DK163465B - CONTACTING A MICROWAVE CONNECTED ON A SUBSTRATE - Google Patents

CONTACTING A MICROWAVE CONNECTED ON A SUBSTRATE Download PDF

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Publication number
DK163465B
DK163465B DK559685A DK559685A DK163465B DK 163465 B DK163465 B DK 163465B DK 559685 A DK559685 A DK 559685A DK 559685 A DK559685 A DK 559685A DK 163465 B DK163465 B DK 163465B
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DK
Denmark
Prior art keywords
substrate
housing
substrates
microwave
metal frame
Prior art date
Application number
DK559685A
Other languages
Danish (da)
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DK559685D0 (en
DK559685A (en
DK163465C (en
Inventor
Wolfgang Schiller
Original Assignee
Ant Nachrichtentech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of DK559685D0 publication Critical patent/DK559685D0/en
Publication of DK559685A publication Critical patent/DK559685A/en
Publication of DK163465B publication Critical patent/DK163465B/en
Application granted granted Critical
Publication of DK163465C publication Critical patent/DK163465C/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

1. A microwave circuit disposed on a substrate, which circuit is connected to plug connections and/or other microwave circuits on adjacent substrates and is connected with respect to ground to a housing receiving the substrate, wherein the substrate is electrically conductively secured with its ground side to a metal frame, characterized in that the metal frame (4, 20) is provided with laterally protruding tongues (5, 6, 7, 19) that are screwed to the housing, and that attached to some of the tongues (6, 7, 19) are substrates (8, 9, 15) of flexible material on top of which are planar lead segments (10, 11, 17) that are connected both to the microwave circuit on the substrate (2, 3), via soldered-on wires (12, 13, 16), and to planar lead segments (17) of adjacent substrates (3) or to leads (14) of plug connections (15).

Description

DK 163465BDK 163465B

iin

Den foreliggende opfindelse angår kontaktering af en på et substrat optaget mikrobølgekobling med stiktilslutninger og/eller tilslutninger til andre mikrobølgekoblinger på nabosubstrater og hvor substratets stel-5 flade er fastgjort elektrisk ledende til en metalramme, hvilken ramme står i elektrisk forbindelse med det hus, hvori substratet er optaget.The present invention relates to contacting a microwave coupling recorded on a substrate with plug connections and / or connections to other microwave couplings on neighboring substrates and wherein the frame surface of the substrate is electrically conductive to a metal frame which is electrically connected to the housing in which the substrate is busy.

Et sådant apparat kendes fra tysk offentliggørelsesskrift nr. 24 56 367. Her udgør fjedrende trykele-10 menter kontakteringen mellem den på substratet påførte mikrobølgekobling og lederbanerne og stelledningen på en bæreplade, hvori det på en metalramme fastgjorte substrat er indsat.Such an apparatus is known from German publication specification No. 24 56 367. Here, resilient pressure elements comprise the contact between the microwave coupling applied to the substrate and the conductor paths and the ground wire on a support plate in which the substrate fixed to a metal frame is inserted.

Ved anvendelse af keramiksubstrater i metalhuse 15 udsættes substratet og huset ved temperaturvariationer for meget forskellige mekaniske udvidelser som følge af de stærkt fra hinanden afvigende varmeudvidelser for keramik og metal. Under disse omstændigheder indebærer fjedrende kontakter den risiko, at der opstår støjimpul-20 ser over dem. Navnlig digitale signaler er støjpåvirkelige, fordi støjimpulserne frembringer fasespring, hvilket fører til forfalskninger af enkelte tegn.When using ceramic substrates in metal housings 15, the substrate and housing are subjected to very different mechanical expansions due to the widely differing heat expansions for ceramics and metal due to temperature variations. In these circumstances, resilient contacts involve the risk of noise impulses over them. In particular, digital signals are noise-sensitive because the noise pulses produce phase jumps, leading to the falsification of individual characters.

