DK200601342A - Hermetisk indesluttet kredslöb - Google Patents
Hermetisk indesluttet kredslöb Download PDFInfo
- Publication number
- DK200601342A DK200601342A DK200601342A DKPA200601342A DK200601342A DK 200601342 A DK200601342 A DK 200601342A DK 200601342 A DK200601342 A DK 200601342A DK PA200601342 A DKPA200601342 A DK PA200601342A DK 200601342 A DK200601342 A DK 200601342A
- Authority
- DK
- Denmark
- Prior art keywords
- circuit
- alumina
- bushing
- silver
- ring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Claims (7)
1. Hermetisk indesluttet kredsløb eksempelvis et filterkredsløb med forbindelsesterminaler (2), der er ført ud, kendetegnet ved, at det er indesluttet i en bøsning (1), fortrinsvis en sølvbøsning, idet de ved enderne af bøsningen (1) udragende forbindelsesterminaler (2) er tætnet ved hjælp af en affaset ring (3) af aluminiumoxid eller et aluminiumoxidlignende materiale, der er loddet til hhv. forbindelsesterminalen (2) og indersiden af bøsningen (1),
2. Kredsløb ifølge krav 1, kendetegnet ved, at ringen (3) af aluminiumoxid er affaset ved indersiden og/eller ydersiden.
3. Kredsløb ifølge krav 2, kendetegnet ved, at affasningsvinklen er ca. 45°.
4. Fremgangsmåde til fremstilling af et hermetisk indesluttet kredsløb med udragende forbindelsesterminaler (2), kendetegnet ved, at kredsløbet anbringes i en sølvbøsning (1) med forbindelsesterminalerne (2) ført ud ved enderne af bøsningen (1), hvorefter der omkring den enkelte forbindelsesterminal (2) anbringes en affaset tætningsring (3) af aluminiumoxid, hvilken ring (3) loddes til hhv. forbindelsesterminalen (2) og indersiden af sølvbøsningen (1).
5. Fremgangsmåde ifølge krav 4, kendetegnet ved, at de affasede flader inden lodningen er belagt med et bindelag af titanium.
6. Fremgangsmåde ifølge krav 5, kendetegnet ved, at bindelaget af titanium er beskyttet mod oxidering af et forholdsvis tyndt lag guld.
7. Fremgangsmåde ifølge krav 6, kendetegnet ved, at der ovenpå guldlaget elektropletteres et sølvlag.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK200601342A DK200601342A (da) | 2006-10-16 | 2006-10-16 | Hermetisk indesluttet kredslöb |
EP07019912A EP1915042A3 (en) | 2006-10-16 | 2007-10-11 | Hermetically sealed circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK200601342 | 2006-10-16 | ||
DK200601342A DK200601342A (da) | 2006-10-16 | 2006-10-16 | Hermetisk indesluttet kredslöb |
Publications (1)
Publication Number | Publication Date |
---|---|
DK200601342A true DK200601342A (da) | 2008-04-17 |
Family
ID=38981013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK200601342A DK200601342A (da) | 2006-10-16 | 2006-10-16 | Hermetisk indesluttet kredslöb |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1915042A3 (da) |
DK (1) | DK200601342A (da) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB753135A (en) * | 1953-08-28 | 1956-07-18 | Standard Telephones Cables Ltd | Improvements in or relating to dry rectifiers |
DE1210489B (de) * | 1961-08-10 | 1966-02-10 | Siemens Ag | Halbleiterbauelement mit einem in einem Gehaeuse gasdicht eingeschlossenen Halbleiterelement |
DE1248808B (da) * | 1962-03-23 | 1900-01-01 | ||
US4839716A (en) * | 1987-06-01 | 1989-06-13 | Olin Corporation | Semiconductor packaging |
US7145076B2 (en) | 2005-02-08 | 2006-12-05 | Greatbatch, Inc. | Method for minimizing stress in feedthrough capacitor filter assemblies |
-
2006
- 2006-10-16 DK DK200601342A patent/DK200601342A/da not_active Application Discontinuation
-
2007
- 2007-10-11 EP EP07019912A patent/EP1915042A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1915042A3 (en) | 2009-09-02 |
EP1915042A2 (en) | 2008-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHS | Application shelved for other reasons than non-payment |