
  • numeral 209 an amplifier
  • numeral 210 a NAND circuit
  • numeral 211 a flip-flip circuit.
  • the output rate of the differential amplifier 207 triggers the threshold rate detector 208, is amplified by the amplifier 209 and then input to the NAND circuit or a gate circuit 20. If a voltage of + Vcc is input during the plating time into the gate circuit 210, in case there arises a certain error of the plating current due to inversion of the flip-flop circuit 211 any abnormal conditions of the plating operation are alarmed or the operation of the plating means is stopped by an output of the flip-flop circuit 211.
  • This monitoring device enables to operate the plating apparatus automatically.
  • an insulating coating material of anti-plating-solution properties such as lacquer is coated on a work surface 220 and formed as a coated layer 211.
  • an organic solvent such as a thinner in lieu of the plating solution is jetted.
  • a part of the coated layer 211 is removed as shown in Fig. 20b.
  • the mask-nozzle means has been used as means for removing a coated layer.
  • Fig. 20c shows a Ni plating treatment 223 which is carried out by a normal operation of the mask-nozzle means.
  • an Au plating treatment 224 is added to the Ni plating treatment 223 as shown in Fig. 20d. Again, it will be possible to remove part of the plated layer as necessary.
  • a very accurate plating can be carried out speedily upon a partitive work surface.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Claims (14)