Opfindelsen har derfor til opgave at angive et apparat af den indledningsvis omhandlede art, som mulig-25 gør en sikker defineret kontaktdannelse, også hvis substratet og huset udvider sig stærkt forskelligt fra hinanden.It is therefore the object of the invention to provide an apparatus of the kind referred to in the preamble, which allows for a secure defined contact formation, even if the substrate and housing extend greatly differently from one another.

Ifølge opfindelsen løses denne opgave ved, at metalrammen er forsynet med i sideretningen udragende tun-30 ger, som kan skrues sammen med huset, og at der på nogle tunger er påført substrater af fleksibelt materiale, som på deres overside bærer plane ledningsstykker, som over påloddede trådstykker dels står i forbindelse med mikrobølgekoblingen på substratet, dels står i forbindelse 35 med plane ledningsstykker på nabosubstrater eller med ledninger for stiktilslutninger.According to the invention, this task is solved by the metal frame having laterally projecting tongues which can be screwed together with the housing and that on some tongues flexible substrates are applied which carry on their top side flat planar pieces which over welded wire pieces are in part connected to the microwave connection on the substrate, and in part are connected to flat wires on neighboring substrates or with wires for plug connections.

22

DK 163465 BDK 163465 B

Kontakteringen ifølge opfindelsen muliggør en lettere udskiftning af substratet, fordi der i huset ikke skal foretages lodninger på substratet. Som følge af den udmærkede varmeledningsevne for keramik skulle 5 nemlig loddestedet på substratet først forvarmes, for at loddemetallet overhovedet flyder. Foropvarmningen af substratet i huset er imidlertid meget besværlig.The contacting according to the invention allows for easier replacement of the substrate because no soldering on the substrate is required in the housing. Because of the excellent thermal conductivity of ceramics, namely, the solder position of the substrate had to be preheated first in order for the solder metal to flow at all. However, preheating the substrate in the housing is very troublesome.

Opfindelsen er i det følgende forklaret nærmere på grundlag af et udførelseseksempel, som er vist på 10 tegningen, hvor fig. 1 viser en perspektivisk fremstilling af et hus med et deri kontakteret substrat, og fig. 2 en metalramme til et substrat.The invention is explained in more detail below on the basis of an embodiment shown in the drawing, in which fig. 1 is a perspective view of a housing with a substrate contacted therein; and FIG. 2 shows a metal frame for a substrate.

Af fig. 1 fremgår et udsnit af et hus 1, som 15 optager flere keramiksubstrater 2 og 3 med mikrobølgekoblinger, som ikke er vist på tegningen.In FIG. 1 shows a section of a housing 1 which accommodates several ceramic substrates 2 and 3 with microwave couplings not shown in the drawing.

Keramiksubstraterne 2,3 er dels med deres på undersiden værende stelflade kontakteret med huset i, dels med deres på oversiden forløbende plane ledninger 20 kontakteret med plane ledninger på nabosubstrater og/el-ler med stiktilslutninger.The ceramic substrates 2,3 are partly contacted with their housing surface on the underside, and partly with their flat conductors extending over the surface 20, contacted with flat wires on neighboring substrates and / or with plug connections.

Til etablering af disse kontakter tjener en metalramme, som substratet loddes på med sin stelflade før indbygningen i huset 1. Fig. 2 viser et planbillede af 25 en sådan metalramme 4.For establishing these contacts, a metal frame on which the substrate is soldered with its support surface serves before incorporation into housing 1. FIG. 2 shows a plan view of such a metal frame 4.

Metalrammen 4 har i sideretningen udragende tunger 5,6 og 7. Tungerne 5,6,7 sammenskrues direkte med huset 1' s bund, hvormed kontakteringen mellem substratet 21 s stelflade og huset 1 sker over metal-30 rammen.The metal frame 4 has projecting tongues 5,6 and 7 in the lateral direction. The tongues 5,6,7 are screwed directly with the bottom of the housing 1, whereby the contact between the frame surface of the substrate 21 and the housing 1 takes place over the metal frame.

