DK532688A - Straalingshaerdelige harpikser til anvendelse ved elektronik, og fremgangsmaade til fremstilling af saadanne harpikser - Google Patents

Straalingshaerdelige harpikser til anvendelse ved elektronik, og fremgangsmaade til fremstilling af saadanne harpikser

Info

Publication number
DK532688A
DK532688A DK532688A DK532688A DK532688A DK 532688 A DK532688 A DK 532688A DK 532688 A DK532688 A DK 532688A DK 532688 A DK532688 A DK 532688A DK 532688 A DK532688 A DK 532688A
Authority
DK
Denmark
Prior art keywords
resines
radiatorable
electronics
procedures
manufacture
Prior art date
Application number
DK532688A
Other languages
English (en)
Other versions
DK532688D0 (da
Inventor
Klaus Budde
Sabine Spiegel
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of DK532688D0 publication Critical patent/DK532688D0/da
Publication of DK532688A publication Critical patent/DK532688A/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
    • C08F299/028—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight photopolymerisable compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
DK532688A 1987-09-28 1988-09-26 Straalingshaerdelige harpikser til anvendelse ved elektronik, og fremgangsmaade til fremstilling af saadanne harpikser DK532688A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3732603 1987-09-28

Publications (2)

Publication Number Publication Date
DK532688D0 DK532688D0 (da) 1988-09-26
DK532688A true DK532688A (da) 1989-03-29

Family

ID=6337028

Family Applications (1)

Application Number Title Priority Date Filing Date
DK532688A DK532688A (da) 1987-09-28 1988-09-26 Straalingshaerdelige harpikser til anvendelse ved elektronik, og fremgangsmaade til fremstilling af saadanne harpikser

Country Status (3)

Country Link
EP (1) EP0309783A3 (da)
JP (1) JPH01213329A (da)
DK (1) DK532688A (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH101523A (ja) * 1996-06-14 1998-01-06 Japan Synthetic Rubber Co Ltd 放射線硬化性樹脂組成物
JP4577808B2 (ja) * 2001-02-15 2010-11-10 日本化薬株式会社 エポキシカルボキシレート化合物及びそれを用いた感光性樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL207001A (da) * 1955-05-09
US3876432A (en) * 1972-09-11 1975-04-08 Sun Chemical Corp Fatty ester modified epoxy resin photopolymerizable compositions
US4284747A (en) * 1978-11-22 1981-08-18 The United States Of America As Represented By The Secretary Of The Navy Cis-trans fluoropolyol polyacrylate
US4564646A (en) * 1981-01-10 1986-01-14 Hitachi Chemical Company, Ltd. Light- and thermosetting resin composition and insulated electrical machinery and appliances using the same
EP0174494B1 (de) * 1984-08-10 1989-06-07 Siemens Aktiengesellschaft Thermostabiles, durch Bestrahlung vernetzbares Polymersystem für mikroelektronische Anwendung
DE3679453D1 (de) * 1985-06-05 1991-07-04 Siemens Ag Verfahren zum herstellen von gedruckten schaltungen unter verwendung eines durch strahlung vernetzenden fotopolymersystems.
DE3788887T2 (de) * 1986-03-24 1994-09-01 Nippon Telegraph & Telephone Epoxy(meth)acrylatharz, Verfahren zu dessen Herstellung, und Klebstoffzusammensetzung, die dasselbe enthält.

Also Published As

Publication number Publication date
EP0309783A3 (de) 1989-08-30
DK532688D0 (da) 1988-09-26
EP0309783A2 (de) 1989-04-05
JPH01213329A (ja) 1989-08-28

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Legal Events

Date Code Title Description
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