1. Eine Galvanisiervorrichtung mit einer Maske (3), die in ihrem Mittelpunkt eine Öffnung aufweist, einer zum Ausspritzen der Galvanisierlösung dienenden Düse (2), die von der Anordnung her auf die Öffnung in der Maske gerichtet ist, und einem Gehäuse (4), das einen abgeschlossenen, von Maske und Düse eingeschlossenen Raum (5) abdeckt, dadurch gekennzeichnet, daß die Maske in engem Kontakt mit einer Arbeitsfläche (1) steht, so daß die Öffnung in der Maske dem Profil eines partitiven Punktes auf der Arbeitsfläche gleicht, daß das Gehäuse (4) zur Aufrechterhaltung eines negativen Luftdruckes in dem abgeschlossenen Raum mit Flüssigkeitsabsaugorganen (6) versehen ist, und die Maske (3) mit Außenluft-Ansaugorganen (7) zur Einleitung der Außenluft in den abgeschlossenen Raum (5) versehen ist, und die Lösung durch den eingeleiteten Luftstrom daran gehindert wird, jeweils zwischen Arbeitsfläche (1) und Masken (3) Oberfläche einzudringen.
2. Vorrichtung gemäß Anspruch 1, bei der die Maske (3) aus dem Gehäuse (4) herausgenommen und durch eine andere Maske mit einer Öffnung anderer Größe ausgewechselt werden kann.
3. Vorrichtung gemäß Anspruch 1, bei der ein Abstand zwischen Arbeitsfläche (1) und Düse (2), d.h. den beiden Elektroden, durch an der Düse und dem Gehäuse befestigte Regulier-Feststellvorrichtungen (8, 9, 10, 11) verstellbar ist.
4. Vorrichtung gemäß Anspruch 1, bei dem das Außenluft-Ansaugorgan (7) einen Luftdurchgang bildet, der in der Maske (3) untergebracht ist, um die Außenluft in der Nähe der Maskenöffnung einzuleiten.
5. Vorrichtung gemäß Anspruch 1, bei der das Außenluft-Ansaugorgan (7) einen Spalt (22) zwischen Masken (3) Seite und einem zu galvanisierenden Bauelement (20) bildet, wobei das Bauelement (20) in die Maskenöffnung eingesetzt wird.
6. Vorrichtung gemäß Anspruch 4, bei der der Luftdurchgang mit einem auf der Masken (30) Oberfläche teilweise aufgeschnittenen Kanal (34) versehen ist und durch den teilweise aufgeschnittenen Kanal (34) und die Arbeitsfläche (35) gebildet wird.
7. Vorrichtung gemäß Anspruch 4, bei der der Luftdurchgang mit einer ringförmigen Ausnehmung (42) in der Nähe der Masken (40) Öffnung versehen ist, wobei die ringförmige Ausnehmung (42) mit einem in der Maske (40) untergebrachten Luftdurchgang (41) in Verbindung steht.
8. Vorrichtung gemäß Anspruch 4, bei der der Luftdurchgang mit einer die Außenluft speichernden Ausnehmung (33) versehen ist, die zwischen einem ersten mit der Außenluft in Verbindung stehenden Luftkanal (31) und einem zweiten Luftkanal (34) gebildet ist, so daß die Außenluft in der Ausnehmung (33) gespeichert wird.
9. Vorrichtung gemäß Anspruch 8, bei der der erste Luftkanal an seinem Einlaß mit einem Rohr versehen ist, durch das das Masken (30) Innere mit Inertgas versorgt wird.
10. Vorrichtung gemäß Anspruch 9, bei der der erste Luftkanal (31) einen Luftreiniger und einen Turbolader aufweist.
11. Vorrichtung gemäß Anspruch 10, mit einer Stromquellenschaltung (83), die den partitiven Punkt auf der Arbeitsfläche und die Düse mit elektrischem Strom von jeweils entgegengesetzter Polarität versorgt, mit einer Luft-Flüssigkeits-Abscheidevorrichtung (68), mit der die alte Galvanisierlösung aus der durch das Außenluft-Ansaugorgan eingeleiteten Luft abgeschieden wird, und einem Galvanisierlösungsbehälter (62), der mit der Luft-Flüssigkeits-Abscheidevorrichtung (68) in Verbindung steht und mit neuaufbereiteter Galvanisierlösung aufgefüllt wird.
12. Vorrichtung gemäß einem der Ansprüche 1 bis 11, bei der eine Vielzahl von Masken-Düsen-Vorrichtungen (120, 121, 122, 123) mit jeweils einer Maske, einer Düse zum Ausspritzen der Galvanisierlösung, einem Außenluft-Ansaugorgan und einem Flüssigkeitsabsaugorgan miteinander verbunden sind, wobei der Vielzahl von Masken-Düsen-Vorrichtungen insgesamt eine Luft-Gas-Abscheideeinheit (68) zugeordnet ist.
13. Vorrichtung gemäß Anspruch 11 oder 12, bei der die Luft-Gas-Abscheidevorrichtung (68) mit dem abgeschlossenen Raum der Maske (61) mittels eines Rohres (68') in Verbindung steht, wobei das Rohr Mittel (69) zur Regelung der Ansaugmenge einer Luft-Flüssigkeitsmischung oder derem negativen Druck dient, während eine anderes zwischen Maske (61) und dem die Galvanisierlösung enthaltenden Behälter (62) liegendes Rohr (62') Mittel (64) zur Regelung der Geschwindigkeit aufweist, mit der die Galvanisierlösung aus der Düse ausgespritzt wird.
14. Vorrichtung gemäß Anspruch 13, bei der das zwischen der Maske (61) und dem die Galvanisierlösung enthaltenden Behälter (62) angeordnete Rohr (62') Mittel (66) zum Schalten der Galvanisierlösung im Galvanisierbahälter (62) und des Wassers in einem Reinigungswasserbehälter (65) aufweist.
EP80304774A 1980-12-31 1980-12-31 Galvanisiervorrichtung Expired EP0055316B1 (de)

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Application Number Priority Date Filing Date Title
EP80304774A EP0055316B1 (de) 1980-12-31 1980-12-31 Galvanisiervorrichtung
DE8080304774T DE3070493D1 (en) 1980-12-31 1980-12-31 A plating apparatus

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EP80304774A EP0055316B1 (de) 1980-12-31 1980-12-31 Galvanisiervorrichtung

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EP0055316A1 EP0055316A1 (de) 1982-07-07
EP0055316B1 true EP0055316B1 (de) 1985-04-10

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GB2237580A (en) * 1989-11-03 1991-05-08 Marconi Gec Ltd A method for plating a hole and adjacent surface portion of a printed circuit board

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JPS51137629A (en) * 1975-05-23 1976-11-27 Nippon Electro Plating Highhspeed continuous plating method

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EP0055316A1 (de) 1982-07-07

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