DK2019579T3 - Effekthalvledermodul med forbundne substratbærere samt fremgangsmåde til dets fremstilling - Google Patents

Effekthalvledermodul med forbundne substratbærere samt fremgangsmåde til dets fremstilling

Info

Publication number
DK2019579T3
DK2019579T3 DK08012359.9T DK08012359T DK2019579T3 DK 2019579 T3 DK2019579 T3 DK 2019579T3 DK 08012359 T DK08012359 T DK 08012359T DK 2019579 T3 DK2019579 T3 DK 2019579T3
Authority
DK
Denmark
Prior art keywords
power semiconductor
semiconductor module
manufacture
well
substrate carriers
Prior art date
Application number
DK08012359.9T
Other languages
English (en)
Inventor
Christian Kroneder
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK2019579T3 publication Critical patent/DK2019579T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DK08012359.9T 2007-07-26 2008-07-09 Effekthalvledermodul med forbundne substratbærere samt fremgangsmåde til dets fremstilling DK2019579T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007034849 2007-07-26

Publications (1)

Publication Number Publication Date
DK2019579T3 true DK2019579T3 (da) 2010-09-27

Family

ID=39745350

Family Applications (1)

Application Number Title Priority Date Filing Date
DK08012359.9T DK2019579T3 (da) 2007-07-26 2008-07-09 Effekthalvledermodul med forbundne substratbærere samt fremgangsmåde til dets fremstilling

Country Status (9)

Country Link
US (1) US7741711B2 (da)
EP (1) EP2019579B1 (da)
JP (1) JP5325487B2 (da)
CN (1) CN101388366B (da)
AT (1) ATE471066T1 (da)
DE (1) DE502008000765D1 (da)
DK (1) DK2019579T3 (da)
ES (1) ES2345414T3 (da)
PL (1) PL2019579T3 (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010000943B4 (de) * 2010-01-15 2021-02-04 Infineon Technologies Ag Leistungshalbleitermodul mit zwei miteinander verbundenen Gehäuseteilen und Verfahren zur Herstellung eines Leistungshalbleitermoduls mit zwei miteinander verbundenen Gehäuseteilen
US9431311B1 (en) 2015-02-19 2016-08-30 Semiconductor Components Industries, Llc Semiconductor package with elastic coupler and related methods

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280348U (da) * 1985-11-08 1987-05-22
JPH07249719A (ja) * 1994-03-14 1995-09-26 Omron Corp 電子機器
JPH0831967A (ja) * 1994-07-19 1996-02-02 Fuji Electric Co Ltd 半導体装置のパッケージ構造
KR100319198B1 (ko) * 1999-11-17 2001-12-29 윤종용 반도체 모듈에 히트 싱크를 조립하는 설비 및 그 조립 방법
DE10100460B4 (de) 2001-01-08 2006-06-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Gehäuse und Anschlußelementen
DE10139287A1 (de) 2001-08-09 2003-03-13 Bombardier Transp Gmbh Halbleitermodul
JP3894070B2 (ja) * 2002-08-06 2007-03-14 富士通株式会社 ヒートシンク、ヒートシンク装置、該ヒートシンクの固定方法及び該ヒートシンクを使用した電子装置
JP2004103846A (ja) * 2002-09-10 2004-04-02 Mitsubishi Electric Corp 電力用半導体装置
JP4055643B2 (ja) * 2003-05-06 2008-03-05 株式会社日立製作所 インバータ装置
DE102005055713B4 (de) * 2005-11-23 2011-11-17 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Anschlusselementen
CN2906924Y (zh) * 2006-03-17 2007-05-30 森洋工业有限公司 一种大功率集成电路封装结构

Also Published As

Publication number Publication date
US7741711B2 (en) 2010-06-22
CN101388366A (zh) 2009-03-18
ES2345414T3 (es) 2010-09-22
PL2019579T3 (pl) 2010-10-29
US20090045500A1 (en) 2009-02-19
ATE471066T1 (de) 2010-06-15
DE502008000765D1 (de) 2010-07-22
EP2019579B1 (de) 2010-06-09
JP2009033169A (ja) 2009-02-12
CN101388366B (zh) 2012-07-11
JP5325487B2 (ja) 2013-10-23
EP2019579A1 (de) 2009-01-28

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