DK2396447T3 - Fremgangsmåde til ionstrålebehandling af et metallag aflejret på et substrat og det derved opnåede substrat - Google Patents

Fremgangsmåde til ionstrålebehandling af et metallag aflejret på et substrat og det derved opnåede substrat Download PDF

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DK2396447T3
DK2396447T3 DK10708319.8T DK10708319T DK2396447T3 DK 2396447 T3 DK2396447 T3 DK 2396447T3 DK 10708319 T DK10708319 T DK 10708319T DK 2396447 T3 DK2396447 T3 DK 2396447T3
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metal layer
substrate
metal
ions
layer
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DK10708319.8T
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Denis Busardo
Frédéric Guernalec
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Quertech
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/40Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
    • B01J23/42Platinum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/48Silver or gold
    • B01J23/52Gold
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/70Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
    • B01J23/72Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/70Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
    • B01J23/74Iron group metals
    • B01J23/745Iron
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/70Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
    • B01J23/74Iron group metals
    • B01J23/755Nickel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J35/00Catalysts, in general, characterised by their form or physical properties
    • B01J35/20Catalysts, in general, characterised by their form or physical properties characterised by their non-solid state
    • B01J35/23Catalysts, in general, characterised by their form or physical properties characterised by their non-solid state in a colloidal state
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J37/00Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
    • B01J37/34Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation
    • B01J37/349Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of flames, plasmas or lasers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • C23C14/5826Treatment with charged particles
    • C23C14/5833Ion beam bombardment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2255/00Catalysts
    • B01D2255/10Noble metals or compounds thereof
    • B01D2255/102Platinum group metals
    • B01D2255/1021Platinum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
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    • B01D2255/20Metals or compounds thereof
    • B01D2255/207Transition metals
    • B01D2255/20738Iron
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2255/00Catalysts
    • B01D2255/20Metals or compounds thereof
    • B01D2255/207Transition metals
    • B01D2255/20753Nickel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2255/00Catalysts
    • B01D2255/20Metals or compounds thereof
    • B01D2255/207Transition metals
    • B01D2255/20761Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2255/00Catalysts
    • B01D2255/90Physical characteristics of catalysts
    • B01D2255/92Dimensions
    • B01D2255/9202Linear dimensions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2258/00Sources of waste gases
    • B01D2258/01Engine exhaust gases

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
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Claims (11)