På tungerne 6 og 7 er der desuden påført substrater 8,9 af et fleksibelt materiale, f.eks. plast, hvis overside er belagt med et plant ledningsstykke 10, 11.On the tongues 6 and 7, substrates 8,9 of a flexible material, e.g. plastic, the top of which is coated with a flat wire 10, 11.

35 Disse plane ledningsstykker 10,11 er påloddede tråde 12,13 forbundet med de plane ledninger på sub-These planar wires 10,11 are welded wires 12,13 connected to the planar wires on sub-lines.

DK 163465 BDK 163465 B

3 stratet. Kontakteringen af trådene 12,13 med de plane ledninger på substratet 2 sker ligeledes ved lodning.3 street. The contacting of the wires 12, 13 with the planar wires on the substrate 2 is also done by soldering.

Da en foropvarmning af loddestedet er nødvendig som følge af keramiksubstratets gode varmeledningsevne, foreta-5 ges denne loddeproces før indbygningen af substratet i huset l.Since a preheating of the solder is necessary due to the good thermal conductivity of the ceramic substrate, this soldering process is carried out prior to incorporation of the substrate in the housing 1.

For ledninger på de plane ledningsstykker 10,11, som forløber på de af fleksibelt materiale fremstillede substrater 8,9, kræves ingen foropvarmning, fordi dis-10 se substrater har en væsentligt dårligere varmeledningsevne og derved lader loddemetallet flyde bedre på de metalliske ledninger. Af denne årsag kan inderlederen 14 i en koaksial stiktilslutning 15 hhv. en forbindelsestråd til nabosubstratet problemløst loddes sammen med 15 det plane ledningsstykke 10 på tungen 6 hhv. med det plane ledningsstykke li på tungen 7 inde i huset.For wires on the planar wires 10,11 which extend on the substrates 8,9 made of flexible material, no preheating is required because these substrates have a significantly poorer thermal conductivity and thereby allow the solder to flow better on the metallic wires. For this reason, the inner conductor 14 in a coaxial plug connection 15 and 15 respectively. a connecting wire to the neighboring substrate is soldered seamlessly together with the planar lead piece 10 on the tongue 6 respectively. with the plane cord 1 of the tongue 7 inside the housing.

Tråden 16, som etablerer forbindelsen mellem mikrobølgekoblingen på substratet 2 og mikrobølgekoblingen på nabosubstratet 3, er dels sammenloddet med 20 det plane ledningsstykke 11 på substratet 9 på tungen 7 i metalrammen 4, dels sammenloddet med det plane ledningsstykke 17 på substratet 18 på tungen 19 i den nabosubstratret 3 bærende metalramme 20.The wire 16, which establishes the connection between the microwave coupling on the substrate 2 and the microwave coupling on the neighboring substrate 3, is partly soldered to the plane conductor 11 on the substrate 9 on the tongue 7 of the metal frame 4 and partly soldered to the plane conductor 17 on the substrate 18 on the tongue 19. the neighboring substrate 3 bearing metal frame 20.

De ens udformede tunger 7 og 19 i metalrammerne 4 25 og 20 er som fig. 1 viser skruet sammen på huset l's bund med skruer, som angriber samtidigt på begge tunger 7, 19.The similarly designed tongues 7 and 19 of the metal frames 4 25 and 20 are as shown in FIG. 1 shows the screw on the bottom of the housing 1 with screws which simultaneously attack on both tongues 7, 19.

De substraterne 2,3 bærende metalrammer og navnlig disses i sideretningen udragende tunger har kun 30 en ringe materialetykkelse, således at de er meget fleksible med henblik på at kunne opfange forskellige udvidelser af huset og af substraterne.The substrates 2,3 carrying metal frames and especially their laterally projecting tongues have only a small material thickness, so that they are very flexible in order to be able to capture different extensions of the housing and of the substrates.

Med denne opfindelse er der altså tilvejebragt et apparat, som tillader definerede loddekontakteringer 35 selv på vanskeligt loddebare keramiksubstrater, der ved temperaturændringer udvider sig meget forskelligt i for-Thus, with this invention there is provided an apparatus which permits defined solder contacts 35 even on difficult solderable ceramic substrates which, at changes in temperature, extend very differently in form.

