EA200800329A1 - CONTACT KNOT ON COMPUTATION CONTACTS WITH CAPILLARY CONNECTING ELEMENT AND METHOD FOR ITS MANUFACTURE - Google Patents

CONTACT KNOT ON COMPUTATION CONTACTS WITH CAPILLARY CONNECTING ELEMENT AND METHOD FOR ITS MANUFACTURE

Info

Publication number
EA200800329A1
EA200800329A1 EA200800329A EA200800329A EA200800329A1 EA 200800329 A1 EA200800329 A1 EA 200800329A1 EA 200800329 A EA200800329 A EA 200800329A EA 200800329 A EA200800329 A EA 200800329A EA 200800329 A1 EA200800329 A1 EA 200800329A1
Authority
EA
Eurasian Patent Office
Prior art keywords
connecting element
contacts
capillary
electrically conductive
solder
Prior art date
Application number
EA200800329A
Other languages
Russian (ru)
Other versions
EA010269B1 (en
Inventor
Александр Иванович Таран
Андрей Александрович Белов
Original Assignee
АЛЬТЕРА СОЛЮШИОНС Эс. Эй.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by АЛЬТЕРА СОЛЮШИОНС Эс. Эй. filed Critical АЛЬТЕРА СОЛЮШИОНС Эс. Эй.
Priority to EA200800329A priority Critical patent/EA200800329A1/en
Publication of EA010269B1 publication Critical patent/EA010269B1/en
Publication of EA200800329A1 publication Critical patent/EA200800329A1/en

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  • Wire Bonding (AREA)

Abstract

Изобретение относится к электронной технике, а конкретно к неразъёмным паяным соединениям, широко используемым в производстве изделий микроэлектроники и полупроводниковых приборов. Предложен контактный узел на встречных контактах, состоящий из двух плоских контактов, связанных между собой соединительным элементом, выполненным в виде перемычки из электропроводящего материала, при этом каждый из упомянутых контактов размещен на поверхности одного из двух копланарных носителей, контакты ориентированы навстречу друг другу, а зазор между копланарными носителями встречных контактов и вокруг соединительного элемента заполнен диэлектрическим материалом, в соответствии с изобретением соединительный элемент выполнен в виде капилляра, с торцевыми фланцами, заполненного электропроводящим связующим материалом, втянутым в упомянутый капилляр со встречных контактов под действием капиллярных сил, возникающих при переходе связующего электропроводящего материала в жидкое состояние с образованием механически стойкого электропроводящего соединения между встречными контактами, причем упомянутый капилляр выполнен в виде отверстия, покрытого смачиваемым электропроводящим связующим материалом, в плоскопараллельной пластине из диэлектрического материала. Предложен способ изготовления контактного узла, в котором высота подъёма припоя в капиллярном соединительном элементе в процессе его формирования определяется формулойгде ρ=8540 кг/м;α =21∙10°Сh - высота поднятия расплавленного припоя в капиллярном соединительном элементе;γ - коэффициент поверхностного натяжения припоя;Θ - угол смачиваемости припоя;α - коэффициентThe invention relates to electronic engineering, and specifically to permanent solder joints, widely used in the manufacture of microelectronics and semiconductor devices. A contact node on opposite contacts, consisting of two flat contacts interconnected by a connecting element made in the form of a jumper of electrically conductive material, each of these contacts located on the surface of one of the two coplanar carriers, the contacts are oriented towards each other, and the gap between the coplanar counter-contact carriers and around the connecting element filled with dielectric material, in accordance with the invention the connecting element is made in the form of a capillary, with end flanges, filled with an electrically conductive bonding material drawn into said capillary from opposite contacts under the action of capillary forces arising when the bonding electrically conductive material passes into a liquid state with the formation of a mechanically resistant electrically conductive connection between the opposite contacts, holes coated with wettable electrically conductive bonding material in a plane-parallel plate of dielectric material . A method of manufacturing a contact unit is proposed, in which the height of solder lift in a capillary connecting element in the process of its formation is determined by the formula where ρ = 8540 kg / m; α = 21 ° 10 ° Сh - the height of the molten solder in the capillary connecting element; γ - surface tension coefficient solder; Θ - solder wettability angle; α - coefficient

EA200800329A 2008-02-14 2008-02-14 CONTACT KNOT ON COMPUTATION CONTACTS WITH CAPILLARY CONNECTING ELEMENT AND METHOD FOR ITS MANUFACTURE EA200800329A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EA200800329A EA200800329A1 (en) 2008-02-14 2008-02-14 CONTACT KNOT ON COMPUTATION CONTACTS WITH CAPILLARY CONNECTING ELEMENT AND METHOD FOR ITS MANUFACTURE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EA200800329A EA200800329A1 (en) 2008-02-14 2008-02-14 CONTACT KNOT ON COMPUTATION CONTACTS WITH CAPILLARY CONNECTING ELEMENT AND METHOD FOR ITS MANUFACTURE

Publications (2)

Publication Number Publication Date
EA010269B1 EA010269B1 (en) 2008-06-30
EA200800329A1 true EA200800329A1 (en) 2008-06-30

Family

ID=40863265

Family Applications (1)

Application Number Title Priority Date Filing Date
EA200800329A EA200800329A1 (en) 2008-02-14 2008-02-14 CONTACT KNOT ON COMPUTATION CONTACTS WITH CAPILLARY CONNECTING ELEMENT AND METHOD FOR ITS MANUFACTURE

Country Status (1)

Country Link
EA (1) EA200800329A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2697814C1 (en) * 2018-07-13 2019-08-20 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Method of making microplates with transition metallized holes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU586519A1 (en) * 1976-06-02 1977-12-30 Предприятие П/Я В-2098 Electric contact
SU1065911A2 (en) * 1982-10-11 1984-01-07 Ульяновское Отделение Всесоюзного Научно-Исследовательского Проектно-Конструкторского И Технологического Института Низковольтного Аппаратостроения "Внииэлектроаппарат" Liquid-metal strong-current contact unit
SU1077727A1 (en) * 1982-12-09 1984-03-07 Предприятие П/Я Р-6930 Method of soldering
SU1329599A1 (en) * 1985-06-28 1991-12-07 Минский радиотехнический институт Method of manufacturing aluminium substrate for hybrid integrated microcircuit
NO308149B1 (en) * 1998-06-02 2000-07-31 Thin Film Electronics Asa Scalable, integrated data processing device
RU2133081C1 (en) * 1998-12-08 1999-07-10 Таран Александр Иванович Multilayer switch-over board (options)
RU2134498C1 (en) * 1998-12-08 1999-08-10 Таран Александр Иванович Contact assembly
RU2300024C2 (en) * 2005-07-07 2007-05-27 Общество с ограниченной ответственностью "Институт рентгеновской оптики" Electric micro-pump

Also Published As

Publication number Publication date
EA010269B1 (en) 2008-06-30

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Legal Events

Date Code Title Description
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AM MD TM

MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AZ BY KZ KG TJ RU