EA201800095A1 - LED STRIP - Google Patents
LED STRIPInfo
- Publication number
- EA201800095A1 EA201800095A1 EA201800095A EA201800095A EA201800095A1 EA 201800095 A1 EA201800095 A1 EA 201800095A1 EA 201800095 A EA201800095 A EA 201800095A EA 201800095 A EA201800095 A EA 201800095A EA 201800095 A1 EA201800095 A1 EA 201800095A1
- Authority
- EA
- Eurasian Patent Office
- Prior art keywords
- led
- substrate
- phosphor composition
- led strip
- emitted
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
- F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
Изобретение относится к сфере конструкций и технологий производства светодиодов. Для расширения направленности диаграммы светодиода от ламбертовской до тороидальной светодиод изготавливается в виде стержня, состоящего из прозрачной сапфировой подложки светодиода, выполненной в виде полосы, с установленными на неё и соединенными в последовательную электрическую цепь светодиодными чипами, покрытой люминофорной композицией, на концах стержня установлены ламели для включения светодиода во внешнюю электрическую цепь и крепления в надсистеме. Отвод тепла, выделяемого светодиодными чипами, осуществляется в виде тепловой радиации, излучаемой подложкой светодиода и люминофорной композицией.The invention relates to the field of designs and technologies for the production of LEDs. To expand the direction of the LED diagram from Lambert to toroidal, the LED is made in the form of a rod consisting of a transparent sapphire LED substrate, made in the form of a strip, with LED chips mounted on it and connected in a series electric circuit, coated with a phosphor composition, the inclusion of the LED in the external circuit and mounting in the super system. The heat dissipation emitted by the LED chips is carried out in the form of thermal radiation emitted by the substrate of the LED and the phosphor composition.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2010145033/07A RU2010145033A (en) | 2010-11-08 | 2010-11-08 | LED LAMP |
RU2011106380/07A RU2011106380A (en) | 2011-02-22 | 2011-02-22 | LED AND LAMP WITH NORMALIZED BRIGHTNESS |
RU2011121318/28A RU2011121318A (en) | 2011-05-27 | 2011-05-27 | LED Chip |
Publications (2)
Publication Number | Publication Date |
---|---|
EA201800095A1 true EA201800095A1 (en) | 2018-12-28 |
EA033577B1 EA033577B1 (en) | 2019-11-06 |
Family
ID=46051179
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EA201300441A EA029315B1 (en) | 2010-11-08 | 2011-11-07 | Light-emitting diode lamp, light-emitting diode with standardized brightness, high-power light-emitting diode chip |
EA201800095A EA033577B1 (en) | 2010-11-08 | 2011-11-07 | Strip light-emitting diode |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EA201300441A EA029315B1 (en) | 2010-11-08 | 2011-11-07 | Light-emitting diode lamp, light-emitting diode with standardized brightness, high-power light-emitting diode chip |
Country Status (2)
Country | Link |
---|---|
EA (2) | EA029315B1 (en) |
WO (1) | WO2012064227A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU198748U1 (en) * | 2019-11-01 | 2020-07-28 | Общество с ограниченной ответственностю "Экселент Тулс" | LED lamp |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
AT410266B (en) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | LIGHT SOURCE WITH A LIGHT-EMITTING ELEMENT |
RU2220478C2 (en) * | 2001-11-23 | 2003-12-27 | Федеральное государственное унитарное предприятие "Научно-исследовательский институт полупроводниковых приборов" | Light source |
RU2231171C1 (en) * | 2003-04-30 | 2004-06-20 | Закрытое акционерное общество "Инновационная фирма "ТЕТИС" | Light-emitting diode |
RU2265969C1 (en) * | 2004-03-10 | 2005-12-10 | Ногинов Александр Леонидович | Decorative multicolor lamp with control device |
DE102004021233A1 (en) * | 2004-04-30 | 2005-12-01 | Osram Opto Semiconductors Gmbh | LED array |
RU66118U1 (en) * | 2007-02-27 | 2007-08-27 | Валентин Николаевич Щербаков | LED DEVICE |
CN100536130C (en) * | 2007-10-12 | 2009-09-02 | 上海大学 | High heat radiation multi-chip integrated high-power white light LED module and its making method |
CN101728466A (en) * | 2008-10-29 | 2010-06-09 | 先进开发光电股份有限公司 | High-power LED ceramic packaging structure and manufacturing method thereof |
US8021025B2 (en) * | 2009-01-15 | 2011-09-20 | Yeh-Chiang Technology Corp. | LED lamp |
RU83587U1 (en) * | 2009-01-20 | 2009-06-10 | Общество с ограниченной ответственностью "Технологии Энергосбережения" | LED STREET LIGHT |
RU87598U1 (en) * | 2009-06-11 | 2009-10-10 | Общество с ограниченной ответственностью "Ледел" | LED CEILING LIGHT |
RU2402837C1 (en) * | 2009-10-21 | 2010-10-27 | Закрытое акционерное общество "ЭПИ-ЦЕНТР" | Semiconductor light-emitting device with porous buffer layer |
RU95181U1 (en) * | 2009-12-04 | 2010-06-10 | Открытое акционерное общество "Еврогрупп XXI" (ООО "Еврогрупп XXI") | HIGH POWER LED LAMP |
-
2011
- 2011-11-07 EA EA201300441A patent/EA029315B1/en not_active IP Right Cessation
- 2011-11-07 WO PCT/RU2011/000859 patent/WO2012064227A1/en active Application Filing
- 2011-11-07 EA EA201800095A patent/EA033577B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EA201300441A1 (en) | 2014-03-31 |
EA033577B1 (en) | 2019-11-06 |
WO2012064227A1 (en) | 2012-05-18 |
EA029315B1 (en) | 2018-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s) |
Designated state(s): AM AZ KG MD TJ TM |