1. Fremgangsmåde til ionstrålebehandling (100) af et metallag (10) aflejret på et substrat (30) kendetegnet ved, at den omfatter et trin (a) til fragmentering af metallaget, med "fragmentering" menes en fremgangsmåde der gør det muligt at opdele et lag af et materiale for således at fremstille aflejringer af nævnte materiale af laget, isoleret fra hinanden, idet disse aflejringer forekommer på overfladen af substratet og er adskilt af zoner, hvor substratet er fri for nævnte materiale af nævnte lag og hvor: - metallaget (10) har en tykkelse, efrag, omfattet mellem 0,2 nm til 20 nm (nanometer); - ionerne af ionstrålen er valgt fra ionerne af elementerne fra listen bestående af helium (He), bor (B), carbon (C), nitrogen (N), oxygen (O), neon (Ne); - ionaccelerationsspændingen er omfattet mellem 20 kV og 200 kV; - temperaturen på metallaget (10) er mindre end eller lig med Tf/3, hvor Tf er smeltepunktet for metallet af metallaget (10); - iondosen per overfladeenhed er valgt fra et område omfattet mellem 1012 ioner/cm2 og 1018 ioner/cm2 for således at fragmentere metallaget (10) for at fremstille metalaflejringer (40) i form af nanopartikler på overfladen af substratet, hvor den maksimale tykkelse af disse er omfattet mellem 0,2 nm og 20 nm, og den maksimale bredde er omfattet mellem 0,2 nm og 100 nm.
2. Fremgangsmåde ifølge det foregående krav kendetegnet ved, at iondosen per overfladeenhed er omfattet mellem 1014 ioner/cm2 og 1017 ioner/cm2.
3. Fremgangsmåde ifølge et hvilket som helst af de foregående krav kendetegnet ved, at tykkelsen af metallaget (10), efrag, er omfattet mellem 1 nm og 10 nm.
4. Fremgangsmåde ifølge et hvilket som helst af de foregående krav kendetegnet ved, at fremgangsmåden også omfatter et trin (aa) til pulverisering af metallaget, før trinnet (a) til fragmentering af metallaget, bestående af at reducere den indledende tykkelse, epuiv + efrag, af et metallag (20, 10) aflejret på substratet (20) ved ionbombardement indtil laget når tykkelsen efrag.
5. Fremgangsmåde ifølge det foregående krav kendetegnet ved, at ionaccelerationsspændingen i trin (aa) til pulverisering af metallaget er omfattet mellem 5 kV og 20 kV.
6. Fremgangsmåde ifølge et hvilket som helst af de foregående krav kendetegnet ved, at substratet (30) og metallaget (10, 20) er bevægelige i forhold til ionstrålen (100) med en hastighed, Vd, omfattet mellem 0,1 mm/s og 1000 mm/s, og hvor den samme zone af metallaget (10, 20) kan flyttes under ionstrålen (100) i en flerhed, N, af passager ved hastighed Vd.
7. Fremgangsmåde ifølge et hvilket som helst af de foregående krav kendetegnet ved, at trinnet til valg af iondosen per overfladeenhed til at fragmentere metallaget (10) for at fremstille metalaflejringer (40) udføres under anvendelse af tidligere opnåede data, der gør det muligt at vise udviklingen af dækningsgraden af et metallag som en funktion af iondosen per overfladeenhed.
8. Fremgangsmåde ifølge det foregående krav kendetegnet ved, at de data, der gør det muligt at vise udviklingen af dækningsgraden, er baseret på eksperimentelle målinger af dækningsgraden af et metallag opnået ved røntgenfotoelektronspektroskopi (XPS).
9. Fremgangsmåde ifølge et hvilket som helst af de foregående krav kendetegnet ved, at metallaget (10, 20) består af et metal eller en legering af dette metal, hvor metallet er valgt fra listen bestående afjern (Fe), kobolt (Co), nikkel (Ni), kobber (Cu), ruthenium (Ru), rhodium (Rh), palladium (Pd), sølv (Ag), cerium (Ce), osmium (Os), iridium (Ir), platin (Pt) og guld (Au).
10. Substrat (30) dækket med metalaflejringer (40) i form af nanopartikler på overfladen af substratet, hvor den maksimale tykkelse er omfattet mellem 0,2 nm og 20 nm, og hvor den maksimale bredde er omfattet mellem 0,2 nm og 100 nm, opnået ifølge fremgangsmåden omfattende et trin til fragmentering af et metallag ifølge et hvilket som helst af de foregående krav, hvor metalaflejringerne optager mellem 1% og 90% af overfladen af substratet, og hvor substratet er blotlagt på henholdsvis 99% til 10% af sin overflade, hvor disse aflejringer forekommer på overfladen af substratet og er adskilt af zoner, hvor substratet fri for nævnte materiale af nævnte lag.
11. Heterogen katalyse-indretning omfattende en zone til omdannelse af en gas eller en væske omfattende mindst et substrat (30) dækket med metalaflejringer (40) ifølge det foregående krav.
DK10708319.8T 2009-02-10 2010-02-10 Fremgangsmåde til ionstrålebehandling af et metallag aflejret på et substrat og det derved opnåede substrat DK2396447T3 (da)

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Application Number Priority Date Filing Date Title
FR0950824A FR2941878B1 (fr) 2009-02-10 2009-02-10 Procede de traitement par un faisceau d'ions d'une couche metallique deposee sur un substrat
PCT/FR2010/050219 WO2010092297A1 (fr) 2009-02-10 2010-02-10 Procede de traitement par un faisceau d'ions d'une couche metallique deposee sur un substrat

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CN (1) CN102362006B (da)
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ES (1) ES2706673T3 (da)
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WO2012177900A1 (en) 2011-06-22 2012-12-27 Research Triangle Institute, International Bipolar microelectronic device
GB201113168D0 (en) 2011-08-01 2011-09-14 Univ Birmingham Method for producing particulate clusters
FR3009217B1 (fr) * 2013-08-01 2016-10-28 Quertech Procede de traitement de poudre a base d'oxyde de cerium
EP2876649B1 (en) * 2013-11-21 2017-10-11 Airbus DS GmbH Method for manufacturing a charge dissipative surface layer
US10612129B2 (en) 2016-06-28 2020-04-07 Corning Incorporated Thin glass based article with high resistance to contact damage
EP3807444A1 (en) * 2018-06-12 2021-04-21 AGC Glass Europe Method for preparing catalytic nanoparticles, catalyst surfaces, and/or catalysts
CN113020612A (zh) * 2021-02-22 2021-06-25 上海理工大学 一种大小连续可调的铜纳米球粒制备方法

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FR2941878A1 (fr) 2010-08-13
WO2010092297A1 (fr) 2010-08-19
FR2941878B1 (fr) 2011-05-06
SI2396447T1 (sl) 2019-03-29
ES2706673T3 (es) 2019-03-29
ZA201105812B (en) 2012-11-28
EP2396447A1 (fr) 2011-12-21
CN102362006B (zh) 2014-01-01
PL2396447T3 (pl) 2019-04-30
EP2396447B1 (fr) 2018-10-31
CN102362006A (zh) 2012-02-22

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