Claims (1)

DK 163465 B hold til metalhuset. Anordning ved kontaktering af en på et substrat 5 optaget mikrobølgekobling med stiktilslutninger og/eller tilslutninger til andre mikrobølgekoblinger på nabosubstrater og hvor substratets stelflade er fastgjort elektrisk ledende til en metalramme, hvilken ramme står i elektrisk forbindelse med det hus, hvori substratet er 10 optaget, kendetegnet ved, at metalrammen (4, 20. er forsynet med i sideretningen udragende tunger (5, 6,7,19), som kan skrues sammen med huset (l), og at der på nogle tunger (6,7,19) er påført substrater (8,9,18) af fleksibelt materiale, som på deres overside bærer 15 plane ledningsstykker (10,11,17), som enten over pålod-dede trådstykker (12,13,16), dels står i forbindelse med mikrobølgekoblingen på substratet (2,3), dels står i forbindelse med plane ledningsstykker (17) på nabosubstrater, eller med ledninger (14) står i forbindelse med 20 stiktilslutninger (15).DK 163465 B hold for the metal housing. Apparatus for contacting a microwave coupling recorded on a substrate 5 with plug connections and / or connections to other microwave couplings on neighboring substrates and wherein the substrate's surface is electrically conductive to a metal frame, which frame is electrically connected to the housing in which the substrate is accommodated, characterized in that the metal frame (4, 20. is provided with laterally projecting tongues (5, 6,7,19) which can be screwed together with the housing (1) and that on some tongues (6,7,19) are applied to substrates (8,9,18) of flexible material which carry on their upper side 15 flat wire pieces (10,11,17) which either over soldered wire pieces (12,13,16) are partly connected to the microwave coupling on the substrate (2,3), in part communicating with plane wires (17) on neighboring substrates, or with wires (14) communicating with 20 plug connections (15).
DK559685A 1984-12-04 1985-12-03 CONTACTING A MICROWAVE CONNECTED ON A SUBSTRATE DK163465C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3444076 1984-12-04
DE19843444076 DE3444076A1 (en) 1984-12-04 1984-12-04 CONTACTING A MICROWAVE CIRCUIT ARRANGED ON A SUBSTRATE

Publications (4)

Publication Number Publication Date
DK559685D0 DK559685D0 (en) 1985-12-03
DK559685A DK559685A (en) 1986-06-05
DK163465B true DK163465B (en) 1992-03-02
DK163465C DK163465C (en) 1992-07-20

Family

ID=6251787

Family Applications (1)

Application Number Title Priority Date Filing Date
DK559685A DK163465C (en) 1984-12-04 1985-12-03 CONTACTING A MICROWAVE CONNECTED ON A SUBSTRATE

Country Status (4)

Country Link
EP (1) EP0183916B1 (en)
AT (1) ATE42431T1 (en)
DE (2) DE3444076A1 (en)
DK (1) DK163465C (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402088A (en) * 1992-12-03 1995-03-28 Ail Systems, Inc. Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2456367A1 (en) * 1971-05-10 1976-08-12 Siemens Ag Mounting plate with conducting paths - has a substrate with thick or thin film circuits and front side conductors like printed circuit
US4042952A (en) * 1976-06-09 1977-08-16 Motorola, Inc. R. F. power transistor device with controlled common lead inductance
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4326180A (en) * 1979-11-05 1982-04-20 Microphase Corporation Microwave backdiode microcircuits and method of making

Also Published As

Publication number Publication date
DE3444076A1 (en) 1986-06-05
DE3569638D1 (en) 1989-05-24
DK559685D0 (en) 1985-12-03
EP0183916B1 (en) 1989-04-19
DK559685A (en) 1986-06-05
ATE42431T1 (en) 1989-05-15
EP0183916A1 (en) 1986-06-11
DK163465C (en) 1992-07-20

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