DK3413361T3 - Lysemitterende diode-lyskilde og -lampe - Google Patents
Lysemitterende diode-lyskilde og -lampe Download PDFInfo
- Publication number
- DK3413361T3 DK3413361T3 DK18184625.4T DK18184625T DK3413361T3 DK 3413361 T3 DK3413361 T3 DK 3413361T3 DK 18184625 T DK18184625 T DK 18184625T DK 3413361 T3 DK3413361 T3 DK 3413361T3
- Authority
- DK
- Denmark
- Prior art keywords
- lamp
- emitting diode
- light source
- light emitting
- diode light
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/26—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of rope form, e.g. LED lighting ropes, or of tubular form
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105106012A TW201621210A (zh) | 2016-02-26 | 2016-02-26 | 發光二極體光源及燈具 |
EP16171214.6A EP3188264B1 (en) | 2016-02-26 | 2016-05-25 | Light-emitting diode light source and lamp |
Publications (1)
Publication Number | Publication Date |
---|---|
DK3413361T3 true DK3413361T3 (da) | 2020-11-23 |
Family
ID=56080328
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK16171214.6T DK3188264T3 (da) | 2016-02-26 | 2016-05-25 | Lysdiodelyskilde og -lampe |
DK19153110.2T DK3493259T3 (da) | 2016-02-26 | 2016-05-25 | Lyskilde med lysemitterende diode og lampe |
DK18184625.4T DK3413361T3 (da) | 2016-02-26 | 2016-05-25 | Lysemitterende diode-lyskilde og -lampe |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK16171214.6T DK3188264T3 (da) | 2016-02-26 | 2016-05-25 | Lysdiodelyskilde og -lampe |
DK19153110.2T DK3493259T3 (da) | 2016-02-26 | 2016-05-25 | Lyskilde med lysemitterende diode og lampe |
Country Status (8)
Country | Link |
---|---|
US (1) | US9945532B2 (da) |
EP (3) | EP3413361B1 (da) |
JP (1) | JP6494578B2 (da) |
KR (1) | KR102048328B1 (da) |
DE (3) | DE202016008633U1 (da) |
DK (3) | DK3188264T3 (da) |
ES (3) | ES2687118T3 (da) |
TW (1) | TW201621210A (da) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11217733B2 (en) * | 2004-05-07 | 2022-01-04 | Bruce H. Baretz | Light emitting diode |
TW201621210A (zh) * | 2016-02-26 | 2016-06-16 | Liquidleds Lighting Corp | 發光二極體光源及燈具 |
TWI678495B (zh) * | 2017-03-31 | 2019-12-01 | 液光固態照明股份有限公司 | 發光二極體燈具 |
CN106981483A (zh) * | 2017-05-12 | 2017-07-25 | 中山市立体光电科技有限公司 | 一种线性led光源的封装结构 |
WO2019015763A1 (en) * | 2017-07-20 | 2019-01-24 | Explorentis | LED LAMP WITH FLEXIBLE LED FILAMENT AND METHOD OF MANUFACTURING THE SAME |
US20190119639A1 (en) * | 2017-09-20 | 2019-04-25 | Nexlmmune, Inc. | Cell compositions comprising antigen-specific t cells for adoptive therapy |
CN108916677B (zh) * | 2018-07-21 | 2020-08-14 | 杭州恒星高虹光电科技股份有限公司 | 柔性led灯丝灯 |
TWI687624B (zh) | 2019-10-25 | 2020-03-11 | 液光固態照明股份有限公司 | 照明裝置 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3075689B2 (ja) * | 1995-12-14 | 2000-08-14 | 積水化学工業株式会社 | 自動換気装置 |
CN2413390Y (zh) * | 2000-02-24 | 2001-01-03 | 台湾光宝电子股份有限公司 | 发光二极体装置 |
JP2002057371A (ja) | 2000-08-15 | 2002-02-22 | Hukuyo Denkyu Kk | 連鎖led光源構造 |
JP3075689U (ja) * | 2000-08-17 | 2001-02-27 | 舶用電球株式会社 | Led電球 |
JP4067802B2 (ja) * | 2001-09-18 | 2008-03-26 | 松下電器産業株式会社 | 照明装置 |
JP4067801B2 (ja) * | 2001-09-18 | 2008-03-26 | 松下電器産業株式会社 | 照明装置 |
US6566824B2 (en) * | 2001-10-16 | 2003-05-20 | Teledyne Lighting And Display Products, Inc. | Flexible lighting segment |
TW558804B (en) * | 2002-04-16 | 2003-10-21 | Yuan Lin | Flexible light emitting device and the manufacturing method thereof |
CN100547282C (zh) * | 2002-04-25 | 2009-10-07 | 林原 | 可挠性发光体装置及其制造方法 |
US20040008525A1 (en) | 2002-07-09 | 2004-01-15 | Hakuyo Denkyuu Kabushiki Kaisha: Fuso Denki Kougyou Kabushiki Kaisha | LED electric bulb |
CN2611741Y (zh) * | 2003-03-11 | 2004-04-14 | 伟力电器股份有限公司 | 展缩式树灯 |
CN2718387Y (zh) * | 2004-03-17 | 2005-08-17 | 杨华贵 | 嵌设于塑胶体内的彩灯 |
US8567992B2 (en) * | 2006-09-12 | 2013-10-29 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
