DK3257089T3 - Fremgangsmåde til fremstilling af et forseglet termoelektrisk modul - Google Patents
Fremgangsmåde til fremstilling af et forseglet termoelektrisk modul Download PDFInfo
- Publication number
- DK3257089T3 DK3257089T3 DK16703971.8T DK16703971T DK3257089T3 DK 3257089 T3 DK3257089 T3 DK 3257089T3 DK 16703971 T DK16703971 T DK 16703971T DK 3257089 T3 DK3257089 T3 DK 3257089T3
- Authority
- DK
- Denmark
- Prior art keywords
- preparing
- procedure
- thermoelectric module
- sealed
- sealed thermoelectric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/853—Thermoelectric active materials comprising inorganic compositions comprising arsenic, antimony or bismuth
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
- B23K20/026—Thermo-compression bonding with diffusion of soldering material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO20150216A NO20150216A1 (en) | 2015-02-13 | 2015-02-13 | Method of manufacturing a sealed thermoelectric module |
| PCT/EP2016/052791 WO2016128442A1 (en) | 2015-02-13 | 2016-02-10 | Method of manufacturing a sealed thermoelectric module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3257089T3 true DK3257089T3 (da) | 2019-06-17 |
Family
ID=55349828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK16703971.8T DK3257089T3 (da) | 2015-02-13 | 2016-02-10 | Fremgangsmåde til fremstilling af et forseglet termoelektrisk modul |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10468576B2 (da) |
| EP (1) | EP3257089B1 (da) |
| CN (1) | CN107210354B (da) |
| DK (1) | DK3257089T3 (da) |
| NO (1) | NO20150216A1 (da) |
| WO (1) | WO2016128442A1 (da) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO341705B1 (en) * | 2016-02-22 | 2018-01-02 | Tegma As | Thermoelectric half-cell and method of production |
| CN109285940B (zh) * | 2018-07-26 | 2019-11-15 | 深圳大学 | 与热电材料匹配的电极及其连接方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5448014A (en) | 1993-01-27 | 1995-09-05 | Trw Inc. | Mass simultaneous sealing and electrical connection of electronic devices |
| US6069312A (en) | 1994-01-28 | 2000-05-30 | California Institute Of Technology | Thermoelectric materials with filled skutterudite structure for thermoelectric devices |
| US6673996B2 (en) | 2001-01-17 | 2004-01-06 | California Institute Of Technology | Thermoelectric unicouple used for power generation |
| US6759586B2 (en) | 2001-03-26 | 2004-07-06 | Kabushiki Kaisha Toshiba | Thermoelectric module and heat exchanger |
| JP3930410B2 (ja) | 2002-09-27 | 2007-06-13 | 株式会社東芝 | 熱電素子モジュール及びその製造方法 |
| JP4488778B2 (ja) | 2003-07-25 | 2010-06-23 | 株式会社東芝 | 熱電変換装置 |
| JP4686171B2 (ja) | 2004-10-29 | 2011-05-18 | 株式会社東芝 | 熱−電気直接変換装置 |
| US8736081B2 (en) * | 2005-08-26 | 2014-05-27 | Innovative Micro Technology | Wafer level hermetic bond using metal alloy with keeper layer |
| DE102006019080B3 (de) | 2006-04-25 | 2007-08-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Herstellungsverfahren für ein gehäustes Bauelement |
| US10508324B2 (en) | 2008-01-23 | 2019-12-17 | Furukawa Co., Ltd. | Thermoelectric conversion material and thermoelectric conversion module |
| JP2009295752A (ja) | 2008-06-04 | 2009-12-17 | Toyota Motor Corp | 熱電発電モジュール |
| US8180083B2 (en) | 2009-07-02 | 2012-05-15 | Magnatone Hearing Aid Corp. | Protective cover for behind-the-ear hearing aid device |
| CN101969094B (zh) | 2009-07-27 | 2012-08-29 | 中国科学院上海硅酸盐研究所 | 一种用于热电材料的涂层及其含有该涂层的器件 |
| JP5663930B2 (ja) | 2010-04-02 | 2015-02-04 | Tdk株式会社 | 熱電モジュール |
| US20120128867A1 (en) | 2010-11-23 | 2012-05-24 | Paulson Charles A | Method of forming conformal barrier layers for protection of thermoelectric materials |
| TWI446982B (zh) * | 2011-12-20 | 2014-08-01 | Ind Tech Res Inst | 熱電模組之固液擴散接合結構及其製造方法 |
| DE102013202785A1 (de) * | 2013-02-20 | 2014-08-21 | Behr Gmbh & Co. Kg | Thermoelektrisches Modul |
| TWI492429B (zh) * | 2013-04-10 | 2015-07-11 | 中國鋼鐵股份有限公司 | 多層熱電模組與其製造方法 |
-
2015
- 2015-02-13 NO NO20150216A patent/NO20150216A1/en unknown
-
2016
- 2016-02-10 EP EP16703971.8A patent/EP3257089B1/en active Active
- 2016-02-10 WO PCT/EP2016/052791 patent/WO2016128442A1/en active Application Filing
- 2016-02-10 US US15/540,120 patent/US10468576B2/en active Active
- 2016-02-10 DK DK16703971.8T patent/DK3257089T3/da active
- 2016-02-10 CN CN201680009899.0A patent/CN107210354B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107210354B (zh) | 2020-04-24 |
| EP3257089A1 (en) | 2017-12-20 |
| US20170365765A1 (en) | 2017-12-21 |
| WO2016128442A1 (en) | 2016-08-18 |
| US10468576B2 (en) | 2019-11-05 |
| EP3257089B1 (en) | 2019-05-01 |
| CN107210354A (zh) | 2017-09-26 |
| NO20150216A1 (en) | 2016-08-15 |
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