TWM376709U (en) * | 2009-09-02 | 2010-03-21 | Liquidleds Lighting Corp | Curved tubular LED lamp |
KR101543333B1 (ko) * | 2010-04-23 | 2015-08-11 | 삼성전자주식회사 | 발광소자 패키지용 리드 프레임, 발광소자 패키지, 및 발광소자 패키지를 채용한 조명장치 |
US20120126699A1 (en) * | 2010-11-18 | 2012-05-24 | Michael Zittel | LED Light Bulb with Battery Backup and Remote Operation |
KR20120076892A (ko) * | 2010-12-30 | 2012-07-10 | 삼성엘이디 주식회사 | 광원 모듈 |
WO2013115379A1 (ja) * | 2012-02-02 | 2013-08-08 | シチズンホールディングス株式会社 | 半導体発光装置及びその製造方法 |
JP2013258180A (ja) * | 2012-06-11 | 2013-12-26 | Toshiba Lighting & Technology Corp | Ledモジュールおよび照明装置 |
US20140268779A1 (en) * | 2013-03-15 | 2014-09-18 | Litetronics International, Inc. | Led light emitting device |
US9772076B2 (en) * | 2013-09-30 | 2017-09-26 | Osram Sylvania Inc. | Cuttable flexible light engines |
US10134714B2 (en) | 2013-11-08 | 2018-11-20 | Osram Sylvania Inc. | Flexible circuit board for LED lighting fixtures |
CN203517451U (zh) * | 2013-11-08 | 2014-04-02 | 江苏华英光宝科技股份有限公司 | 全角度可弯折led灯丝条及其构成的仿古led灯泡 |
ES2732705T3 (es) | 2013-12-02 | 2019-11-25 | Tiehan Ge | Filamento de LED en espiral y bombilla de luz que usa filamento de LED en espiral |
CN105074321A (zh) | 2014-03-13 | 2015-11-18 | 皇家飞利浦有限公司 | 用于照明装置的灯丝 |
JP2015179648A (ja) | 2014-03-20 | 2015-10-08 | 東芝ライテック株式会社 | 発光装置および照明装置 |
CN104157772A (zh) * | 2014-08-27 | 2014-11-19 | 江苏华英光宝科技股份有限公司 | 含正装芯片倒装360度发光可任意环绕led灯丝的led光源 |
CN104952864B (zh) | 2015-06-24 | 2017-06-23 | 厦门多彩光电子科技有限公司 | Led灯丝及其制造方法 |
US9478587B1 (en) * | 2015-12-22 | 2016-10-25 | Dicon Fiberoptics Inc. | Multi-layer circuit board for mounting multi-color LED chips into a uniform light emitter |
TWM523810U (zh) * | 2016-02-26 | 2016-06-11 | Liquidleds Lighting Corp | 發光二極體光源及燈具 |
TW201621210A (zh) * | 2016-02-26 | 2016-06-16 | Liquidleds Lighting Corp | 發光二極體光源及燈具 |
-
2016
- 2016-02-26 TW TW105106012A patent/TW201621210A/zh unknown
- 2016-05-25 EP EP18184625.4A patent/EP3413361B1/en active Active
- 2016-05-25 ES ES16171214.6T patent/ES2687118T3/es active Active
- 2016-05-25 DK DK16171214.6T patent/DK3188264T3/da active
- 2016-05-25 ES ES19153110T patent/ES2928316T3/es active Active
- 2016-05-25 DE DE202016008633.3U patent/DE202016008633U1/de active Active
- 2016-05-25 DK DK19153110.2T patent/DK3493259T3/da active
- 2016-05-25 ES ES18184625T patent/ES2834094T3/es active Active
- 2016-05-25 DE DE202016008634.1U patent/DE202016008634U1/de active Active
- 2016-05-25 EP EP16171214.6A patent/EP3188264B1/en active Active
- 2016-05-25 DK DK18184625.4T patent/DK3413361T3/da active
- 2016-05-25 EP EP19153110.2A patent/EP3493259B8/en active Active
- 2016-05-25 DE DE202016008632.5U patent/DE202016008632U1/de active Active
- 2016-05-26 US US15/165,246 patent/US9945532B2/en active Active
- 2016-09-23 JP JP2016185187A patent/JP6494578B2/ja active Active
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2017
- 2017-02-23 KR KR1020170023865A patent/KR102048328B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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DK3188264T3 (da) | 2018-11-19 |
EP3413361A1 (en) | 2018-12-12 |
KR102048328B1 (ko) | 2019-11-25 |
EP3413361B1 (en) | 2020-09-02 |
ES2687118T3 (es) | 2018-10-23 |
US9945532B2 (en) | 2018-04-17 |
EP3493259B1 (en) | 2022-07-20 |
DE202016008632U1 (de) | 2018-10-24 |
TWI563206B (da) | 2016-12-21 |
JP6494578B2 (ja) | 2019-04-03 |
DE202016008633U1 (de) | 2018-10-24 |
ES2834094T3 (es) | 2021-06-16 |
ES2928316T3 (es) | 2022-11-17 |
KR20170101137A (ko) | 2017-09-05 |
DE202016008634U1 (de) | 2018-10-24 |
EP3188264B1 (en) | 2018-07-25 |
US20170248277A1 (en) | 2017-08-31 |
JP2017152357A (ja) | 2017-08-31 |
TW201621210A (zh) | 2016-06-16 |
EP3188264A1 (en) | 2017-07-05 |
DK3493259T3 (da) | 2022-10-17 |
EP3493259B8 (en) | 2023-03-22 |
EP3493259A1 (en) | 2019-06-05 |
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